CN110928388A - Integrated component of liquid cooling plate and circuit board and liquid cooling server - Google Patents
Integrated component of liquid cooling plate and circuit board and liquid cooling server Download PDFInfo
- Publication number
- CN110928388A CN110928388A CN201911368024.1A CN201911368024A CN110928388A CN 110928388 A CN110928388 A CN 110928388A CN 201911368024 A CN201911368024 A CN 201911368024A CN 110928388 A CN110928388 A CN 110928388A
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- liquid
- liquid cooling
- cooling plate
- circuit board
- integrated
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses an integrated component of a liquid cooling plate and a circuit board and a liquid cooling server, wherein the integrated component of the liquid cooling plate and the circuit board comprises a plurality of integrated components and a communicating piece, each integrated component comprises a liquid cooling plate and a circuit board, and a liquid passing channel is defined in each liquid cooling plate; the circuit board and the liquid cooling plate are arranged in a stacked mode and connected with each other, and the circuit board is provided with a plurality of force calculating chips; the communicating piece comprises an inlet communicating piece and an outlet communicating piece, one end of the liquid passing channel of the adjacent integrated assembly is communicated through the inlet communicating piece, the other end of the liquid passing channel of the adjacent integrated assembly is communicated through the outlet communicating piece, the integrated assembly is provided with a liquid inlet and a liquid outlet, the liquid inlet is directly communicated with one of the liquid passing channels, and the liquid outlet is directly communicated with one of the liquid passing channels. Through setting up the intercommunication piece can make integrated component only be equipped with a liquid outlet and a inlet, make integrated component simple structure reliable to the thermal diffusivity is better, and the outward appearance is neat and artistic.
Description
Technical Field
The invention relates to the technical field of server cooling, in particular to an integrated component of a liquid cooling plate and a circuit board and a liquid cooling server.
Background
With the rapid development of electronic information technology, the application of servers is more and more extensive. The large amount of energy consumption causes heat dissipation problems of the server to become particularly important.
In the related art, the server may use a liquid cooling plate having a heat dissipation function to dissipate heat. A plurality of liquid cooling boards can be integrated together, but every integrated liquid cooling board together all is equipped with a inlet and a liquid outlet, consequently need set up a plurality of independent joints, and when integrated liquid cooling board was more, the joint that needs was in large quantity, and the structure is complicated to it is not pleasing to the eye.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention aims to provide an integrated component of a liquid cooling plate and a circuit board, which has a simple and reliable structure and good heat dissipation performance.
The invention also provides a liquid cooling server with the integrated component of the liquid cooling plate and the circuit board.
According to the integrated component of the liquid cooling plate and the circuit board of the embodiment of the first aspect of the invention, the integrated component comprises: the liquid cooling device comprises a plurality of integrated assemblies and communicating pieces, wherein the integrated assemblies and the communicating pieces are arranged in a stacked mode, each integrated assembly comprises a liquid cooling plate and a circuit board, and a liquid passing channel is defined in each liquid cooling plate; the circuit board and the liquid cooling plate are arranged in a stacked mode and connected with each other, and a plurality of force calculating chips are arranged on one side of the circuit board; the communicating piece comprises an inlet communicating piece and an outlet communicating piece, the communicating piece is clamped between two adjacent integrated assemblies, one end of a liquid passing channel of each adjacent integrated assembly is communicated through the inlet communicating piece, the other end of the liquid passing channel of each adjacent integrated assembly is communicated through the outlet communicating piece, each integrated assembly is provided with a liquid inlet and a liquid outlet, the liquid inlet is directly communicated with one of the liquid passing channels, and the liquid outlet is directly communicated with one of the liquid passing channels.
Therefore, according to the integrated component of the liquid cooling plate and the circuit board, the communicating piece is arranged, so that the integrated component is only provided with the liquid outlet and the liquid inlet, the integrated component is simple and reliable in structure, good in heat dissipation performance and neat and attractive in appearance.
According to some embodiments of the invention, the communication member is a communication sleeve, and two ends of the communication member are respectively inserted into two adjacent liquid cooling plates.
According to some embodiments of the invention, one end of the communication sleeve is connected to one of the liquid-cooled plates by a screw thread, and the other end of the communication sleeve is inserted into the other liquid-cooled plate and sealed by a sealing member.
According to some embodiments of the invention, the communication sleeve has a first positioning flange and a second positioning flange, the first positioning flange abutting one of the liquid-cooled plates and the second positioning flange abutting the other of the liquid-cooled plates.
According to some embodiments of the invention, a plurality of the integrated components are connected by primary fasteners passing through at least the liquid-cooled panel, and further comprising secondary fasteners located on both sides of the communication member.
According to some embodiments of the invention, the liquid-cooled panel comprises:
the liquid cooling plate main body is integrally formed by extrusion, a plurality of circulation holes which are arranged in parallel and penetrate through two end parts of the liquid cooling plate main body are formed in the liquid cooling plate main body, the circulation holes are arranged in a spaced mode through spacing ribs, at least one side of the liquid cooling plate is provided with a plurality of protruding parts, and the protruding parts are suitable for being connected with a force calculating chip;
the two end covers are respectively arranged at two ends of the liquid cooling plate main body and connected with the liquid cooling plate, the circulation hole is connected end to end through the liquid passing channel to form a cooling flow path, the liquid inlet and the liquid outlet are formed in the end covers, a water inlet connector is inserted into the liquid inlet, and a water outlet connector is inserted into the liquid outlet.
According to some embodiments of the invention, the liquid passing channel is a serpentine shape with a winding, two ends of the liquid passing channel are respectively formed as an inlet and an outlet, the end cap has a socket opposite to the inlet and the outlet, the water inlet connector is inserted into one of the inlets through the socket, the water outlet connector is inserted into one of the outlets through the socket, and the other sockets are blocked by the blocking cover.
According to some embodiments of the invention, the liquid cooling plate extends out of the circuit board, the communicating member is inserted into the boss and communicates with the flow hole, and the spacing ribs on two sides of the boss into which the communicating member is inserted are connected by auxiliary fasteners.
According to some embodiments of the invention, the integrated component of the liquid cooling plate and the circuit board comprises a positioning rod, and the positioning rod is positioned at the same end with the water inlet joint and the water outlet joint and is arranged adjacent to the corner of the liquid cooling plate.
The liquid cooling server according to the second aspect of the present invention includes the integrated component of the liquid cooling plate and the circuit board according to the first aspect of the present invention.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of an integrated component of a liquid cooled plate and a circuit board according to an embodiment of the invention;
FIG. 2 is a schematic view of the back of an integrated liquid cooled plate and circuit board assembly according to an embodiment of the invention;
fig. 3 is a schematic view of another angle of the back of the integrated component of the liquid cooled plate and the circuit board according to an embodiment of the invention.
FIG. 4 is a cross-sectional view of section A-A of FIG. 3;
FIG. 5 is a cross-sectional view of section C-C of FIG. 3;
FIG. 6 is a cross-sectional view of section B-B of FIG. 3;
fig. 7 is an enlarged view of a portion D in fig. 6.
Reference numerals:
an integrated component 100 of a liquid cooling plate and a circuit board;
an integrated assembly 10; a liquid-cooled plate 11; a liquid passing channel 111; an inlet 1111; an outlet 1112; a liquid-cooled plate body 112; a flow hole 113; the spacing ribs 114; an end cap 115; a boss 116; a wiring board 12; a force calculating chip 121; a gap 122; a primary fastener 13; a distance sleeve 131; the auxiliary fastener 14; a screw 15; a positioning pin 16;
a communication member 20; an inlet communication member 21; an outlet communication member 22; a first positioning flange 23; a second locating flange 24;
a liquid inlet 30; a liquid outlet 40; a seal 50;
a water inlet joint 60; a water outlet joint 70; a plug cover 80; the rod 90 is positioned.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
An integrated liquid-cooled board and wiring board 100 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 7.
As shown in fig. 1 to 4, an integrated assembly 100 of a liquid cooling plate and a circuit board according to an embodiment of the present invention includes an integrated assembly 10 and a communication member 20.
Specifically, each integrated assembly 10 includes a liquid-cooled plate 11 and a wiring board 12, the liquid-cooled plate 11 defining a liquid passage 111 therein. The circuit board 12 and the liquid cooling plate 11 are stacked and connected to each other, and a plurality of power calculating chips 121 are provided on one side of the circuit board 12. The communicating member 20 includes an inlet communicating member 21 and an outlet communicating member 22, the communicating member 20 is sandwiched between two integrated components 10 adjacent to each other, one end of the liquid passing channel of the adjacent integrated component 10 is communicated through the inlet communicating member 21, the other end of the liquid passing channel of the adjacent integrated component 10 is communicated through the outlet communicating member 22, the integrated component 100 has a liquid inlet 30 and a liquid outlet 40, the liquid inlet 30 is directly communicated with one of the plurality of liquid passing channels 111, and the liquid outlet 40 is directly communicated with one of the plurality of liquid passing channels 111.
As shown in fig. 1 to 4, the circuit board 12 and the liquid cooling plate 11 are stacked (e.g., arranged in the vertical direction of fig. 1), and the cooling liquid flows through the liquid channel 111 to dissipate heat of the force calculating chip 121. The inlet communication member 21 is provided to allow the cooling liquid to enter from the liquid inlet 30 and to be distributed to the plurality of liquid passing channels 111 of the two liquid-cooling plates 11. After the cooling liquid in the multiple liquid passing channels 111 respectively flows through the liquid passing channels 111, the cooling liquid can flow out from the liquid outlet 40 through the outlet communication member 22, so that the heat dissipation of the integrated component 100 can be realized.
According to the integrated component 100 of the liquid cooling plate and the circuit board of the embodiment of the invention, by adopting the integrated assembly 10 and the communicating member 20, the liquid inlet 30 and the liquid outlet 40 of the integrated component 100 can be reduced, and only one liquid inlet 30 and one liquid outlet 40 are arranged to realize the cooling effect of the plurality of liquid passing channels 111 on the computing chip 121, so that the structure of the integrated component 100 is simple and reliable, the appearance is neat and beautiful, and the heat dissipation performance of the integrated component 100 can be ensured.
Specifically, the communicating member 20 is a communicating sleeve, and two ends of the communicating member 20 are respectively inserted into two adjacent liquid cooling plates 11, so that inlets of the liquid passing channels 111 of the adjacent liquid cooling plates 11 can be communicated, and outlets 1112 of the liquid passing channels 111 of the adjacent liquid cooling plates 11 can be communicated, thereby reducing the number of joints of the integrated component 100 and simplifying the structure of the integrated component 100. The communicating member 20 may be a cylindrical body extending in the up-down direction, and this arrangement may allow the communicating member 20 to communicate with the liquid passing passage 111 more effectively, so that structural reliability of the integrated part 100 may be secured.
Further, one end of the communication bushing is connected to one of the liquid-cooled plates 11 by a screw, and the other end of the communication bushing is inserted into the other liquid-cooled plate 11 and sealed by a sealing member 50. In the example of fig. 4, the integrated component 100 is provided with two integrated assemblies 10 stacked in the up-down direction. One end (e.g., the upper end of fig. 4) of the communication pipe housing is provided with a screw thread and is connected with the liquid-cooled plate 11 of the upper end, so that the structure of the communication pipe housing can be secured, and the other end of the communication pipe housing is inserted into the liquid-cooled plate 11 of the lower end and can be sealingly fastened by a sealing member 50, such as a packing, so that the structural reliability of the integrated part 100 can be improved.
In some alternative embodiments of the invention, with reference to fig. 4, the communication bushing has a first positioning flange 23 and a second positioning flange 24, the first positioning flange 23 abutting one of the liquid-cooled plates 11 and the second positioning flange 24 abutting the other liquid-cooled plate 11. The first positioning flange 23 abuts against the outer surface of the liquid cooling plate 11 of the integrated component 10 at the upper end, so that the reliability of the connected communicating sleeve and the integrated component 10 at the upper end can be improved, and the second positioning flange 24 abuts against the inner side surface of the liquid cooling plate 11 of the integrated component 10 at the lower end, so that the second positioning flange 24 can avoid the circuit board 12 of the integrated component 10 at the lower end and is tightly attached to the sealing element 50, so that the sealing performance of the integrated component 100 can be improved, and the stability and the reliability of the structure of the integrated component 100 can be further improved.
Specifically, as shown in fig. 5 and 6, a plurality of integrated components 10 are connected by a primary fastening member 13 passing through at least a liquid-cooled panel 11, and further include secondary fastening members 14, the secondary fastening members 14 being located at both sides of a communication member 20. The primary fastening member 13 and the secondary fastening member 14 are provided on the integrated component 100 at a distance, so that the structural reliability of the integrated component 100 can be secured. The circuit board 12 is provided with a notch 122 for avoiding the main fastening piece 13, and the notch 122 can play a role in positioning and can enable the main fastening piece 13 to avoid the position of the power calculating chip 121. The main fastening piece 13 can pass through a plurality of integrated components 10 at the position of the gap 122 to fix the plurality of integrated components 10, and the main fastening piece 13 can be sleeved with a distance sleeve 131, two ends of the distance sleeve 131 are abutted between the ends of two adjacent liquid cooling plates 11, and the distance sleeve 131 can support the liquid cooling plates 11 to improve the structural stability of the integrated components 10. Referring to fig. 6, the auxiliary fastening members 14 are disposed at both sides of the communication member 20 to further improve the structural stability of the integrated assembly 10, and simultaneously, to compress the sealing member 50 to improve the sealability of the integrated part 100.
With reference to fig. 3, two positioning pins 16 are disposed on the integrated component 100, the positioning pins 16 can perform a positioning function and fix the integrated component 100, and the two positioning pins 16 are disposed at the front right end and the rear left end in the example of fig. 3, respectively, so that the span of the positioning pins 16 is large, and the structural stability and reliability of the integrated component 100 can be ensured more effectively.
In some embodiments of the present invention, the liquid cooling plate 11 includes a liquid cooling plate main body 112 and two end caps 115, the liquid cooling plate main body 112 is integrally formed by extrusion, and the wall of the liquid cooling plate main body 112 integrally formed by extrusion is thicker, and the structure is stable and reliable.
Further, referring to fig. 5-7, a plurality of flow holes 113 are formed in the liquid cooling plate main body 112, the flow holes 113 are arranged in parallel and penetrate through two end portions of the liquid cooling plate main body 112, the flow holes 113 are separated by a spacer rib 114, at least one side of the liquid cooling plate 11 is provided with a plurality of protrusions 116, the protrusions 116 are suitable for being connected with the force calculating chip 121, two end caps 115 are respectively connected with the liquid cooling plate 11 at two ends of the liquid cooling plate main body 112, the flow holes 113 are connected end to end through a liquid passing channel 111 to form a cooling flow path, the liquid inlet 30 and the liquid outlet 40 are formed in the end caps 115, the liquid inlet 30 is inserted with the water inlet connector 60, and the liquid outlet 40 is inserted.
One side of the liquid cooling plate 11 is provided with a plurality of protruding parts 116, a plurality of force calculating chips 121 are correspondingly attached to the plurality of protruding parts 116, the force calculating chips 121 and the liquid cooling plate main body 112 can be connected through screws 15 such as elastic screws 15, after the elastic screws 15 are installed, springs on the elastic screws 15 can be compressed, pressure is generated on the circuit board 12, the circuit board 12 and the liquid cooling plate 11 are attached tightly, and therefore the force calculating chips 121 can be attached to the protruding parts 116 and are in seamless contact with the protruding parts 116. The spacing ribs 114 and the inner walls of the protruding portions 116 define a circulation hole 113 together, cooling liquid is arranged in the circulation hole 113, heat generated by the force calculating chip 121 can be conducted to the cooling liquid in the circulation hole 113 through the protruding portions 116, and the cooling liquid circulates to enable the force calculating chip 121 to be cooled. Two end caps 115 are respectively disposed at two ends (e.g., front and rear ends in fig. 1) of the liquid cold plate main body 112, and the two end caps 115 can be fastened and locked by a pre-positioned fastening member. The cooling liquid in the multiple integrated assemblies 10 can flow in from the water inlet joint 60, and flow out from the water outlet joint 70 after passing through the liquid passage 111, so that the purpose of heat dissipation can be achieved, and the heat dissipation performance is good.
Optionally, the water inlet connector 60 and the water outlet connector 70 are disposed on different integrated assemblies 10, so as to ensure the cooling effect of the integrated component 100.
As shown in fig. 1 and 2, the water inlet connector 60 and the water outlet connector 70 of the integrated component 100 are respectively disposed on two different integrated assemblies 10, the water inlet connector 60 is disposed on the integrated assembly 10 shown at the upper end of fig. 2, and the water outlet connector 70 is disposed on the integrated assembly 10 at the lower end of fig. 1, which can improve the heat dissipation performance of the integrated component 100.
According to some alternative embodiments of the present invention, the liquid passing channel 111 has a serpentine shape, so that the contact area between the liquid passing channel 111 and the chip can be increased, and the heat dissipation performance of the integrated component 100 can be ensured. The two ends of the liquid passing channel 111 are respectively formed into an inlet 1111 and an outlet 1112, the end cover 115 is provided with a socket (not shown) opposite to the inlet 1111 and the outlet 1112, the water inlet joint 60 is inserted into one of the inlet 1111 through the socket, the water outlet joint 70 is inserted into one of the outlet 1112 through the socket, and the other sockets are blocked by the blocking cover 80, so that the liquid cooling plates 11 of the integrated assemblies 10 have the same structure, and the processing procedures can be reduced.
Specifically, referring to fig. 4, the fluid-cooled plate 11 protrudes out of the circuit board 12 in the front-rear direction, the communicating member 20 is inserted into the boss 116 and communicates with the circulation hole 113, and the spacing ribs 114 on both sides of the boss 116 into which the communicating member 20 is inserted are connected by the auxiliary fastening member 14, so that the reliability and sealing property of the communicating member 20 can be improved, and the structural stability of the integrated component 100 can be improved.
Further, as shown in fig. 2, 3 and 6, the integrated component 100 further includes a positioning rod 90, and the positioning rod 90 is located at the same end as the water inlet joint 60 and the water outlet joint 70 and is disposed adjacent to the corner of the liquid cooling plate 11. The positioning rod 90 can be positioned during installation of the integrated component 100, and meanwhile, when the integrated component 100 after installation needs to be disassembled, the positioning rod 90 can be pulled out of the integrated component 100 through a tool, and the positioning rod 90 arranged in this way can be convenient for installation and disassembly of the integrated component 100.
The liquid cooling server according to the second embodiment of the present invention comprises the integrated component 100 of the liquid cooling board and the circuit board according to the first embodiment of the present invention. From this, the liquid cooling server has simple structure, the better advantage of thermal diffusivity.
Referring to fig. 1, an integrated liquid-cooled board and circuit board assembly 100 is provided with two integrated assemblies 10. In other embodiments of the present invention, the integrated component 100 of the liquid cooling plate and the circuit board may be provided with a plurality of integrated assemblies 10, and the liquid passing channels 111 of the plurality of integrated assemblies 10 may be communicated through a plurality of communicating members 20. "plurality" means two or more.
For example, the liquid-cooled server may be a water-cooled server suitable for application to a virtual currency miner.
Other configurations of liquid cooling servers according to embodiments of the present invention, such as data interfaces, power interfaces, etc., and operations are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means two or more.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An integrated component of a liquid cooling plate and a circuit board, comprising:
a plurality of integrated components disposed on top of one another, each of the integrated components comprising:
liquid cooling plates, wherein each liquid cooling plate internally defines a liquid passing channel;
the circuit board and the liquid cooling plate are arranged in a stacked mode and connected with each other, and a plurality of force calculating chips are arranged on one side of the circuit board; the communicating piece, the communicating piece includes import communicating piece and export communicating piece, the communicating piece presss from both sides between two integrated assemblies adjacent each other, and the one end of crossing the liquid passageway of adjacent integrated assembly is passed through import communicating piece intercommunication, and the other end of crossing the liquid passageway of adjacent integrated assembly is passed through export communicating piece intercommunication, integrated assembly has inlet and liquid outlet, the inlet with a plurality of cross one of the liquid passageways directly communicate just the liquid outlet with a plurality of one of the liquid passageways directly communicate.
2. The integrated component of a liquid cooling plate and a circuit board as claimed in claim 1, wherein the connecting member is a connecting sleeve, and two ends of the connecting member are respectively inserted into two adjacent liquid cooling plates.
3. The integrated component of a liquid cooling plate and a circuit board as recited in claim 2, wherein one end of the communication sleeve is connected to one of the liquid cooling plates by a screw thread, and the other end of the communication sleeve is inserted into the other liquid cooling plate and sealed by a sealing member.
4. The integrated liquid cooling plate and circuit board assembly of claim 3, wherein the communication sleeve has a first positioning flange and a second positioning flange, the first positioning flange abuts against one of the liquid cooling plates, and the second positioning flange abuts against the other of the liquid cooling plates.
5. The integrated assembly of a liquid cooled plate and a circuit board of claim 1, wherein a plurality of said integrated components are connected by primary fasteners passing through at least said liquid cooled plate, further comprising secondary fasteners on opposite sides of said communication member.
6. The integrated liquid cooled plate and circuit board assembly of any of claims 1 to 5, wherein the liquid cooled plate comprises:
the liquid cooling plate main body is integrally formed by extrusion, a plurality of circulation holes which are arranged in parallel and penetrate through two end parts of the liquid cooling plate main body are formed in the liquid cooling plate main body, the circulation holes are arranged in a spaced mode through spacing ribs, at least one side of the liquid cooling plate is provided with a plurality of protruding parts, and the protruding parts are suitable for being connected with a force calculating chip;
the two end covers are respectively arranged at two ends of the liquid cooling plate main body and connected with the liquid cooling plate, the circulation hole is connected end to end through the liquid passing channel to form a cooling flow path, the liquid inlet and the liquid outlet are formed in the end covers, a water inlet connector is inserted into the liquid inlet, and a water outlet connector is inserted into the liquid outlet.
7. The integrated liquid cooled plate and circuit board assembly of claim 6, wherein said flow passage has a serpentine shape with an inlet and an outlet formed at opposite ends of said flow passage, said end cap having a socket opposite said inlet and said outlet, said inlet fitting being inserted into one of said plurality of inlets through said socket, said outlet fitting being inserted into one of said plurality of outlets through said socket, the remaining sockets being closed by closures.
8. The integrated component of a liquid cooling plate and a circuit board as claimed in claim 6, wherein the liquid cooling plate extends out of the circuit board, the communicating member is inserted into the protrusion and communicates with the through hole, and the spacer ribs on both sides of the protrusion into which the communicating member is inserted are connected by an auxiliary fastener.
9. The integrated component of a liquid cooling plate and a circuit board of claim 6, further comprising a positioning rod, wherein the positioning rod is located at the same end as the water inlet joint and the water outlet joint and is adjacent to the corner of the liquid cooling plate.
10. A liquid cooled server comprising an integrated assembly of a liquid cooled plate and a circuit board according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911368024.1A CN110928388A (en) | 2019-12-26 | 2019-12-26 | Integrated component of liquid cooling plate and circuit board and liquid cooling server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911368024.1A CN110928388A (en) | 2019-12-26 | 2019-12-26 | Integrated component of liquid cooling plate and circuit board and liquid cooling server |
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| Publication Number | Publication Date |
|---|---|
| CN110928388A true CN110928388A (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911368024.1A Pending CN110928388A (en) | 2019-12-26 | 2019-12-26 | Integrated component of liquid cooling plate and circuit board and liquid cooling server |
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| Country | Link |
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| CN (1) | CN110928388A (en) |
Cited By (1)
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| WO2021227846A1 (en) * | 2020-05-12 | 2021-11-18 | 深圳比特微电子科技有限公司 | Liquid cooling plate suitable for liquid-cooling heat dissipation of electronic device, and heat dissipation unit |
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