CN110940288A - Method for detecting edge profile of wafer - Google Patents
Method for detecting edge profile of wafer Download PDFInfo
- Publication number
- CN110940288A CN110940288A CN201911036983.3A CN201911036983A CN110940288A CN 110940288 A CN110940288 A CN 110940288A CN 201911036983 A CN201911036983 A CN 201911036983A CN 110940288 A CN110940288 A CN 110940288A
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- wafer
- edge
- ruler
- detecting
- clamping
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 238000013499 data model Methods 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
Abstract
The invention relates to the field of wafer detection, and discloses a method for detecting a wafer edge profile, which comprises the following steps: clamping a wafer (1) on a clamp, and arranging a stamping agent on a supporting disc (9); pressing the edge to be formed of the wafer (1) into a stamping agent, rolling the wafer (1), and rolling the edge to be formed of the wafer (1) on the stamping agent to form a stamping model; scanning the model by using a laser confocal microscope to obtain three-dimensional images of the impression model at different positions; and fourthly, splicing the three-dimensional images by using computer software to obtain a three-dimensional edge data model of the wafer (1). By the technical scheme, the three-dimensional images of the impression model at different positions can be spliced to form the three-dimensional edge data model, and the shape information of the edge can be detected more comprehensively and completely, so that the wafer processing technology can be monitored, and the wafer production quality can be improved.
Description
Technical Field
The invention relates to the field of wafer detection, in particular to a method for detecting a wafer edge profile.
Background
The current detection method for the edge profile of the chamfered wafer mainly comprises three methods:
1. cutting the wafer along the radial direction, amplifying the wafer by an optical projector, focusing the wafer to enable the section to be clearly projected onto a display screen, and comparing the section with a standard template;
2. placing the wafer under a parallel light path, projecting the edge of the wafer onto a display screen, and comparing the image of the edge profile with the edge profile template coordinate graph;
3. the wafer is placed under a light source, the CCD camera is used for displaying the outline shape image of the edge of the wafer or the notch reference surface on a display screen, and the detection image is analyzed through analysis software.
The existing wafer edge detection methods are all used for carrying out projection measurement on the wafer edge, the obtained edge appearance is two-dimensional, and the provided information quantity is small.
Disclosure of Invention
The invention aims to provide a method for detecting the edge profile of a wafer, which aims to solve the problem of incomplete detection of the edge information of the wafer.
In order to achieve the above object, the present invention provides a method for detecting a wafer edge profile, wherein the method comprises:
clamping a wafer on a clamp, and arranging a stamping agent on a supporting disc;
pressing the edge to be molded of the wafer into a mold agent, rolling the wafer along a linear direction parallel to the support plate, and rolling the edge to be molded of the wafer on the mold agent to form a mold model;
step three, using a laser confocal microscope to successively and continuously scan the impression model at different positions along the linear direction to obtain three-dimensional images of the impression model at different positions;
and fourthly, splicing the three-dimensional images of the impression model at different positions by using computer software to obtain a three-dimensional edge data model of the wafer.
Optionally, the clamp comprises two clamping pieces similar to the outline of the wafer, and in step one, the clamp clamps the wafer in a manner that the two clamping pieces are aligned with each other, and the edge to be formed of the wafer radially protrudes relative to the edges of the clamping pieces.
Optionally, a gear is arranged on the back of the clamping piece, a rack extending parallel to the supporting plate is arranged on the supporting plate, and the gear can be meshed with the rack and roll on the rack.
Optionally, magnets are provided on the gear, wherein the magnets on one of the clips are rotatable between a locked position in which the two magnets attract each other to enable the two clips to clamp the wafer, and an unlocked position in which the two magnets repel each other to enable the two clips to be separated from each other.
Optionally, the magnet is provided with a knob portion.
Optionally, in step one, a part of the edge to be formed of the wafer is clamped on a clamping ruler, and then the clamping piece is clamped on the wafer by taking the clamping ruler as a limiting boundary,
the clamping ruler comprises a first ruler, a second ruler and a third ruler which are connected in a vertical crossing mode, the third ruler is perpendicular to the first ruler and parallel to the second ruler, the first ruler, the second ruler and the third ruler are located between the first ruler and the second ruler in a direction, clamping grooves are formed in each side face of the wafer, and the edges of the wafer to be molded are clamped.
Optionally, the third ruler is movable towards the second ruler to clamp the wafer between the first ruler, the second ruler and the third ruler.
Optionally, the radial dimension of the edge to be formed is 1mm-2mm, the thickness is 0.5mm-1mm, the depth of the groove is equal to the radial dimension of the edge to be formed, and the width of the groove is equal to the thickness of the edge to be formed.
Optionally, the wafer is provided with a positioning edge, the clamping piece is provided with a cut edge corresponding to the positioning edge, and in the first step, the positioning edge is inserted into the groove.
Optionally, a support plate extending vertically is arranged on the support plate, and the rack is located on the upper side edge of the support plate.
Alternatively, the impression agent is a silicone rubber or an ether rubber.
Optionally, the clip is provided with a polypropylene coating and the surface of the clip facing the wafer is provided with a dust free pad.
By the technical scheme, the three-dimensional images of the impression model at different positions can be spliced to form the three-dimensional edge data model, and the shape information of the edge can be detected more comprehensively and completely, so that the wafer processing technology can be monitored, and the wafer production quality can be improved.
Drawings
FIG. 1 is a schematic view of a clip and a wafer according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a structure of a clamping ruler, a clamping piece and a wafer according to an embodiment of the invention;
FIG. 3 is a schematic structural view of a support disk according to an embodiment of the present invention;
fig. 4 is a sectional view of an impression model according to an embodiment of the present invention.
Description of the reference numerals
1 wafer 2 clip
3 Gear 4 magnet
5 knob part 6 first straight ruler
7 second straightedge 8 third straightedge
9 support plate 10 rack
11 support plate
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The invention provides a method for detecting a wafer edge profile, which comprises the following steps:
firstly, clamping a wafer 1 on a clamp, and arranging a stamping agent on a supporting disk 9;
pressing the edge to be formed of the wafer 1 into a stamping agent, rolling the wafer 1 along a linear direction parallel to the support plate 9, and rolling the edge to be formed of the wafer 1 on the stamping agent to form a stamping model;
step three, using a laser confocal microscope to successively and continuously scan the impression model at different positions along the linear direction to obtain three-dimensional images of the impression model at different positions;
and fourthly, splicing the three-dimensional images of the impression model at different positions by using computer software to obtain a three-dimensional edge data model of the wafer 1.
The invention of the present solution is that a die model (refer to fig. 4) along the linear direction is formed on a die agent by rolling the wafer 1 so that the edge to be formed is formed, then the die model is scanned along the linear direction, the obtained three-dimensional image is corresponding to the position, and finally the three-dimensional image corresponding to each position is spliced into a three-dimensional edge data model by using computer software.
For example, a full perimeter length of the die model formed on the die agent by the wafer 1 may be obtained by equally dividing the die model into n parts, sequentially scanning each part of the die model by a confocal laser microscope, and then stitching the n three-dimensional images into a full ring-shaped three-dimensional model. Wherein, each three-dimensional image is the expansion of the corresponding three-dimensional model with a small radian in the linear direction. When the impression model n is divided equally, the laser confocal microscope scans the impression model successively and continuously at a plurality of equally spaced positions in a linear direction, in other embodiments, the impression model may be scanned unequally, and correspondingly, the impression model may be scanned at unequally spaced positions, for example, the density of scanning position points may be increased in some specific regions to more accurately restore the three-dimensional model.
Specifically, the clamp comprises two clamping pieces 2 similar to the outline of the wafer 1, in the first step, the clamp clamps the wafer 1 in a manner that the two clamping pieces 2 are aligned with each other, and the edge to be formed of the wafer 1 radially extends relative to the edges of the clamping pieces 2. Referring to fig. 1, the clip 2 and the wafer 1 have similar outlines, that is, the two have the same shape, and the size ratio of the clip 2 to the wafer 1 is smaller than 1, that is, the clip 2 is a scaled-down shape of the wafer 1, so as to allow the edge of the wafer 1 to be formed to protrude from the edge of the clip 2.
In addition, the back of the clamping piece 2 is provided with a gear 3, the supporting disk 9 is provided with a rack 10 extending parallel to the supporting disk 9, and the gear 3 can be meshed with the rack 10 and roll on the rack 10. As described above, the wafer 1 rolls along the linear direction parallel to the support plate 9, so that a stamp model with a substantially uniform depth can be formed on the stamp agent, and further, the movement of the wafer 1 relative to the support plate 9 is ensured to be rolling by the cooperation of the gear 3 and the rack 10, thereby avoiding the phenomenon of slip between the two to affect the molding of the stamp model.
Further, magnets 4 are provided on the gear 3, wherein the magnets 4 on one of the clips 2 are capable of rotating between a locking position in which the two magnets 4 are attracted to each other so that the two clips 2 can clamp the wafer 1 and an unlocking position in which the two magnets 4 repel each other so that the two clips 2 are separated from each other. Magnets 4 are provided on the gear wheels 3 of both jaws 2 and one of the magnets can be rotated to change the relative position of the two magnets 4, in particular the relative position of the poles, with the two jaws 2 aligned, so that the magnets 4 can be rotated between a locked position attracting each other and an unlocked position repelling each other, facilitating the clamping of the jaws 2 or the wafer 1. The magnet 4 may be disposed in a hole at the center of the gear 3, or may be disposed outside the gear 3.
Further, a knob portion 5 is provided on the magnet 4. The relative rotation of the magnet 4 can be more conveniently operated by the knob portion 5.
In addition, in the first step, a part of the edge to be formed of the wafer 1 is clamped on a clamping ruler, and then the clamping piece 2 is clamped on the wafer 1 by taking the clamping ruler as a limited boundary, wherein the clamping ruler comprises a first straight ruler 6, a second straight ruler 7 and a third straight ruler 8 which are perpendicularly crossed and connected, the third straight ruler 8 is perpendicular to the first straight ruler 6 and parallel to the second straight ruler 7, and grooves for clamping the edge to be formed are arranged on each side surface of the wafer 1, facing the first straight ruler 6, the second straight ruler 7 and the third straight ruler 8, among the three sides.
Through the clamping ruler, the edge to be formed of the wafer 1 can be clamped, a defined boundary is formed, so that the clamping pieces 2 are prevented from covering the edge to be formed, specifically, as shown in fig. 2, the first straight ruler 6, the second straight ruler 7 and the third straight ruler 8 clamp three sections of the edge to be formed of the wafer 1 at three positions through grooves, and a door-shaped structure defining the positions of the clamping pieces 2 is formed, so that the two clamping pieces 2 can be concentrically clamped on the wafer 1. Wherein, form on the side of ruler the recess, the edge of treating the shaping of wafer 1 can insert in the recess, and clamping piece 2 can backstop on the side of ruler to realize above limit function to clamping piece 2.
Further, the third straightedge 8 is movable towards the second straightedge 7 to clamp the wafer 1 between the first straightedge 6, the second straightedge 7 and the third straightedge 8. The third ruler 8 can move towards (and away from) the second ruler 7, the edge of the wafer 1 can be inserted into the groove of the first ruler 6 and the groove of the second ruler 7, then the third ruler 8 can move towards the second ruler 7 until the edge of the wafer 1 is inserted into the edge of the third ruler 8, then the clamping pieces 2 are clamped on the wafer 1 from the two sides of the wafer 1, the side faces of the three rulers can play a limiting role, and the clamping pieces 2 and the wafer 1 are guaranteed to be aligned and concentric.
The radial dimension of the edge to be molded is 1mm-2mm, the thickness of the edge to be molded is 0.5mm-1mm, the depth of the groove is equal to the radial dimension of the edge to be molded, and the width of the groove is equal to the thickness of the edge to be molded. That is, the size of the groove is kept consistent with the size of the edge to be formed, so that the edge to be formed can be stably clamped in the groove, and the clamping piece 2 is clamped at the radial inner side of the edge to be formed.
In addition, the wafer 1 is provided with a positioning edge, the clamping piece 2 is provided with an edge cutting corresponding to the positioning edge, and in the first step, the positioning edge is inserted into the groove. Wafer 1 can be provided with the location limit of a plurality of linear types, and the location limit can be supported in the recess of ruler steadily, and corresponding clamping piece 2 also is formed with the side cut of linear type, and the side cut can be supported on the side of ruler steadily, through aligning side cut and location limit, can be so that clamping piece 2 and wafer 1 correspond, especially, two clamping pieces 2 cut the side cut and align the back, can make the tooth of two gears 3 align to can respectively with two racks 10 on mesh in step. The wafer 1 may have one positioning edge, a plurality of positioning edges, or a positioning groove structure, and when the wafer 1 rolls on the mold medium, a special structure formed by the positioning edges may also be used as a calibration point, for example, as a starting point of scanning.
Furthermore, a support plate 11 extending upright is provided on the support plate 9, and the rack 10 is located on the upper edge of the support plate 11. Referring to fig. 3, two support plates 11 are connected to the support plate 9, and a rack 10 is disposed on an upper edge of each support plate 11, so that the rack 10 is substantially parallel to the support plate 9, and when the gear 3 and the wafer 1 roll, the distance between the central axis and the support plate 9 is kept constant, thereby forming a stamp model with a uniform depth on the stamp agent. In other embodiments, a support structure in the form of a support frame, support bar, or the like may be used to support rack 10.
Wherein the stamping agent is silicon rubber or ether rubber. The impression agent can form a concave shape corresponding to the edge to be formed under the extrusion of the wafer 1, and can maintain the shape without deformation so as to facilitate the scanning of the formed shape through a laser confocal microscope.
In addition, the clip 2 is provided with a polypropylene coating and the surface of the clip 2 facing the wafer 1 is provided with a dust-free pad. The polypropylene coating can prevent the wafer 1 from being scratched by the clamping pieces 2, and the dust-free pad can prevent dust from accumulating and prevent the wafer 1 from being stuck with dust.
The operation of the detection method according to the preferred embodiment of the present invention will be described in detail below.
Step one, inserting the edge to be formed of the wafer 1 into a groove of a first straight ruler 6 and/or a second straight ruler 7 of a clamping ruler, wherein a positioning edge on the edge to be formed is inserted into the groove, and moving a third straight ruler 8 to enable the edge to be formed of the wafer 1 to be inserted into the groove of the third straight ruler 8; the two clamping pieces 2 are respectively clamped to two sides of the wafer 1, the cut edges of the clamping pieces 2 are aligned with the positioning edges of the wafer 1, the edges of the clamping pieces 2 stop at the side faces of the straightedges, the knob parts 5 are rotated to enable the magnets to move from the unlocking positions to the locking positions, the two magnets are mutually adsorbed to enable the clamping pieces 2 to clamp the wafer 1, and the third straightedge 8 is moved to take down the clamping pieces 2 and the wafer 1; coating a certain thickness of the impression agent on the supporting disc 9;
placing the clamping piece 2 between the supporting plates 11, respectively engaging the two gears 3 with the two racks, pressing the positioning edges into the impression compound, and rolling the clamping piece 2 for a circle to roll the wafer 1 to form an impression model on the impression compound;
determining a plurality of equally spaced position points along a straight line direction by taking an impression model formed by the positioning edge as a starting point, and scanning the whole impression model at each position point by using a laser confocal microscope to obtain corresponding three-dimensional images at the plurality of position points;
and fourthly, splicing and restoring the three-dimensional image of each position point into a three-dimensional edge data model through computer software.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, numerous simple modifications can be made to the technical solution of the invention, including combinations of the specific features in any suitable way, and the invention will not be further described in relation to the various possible combinations in order to avoid unnecessary repetition. Such simple modifications and combinations should be considered within the scope of the present disclosure as well.
Claims (12)
1. A method for detecting the edge profile of a wafer is characterized by comprising the following steps:
clamping a wafer (1) on a clamp, and arranging a stamping agent on a supporting disc (9);
pressing the edge to be formed of the wafer (1) into a stamping agent, rolling the wafer (1) along a linear direction parallel to the support plate (9), and rolling the edge to be formed of the wafer (1) on the stamping agent to form a stamping model;
step three, using a laser confocal microscope to successively and continuously scan the impression model at different positions along the linear direction to obtain three-dimensional images of the impression model at different positions;
and fourthly, splicing the three-dimensional images of the impression model at different positions by using computer software to obtain a three-dimensional edge data model of the wafer (1).
2. The method for detecting the edge profile of a wafer according to claim 1, wherein the clamp comprises two clamping pieces (2) similar to the profile of the wafer (1), and in step one, the clamp clamps the wafer (1) in a manner that the two clamping pieces (2) are aligned with each other, and the edge to be formed of the wafer (1) radially protrudes relative to the edges of the clamping pieces (2).
3. The method for detecting the edge profile of the wafer as claimed in claim 2, wherein a gear (3) is arranged on the back surface of the clamping piece (2), a rack (10) extending parallel to the supporting plate (9) is arranged on the supporting plate (9), and the gear (3) can be meshed with the rack (10) and roll on the rack (10).
4. The method for detecting the edge profile of a wafer as claimed in claim 3, wherein magnets (4) are provided on the gear (3), wherein the magnets (4) on one of the jaws (2) are rotatable between a locked position, in which the two magnets (4) are attracted to each other so that the two jaws (2) can clamp the wafer (1), and an unlocked position, in which the two magnets (4) repel each other so that the two jaws (2) are separated from each other.
5. The method for detecting the edge profile of a wafer as claimed in claim 4, wherein the magnet (4) is provided with a knob portion (5).
6. The method for detecting the edge profile of a wafer according to claim 3, wherein in step one, a part of the edge to be formed of the wafer (1) is clamped on a clamping ruler, and then the clamping piece (2) is clamped on the wafer (1) by using the clamping ruler as a limiting boundary,
wherein, press from both sides the chi including first ruler (6) and second ruler (7) and third ruler (8) of crossing the connection perpendicularly, third ruler (8) perpendicular to first ruler (6) and be on a parallel with second ruler (7), first ruler (6), second ruler (7) with third ruler (8) orientation is located between the three all be provided with the centre gripping on each side of wafer (1) wait the recess at shaping edge.
7. The method of detecting a wafer edge profile as claimed in claim 6, characterized in that the third straightedge (8) is movable towards the second straightedge (7) to clamp the wafer (1) between the first straightedge (6), the second straightedge (7) and the third straightedge (8).
8. The method as claimed in claim 6, wherein the edge to be formed has a radial dimension of 1mm to 2mm and a thickness of 0.5mm to 1mm, the depth of the groove is equal to the radial dimension of the edge to be formed, and the width of the groove is equal to the thickness of the edge to be formed.
9. The method for detecting the edge profile of a wafer as claimed in claim 6, wherein the wafer (1) is provided with a positioning edge, the clamping piece (2) is provided with a cutting edge corresponding to the positioning edge, and the positioning edge is inserted into the groove in the first step.
10. The wafer edge profile detection method according to claim 3, characterized in that a support plate (11) extending vertically is arranged on the support plate (9), and the rack (10) is located on the upper side edge of the support plate (11).
11. The method as claimed in claim 1, wherein the molding compound is silicone rubber or ether rubber.
12. The method for detecting the edge profile of a wafer as claimed in claim 1, characterized in that the clamping piece (2) is provided with a polypropylene coating and the surface of the clamping piece (2) facing the wafer (1) is provided with a dust-free pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911036983.3A CN110940288B (en) | 2019-10-29 | 2019-10-29 | Method for detecting wafer edge profile |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911036983.3A CN110940288B (en) | 2019-10-29 | 2019-10-29 | Method for detecting wafer edge profile |
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| CN110940288A true CN110940288A (en) | 2020-03-31 |
| CN110940288B CN110940288B (en) | 2023-06-20 |
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| US5422724A (en) * | 1992-05-20 | 1995-06-06 | Applied Materials, Inc. | Multiple-scan method for wafer particle analysis |
| JP2003148945A (en) * | 2001-11-13 | 2003-05-21 | Hitachi High-Technologies Corp | System and method for measuring three-dimensional shape of fine pattern |
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| CN104061857A (en) * | 2014-06-16 | 2014-09-24 | 江西赛维Ldk太阳能高科技有限公司 | Guiding wheel structure parameter detecting method |
| US20150125657A1 (en) * | 2012-04-12 | 2015-05-07 | Maha-Aip Gmbh & Co. Kg | Road surface covering elements for a chassis dynamometer |
| CN106486406A (en) * | 2016-10-21 | 2017-03-08 | 杭州长川科技股份有限公司 | The pre- alignment device of IC wafers and pre- alignment method |
| US20170372988A1 (en) * | 2016-06-23 | 2017-12-28 | Nxp B.V. | Wafer level chip scale semiconductor package |
| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
-
2019
- 2019-10-29 CN CN201911036983.3A patent/CN110940288B/en active Active
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| US5422724A (en) * | 1992-05-20 | 1995-06-06 | Applied Materials, Inc. | Multiple-scan method for wafer particle analysis |
| JP2003148945A (en) * | 2001-11-13 | 2003-05-21 | Hitachi High-Technologies Corp | System and method for measuring three-dimensional shape of fine pattern |
| US20080144006A1 (en) * | 2004-05-17 | 2008-06-19 | Schott Ag | Method for Measuring Topographic Structures on Devices |
| US20150125657A1 (en) * | 2012-04-12 | 2015-05-07 | Maha-Aip Gmbh & Co. Kg | Road surface covering elements for a chassis dynamometer |
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| CN110940288B (en) | 2023-06-20 |
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