CN110926626A - Temperature acquisition unit chip and temperature acquisition system - Google Patents
Temperature acquisition unit chip and temperature acquisition system Download PDFInfo
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- CN110926626A CN110926626A CN201911264947.2A CN201911264947A CN110926626A CN 110926626 A CN110926626 A CN 110926626A CN 201911264947 A CN201911264947 A CN 201911264947A CN 110926626 A CN110926626 A CN 110926626A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
Abstract
The invention discloses a temperature acquisition unit chip and a temperature acquisition system, wherein the temperature acquisition unit chip comprises a temperature sensor, a controller, a clock, a memory, an asynchronous transceiver and an NMOS (N-channel metal oxide semiconductor) tube, wherein the temperature sensor, the clock, the memory and the asynchronous transceiver are all connected with the controller; and a power interface of the controller is connected with the power pin. The temperature acquisition system comprises one or more temperature acquisition units and an MCU, and the connection relationship of the temperature acquisition units can be various. The invention has asynchronous serial output of temperature acquisition results, is suitable for different places, has small limitation and strong universality and is more convenient to use; the system has simpler structure, less pins, smaller chip volume and more compact system structure.
Description
Technical Field
The invention belongs to the field of sensors, and particularly relates to a serial communication temperature acquisition unit chip and a temperature acquisition system.
Background
Temperature sensors in the market at present all adopt a specific transmission mode to transmit signals with the outside, so that when a certain temperature sensor is used, only a signal transmission method specified by the temperature sensor can be adopted to transmit the signals, and when the temperature sensor is used, the temperature sensor can only be matched with a limited single chip microcomputer to be used, and cannot be used as an independent device to be directly connected with devices such as a PC (personal computer) and an industrial personal computer in a common serial port mode.
Disclosure of Invention
The purpose of the invention is as follows: the invention provides a temperature acquisition unit chip, aiming at solving the problem of weak temperature sensor in the prior art.
The invention also aims to provide a temperature acquisition system and a temperature acquisition method.
The technical scheme is as follows: a temperature acquisition unit chip comprises a temperature sensor, a controller, a clock, a memory, an asynchronous transceiver, an NMOS (N-channel metal oxide semiconductor) tube, a power supply pin, a data pin and a ground pin, wherein the temperature sensor, the clock, the memory and the asynchronous transceiver are all connected with the controller; the power interface of the controller is connected with the power pin.
Further, an input buffer is also included; the input end of the input buffer is connected with the data pin, and the output end of the input buffer is connected with the asynchronous transceiver.
Further, the input end of the input buffer and the drain electrode of the NMOS tube are independent on a bare chip or are short-circuited on the bare chip.
Furthermore, the data pins comprise a data input pin and a data output pin, the input end of the input buffer is connected with the data input pin, and the drain electrode of the NMOS tube is connected with the data output pin.
Further, the power pin and data pin are independent of each other on the die and are shorted at package time.
A temperature acquisition system adopting temperature acquisition unit chips comprises a plurality of temperature acquisition unit chips and an MCU (microprogrammed control unit), wherein the number of the temperature acquisition unit chips is N, data pins of the N temperature acquisition unit chips are all connected to a first I/O (input/output) port of the MCU, and the first I/O port is connected with a power supply through a pull-up resistor; and power pins from the first temperature acquisition unit chip to the Nth temperature acquisition unit chip are respectively connected with a second I/O port to an (N + 1) th I/O port of the MCU.
A temperature acquisition method adopting a temperature acquisition system comprises the following steps:
(1) in the I/O ports from the second I/O port to the (N + 1) th I/O port, the MCU selects one I/O port to supply power according to the temperature acquisition unit chip to be acquired, and the rest I/O ports do not supply power to the temperature acquisition unit chip;
(2) the temperature acquisition unit chip which is powered on is actively started once or continuously started for a plurality of times at intervals after being powered on, and actively sends acquisition data to the MCU after each time of temperature acquisition;
(3) and (3) the MCU selects another I/O port to supply power, and the step (2) is repeatedly executed.
A temperature acquisition system adopting a temperature acquisition unit comprises a plurality of temperature acquisition unit chips and an MCU (micro control unit), wherein the number of the temperature acquisition unit chips is N, and data pins of the N temperature acquisition unit chips are all connected to a first I/O (input/output) port of the MCU; the power pins of the N temperature acquisition unit chips are all connected with a power supply; the memory of each temperature acquisition unit chip stores a unique address.
A temperature acquisition method adopting a temperature acquisition system comprises the following steps:
(1) the method comprises the following steps that an MCU sends request signals to N temperature acquisition unit chips through a first I/O port, wherein the request signals comprise initial signals;
(2) n temperature acquisition unit chips receive request signals sent by the MCU, and if the request signals do not include temperature acquisition unit addresses, the step (3) is executed; if the request signal comprises the temperature acquisition unit address, executing the step (4);
(3) the N temperature acquisition unit chips execute commands, when a request signal containing the address of the temperature acquisition unit is received, the address is compared with the address stored in the memory of the temperature acquisition unit, and if the comparison is successful, response data are directly sent to the MCU; if the comparison is unsuccessful, no processing is carried out, and the next request signal is waited;
(4) the N temperature acquisition unit chips compare the address with the address stored in the memory of the N temperature acquisition unit chips, and if the address is successfully compared, the N temperature acquisition unit chips execute a command and send response data; if the comparison is unsuccessful, no processing is performed, and the next request signal is waited.
A temperature acquisition system adopting a temperature acquisition unit chip comprises the temperature acquisition unit chip and an MCU (micro control unit), wherein a power pin and a data pin of the temperature acquisition unit chip are both connected with a first I/O (input/output) port of the MCU, and the first I/O port of the MCU is connected with a power supply through a pull-up resistor.
The utility model provides an adopt temperature acquisition system of temperature acquisition unit chip, includes temperature acquisition unit chip and MCU, and the data pin of temperature acquisition unit chip connects MCU's first IO mouth, and MCU's second IO mouth is connected to the power pin of temperature acquisition unit chip, connecting resistance between temperature acquisition unit chip's power pin and the data pin.
The invention provides a temperature acquisition unit chip and a temperature acquisition system, compared with the prior art, the temperature acquisition unit chip has the following advantages: the temperature acquisition result is asynchronously and serially output, so that the device can be suitable for different places, has small limitation and stronger performance, can be externally connected with an MCU (microprogrammed control Unit), can be directly connected with equipment such as a PC (personal computer) and the like, meets more application scenes, and is more convenient to use; the system can be connected with a plurality of temperature sensors, and adopts a single bus protocol to transmit signals, so that the system has simpler structure, less pins, smaller chip volume and more compact system structure.
Drawings
FIG. 1 is a schematic diagram of an internal structure of a temperature acquisition unit chip according to an embodiment;
FIG. 2 is a schematic structural diagram of a temperature acquisition system according to an embodiment;
FIG. 3 is a schematic structural diagram of a second temperature acquisition system according to an embodiment;
FIG. 4 is a schematic structural diagram of a third temperature acquisition system according to an embodiment;
FIG. 5 is a schematic diagram of an internal structure of a first design of a chip with four temperature acquisition units according to an embodiment;
FIG. 6 is a schematic diagram of an internal structure of a second design of a chip with four temperature acquisition units according to an embodiment;
FIG. 7 is a schematic diagram of an internal structure of a third design of a fourth temperature acquisition unit chip according to an embodiment;
fig. 8 is a schematic structural diagram of a four-temperature acquisition system according to an embodiment.
Detailed Description
The invention is further explained below with reference to the figures and the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1, a temperature acquisition unit chip includes a temperature sensor, a controller, a clock, a memory, an asynchronous transceiver, an NMOS transistor, a power pin, a data pin, and a ground pin; the temperature sensor, the clock, the memory and the asynchronous transceiver are all connected with the controller, the grid electrode of the NMOS tube is connected with the sending end of the asynchronous transceiver, the drain electrode of the NMOS tube is connected with the data output pin, and the source electrode of the NMOS tube is connected with the ground pin; the power interface of the controller is connected with the power pin.
The dashed lines in fig. 1 represent the die, and the data pins and the power pins are independent of each other on the die. However, in the package level, the data pin and the power pin may be independent from each other, that is, as shown in fig. 1, or may be shorted to form the same external pin, that is, the data pin and the power pin are shared.
The temperature sensor is used for acquiring temperature signals; the clock is used for providing an internal clock; the controller is used for receiving and transmitting the internal protocol format and the data code; the memory is one or more of EEPROM, Flash, MTP and OTP, and is used for storing calibration data and/or bus address of the temperature acquisition unit; the asynchronous transceiver is used for data conversion communication.
As shown in fig. 2, the temperature acquisition system includes a temperature acquisition unit chip and an MCU, wherein a power pin and a data pin of the temperature acquisition unit chip are both connected to a first I/O port I/O0 of the MCU, and the first I/O port of the MCU is connected to a power supply via a pull-up resistor. The power pin and the data pin share one I/O port, and the data pin and the power pin of the structure can share through a single bus protocol transmission signal.
The temperature acquisition unit chip outputs signals through a serial bus, can be externally connected with an MCU (micro control unit), can be directly connected with equipment such as a PC (personal computer), meets more application scenes, and is more convenient to use, small in limitation and stronger in performance.
Example two:
as shown in fig. 3, the temperature acquisition unit chip of the second embodiment has the same structure as that of the first embodiment. The temperature acquisition system comprises a temperature acquisition unit chip and an MCU. The data pin of the temperature acquisition unit chip is connected with the first I/O port I/O0 of the MCU, the power pin of the temperature acquisition unit chip is connected with the second I/O port I/O1 of the MCU, and a resistor R is connected between the power pin and the data pin of the temperature acquisition unit chip. The system of the embodiment can further embody the advantage of power saving.
Example three:
as shown in fig. 4, the temperature acquisition system includes two temperature acquisition unit chips and an MCU, and the internal structure composition of the temperature acquisition unit chips is the same as that of the first embodiment. In practice, the number of the temperature acquisition unit chips can be increased according to needs, and the principle and the connection mode are the same. Data pins of the two temperature acquisition unit chips are connected to a first I/O port I/O0 of the MCU, and the first I/O port is connected with a power supply through a pull-up resistor; the power supply pins of the first temperature acquisition unit chip T1 and the second temperature acquisition unit chip T2 are respectively connected with a second I/O port I/O1 and a third I/O port I/O2 of the MCU. The plurality of temperature acquisition unit chips share the data transmission port, one of the temperature acquisition unit chips is powered to gate the sensor, and the temperature acquisition unit which is not powered does not work.
The temperature acquisition method using the temperature acquisition system comprises the following steps:
(1) in the I/O ports from the second I/O port to the (N + 1) th I/O port, the MCU selects one I/O port to supply power according to the temperature acquisition unit chip to be acquired, and the rest I/O ports do not supply power to the temperature acquisition unit chip;
(2) the temperature acquisition unit chip which is powered on is actively started once or continuously started for a plurality of times at intervals after being powered on, and actively sends acquisition data to the MCU after each time of temperature acquisition;
(3) and (3) the MCU selects another I/O port to supply power, and the step (2) is repeatedly executed.
Example four:
as shown in fig. 5, compared with the first embodiment, the temperature acquisition unit chip of the present embodiment further includes an input buffer, an input end of the input buffer is connected to the data pin, and an output end of the input buffer is connected to the asynchronous transceiver. As shown in fig. 5 and 6, the input of the input buffer and the drain of the NMOS transistor are independent from each other or shorted together at the die level. When the input end of the input buffer and the drain electrode of the NMOS tube are independent from each other at the level of a bare chip, the input buffer and the drain electrode of the NMOS tube can be shorted into a data pin during packaging, as shown in FIG. 5; different pins, i.e., a data input pin DQ1 and a data output pin DQ2 in fig. 7, may be formed separately. In the embodiment, the temperature acquisition unit chip is additionally provided with an input buffer for receiving the request signal transmitted from the MCU.
As shown in fig. 8, the temperature acquisition system includes two temperature acquisition unit chips and an MCU, the number of the temperature acquisition unit chips can be increased as required, and the principle and the connection mode are the same. Data pins of the two temperature acquisition unit chips are connected to a first I/O port I/O0 of the MCU; and power pins of the two temperature acquisition unit chips are directly connected with a power supply or connected with the power supply through pull-up resistors. The plurality of temperature acquisition unit chips share the data transmission port, and the corresponding temperature acquisition units are gated to work in an addressing mode.
When a plurality of temperature acquisition unit chips are connected with an MCU, the mode is adopted for connection, only one I/O port is needed, the I/O port is saved, the chip volume is reduced, and the cost is reduced. In practical applications, one I/O port of the MCU usually does not have the transmitting and receiving capabilities at the same time, but only one of them, so the first I/O port of the MCU in this embodiment is usually formed by short-circuiting a transmitting output pin and a receiving input pin of the MCU with an asynchronous transceiver.
The temperature acquisition method adopting the temperature acquisition system comprises the following steps:
(1) the MCU sends request signals to the N temperature acquisition unit chips through the first I/O port, wherein the request signals comprise starting signals (break signals). Because the N temperature acquisition unit chips are connected with the MCU through the bus, a break signal needs to be set in the request signal so that the temperature acquisition unit can distinguish the request signal sent by the MCU, and in actual operation, in addition to using the break signal as a start signal, a resolution bit can be added to the request signal so as to distinguish the request signal sent by the MCU by using the value of the resolution bit;
(2) n temperature acquisition unit chips receive request signals sent by the MCU, and if the request signals do not include temperature acquisition unit addresses, the step (3) is executed; if the request signal comprises the temperature acquisition unit address, executing the step (4);
(3) the N temperature acquisition unit chips execute commands, when a request signal containing the address of the temperature acquisition unit is received, the address is compared with the address stored in the memory of the temperature acquisition unit, and if the comparison is successful, response data are directly sent to the MCU; if the comparison is unsuccessful, no processing is carried out, and the next request signal is waited;
(4) the N temperature acquisition unit chips compare the address with the address stored in the memory of the N temperature acquisition unit chips, and if the address is successfully compared, the N temperature acquisition unit chips execute a command and send response data; if the comparison is unsuccessful, no processing is performed, and the next request signal is waited.
Because the temperature is collected more time-consuming, in order to improve the working efficiency, the MCU in the method firstly sends a request signal which does not contain the address of the temperature collection unit, firstly all the temperature collection units collect uniformly, and then the address is sent to obtain data one by one according to the requirement, so that the collection time is shorter, the collected data is more, and the working efficiency is improved.
Claims (11)
1. A temperature acquisition unit chip is characterized by comprising a temperature sensor, a controller, a clock, a memory, an asynchronous transceiver, an NMOS (N-channel metal oxide semiconductor) tube, a power supply pin, a data pin and a ground pin, wherein the temperature sensor, the clock, the memory and the asynchronous transceiver are all connected with the controller; the power interface of the controller is connected with the power pin.
2. The temperature acquisition unit chip of claim 1, further comprising an input buffer; the input end of the input buffer is connected with the data pin, and the output end of the input buffer is connected with the asynchronous transceiver.
3. The temperature acquisition unit chip of claim 2, wherein the input end of the input buffer and the drain of the NMOS tube are independent from each other on a die or are shorted on the die.
4. The temperature acquisition unit chip of claim 2, wherein the data pins comprise a data input pin and a data output pin, the input end of the input buffer is connected with the data input pin, and the drain electrode of the NMOS tube is connected with the data output pin.
5. The temperature acquisition unit chip according to any one of claims 1 to 3, wherein the power supply pin and the data pin are independent of each other on a die and are shorted during packaging.
6. A temperature acquisition system adopting the temperature acquisition unit chip as claimed in any one of claims 1 to 5, comprising a plurality of temperature acquisition unit chips and an MCU, wherein the temperature acquisition unit chips are N, the data pins of the N temperature acquisition unit chips are all connected to a first I/O port of the MCU, and the first I/O port is connected with a power supply through a pull-up resistor; and power pins from the first temperature acquisition unit chip to the Nth temperature acquisition unit chip are respectively connected with a second I/O port to an (N + 1) th I/O port of the MCU.
7. A temperature acquisition method using the temperature acquisition system according to claim 6, comprising the steps of:
(1) in the I/O ports from the second I/O port to the (N + 1) th I/O port, the MCU selects one I/O port to supply power according to the temperature acquisition unit chip to be acquired, and the rest I/O ports do not supply power to the temperature acquisition unit chip;
(2) the temperature acquisition unit chip which is powered on is actively started once or continuously started for a plurality of times at intervals after being powered on, and actively sends acquisition data to the MCU after each time of temperature acquisition;
(3) and (3) the MCU selects another I/O port to supply power, and the step (2) is repeatedly executed.
8. A temperature acquisition system adopting the temperature acquisition unit as claimed in any one of claims 2 to 5, which is characterized by comprising a plurality of temperature acquisition unit chips and an MCU, wherein the number of the temperature acquisition unit chips is N, and data pins of the N temperature acquisition unit chips are all connected to a first I/O port of the MCU; the power pins of the N temperature acquisition unit chips are all connected with a power supply; the memory of each temperature acquisition unit chip stores a unique address.
9. A temperature acquisition method using the temperature acquisition system according to claim 8, comprising the steps of:
(1) the method comprises the following steps that an MCU sends request signals to N temperature acquisition unit chips through a first I/O port, wherein the request signals comprise initial signals;
(2) n temperature acquisition unit chips receive request signals sent by the MCU, and if the request signals do not include temperature acquisition unit addresses, the step (3) is executed; if the request signal comprises the temperature acquisition unit address, executing the step (4);
(3) the N temperature acquisition unit chips execute commands, when a request signal containing the address of the temperature acquisition unit is received, the address is compared with the address stored in the memory of the temperature acquisition unit, and if the comparison is successful, response data are directly sent to the MCU; if the comparison is unsuccessful, no processing is carried out, and the next request signal is waited;
(4) the N temperature acquisition unit chips compare the address with the address stored in the memory of the N temperature acquisition unit chips, and if the address is successfully compared, the N temperature acquisition unit chips execute a command and send response data; if the comparison is unsuccessful, no processing is performed, and the next request signal is waited.
10. A temperature acquisition system adopting the temperature acquisition unit chip as claimed in any one of claims 1 to 5, which comprises the temperature acquisition unit chip and an MCU, wherein a power supply pin and a data pin of the temperature acquisition unit chip are both connected with a first I/O port of the MCU, and the first I/O port of the MCU is connected with a power supply through a pull-up resistor.
11. A temperature acquisition system adopting the temperature acquisition unit chip as claimed in any one of claims 1 to 5, which comprises the temperature acquisition unit chip and an MCU, wherein a data pin of the temperature acquisition unit chip is connected with a first I/O port of the MCU, a power pin of the temperature acquisition unit chip is connected with a second I/O port of the MCU, and a resistor is connected between the power pin and the data pin of the temperature acquisition unit chip.
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| CN201911264947.2A CN110926626A (en) | 2019-12-10 | 2019-12-10 | Temperature acquisition unit chip and temperature acquisition system |
| CN202022926806.7U CN214066366U (en) | 2019-12-10 | 2020-12-09 | Temperature acquisition unit chip and temperature acquisition system |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527007A (en) * | 2007-10-25 | 2009-09-09 | 上海复旦微电子股份有限公司 | Movable non-contact circuit for interconnecting SIM card and non-contact front-end chip |
| US20130089160A1 (en) * | 2011-10-11 | 2013-04-11 | Hon Hai Precision Industry Co., Ltd. | Serial port connection circuit and server |
| CN104330177A (en) * | 2014-11-10 | 2015-02-04 | 兰州大学 | Ultra-low power consumption and portable ground temperature acquisition device and method |
| CN106371475A (en) * | 2016-12-06 | 2017-02-01 | 安图实验仪器(郑州)有限公司 | Multipath temperature control system developed on the basis of STM32 |
| CN207689030U (en) * | 2017-12-15 | 2018-08-03 | 中国石油天然气股份有限公司 | Temperature transmitter and temperature acquisition system |
| CN209199240U (en) * | 2019-01-24 | 2019-08-02 | 昆山毅普腾自动化技术有限公司 | Bulk liquids automatic vending machine control system |
| CN110411604A (en) * | 2018-04-27 | 2019-11-05 | 邵曦 | It can be realized the acquisition terminal of temperature acquisition |
-
2019
- 2019-12-10 CN CN201911264947.2A patent/CN110926626A/en active Pending
-
2020
- 2020-12-09 CN CN202022926806.7U patent/CN214066366U/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527007A (en) * | 2007-10-25 | 2009-09-09 | 上海复旦微电子股份有限公司 | Movable non-contact circuit for interconnecting SIM card and non-contact front-end chip |
| US20130089160A1 (en) * | 2011-10-11 | 2013-04-11 | Hon Hai Precision Industry Co., Ltd. | Serial port connection circuit and server |
| CN104330177A (en) * | 2014-11-10 | 2015-02-04 | 兰州大学 | Ultra-low power consumption and portable ground temperature acquisition device and method |
| CN106371475A (en) * | 2016-12-06 | 2017-02-01 | 安图实验仪器(郑州)有限公司 | Multipath temperature control system developed on the basis of STM32 |
| CN207689030U (en) * | 2017-12-15 | 2018-08-03 | 中国石油天然气股份有限公司 | Temperature transmitter and temperature acquisition system |
| CN110411604A (en) * | 2018-04-27 | 2019-11-05 | 邵曦 | It can be realized the acquisition terminal of temperature acquisition |
| CN209199240U (en) * | 2019-01-24 | 2019-08-02 | 昆山毅普腾自动化技术有限公司 | Bulk liquids automatic vending machine control system |
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