CN110944447A

CN110944447A - Metalized hole embedded copper column conductive circuit board and manufacturing process thereof

Info

Publication number: CN110944447A
Application number: CN201911297614.XA
Authority: CN
Inventors: 李健伟; 余同德; 黄瑾; 林雪亮; 林铭
Original assignee: Shantou Kaixing Printed Board Ltd Co
Current assignee: Shantou Kaixing Printed Board Ltd Co
Priority date: 2019-10-28
Filing date: 2019-12-17
Publication date: 2020-03-31

Abstract

The invention relates to the technical field of circuit board manufacturing equipment, in particular to a copper column conductive circuit board with a metalized hole embedded and a manufacturing process thereof, which relates to a double-sided board, copper columns and copper holes, wherein the double-sided board is provided with a plurality of copper holes, the copper columns are embedded in the copper holes, the copper columns are cylinders, the diameter of each copper column is 4.12mm or 0.97mm, the thickness of each copper column is 1.5mm, one side edge of each copper column is a chamfer of 0.3mm, and the copper columns with the diameter of 0.97mm are arranged on the periphery of the copper columns with the diameter of 4.12 mm. Compared with the prior art, the beneficial effects are: the new process manufacturing scheme reduces unnecessary multiple electroplating processes for the plate, reduces the cost and reduces the impact of the multi-electroplating scheme on the output benefit of a circuit board factory. The novel small copper column embedded scheme has the advantages that the special hole conducting solid cross section is larger than that of the traditional scheme, and the small copper column can play a role in supporting and tightening the 'sticking' of the inner wall drilled out by the hole wall of the primary hole and the base material, so that the potential risk of copper stripping of the via hole can be reduced when high-voltage high current passes through the via hole for conducting.

Description

Metalized hole embedded copper column conductive circuit board and manufacturing process thereof

Technical Field

The invention relates to the technical field of circuit board manufacturing equipment, in particular to a copper column conductive circuit board embedded in a metalized hole and a manufacturing process thereof.

Background

A series of thick copper plate high voltage high current circuit boards with finished surface copper up to 5OZ provide special requirement that finished hole copper reach 3OZ in the stage of designing a sample. The average value of the conventional pore copper falls between 20um and 25um, and the requirement of the average value of the pore copper reaches 1OZ (namely 35 um), so that the average value is a more special requirement. According to the conventional process of the circuit board, 4 processes are needed to be ensured to achieve the hole copper 3OZ by the full-board electroplating process. The thickening process of the hole copper is also accompanied by the increase of the surface copper, namely, the circuit board needs to adopt lower base copper, and the surface copper is accompanied by the increase of the hole copper to meet the requirement. However, the electroplating process will increase the uniformity of the surface copper thickness, which will affect the line width and line distance manufacturing of the outer circuit layer. In addition, the manufacturing mode of multiple electroplating reduces the board passing benefit of a manufacturer by multiple electroplating in the process equipment configuration of the circuit board, and the cost is much higher than that of the conventional method.

The requirement for large-hole copper of the product is not required for all network via holes, and for a certain board as an example, in a designed single chip, two groups of eighteen via holes have special copper thickness requirement for the via holes, because the two groups of eighteen via holes bear special high-pressure and high-flow requirements in the board.

The applicant has seen the shortcomings of the conventional circuit board, inherits the spirit of research innovation and lean refinement, combines production practice, and provides a practical solution by using a professional scientific method, so that the application of the scheme is provided.

Disclosure of Invention

The invention overcomes at least one of the above-mentioned defects of the prior art, and provides a way that a metalized hole is embedded in a copper pillar conductive electric circuit board, and a via hole is embedded in a small copper pillar, so as to enhance the high-voltage and high-current conductive requirements of the via holes.

In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a metallized hole embedding copper post leads strong current circuit board, double sided board and copper post, copper hole are equipped with a plurality of copper holes on the double sided board, the gomphosis of copper post is in the copper hole, the copper post be the cylinder, the copper post is two kinds of diameter 4.12mm and 0.97mm, the thickness 1.5mm of copper post, copper post one side edge is 0.3 mm's chamfer, the copper post setting of 0.97mm diameter is peripheral at diameter 4.12 mm's copper post.

A manufacturing process of a copper column embedded heat dissipation circuit board comprises the following steps: two kinds of brass bars with the length of 1.5mm and the diameters of 4.12mm and 0.97mm are selected and milled by a precision machine tool to be processed into a cylinder, the copper cylinder has the diameters of 4.12mm and 0.97mm, the thickness of the two kinds of copper cylinders is 1.5mm, and meanwhile, in order to enable the copper cylinder to be smoothly embedded, a chamfer with the thickness of 0.3mm is formed on one side of the copper cylinder; step two: drilling a plurality of copper holes on a double-sided board with the thickness of 1.4mm by adopting two drill bits with the diameters of 4.15mm and 1.0mm, and removing burrs; step three: carrying out primary electroplating, wherein the electroplating condition adopts 12ASF current, the electroplating time is 75 minutes, the diameters of copper holes are detected, copper columns with two diameters are embedded into the copper holes, one end with a chamfer is lightly pushed into the CS surface of a double-sided board by hand, the board is placed on thin adhesive packing paper, and the thin adhesive packing paper is knocked in by an adhesive hammer; step four: and (3) carrying out full-board electroplating for the second time, wherein the electroplating condition adopts 25ASF current, the electroplating time is 75 minutes, and the finished double-sided board surface treatment adopts a lead-free tin spraying process.

Compared with the prior art, the beneficial effects are: the new process manufacturing scheme reduces unnecessary multiple electroplating processes for the plate, reduces the cost and reduces the impact of the multi-electroplating scheme on the output benefit of a circuit board factory. The novel small copper column embedded scheme has the advantages that the special hole conducting solid cross section is larger than that of the traditional scheme, and the small copper column can play a role in supporting and tightening the 'sticking' of the inner wall drilled out by the hole wall of the primary hole and the base material, so that the potential risk of copper stripping of the via hole can be reduced when high-voltage high current passes through the via hole for conducting.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.

As shown in fig. 1, a metalized hole embedded copper pillar conductive electric circuit board mainly includes: double sided board 1 and copper post 2, copper hole 3, its characterized in that: be equipped with a plurality of copper holes 3 on the double sided board 1, the 2 gomphosis of copper post is in copper hole 3, copper post 2 be the cylinder, copper post 2 is diameter 4.12mm and two kinds of 0.97mm, the thickness 1.5mm of copper post 2, 2 edges of copper post are 0.3 mm's chamfer, the copper post 2 setting of 0.97mm diameter is peripheral at diameter 4.12 mm's copper post 2.

A manufacturing process of a copper column embedded heat dissipation circuit board comprises the following steps: two kinds of brass bars with the length of 1.5mm and the diameters of 4.12mm and 0.97mm are selected and milled by a precision machine tool to be processed into a cylinder, wherein the copper column 2 has the diameters of 4.12mm and 0.97mm, the thickness of the two kinds of copper columns 2 is 1.5mm, and meanwhile, in order to enable the copper column to be smoothly embedded, a chamfer with the thickness of 0.3mm is formed on one column side of the copper column; step two: drilling a plurality of copper holes 3 in a double-sided board 1 with the thickness of 1.4mm by adopting two drill bits with the diameters of 4.15mm and 1.0mm, and removing burrs; step three: carrying out primary electroplating, wherein the electroplating condition adopts 12ASF current, the electroplating time is 75 minutes, the diameters of the copper holes 3 are detected, the copper columns 2 with two diameters are embedded into the copper holes 3, one end with a chamfer is lightly pushed into the CS surface of the double-sided board 1 by hand, the board is placed on thin adhesive packing paper, and the board is knocked in by an adhesive hammer; step four: and (3) carrying out full-board electroplating for the second time, wherein the electroplating condition adopts 25ASF current, the electroplating time is 75 minutes, and then carrying out lead-free tin spraying surface treatment on the finished double-sided board 1.

Testing the plate according to the conventional on-off condition, and determining the plate is qualified; the plate is embedded into the copper column area, longitudinal section observation is carried out, primary copper plating is matched with the hole wall and the edge of the small copper column, and secondary copper plating has good covering and fastening conditions on the packing density of the connection area of the primary hole copper and the small copper column and normal appearance; the plate simulates the reflow soldering process, and no abnormity occurs; four groups of wires connected through special holes on the plate are used for carrying out over-voltage and over-current tests with the voltage of 4000V and 12mA in a laboratory without abnormity, and the tested plate is sampled again to be longitudinally sliced for manufacturing and observation, so that the effect is not changed before power is on.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a metallization hole embedding copper post electric conduction circuit board, mainly includes: double sided board (1) and copper post (2), copper hole (3), its characterized in that: be equipped with a plurality of copper holes (3) on double sided board (1), copper post (2) gomphosis is in copper hole (3), copper post (2) be the cylinder, copper post (2) are two kinds for diameter 4.12mm and 0.97mm, the thickness 1.5mm of copper post (2), copper post (2) one side edge is 0.3 mm's chamfer, and copper post (2) of 0.97mm diameter set up peripherally at diameter 4.12 mm's copper post (2).

2. A manufacturing process of a copper column embedded heat dissipation circuit board is characterized in that:

the method comprises the following steps: two kinds of brass bars with the length of 1.5mm and the diameters of 4.12mm and 0.97mm are selected and milled by a precision machine tool to be processed into a cylinder, wherein the copper column (2) has the diameters of 4.12mm and 0.97mm, the thickness of the two kinds of copper columns (2) is 1.5mm, and meanwhile, in order to enable the copper column to be smoothly embedded, a chamfer with the thickness of 0.3mm is formed on one side of the copper column;

step two: drilling a plurality of copper holes 3 in a double-sided board 1 with the thickness of 1.4mm by adopting two drill bits with the diameters of 4.15mm and 1.0mm, and removing burrs;

step three: electroplating for the first time, wherein the electroplating condition adopts 12ASF current, the electroplating time is 75 minutes, the diameter of the copper hole 3 is detected, copper columns (2) with two diameters are embedded into the copper hole (3), one end with a chamfer is lightly pushed into the CS surface of the double-sided board 1 by hand, the board is placed on thin adhesive packing paper, and the board is knocked in by an adhesive hammer;

step four: and (3) carrying out full-board electroplating for the second time, wherein the electroplating conditions adopt 25ASF current, the electroplating time is 75 minutes, and the finished double-sided board 1 is subjected to surface treatment and lead-free tin spraying.