CN110933574B

CN110933574B - Loudspeaker

Info

Publication number: CN110933574B
Application number: CN201911209214.9A
Authority: CN
Inventors: 汪犟
Original assignee: Jiekai Communications Shenzhen Co Ltd
Current assignee: Jiekai Communications Shenzhen Co Ltd
Priority date: 2019-11-30
Filing date: 2019-11-30
Publication date: 2021-06-15
Anticipated expiration: 2039-11-30
Also published as: CN110933574A

Abstract

The utility model relates to a loudspeaker, this loudspeaker includes the casing, install the flexible circuit board on the casing, be located the connection shell fragment on the flexible circuit board, and be located the loudspeaker body on the connection shell fragment, wherein, be equipped with contact pad and first locating hole on the flexible circuit board, the lower extreme and the contact pad electrical contact of connecting the shell fragment, the upper end is connected with loudspeaker body electricity, be equipped with the locating surface on the casing, and with the first locating post of first locating hole matching, the locating surface is used for the mounted position of mark flexible circuit board on the casing. Through this kind of mode, when manual installation flexible circuit board, can combine locating hole, reference column and locating surface to carry out accurate location installation to flexible circuit board, and then avoid appearing loudspeaker connection shell fragment and flexible circuit board can not contact or contact failure's problem.

Description

Loudspeaker

Technical Field

The application relates to the technical field of loudspeakers, in particular to a loudspeaker.

Background

The existing loudspeaker generally comprises a loudspeaker body, a flexible circuit board and a shell, wherein the flexible circuit board is provided with a positioning hole, the shell is provided with a positioning column corresponding to the positioning hole, the flexible circuit board is positioned and installed on the shell through the positioning hole and the positioning column, and the loudspeaker body is positioned on the flexible circuit board and is in contact with the flexible circuit board through an elastic sheet to transmit an electric signal.

However, the height of the positioning column on the housing is limited and small, which may cause the problems of inaccurate positioning and installation deviation when the flexible circuit board is manually installed, and further cause the problems that the speaker elastic sheet and the flexible circuit board cannot be contacted or are not contacted well.

Disclosure of Invention

An object of this application is to provide a speaker to the problem that appears unable pinpointing and installation skew when avoiding manual installation flexible circuit board, and then avoids loudspeaker shell fragment and flexible circuit board can not contact or contact failure's problem.

In order to solve the above problem, an embodiment of the present application provides a speaker, including: the loudspeaker comprises a shell, a flexible circuit board arranged on the shell, a connecting elastic sheet positioned on the flexible circuit board and a loudspeaker body positioned on the connecting elastic sheet; the flexible circuit board is provided with a contact pad and a first positioning hole, the lower end of the connecting elastic sheet is in electrical contact with the contact pad, the upper end of the connecting elastic sheet is electrically connected with the loudspeaker body, the shell is provided with a positioning surface and a first positioning column matched with the first positioning hole, and the positioning surface is used for marking the installation position of the flexible circuit board on the shell.

The positioning surface is obtained by polishing a preset area on the upper surface of the shell.

The shape and the size of the positioning surface are matched with those of the cross section of the flexible circuit board.

The flexible circuit board comprises a first area and a second area which are adjacent, the contact pad is located in the second area, and the first positioning hole is located in the first area.

The flexible circuit board is further provided with a connecting pad and a wire, the connecting pad is located on the first area, and the wire is located between the connecting pad and the contact pad and used for connecting the connecting pad and the contact pad.

The number of the connecting bonding pads is two, the two connecting bonding pads are arranged at intervals, and the first positioning hole is located outside an interval area between the two connecting bonding pads.

The flexible circuit board is further provided with a second positioning hole, the shell is provided with a second positioning column matched with the second positioning hole, and the second positioning hole is located in the second area.

The number of the contact pads is two, the two contact pads are arranged at intervals, and the second positioning hole is located outside an interval area between the two contact pads.

The flexible circuit board further comprises a bending area, the bending area is located between the first area and the second area, the upper surface of the shell protrudes upwards to form a step, the step comprises an upper step surface, a side step surface and a lower step surface which are sequentially connected, the first area is located on the upper step surface, the bending area is located on the side step surface, and the second area is located on the lower step surface.

Wherein, the height of the first positioning column is not higher than the thickness of the flexible circuit board.

The beneficial effect of this application is: be different from prior art, the speaker that this application provided, which comprises a housin, install the flexible circuit board on the casing, be located the connection shell fragment on the flexible circuit board, and be located the loudspeaker body on the connection shell fragment, wherein, be equipped with contact pad and first locating hole on the flexible circuit board, the lower extreme and the contact pad electrical contact of connecting the shell fragment, the upper end is connected with loudspeaker body electricity, be equipped with the locating surface on the casing, and the first locating column that matches with first locating hole, the locating surface is used for marking the mounted position of flexible circuit board on the casing, thereby, when installing flexible circuit board by hand, can combine the locating hole, locating column and locating surface carry out accurate location installation to flexible circuit board, and then avoid appearing loudspeaker connection shell fragment and flexible circuit board can not contact or contact failure's problem.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic top view of a speaker according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1;

FIG. 3 is a schematic structural view of the housing of FIG. 1;

FIG. 4 is a schematic diagram of the structure of the flexible circuit board of FIG. 1;

FIG. 5 is another schematic structural diagram of a flexible circuit board provided in an embodiment of the present application;

fig. 6 is another schematic structural diagram of a flexible circuit board provided in an embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.

It should be noted that directional terms mentioned in the present application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], and the like, refer to directions of the attached drawings only. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals. In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

At present, the speaker generally includes the loudspeaker body, flexible circuit board and casing, wherein, be equipped with the locating hole on the flexible circuit board, be equipped with the reference column that corresponds with this locating hole on the casing, the flexible circuit board passes through locating hole and reference column location installation on the casing, the loudspeaker body is located the flexible circuit board, and with this flexible circuit board between transmit the signal of telecommunication through the shell fragment contact, however, because the height of reference column is restricted and less on the casing, can lead to the unable accurate positioning of appearance when the flexible circuit board is installed by hand, and paste the problem of skew, and then lead to the problem that loudspeaker shell fragment and flexible circuit board can not contact or contact failure. In order to solve the problems, the technical scheme adopted by the application is to provide the loudspeaker so as to avoid the problems of incapability of accurately positioning and installation deviation when the flexible circuit board is manually pasted, and further avoid the problems that the loudspeaker elastic sheet cannot be contacted with or is not in contact with the flexible circuit board.

Referring to fig. 1 to 4, fig. 1 is a schematic top view structure diagram of a speaker according to an embodiment of the present disclosure, fig. 2 is a schematic cross-sectional structure diagram taken along a line a-a' in fig. 1, fig. 3 is a schematic structural diagram of a housing in fig. 1, and fig. 4 is a schematic structural diagram of a flexible circuit board in fig. 1. As shown in fig. 1 to 4, the speaker 10 includes a housing 11, a flexible circuit board 12 mounted on the housing 11, a connection spring 13 located on the flexible circuit board 12, and a speaker body 14 located on the connection spring 13. The flexible circuit board 12 is provided with a contact pad 121 and a first positioning hole 122, the lower end 13R of the connecting spring piece 13 is electrically contacted with the contact pad 121, the upper end of the connecting spring piece is electrically connected with the horn body 14, the shell 11 is provided with a positioning surface 11R and a first positioning column 111 matched with the first positioning hole 122, and the positioning surface 11R is used for marking the installation position of the flexible circuit board 12 on the shell 11.

In this embodiment, the positioning surface 11R is located in the upper surface of the housing 11, and a region of the upper surface of the housing 11 other than the positioning surface 11R can be used as a non-positioning surface, wherein the positioning surface 11R can be distinguished from the non-positioning surface by different colors and/or different roughnesses.

For example, a polishing process may be performed on a predetermined area of the upper surface of the housing 11 mechanically or chemically, so as to reduce the surface roughness of the predetermined area of the upper surface of the housing 11, thereby obtaining a bright and flat positioning surface 11R. The chemical polishing may be performed by regularly dissolving a predetermined area of the upper surface of the housing 11 to achieve smoothness and flatness; the mechanical polishing may be performed by cutting a predetermined area of the upper surface of the housing 11 so that the predetermined area of the upper surface of the housing 11 is plastically deformed to remove the polished convex portion to obtain a smooth surface. Further, in some embodiments, before polishing the preset region of the upper surface of the housing 11, the preset region of the upper surface of the housing 11 may be polished, and then the polished preset region of the upper surface of the housing 11 may be polished, so that the polishing effect is better, and the formed positioning surface 11R is smoother. Here, it should be noted that the grinding process may be understood as rough machining before the polishing process, that is, a preset area on the upper surface of the housing 11 may be subjected to rough grinding and then to fine grinding to complete the polishing process.

When the flexible circuit board 12 is mounted on the housing 11, the first positioning post 111 on the housing 11 is embedded in the first positioning hole 122 on the flexible circuit board 12, wherein the shape of the first positioning hole 122 on the flexible circuit board 12 may be one or more of circular, rectangular, triangular, oval, or racetrack-shaped geometric shapes, and the cross-sectional shape of the first positioning post 111 on the housing 11 may be the same as the shape of the corresponding first positioning hole 122.

In this embodiment, the positioning surface 11R on the upper surface of the housing 11 is used to mark the installation position of the flexible circuit board 12 on the housing 11, specifically, when the speaker 10 fails and the flexible circuit board 12 needs to be replaced, a maintenance worker may firstly set the first positioning hole 122 on the flexible circuit board 12 on the corresponding first positioning post 111 on the housing 11, wherein the first positioning hole 122 and the first positioning post 111 may be set by interference or by clearance, so as to preliminarily determine the installation position of the flexible circuit board 12, and then may refer to the boundary line between the positioning surface 11R in the upper surface of the housing 11 and the non-positioning surface, so as to accurately determine the installation position of the flexible circuit board 12. The shape and size of the positioning surface 11R may be matched with the shape and size of the cross section of the flexible circuit board 12, that is, when the flexible circuit board 12 is accurately mounted on the housing 11, the contact boundary line between the flexible circuit board 12 and the housing 11 and the boundary line between the positioning surface 11R and the non-positioning surface at least partially coincide with each other, for example, as shown in fig. 3 and 4, the shape and size of the positioning surface 11R may be completely the same as the shape and size of the cross section of the flexible circuit board 12, where it should be noted that, in this embodiment, the same shape and size of the two surfaces means the same shape and size of the overall outline of the two surfaces, and the difference of details in the two surfaces is neglected.

Thus, with the speaker design in the present application, when the speaker 10 fails and the flexible circuit board 12 needs to be manually replaced, the first positioning hole 122 located on the flexible circuit board 12, the first positioning post 111 and the positioning surface 11R located on the housing 11 can be utilized to accurately determine the mounting position of the flexible circuit board 12 on the housing 11, thereby avoiding the problem that the contact between the connection elastic sheet 13 and the contact pad 121 on the flexible circuit board 12 is poor or unable to contact due to the installation offset of the flexible circuit board 12, and further avoiding the speaker failure.

In some embodiments, an adhesive layer (not shown) may be further disposed between the flexible circuit board 12 and the housing 11, wherein a relief hole corresponding to the first positioning hole 122 may be disposed on the adhesive layer, and the flexible circuit board 12 is bonded to the housing 11 through the adhesive layer, so as to fix the flexible circuit board 12 on the housing 11, specifically, the adhesive layer may be a double-sided adhesive layer or a back adhesive layer.

In this embodiment, the speaker body 14 may include a voice coil (not shown), wherein the upper end of the connecting spring 13 may be fixedly disposed on the bottom surface of the speaker body 14 and electrically connected to the voice coil of the speaker body 14. Specifically, as shown in fig. 2, the number of the connecting elastic pieces 13 may be two, and the two connecting elastic pieces 13 may be electrically connected to the positive electrode and the negative electrode of the voice coil of the speaker body 14, respectively.

Further, with reference to fig. 2, the number of the contact pads 121 may also be two, and the two contact pads 121 are electrically contacted with the corresponding connection elastic pieces 13 respectively, so as to realize the one-to-one corresponding electrical connection between the positive and negative electrodes of the voice coil of the speaker body 14 and the two contact pads 121 on the flexible circuit board 12. Specifically, the lower end 13R of the connecting elastic sheet 13 may adopt a folded edge design, for example, as shown in fig. 2, the lower end 13R of the connecting elastic sheet 13 may have a contact surface 13R horizontally arranged, and the connecting elastic sheet 13 is in surface contact with the upper surface of the contact pad 121 on the flexible circuit board 12 through the contact surface 13R, so that the contact pad 121 on the flexible circuit board 12 and the connecting elastic sheet 13 can be in sufficient contact, and it should be noted that, for convenience of description, the same structure at the same position is given the same device name.

In some embodiments, as shown in fig. 5, the flexible circuit board 12 may include a first region 12R and a second region 12RR that are adjacently disposed, wherein the contact pad 121 is located on the second region 12RR of the flexible circuit board 12, and the first positioning hole 122 is located on the first region 12R of the flexible circuit board 12, so that the first positioning hole 122 is disposed on a side region of the region where the contact pad 121 is located, that is, the first positioning column 111 will not be present in the second region 12RR where the contact pad 121 is located, and therefore, the situation that the first positioning column 111 abuts against the speaker body 14 due to the fact that the first positioning column 111 is located below the speaker body 14 can be avoided, and thus, speaker failure is reduced.

In addition, considering that the thickness of the speaker body 14 is generally large due to its own structural characteristics, the upper surface of the housing 11 may be protruded upward to form a step (not shown), and correspondingly, the flexible circuit board 12 may further include a bending region (not shown) connected to and between the first region 12R and the second region 12RR, wherein the step may include an upper step surface, a side step surface and a lower step surface which are connected in sequence, specifically, when the flexible circuit board 12 is mounted on the housing 11, the first region 12R of the flexible circuit board 12 is located on the upper step surface of the step, the bending region of the flexible circuit board 12 is located on the side step surface of the step, the second region 12RR of the flexible circuit board 12 is located on the lower step surface of the step, and when the speaker body 14 is electrically contacted with the flexible circuit board 12 through the connection elastic piece 13, the speaker body 14 is located directly above the second region 12RR of the flexible circuit board 12.

Further, with reference to fig. 5, the flexible circuit board 12 may further include two connection pads 123, and the two connection pads 123 are electrically connected to the two contact pads 121 on the flexible circuit board 12 in a one-to-one correspondence manner. Specifically, the flexible circuit board 12 may be connected to an external circuit through the two connection pads 123 to obtain the operating voltage of the horn body 14.

In an embodiment, with continued reference to fig. 5, the connection pad 123 is located on the first region 12R of the flexible circuit board 12, the contact pad 121 is located on the second region 12RR of the flexible circuit board 12, and a trace 124 may be further disposed on the flexible circuit board 12, wherein the trace 124 is located between the connection pad 123 and the contact pad 121 for electrically connecting the connection pad 123 and the contact pad 121.

Specifically, as shown in fig. 5, two connection pads on the flexible circuit board 12 may be disposed at intervals on the flexible circuit board 12, and the first positioning hole 122 on the flexible circuit board 12 is located outside the interval region between the two connection pads 123, so as to prevent the first positioning hole 122 from occupying the gold pad area between the connection pads 123, and further, the connection pads 123 with a larger upper surface area are favorably designed, and thus, the electrical connection effect between the connection pads 123 and the external circuit is improved.

In some embodiments, as shown in fig. 6, a second positioning hole 125 may be further disposed on the flexible circuit board 12, and correspondingly, a second positioning post (not shown) matching with the second positioning hole 125 may be disposed on the housing 11, specifically, when the flexible circuit board 12 is mounted on the housing 11, the second positioning post on the housing 11 may be embedded in the second positioning hole 125 on the flexible circuit board 12, wherein the shape of the second positioning hole 125 on the flexible circuit board 12 may be one or more of geometric shapes such as a circle, a rectangle, a triangle, an ellipse, or a racetrack, and the cross-sectional shape of the second positioning post on the housing 11 may be the same as the shape of the corresponding second positioning hole 125.

As shown in fig. 6, the second positioning hole 125 located on the flexible circuit board 12 may be specifically located on the second region 12RR of the flexible circuit board 12. Specifically, when the speaker 10 fails and the flexible circuit board 12 needs to be replaced, a maintenance person may first set the first positioning hole 122 on the flexible circuit board 12 to the corresponding first positioning post 111 on the housing 11, and set the second positioning hole 122 on the flexible circuit board 12 to the corresponding second positioning post on the housing 11, so as to preliminarily determine the mounting position of the flexible circuit board 12 on the housing 11, and then may refer to the boundary line between the positioning surface 11R and the non-positioning surface on the upper surface of the housing 11, so as to accurately determine the mounting position of the flexible circuit board 12 on the housing 11. Therefore, the first region 12R and the second region 12RR of the flexible circuit board 12 are correspondingly provided with the positioning holes, which is beneficial to further improving the efficiency of manually replacing the flexible circuit board 12 of the loudspeaker 10.

In addition, in some embodiments, in order to avoid the situation that the first positioning post 111 and the second positioning post corresponding to the first positioning hole 122 and the second positioning hole 125 abut against the speaker main body 14 located above the flexible circuit board 12 due to their heights being too high, the heights of the first positioning post 111 and the second positioning post on the housing 11 may be set to be not higher than the thickness of the flexible circuit board 11, that is, the first positioning post 111 may be completely accommodated in the first positioning hole 122 of the flexible circuit board 12, and the second positioning post may be completely accommodated in the second positioning hole 125 of the flexible circuit board 12.

With reference to fig. 6, the number of the contact pads 121 on the flexible circuit board 12 is two, the two contact pads 121 may be disposed on the flexible circuit board 122 at an interval, and the second positioning hole 125 on the flexible circuit board 12 is located outside an interval region between the two contact pads 121, so as to prevent the second positioning hole 125 from occupying a pad gold area between the contact pads 121, thereby facilitating the design of obtaining the contact pad 121 with a larger upper surface area, and improving an electrical contact effect between the contact pad 121 and the lower end 13R of the connecting elastic piece 13.

In some embodiments, as shown in fig. 6, when the number of the connection pads 123 is two, the connection pads 123 may be disposed on the flexible circuit board 12 at a staggered interval, and the number of the first positioning holes 122 may be at least one, for example, when the number of the first positioning holes 122 is two, the two first positioning holes 122 may be disposed on the side regions of the two contact pads 123 disposed at the staggered interval, respectively.

In some embodiments, the number of the second positioning holes 125 may be at least one, and when the height of the second positioning column on the housing 11 corresponding to the second positioning hole 125 is not higher than the thickness of the flexible circuit board 12, the at least one second positioning hole 125 may be disposed on the spaced area between the two contact pads 121 disposed at the interval, so as to further improve the efficiency of manually replacing the flexible circuit board 12 of the speaker 10. In practice, the number of the second positioning holes disposed in the spacing region between the two contact pads 121 disposed at the above interval should be appropriate, and should not be too large, so as to avoid the second positioning holes 125 occupying too much pad gold area between the contact pads 121.

In the above embodiment, the housing 11 of the speaker 10 may be specifically a lower housing 11 of the speaker 10, and further, the speaker 10 may further include an upper housing (not shown), wherein the flexible circuit board 12, the connection elastic piece 13, and the speaker body 14 are accommodated in a casing formed by the upper housing and the lower housing 11, and the lower housing 11 may be made of plastic.

Specifically, above-mentioned loudspeaker body 14 can specifically include vibration system and magnetic circuit, vibration system includes the vibrating diaphragm and is fixed in the voice coil loudspeaker voice coil on the vibrating diaphragm, magnetic circuit is provided with the magnetic gap, the voice coil loudspeaker voice coil sets up in the magnetic gap, the voice coil loudspeaker voice coil passes through the voice coil loudspeaker voice coil lead wire and is connected the shell fragment 13 electricity with the aforesaid, wherein, outside electronic signal passes through above-mentioned connection pad 123 in proper order, walk line 124, contact pad 121 and connect in the shell fragment 13 gets into the voice coil loudspeaker voice coil, later set up the voice coil loudspeaker voice coil internal current in the magnetic gap and change and make the voice coil loudspeaker voice coil receive magnetic. Specifically, the voice coil lead in the speaker body 14 may be electrically connected to the connecting spring 13 by soldering.

In addition, in the assembly and production process of the speaker 10, in order to achieve good electrical contact between the lower end 13R of the connecting elastic piece 13 and the contact pad 121 on the flexible circuit board 12, the speaker body 14 with the connecting elastic piece 13 connected to the bottom thereof needs to be fixed on the inner surface of the upper housing of the speaker 10, and the flexible circuit board 12 needs to be fixed on the inner surface of the lower housing 11 of the speaker 10, and then the upper housing and the lower housing 11 can be fixed into a whole by using fixing methods such as a buckle or a screw, so as to achieve tight contact between the bottom 13R of the connecting elastic piece 13 and the upper surface of the contact pad 121 on the flexible circuit board 12.

In the above embodiment, the speaker 10 may be disposed in an electronic device, wherein the electronic device may be a smart phone, a smart computer, a smart speaker, or the like.

Be different from prior art, speaker in this embodiment, which comprises a housin, install the flexible circuit board on the casing, be located the connection shell fragment on the flexible circuit board, and be located the loudspeaker body on the connection shell fragment, wherein, be equipped with contact pad and first locating hole on the flexible circuit board, the lower extreme and the contact pad electrical contact of connecting the shell fragment, the upper end is connected with loudspeaker body electricity, be equipped with the locating surface on the casing, and the first locating column that matches with first locating hole, the locating surface is used for marking the mounted position of flexible circuit board on the casing, thereby, when installing flexible circuit board by hand, can combine the locating hole, locating column and locating surface carry out accurate location installation to flexible circuit board, and then avoid appearing loudspeaker connection shell fragment and flexible circuit board can not contact or contact failure's problem.

The foregoing detailed description is directed to a speaker provided in the embodiments of the present application, and the principles and embodiments of the present application are described herein by using specific examples, which are only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A loudspeaker, comprising:

the loudspeaker comprises a shell, a flexible circuit board arranged on the shell, a connecting elastic sheet positioned on the flexible circuit board, and a loudspeaker body positioned on the connecting elastic sheet;

the loudspeaker shell is characterized in that a contact pad and a first positioning hole are formed in the flexible circuit board, the lower end of the connecting elastic sheet is in electrical contact with the contact pad, the upper end of the connecting elastic sheet is electrically connected with the loudspeaker body, a positioning face and a first positioning column matched with the first positioning hole are formed in the shell, the positioning face is used for marking the installation position of the flexible circuit board on the shell, the positioning face is located in the upper surface of the shell, the area, except the positioning face, of the upper surface of the shell is a non-positioning face, and the positioning face is distinguished from the non-positioning face through different colors and/or different roughness.

2. The speaker of claim 1, wherein the positioning surface is obtained by polishing a predetermined area of the upper surface of the housing.

3. The loudspeaker of claim 1, wherein the shape and size of the locating surface matches the shape and size of the cross-section of the flexible circuit board.

4. The loudspeaker of claim 1, wherein the flexible circuit board includes adjacent first and second regions, the contact pad being located in the second region, the first locating hole being located in the first region.

5. The loudspeaker of claim 4, wherein the flexible circuit board further comprises a connection pad and a trace, the connection pad is located on the first region, and the trace is located between the connection pad and the contact pad for connecting the connection pad and the contact pad.

6. The speaker of claim 5, wherein the number of the connection pads is two, the two connection pads are spaced apart, and the first positioning hole is located outside a spaced area between the two connection pads.

7. The speaker of claim 4, wherein the flexible circuit board further has a second positioning hole, and the housing has a second positioning post matching with the second positioning hole, and the second positioning hole is located in the second area.

8. The loudspeaker of claim 7, wherein the number of the contact pads is two, the two contact pads are spaced apart, and the second positioning hole is located outside a spacing region between the two contact pads.

9. The speaker of claim 4, wherein the flexible circuit board further comprises a bending region, the bending region is located between the first region and the second region, the upper surface of the housing protrudes upward to form a step, the step comprises an upper step surface, a side step surface and a lower step surface which are connected in sequence, the first region is located on the upper step surface, the bending region is located on the side step surface, and the second region is located on the lower step surface.

10. The loudspeaker of claim 1, wherein the height of the first positioning post is no greater than the thickness of the flexible circuit board.