CN110931941A - AiP slot antenna packaging structure and preparation method thereof - Google Patents
AiP slot antenna packaging structure and preparation method thereof Download PDFInfo
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- CN110931941A CN110931941A CN201911240771.7A CN201911240771A CN110931941A CN 110931941 A CN110931941 A CN 110931941A CN 201911240771 A CN201911240771 A CN 201911240771A CN 110931941 A CN110931941 A CN 110931941A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/106—Microstrip slot antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
Abstract
The invention discloses an AiP slot antenna packaging structure, which comprises: a first plastic packaging layer; the first metal layer covers the upper surface of the first plastic packaging layer; an antenna slot disposed in the first metal layer; the second metal layer is arranged on the lower surface of the first plastic packaging layer and is connected and grounded; a waveguide signal feed-in port disposed on the second metal layer; the second plastic packaging layer is arranged below the second metal layer; the chip is coated by the second plastic packaging layer, and pins on the front surface of the chip are leaked from the bottom surface of the second plastic packaging layer; the waveguide signal feed-in structure penetrates through the second plastic packaging layer and is coupled with the waveguide signal feed-in port; a re-layout wiring layer, which is arranged below the second plastic packaging layer and is electrically connected to the waveguide signal feed-in structure and the pins of the chip; and the external solder balls are arranged below the second re-layout wiring layer and are electrically connected to the second re-layout wiring layer.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure of a packaged Antenna AiP (Antenna-in-Package) slot Antenna in a radio frequency communication technology and a preparation method thereof.
Background
Antennas are important components in wireless systems, both in isolation and in integration. Separate antennas are common, and integrated antennas have also silently entered our line of sight. Integrated antennas include both on-chip antennas (AoC) and packaged Antennas (AiP).
AiP is a technology for integrating antenna and chip in package based on packaging material and process to realize system-level wireless function. AiP technology is in line with the trend of increasing the integration level of silicon-based semiconductor technology, and provides a good antenna solution for system-level wireless chips, thus being popular with the manufacturers of chips and packages. AiP technology has a good compromise between antenna performance, cost and volume, and represents an important achievement in antenna technology in recent years. In addition, AiP technology extends antenna antennas to the fields of integrated circuits, packaging, materials and processes, and calls for multidisciplinary collaborative design and system level optimization.
The SiP technology can improve system performance and reduce system power consumption, but different materials and processes are adopted for manufacturing functional modules and packages of the existing Aip antenna, which can cause problems of reduced system reliability, increased system cost and the like.
Disclosure of Invention
To solve the problems in the prior art, according to an embodiment of the present invention, there is provided an AiP slot antenna package structure, including:
a first plastic packaging layer;
the first metal layer covers the upper surface of the first plastic packaging layer;
an antenna slot disposed in the first metal layer;
the second metal layer is arranged on the lower surface of the first plastic packaging layer and is connected and grounded;
a waveguide signal feed-in port disposed on the second metal layer;
the second plastic packaging layer is arranged below the second metal layer;
the chip is coated by the second plastic packaging layer, and pins on the front surface of the chip are leaked from the bottom surface of the second plastic packaging layer;
the waveguide signal feed-in structure penetrates through the second plastic packaging layer and is coupled with the waveguide signal feed-in port;
a re-layout wiring layer, which is arranged below the second plastic packaging layer and is electrically connected to the waveguide signal feed-in structure and the pins of the chip; and
and the external solder balls are arranged below the second re-layout wiring layer and are electrically connected to the second re-layout wiring layer.
In one embodiment of the present invention, the AiP slot antenna package structure further includes a conductive compartment wall disposed inside the first molding layer, the conductive compartment wall dividing the first molding layer into a plurality of compartments.
In an embodiment of the present invention, the material of the conductive partition wall is metal, conductive silver paste or conductive adhesive.
In one embodiment of the invention, said first metal layer, said antenna slot, said second metal layer and/or said electrically conductive compartment wall together constitute one or more rectangular waveguides with slot antennas.
In an embodiment of the present invention, the waveguide signal feeding structure is formed by a ring-shaped conductive structure and a second conductive structure disposed inside the ring-shaped conductive structure, or a group of annularly arranged conductive structures and a second conductive structure disposed inside the group of annularly arranged conductive structures.
In an embodiment of the present invention, the material of the waveguide signal feeding structure is metal, conductive silver paste or conductive adhesive.
In one embodiment of the invention, the second conductive structure protrudes upwardly from the plane of the second metal layer, deep inside the waveguide cavity.
In one embodiment of the present invention, the side metal layer is made of metal or conductive adhesive.
According to another embodiment of the present invention, there is provided a manufacturing method of an AiP slot antenna package structure, including:
carrying out plastic package on the chip to form a first plastic package layer for coating the chip;
forming a first re-layout wiring layer on the lower surface of the first plastic packaging layer and the front surface of the chip;
forming a waveguide signal feed-in structure in the first plastic package layer, forming a first metal layer on the upper surface of the first plastic package layer, and forming a waveguide signal feed-in port at a position corresponding to the waveguide signal feed-in structure;
forming a second plastic packaging layer above the first metal layer;
forming a waveguide side wall in the second plastic packaging layer;
manufacturing a second metal layer on the upper surface of the second plastic packaging layer, and manufacturing a gap at a corresponding position, thereby forming a gap antenna;
and forming an external solder ball electrically connected with the first re-layout wiring layer.
In another embodiment of the present invention, forming a conductive partition wall inside the second molding layer is further included.
The invention provides an AiP slot antenna packaging structure and a preparation method thereof, which adopts a multilayer plastic packaging layer structure (such as a fan-out structure, Fanout), after forming metal covering on the upper surface of a top layer plastic packaging layer, a slot is manufactured at a proper position to form a slot antenna, a waveguide signal feed inlet is formed on the bottom surface of the top layer plastic packaging layer, required metal is formed on the bottom surface of the top layer plastic packaging layer and is grounded, and a waveguide side wall is formed on the top layer plastic packaging layer, so that the top layer plastic packaging layer structure forms a rectangular waveguide with the slot antenna; and forming a chip fan-out structure on the bottom plastic package layer, and forming a waveguide signal feed-in structure through the giant copper pillar, thereby forming an AiP slot antenna packaging structure. Meanwhile, a multi-channel AiP slot antenna packaging structure can be formed in a metal separation cavity mode on the top plastic package layer, and single-side multi-channel radiation is achieved. The AiP slot antenna packaging structure and the preparation method thereof can realize wafer-level packaging by combining a double-layer fan-out process with the processing of a plastic packaging layer conductive copper Pillar (Mega Pillar), and have the advantages of small thickness, multiple channels, multiple directions and low cost.
Drawings
To further clarify the above and other advantages and features of embodiments of the present invention, a more particular description of embodiments of the invention will be rendered by reference to the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be denoted by the same or similar reference numerals for clarity.
Fig. 1 shows a cross-sectional schematic view of an AiP slot antenna package structure 100 according to an embodiment of the invention.
Fig. 2A-2G illustrate cross-sectional views of a process for forming such an AiP slot antenna package structure 100 according to one embodiment of the invention.
Fig. 3 illustrates a flow diagram 300 for forming such an AiP slot antenna package structure 100 according to one embodiment of the invention.
Fig. 4 shows a cross-sectional schematic diagram of a multi-channel AiP slot antenna package structure 400 according to yet another embodiment of the invention.
Fig. 5 is a cross-sectional schematic diagram of a multi-channel AiP slot antenna package structure 500 according to yet another embodiment of the invention.
Detailed Description
In the following description, the invention is described with reference to various embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of embodiments of the invention. Similarly, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the invention may be practiced without specific details. Further, it should be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.
Reference in the specification to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.
It should be noted that, in the embodiments of the present invention, the process steps are described in a specific order, however, this is only for convenience of distinguishing the steps, and the order of the steps is not limited, and in different embodiments of the present invention, the order of the steps may be adjusted according to the adjustment of the process.
The invention provides an AiP slot antenna packaging structure and a preparation method thereof, which adopts a multilayer plastic packaging layer structure (such as a fan-out structure, Fanout), after forming metal cover on the upper surface of a top layer plastic packaging layer, a slot is manufactured at a proper position to form a slot antenna, a waveguide signal feed-in port is formed on the bottom surface of the top layer plastic packaging layer, required metal is formed on the bottom surface of the top layer plastic packaging layer and is grounded, conductive adhesive or metal is filled in a pilar copper column or a dug cavity of the top layer plastic packaging layer to form a waveguide side wall, so that the top layer plastic packaging layer structure forms a rectangular waveguide with the slot antenna; and forming a chip fan-out structure on the bottom plastic package layer, and forming a waveguide signal feed-in structure through the giant copper pillar, thereby forming an AiP slot antenna packaging structure. Meanwhile, a multi-channel AiP slot antenna packaging structure can be formed in a metal separation cavity mode on the top plastic package layer, and single-side multi-channel radiation is achieved. The AiP slot antenna packaging structure and the preparation method thereof can realize wafer-level packaging by combining a double-layer fan-out process with the processing of a plastic packaging layer conductive copper pillar (MegaPillar), and have the advantages of small thickness, multiple channels, multiple directions and low cost.
An AiP slot antenna package structure according to an embodiment of the invention is described in detail below with reference to fig. 1. Fig. 1 shows a cross-sectional schematic view of an AiP slot antenna package structure 100 according to an embodiment of the invention. As shown in fig. 1, the AiP slot antenna 100 further includes a first molding compound layer 101, a first metal layer 102, an antenna slot 103, a second metal layer 104, a waveguide signal feed port 104-1, a second molding compound layer 105, a chip 106, a second molding compound layer conductive via 107, a redistribution layer 108, an external solder ball 109, and a waveguide sidewall 110.
The first molding layer 101 is located above the AiP slot antenna package structure 100 and is molded with a molding material such as resin.
The first metal layer 102 is disposed on the upper surface of the first molding compound layer 101, and covers the entire upper surface of the first molding compound layer 101, while the first metal layer 102 is grounded. First metal layer 102 may be made of a metal material such as copper or nickel, and may be formed by plating, sputtering, or copper-clad lamination.
The antenna slot 103 is disposed on the first metal layer 102, and its specific position and size are determined according to design requirements. The antenna slot 103 and the corresponding first metal layer 102 together constitute a slot antenna.
The second metal layer 104 is disposed on the bottom surface of the first molding compound layer 101, a waveguide signal feed port 104-1 is disposed at a predetermined position, and a full-coverage metal layer is formed on the bottom surface outside the waveguide signal feed port 104-1 and is connected to ground.
The second molding compound layer 105 is disposed below the second metal layer 104, and the second molding compound layer 105 is mainly used for wafer reconfiguration of the chips 106 therein to realize Fan-out (Fan out).
The chip 106 is arranged to be encapsulated by the second molding layer 105. In one embodiment of the present invention, the top and side surfaces of the chip 106 are covered by the second molding layer 105, and the bottom surface leaks from the bottom surface of the second molding layer 105, thereby achieving leakage of the electrodes.
The second plastic package layer 105 is arranged in the second plastic package layer conductive through hole 107, and the second plastic package layer conductive through hole 107 penetrates through the second plastic package layer 105, and forms a waveguide signal feed-in transmission structure, and is connected with the waveguide signal feed-in port 104-1, so that transmission of antenna signals is realized.
The re-layout wiring layer 108 is disposed on the bottom surface of the second molding layer 105, and is electrically connected to the pads of the chip 106 and the second molding layer conductive vias 107, so as to achieve electrical and/or signal interconnection and communication. In one embodiment of the present invention, the second re-layout wiring layer 108 has a single layer or a plurality of layers.
External connection solder balls 109 are provided at the external connection pads of the second re-layout wiring layer 180.
The waveguide sidewalls 110 are disposed through the first molding layer and are electrically connected to the fanout RDL ground plane so that the top fanout forms a rectangular waveguide with a slot antenna. In one embodiment of the invention, the waveguide sidewalls 110 are densely packed conductive copper pillars; in yet another embodiment of the present invention, the waveguide sidewalls 110 are formed by hollowing out a cavity filled with a conductive paste.
In addition, dielectric layers are disposed between the same metal layer of the redistribution layer 108 and between adjacent metal layers to perform insulating and mechanical supporting functions.
The process of forming the AiP slot antenna package structure 100 is described in detail below with reference to fig. 2A-2G and fig. 3. Fig. 2A-2G illustrate cross-sectional views of a process for forming an AiP slot antenna package structure 100 according to one embodiment of the invention; fig. 3 illustrates a flow diagram 300 for forming such an AiP slot antenna package structure 100 according to one embodiment of the invention.
First, in step 310, as shown in fig. 2A, the chip 201 is subjected to plastic molding to form a first molding layer 202 covering the chip 201. In an embodiment of the present invention, the step may be completed by attaching the chip 201 to a temporary carrier plate that can be detachably bonded, and after the step of molding, removing the temporary carrier plate by detaching the bonding, which is a conventional wafer reconfiguration process in a fan-out process.
Next, at step 320, as shown in fig. 2B, a first re-layout wiring layer 203 is formed on the lower surface of the first molding layer 202 and the front surface of the chip 201, and the first re-layout wiring layer 203 forms electrical and/or signal interconnections with the chip 201. In an embodiment of the present invention, the first re-layout wiring layer 203 may be formed by patterned plating, and the first re-layout wiring layer 203 may be a single layer or multiple layers according to design requirements, wherein an external connection pad (not shown in the figure) is further disposed on the outermost wiring layer.
Then, in step 330, as shown in fig. 2C, a first molding layer conductive via 204 is formed inside the first molding layer 202, and a first metal layer 205 is formed on the upper surface of the first molding layer 202, wherein a waveguide signal feed 205-1 is formed at a position corresponding to the first molding layer conductive via 204. In an embodiment of the present invention, the first plastic package layer conductive via 204 is a metal via formed by a via, electroplating, or the like, and plays a role in transmitting a waveguide signal after being fed.
Next, in step 340, as shown in fig. 2D, a second molding layer 206 is formed on the first metal layer 205.
Then, at step 350, as shown in fig. 2E, waveguide sidewalls 207 are formed through the second molding layer 206. In one embodiment of the present invention, the waveguide sidewalls 207 are densely packed conductive copper pillars formed by electroplating; in yet another embodiment of the present invention, the waveguide sidewalls 207 are formed by hollowing out a cavity filled with a conductive paste.
Next, in step 360, as shown in fig. 2F, a second metal layer 208 is formed on the upper surface of the second molding layer 206, and a slot 209 is formed at a corresponding position, thereby forming a slot antenna. In one embodiment of the present invention, the second metal layer 208 is formed by sputtering, electroplating, or the like, and the slit 209 is formed by patterned etching. In yet another embodiment of the present invention, the second metal layer 208 and the slit 209 are formed in one step by patterned electroplating or deposition.
Finally, in step 370, as shown in fig. 2G, external solder balls 210 electrically connected to the first re-layout wiring layer 203 are formed. In an embodiment of the invention, the external solder balls 210 may be formed on the external pads (not shown) of the first redistribution routing layer 203 by ball-planting or electroplating, in combination with a reflow process.
A multi-channel AiP slot antenna package structure according to yet another embodiment of the invention is described below with reference to fig. 4. Fig. 4 shows a cross-sectional schematic diagram of a multi-channel AiP slot antenna package structure 400 according to yet another embodiment of the invention. As shown in fig. 4, the multi-channel AiP slot antenna package 400 further includes a first molding layer 401, a first metal layer 402, an antenna slot 403, a metal partition wall 404, a second metal layer 405, a first waveguide signal feed port 405-1, a second waveguide signal feed port 405-2, a second molding layer 406, a chip 407, a second molding layer conductive via 408, a redistribution layer 409, and an external solder ball 410.
The multi-channel AiP slot antenna package 400 differs from the AiP slot antenna package 100 in that the first molding layer 401 is divided into a plurality of cells by metal cell walls 404 inside the first molding layer 401. Thus each separate cavity, the slot antenna above the separate cavity, the side wall and the bottom are grounded to form a rectangular waveguide with the slot antenna; on the other hand, a plurality of waveguide signal feeding ports 405-1, 405-2 are formed on the second metal layer 405, however, it should be understood by those skilled in the art that more waveguide signal feeding ports may be provided to realize signal feeding of the antenna array. In one embodiment of the present invention, the metal compartment walls 405 are filled with conductive glue by laser grooving, preferably the compartment is completely filled, or the compartment is implemented with a relatively dense mega pilar.
A multi-channel AiP slot antenna package structure according to yet another embodiment of the invention is described below with reference to fig. 5. Fig. 5 is a cross-sectional schematic diagram of a multi-channel AiP slot antenna package structure 500 according to yet another embodiment of the invention. As shown in fig. 5, the multi-channel AiP slot antenna package structure 500 further includes a first molding layer 501, a first metal layer 502, an antenna slot 503, a metal partition wall 504, a second metal layer 505, a first waveguide signal feed port 505-1, a second waveguide signal feed port 505-2, a second molding layer 506, a chip 507, a second molding layer conductive via 508, a redistribution layer 509, and an external solder ball 510.
The multi-channel AiP slot antenna package structure 500 is different from the multi-channel AiP slot antenna package structure 400 only in that in order to improve the coupling efficiency of the waveguide signal feed ports 505-1 and 505-2 to the rectangular waveguide cavity formed by the first plastic package layer 501, the signal path needs to be extended deep into the waveguide cavity, so that the waveguide signal feed ports 505-1 and 505-2 are extended deep into the first plastic package layer 501, or the waveguide signal feed ports 505-1 and 505-2 are extended upward from the plane of the second metal layer 505 and extended deep into the waveguide cavity. In an embodiment of the invention, the front surface of the second plastic package layer can be used for manufacturing two layers of RDLs, and the RDL of the first layer (adjacent to the second plastic package layer) is a metal layer which is basically covered completely, so that grounding is realized; the second layer of RDL extends a distance up from the surface of the first layer of RDL to reach deep into the waveguide cavity. The specific penetration distance is determined according to design requirements. In one embodiment of the invention, the second RDL may be implemented by a short Copper Pillar (Copper pilar).
Based on the AiP slot antenna packaging structure and the preparation method thereof provided by the invention, a multi-layer plastic packaging layer structure (such as a fan-out structure, Fanout) is adopted, after metal covering is formed on the upper surface of a top layer plastic packaging layer, a slot antenna is formed at a proper position, a waveguide signal feed-in port is formed on the bottom surface of the top layer plastic packaging layer, and full-metallization grounding is formed on the bottom surface and the side surface of the top layer plastic packaging layer except the waveguide signal feed-in port, so that a rectangular waveguide with the slot antenna is formed on the top layer plastic packaging layer structure; and forming a chip fan-out structure on the bottom plastic package layer, and forming a waveguide signal feed-in structure through the giant copper pillar, thereby forming an AiP slot antenna packaging structure. Meanwhile, a multi-channel AiP slot antenna packaging structure can be formed in a metal separation cavity mode on the top plastic package layer, and single-side multi-channel radiation is achieved. The AiP slot antenna packaging structure and the preparation method thereof can realize wafer-level packaging by combining a double-layer fan-out process with the processing of a plastic packaging layer conductive copper Pillar (Mega Pillar), and have the advantages of small thickness, multiple channels, multiple directions and low cost.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention disclosed herein should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims (9)
1. An AiP slot antenna package structure, comprising:
a first plastic packaging layer;
the first metal layer covers the upper surface of the first plastic packaging layer;
an antenna slot disposed in the first metal layer;
the second metal layer is arranged on the lower surface of the first plastic packaging layer and is connected and grounded;
a waveguide signal feed-in port disposed on the second metal layer;
the second plastic packaging layer is arranged below the second metal layer;
the chip is coated by the second plastic packaging layer, and pins on the front surface of the chip are leaked from the bottom surface of the second plastic packaging layer;
the waveguide signal feed-in structure penetrates through the second plastic packaging layer and is coupled with the waveguide signal feed-in port;
a re-layout wiring layer, which is arranged below the second plastic packaging layer and is electrically connected to the waveguide signal feed-in structure and the pins of the chip; and
and the external solder balls are arranged below the second re-layout wiring layer and are electrically connected to the second re-layout wiring layer.
2. The AiP slot antenna package structure of claim 1, further comprising a conductive compartment wall disposed inside and or to a side of the first plastic encapsulant layer, the conductive compartment wall causing the first plastic encapsulant layer to form one or more compartments.
3. The AiP slot antenna package structure of claim 2, wherein the material of the conductive cavity wall is metal, conductive silver paste or conductive adhesive.
4. The AiP slot antenna package structure of claim 1 or 2, wherein the first metal layer, the antenna slot, the second metal layer, and the conductive cavity wall together form one or more rectangular waveguides with slot antennas.
5. The AiP slot antenna package structure of claim 1 or 2, wherein the waveguide signal feed structure is formed of a loop-shaped conductive structure and a second conductive structure disposed inside the loop-shaped conductive structure, or a set of loop-shaped arranged conductive structures and a second conductive structure disposed inside the set of loop-shaped arranged conductive structures.
6. The AiP slot antenna package structure of claim 5, wherein the waveguide signal feed structure is made of metal, conductive silver paste or conductive adhesive.
7. The AiP slot antenna package of claim 5, wherein the second conductive structure protrudes upward from the plane of the second metal layer deep inside the waveguide cavity.
8. A manufacturing method of an AiP slot antenna packaging structure comprises the following steps:
carrying out plastic package on the chip to form a first plastic package layer for coating the chip;
forming a first re-layout wiring layer on the lower surface of the first plastic packaging layer and the front surface of the chip;
forming a waveguide signal feed-in structure in the first plastic package layer, forming a first metal layer on the upper surface of the first plastic package layer, and forming a waveguide signal feed-in port at a position corresponding to the waveguide signal feed-in structure;
forming a second plastic packaging layer above the first metal layer;
forming a waveguide side wall in the second plastic packaging layer;
manufacturing a second metal layer on the upper surface of the second plastic packaging layer, and manufacturing a gap at a corresponding position, thereby forming a gap antenna;
and forming an external solder ball electrically connected with the first re-layout wiring layer.
9. The method of manufacturing an AiP slot antenna package structure of claim 8, further comprising forming conductive spacer walls inside the second molding layer.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113410181A (en) * | 2021-06-18 | 2021-09-17 | 广东工业大学 | Semiconductor packaging structure |
| CN114284738A (en) * | 2020-09-28 | 2022-04-05 | 联发科技股份有限公司 | Antenna structure and antenna package |
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| CN110931941B (en) | 2021-06-29 |
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