CN110923625A - Mask module, evaporation system, evaporation method and display substrate - Google Patents
Mask module, evaporation system, evaporation method and display substrate Download PDFInfo
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- CN110923625A CN110923625A CN201911293851.9A CN201911293851A CN110923625A CN 110923625 A CN110923625 A CN 110923625A CN 201911293851 A CN201911293851 A CN 201911293851A CN 110923625 A CN110923625 A CN 110923625A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
Abstract
The application discloses a mask module, an evaporation system, an evaporation method and a display substrate, and belongs to the technical field of display. The mask module includes: the mask comprises a first sub-mask plate and a second sub-mask plate fixedly connected with the first sub-mask plate. The first sub-mask plate is provided with a first opening for vapor deposition of a first substrate area of a substrate to be vapor deposited. The second sub-mask plate is provided with a second opening used for evaporating a sub-pixel area in a second substrate area of the substrate to be evaporated. If the mask module is adopted to carry out vapor deposition on the substrate to be vapor deposited so as to form a cathode in the substrate, wherein the cathode in the second substrate area belongs to a blocky cathode. When the display substrate is formed on the substrate subsequently, the intensity of light rays entering the sensing device after penetrating through the second substrate area is effectively improved, and therefore the reliability of the sensing device is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a mask module, an evaporation system, an evaporation method and a display substrate.
Background
In general, a front surface of a display device such as a mobile phone or a tablet computer needs to be provided with a sensing device such as a camera and a light sensor, but the sensing device positioned on the front surface affects a screen ratio of the display device. Therefore, more and more manufacturers are currently dedicated to research on display devices in which the sensor device is located below the display substrate (i.e., on the side close to the non-display side of the display substrate).
The display substrate has a first substrate area having a pixel resolution greater than a pixel resolution of a second substrate area, and a second substrate area below which the sensing device may be located. Because the pixel resolution of the second substrate area is low, ambient light outside the display substrate can penetrate through the second substrate area to enter the sensing device, and the sensing device can acquire the ambient light.
However, in the process of manufacturing the display substrate, the film layer such as the cathode in the display substrate is usually formed by using an open mask evaporation, so the cathode usually covers the whole surface of the first substrate region and the second substrate region. When the ambient light penetrates through the cathode in the second substrate region, the cathode reflects or refracts the ambient light, so that the intensity of the light entering the sensing device is low, and the reliability of the sensing device is low.
Disclosure of Invention
The embodiment of the application provides a mask module, an evaporation system, an evaporation method and a display substrate. The problem of low reliability of a sensing device in the related art can be solved, and the technical scheme is as follows:
in a first aspect, a mask module is provided, which includes:
a first sub-mask having a first opening;
the second sub-mask plate is fixedly connected with the first sub-mask plate and is provided with a second opening;
the first opening is configured to evaporate a first substrate area of a substrate to be evaporated, the second opening is configured to evaporate a sub-pixel area in a second substrate area of the substrate, the first substrate area and the second substrate area both have sub-pixel areas, and a pixel resolution of the second substrate area is smaller than a pixel resolution of the first substrate area.
Optionally, the first sub-mask has a plurality of first openings, the number of second sub-masks in the mask module is a plurality of, every second sub-mask corresponds to at least one first opening, every first edge region of the second sub-masks coincides with the second edge region of the corresponding first opening, the first edge region is the edge region adjacent to the corresponding first opening in the second sub-masks, and the second edge region is the edge region adjacent to the corresponding second sub-masks in the first opening.
Optionally, the plurality of first openings are arranged in multiple rows, each row of the first openings corresponds to one of the second sub-masks, and a first edge region of each of the second sub-masks coincides with a second edge region of each of the first openings in the corresponding row of the first openings.
Optionally, each of the second sub-mask plates is strip-shaped, and the length directions of the plurality of second sub-mask plates are the same.
Optionally, the second sub-mask has a plurality of second openings, and each second opening corresponds to one sub-pixel region in the second substrate region.
In a second aspect, there is provided an evaporation system comprising: an evaporation source and a first mask module, wherein the first mask module is any one of the mask modules of the first aspect;
the evaporation system is configured to: and through the evaporation source, the first mask module is adopted to carry out evaporation on the substrate to be evaporated, and a first evaporation material is formed on the substrate.
Optionally, the evaporation system further includes: a second mask module, the second mask module comprising:
a third sub-mask having a shielding plate corresponding to the first opening in the first sub-mask;
a fourth sub-mask plate fixedly connected with the third sub-mask plate, wherein the fourth sub-mask plate is provided with a third opening;
the shielding plate is configured to shield a first substrate area in the substrate, the third opening is configured to perform evaporation on a designated area in a second substrate area in the substrate, and the designated area is a peripheral area of the sub-pixel area;
the evaporation system is further configured to: and evaporating the substrate by adopting the second mask module through the evaporation source to form a second evaporation material overlapped with the first evaporation material on the substrate.
Optionally, the fourth sub-mask has a plurality of opening groups, each opening group corresponds to one sub-pixel region in the second substrate region, and each opening group includes at least one third opening.
Optionally, the third openings in the fourth sub-mask are all rectangular in shape, and each opening group includes: and four third openings, wherein the length directions of two of the third openings are the same as the row arrangement direction of the sub-pixel regions in the second substrate region, and the length directions of the other two of the third openings are the same as the column arrangement direction of the sub-pixel regions in the second substrate region.
Optionally, a second sub-mask in the first mask module further has a fourth opening, and a fourth sub-mask in the second mask module further has a fifth opening;
the fourth opening and the fifth opening are used for evaporating a non-display area in the second substrate area;
the evaporation system is configured to: evaporating the substrate by adopting the first mask module through the evaporation source, and forming a first evaporation material in a non-display area of a second substrate area of the substrate;
and performing evaporation on the substrate by adopting the second mask module through the evaporation source, and forming a second evaporation material overlapped with the first evaporation material in a non-display area of a second substrate area of the substrate.
Optionally, the third sub-mask has a plurality of shielding plates, the number of fourth sub-mask in the second mask module is a plurality of, every the shielding plate corresponds to one fourth sub-mask, every the third edge region of the fourth sub-mask coincides with the fourth edge region of the corresponding shielding plate, the third edge region is the edge region adjacent to the corresponding shielding plate in the fourth sub-mask, and the fourth edge region is the edge region adjacent to the corresponding fourth sub-mask in the shielding plate.
Optionally, each of the fourth sub-mask plates is strip-shaped, and the length directions of the plurality of fourth sub-mask plates are the same.
In a third aspect, there is provided an evaporation method applied to the evaporation system of any one of the second aspects, the method including:
and through the evaporation source, the first mask module is adopted to carry out evaporation on the substrate to be evaporated, and a first evaporation material is formed on the substrate.
Optionally, the evaporation system includes: the second mask plate module, the second mask plate module includes: the third sub-mask plate is a fourth sub-mask plate fixedly connected with the third sub-mask plate; the third sub-mask is provided with a shielding plate corresponding to the first opening in the first sub-mask; the fourth sub-mask plate is provided with a third opening; the shielding plate is configured to shield a first substrate area in the substrate, and the third opening is configured to evaporate a designated area in a second substrate area in the substrate, wherein the designated area is a peripheral area of the sub-pixel area; the method further comprises the following steps:
and after a first evaporation material is formed on the substrate, evaporating the substrate by using the second mask module through the evaporation source, and forming a second evaporation material overlapped with the first evaporation material on the substrate.
In a fourth aspect, a display substrate is provided, the display substrate comprising: a substrate and a light emitting device on the substrate, the light emitting device comprising: an anode, an organic light-emitting layer, and a cathode laminated in a direction away from the substrate, the cathode being formed by the vapor deposition method according to any one of the third aspects;
the display substrate has a first substrate region and a second substrate region, and the cathode includes: a plate-shaped cathode located in the first substrate region, and a block-shaped cathode located in the second substrate region. The technical scheme provided by the embodiment of the application has the following beneficial effects:
the mask module includes: the mask comprises a first sub-mask plate and a second sub-mask plate fixedly connected with the first sub-mask plate. The first sub-mask plate is provided with a first opening for vapor deposition of a first substrate area of a substrate to be vapor deposited. The second sub-mask plate is provided with a second opening used for evaporating a sub-pixel area in a second substrate area of the substrate to be evaporated. If the mask module is adopted to carry out vapor deposition on the substrate to be vapor deposited so as to form a cathode in the substrate, the cathode in the first substrate area belongs to a plate-shaped cathode, and the cathode in the second substrate area belongs to a block-shaped cathode. When the display substrate is formed subsequently on the substrate, the probability that the cathode in the display substrate reflects or refracts ambient light can be reduced on the premise of reducing the manufacturing cost of the display substrate and improving the display effect of the display substrate, the intensity of the light entering the sensing device after penetrating through the second substrate area is effectively improved, and therefore the reliability of the sensing device is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a mask module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a substrate to be vapor-deposited according to an embodiment of the present disclosure;
fig. 3 is an effect diagram after evaporation is performed on the substrate to be evaporated shown in fig. 2 by using the mask module shown in fig. 1 according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of another mask module according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a second mask module according to an embodiment of the present disclosure;
fig. 6 is a diagram illustrating an effect obtained after the second mask module shown in fig. 5 is used to perform evaporation on the substrate to be evaporated shown in fig. 2 according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of another second mask module according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural diagram of a first mask module according to another embodiment of the present disclosure;
FIG. 9 is a schematic view illustrating a second mask module according to another embodiment of the present disclosure;
fig. 10 is a diagram illustrating an effect of performing vapor deposition on a substrate to be vapor deposited by using the first mask module shown in fig. 8 and then performing vapor deposition on the substrate by using the second mask module shown in fig. 9 according to an embodiment of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a mask module according to an embodiment of the present disclosure. The mask module 100 may include:
a first sub-mask 101, and a second sub-mask 102 fixedly connected to the first sub-mask 101. The first sub-mask 101 has a first opening 101 a. The second sub-mask 102 has a second opening 102 a.
In the embodiment of the present application, the mask module 100 is used for evaporation of a substrate to be evaporated. Referring to fig. 2, fig. 2 is a schematic structural diagram of a substrate to be evaporated according to an embodiment of the present application, where the substrate 00 to be evaporated includes: a first substrate region 00a and a second substrate region 00b, the first substrate region 00a having a sub-pixel region 00a1, the second substrate region 00b having a sub-pixel region 00b 1. The pixel resolution of the second substrate area 00b is smaller than the pixel resolution of the first substrate area 00 a. That is, the number of sub-pixel regions 00b1 included in a unit area in the second substrate region 00b is smaller than the number of sub-pixel regions 00b1 included in a unit area in the first substrate region 00 a.
The first opening 101a is disposed to deposit vapor on the first substrate region 00a of the substrate 00 to be deposited, and the second opening 102a is disposed to deposit vapor on the sub-pixel region 00b1 in the second substrate region 00b of the substrate 00 to be deposited.
In the embodiment of the present application, the first sub-mask 101 belongs to an open mask, and the second sub-mask 102 belongs to a fine metal mask. The first sub-mask 101 may be fixedly connected to the second sub-mask 102 by welding.
For example, referring to fig. 3, fig. 3 is a diagram illustrating an effect of a substrate to be vapor-deposited shown in fig. 2 after vapor deposition is performed on the substrate to be vapor-deposited shown in fig. 2 by using the mask module 100 shown in fig. 1, where the substrate 00 to be vapor-deposited shown in fig. 2 is vapor-deposited to form a cathode in the substrate 00 to be vapor-deposited, the substrate 00 to be vapor-deposited may be a substrate on which an anode and a light-emitting layer in a light-emitting device are formed. Since the inner cathode of the second substrate area 00b in the substrate 00 is formed through the second opening 102a in the second sub-mask 102, the cathode located in the second substrate 00b does not cover the second substrate area 00b, the cathode located in the second substrate 00b belongs to the block-shaped cathodes 001, and each block-shaped cathode 001 may correspond to one sub-pixel area of the second substrate area 00 b.
If the substrate 00 is subsequently formed with a display substrate, and the sensor device is located below the second substrate area 00b in the substrate 00, because the cathode in the second substrate area 00b does not cover the second substrate area 00b, when the ambient light outside the display substrate passes through the cathode in the second substrate area 00b, the probability that the cathode reflects or refracts the ambient light can be reduced, the intensity of the light entering the sensor device is effectively improved, and the reliability of the sensor device is improved. If the sensing device is a camera, the display substrate prepared by the mask module provided by the embodiment of the application can improve the image quality of the image acquired by the camera; if sensing device is light sensor, the display substrate who prepares through the mask module that this application embodiment provided can improve the accuracy of the intensity of the ambient light that light sensor gathered.
In the related art, a display substrate is also provided, in which a cathode is formed by using a fine metal mask evaporation method, and at this time, cathodes in a first substrate region and a second substrate region in the display substrate are both bulk cathodes. However, the voltage applied to the cathode in the display substrate is generally the same, so the display substrate needs to be separately conducted to the cathode power terminal for applying the voltage to the cathode for each block-shaped cathode, which is difficult, resulting in higher manufacturing cost of the display substrate. Moreover, the voltage applied to each block-shaped cathode in such a display substrate is difficult to be consistent, which results in poor display effect of the display substrate.
In the embodiment of the present invention, as shown in fig. 3, if the mask module 100 is used to perform vapor deposition on the substrate 00 to be vapor deposited so as to form the cathode in the substrate 00, since the cathode in the first substrate area 00a of the substrate 00 is formed through the first opening 101a in the first sub-mask 101, the cathode in the first substrate area 00a covers the entire surface of the first substrate area 00a, and the cathode in the first substrate area 00a belongs to the plate-shaped cathode 002. When the display substrate is formed on the substrate 00, only the plate-shaped cathode 002 located in the first substrate area 00a needs to be conducted with the cathode power terminal for applying a voltage to the cathode, and the block-shaped cathodes 001 located in the second substrate area 00b need to be conducted with the cathode power terminal, so that the manufacturing cost of the display substrate is effectively reduced. In addition, the voltage applied to the plate-like cathode 002 in the first substrate area 00a of the display substrate is uniform, and the display effect of the display substrate is effectively improved.
To sum up, the mask module that this application embodiment provided includes: the mask comprises a first sub-mask plate and a second sub-mask plate fixedly connected with the first sub-mask plate. The first sub-mask plate is provided with a first opening for vapor deposition of a first substrate area of a substrate to be vapor deposited. The second sub-mask plate is provided with a second opening used for evaporating a sub-pixel area in a second substrate area of the substrate to be evaporated. If the mask module is adopted to carry out vapor deposition on the substrate to be vapor deposited so as to form a cathode in the substrate, the cathode in the first substrate area belongs to a plate-shaped cathode, and the cathode in the second substrate area belongs to a block-shaped cathode. When the display substrate is formed subsequently on the substrate, the probability that the cathode in the display substrate reflects or refracts ambient light can be reduced on the premise of reducing the manufacturing cost of the display substrate and improving the display effect of the display substrate, the intensity of the light entering the sensing device after penetrating through the second substrate area is effectively improved, and therefore the reliability of the sensing device is improved.
Optionally, as shown in fig. 4, fig. 4 is a schematic structural diagram of another mask module provided in the embodiment of the present application. The first sub-mask 101 has a plurality of first openings 101a, and for example, after the mask module 100 is used for evaporating a substrate to be evaporated, the substrate to be evaporated can be used for cutting a plurality of display substrates corresponding to the plurality of first openings 101 a. The number of the second sub-masks 102 in the mask module 100 is multiple, each second sub-mask 102 corresponds to at least one second opening 101a, and the first edge region 1021 of each second sub-mask 102 coincides with the second edge region 101a1 of the corresponding first opening 101 a. The first edge region 1021 is an edge region of the second sub-mask 102 adjacent to the corresponding first opening 101 a; the second edge region 101a1 is an edge region of the first opening 101a adjacent to the corresponding second sub-mask 102. At this time, after the substrate to be vapor-deposited is vapor-deposited by the mask module 100, the vapor-deposition material can be simultaneously formed in the first substrate region and the second substrate region of the substrate.
Illustratively, the plurality of first openings 101a in the first sub-mask 101 are arranged in a plurality of columns, each column of the first openings 101a corresponds to one second sub-mask 102, and the first edge region 1021 of each second sub-mask 102 coincides with the second edge region 101a1 of each first opening 101a in the corresponding column of the first openings 101 a. At this time, the first openings 101a in the same row share one second sub-mask plate 102, and a second sub-mask plate is not required to be independently configured for each first opening, so that the evaporation efficiency of evaporation of the substrate to be evaporated by adopting the mask module is effectively improved.
In the embodiment of the present application, each of the second sub-masks 102 has a strip shape. The length directions x1 of the plurality of second sub-masks 102 are all the same, and the length direction x1 of each second sub-mask 102 is perpendicular to the arrangement direction y1 of the plurality of rows of first openings 101 a.
Optionally, the second sub-mask 102 has a plurality of second openings 102 a. Each of the second openings 102a corresponds to one sub-pixel region in the second substrate region in the substrate to be evaporated.
To sum up, the mask module that this application embodiment provided includes: the mask comprises a first sub-mask plate and a second sub-mask plate fixedly connected with the first sub-mask plate. The first sub-mask plate is provided with a first opening for vapor deposition of a first substrate area of a substrate to be vapor deposited. The second sub-mask plate is provided with a second opening used for evaporating a sub-pixel area in a second substrate area of the substrate to be evaporated. If the mask module is adopted to carry out vapor deposition on the substrate to be vapor deposited so as to form a cathode in the substrate, the cathode in the first substrate area belongs to a plate-shaped cathode, and the cathode in the second substrate area belongs to a block-shaped cathode. When the display substrate is formed subsequently on the substrate, the probability that the cathode in the display substrate reflects or refracts ambient light can be reduced on the premise of reducing the manufacturing cost of the display substrate and improving the display effect of the display substrate, the intensity of the light entering the sensing device after penetrating through the second substrate area is effectively improved, and therefore the reliability of the sensing device is improved.
The embodiment of the present application further provides an evaporation system, and the evaporation system may include: the vapor deposition source and the first mask module. The first mask module may be the mask module 100 shown in fig. 1 or 4.
Wherein the evaporation system is configured to: by using the evaporation source, the first mask module 100 is used to evaporate the substrate to be evaporated, so as to form a first evaporation material on the substrate. In an example, the evaporation system uses the first mask module 100 to evaporate a first substrate region of a substrate to be evaporated and to evaporate a sub-pixel region of a second substrate region of the substrate to be evaporated by using an evaporation source, so as to form a first evaporation material in the sub-pixel regions of the first substrate region and the second substrate region.
In the embodiment of the present application, when the evaporation system is used to evaporate a cathode on a substrate to be evaporated, the first evaporation material formed on the substrate is a cathode material. For example, the substrate shown in fig. 3 can be formed by using the first mask module 100 after a substrate to be vapor-deposited is vapor-deposited. The first evaporation material includes: a plate-like cathode 001 located in the first substrate region 00a, and a block-like cathode 002 located in the second substrate region 00 b.
Optionally, the evaporation system may further include: and a second mask module. As shown in fig. 5, fig. 5 is a schematic structural diagram of a second mask module according to an embodiment of the present disclosure. The second mask module 200 may include:
a third sub-mask 201, and a fourth sub-mask 202 fixedly connected to the third sub-mask 201. The third sub-mask 201 has a shielding plate 201a corresponding to the first opening in the first sub-mask. The fourth sub-mask 202 has a third opening 202 a.
The shielding plate 201a is configured to shield a first substrate region of the substrate to be vapor-deposited, and the third opening 202a is configured to vapor-deposit a predetermined region of a second substrate region of the substrate to be vapor-deposited. Illustratively, as shown in fig. 2, the designated area is a peripheral area 00b2 of the sub-pixel area 00b1 in the second substrate area 00 b. The peripheral region 00b2 of the sub-pixel region 00b1 is: the second substrate region 00b is a region located around the sub-pixel region 00b 1.
In the embodiment of the present application, the fourth sub-mask 201 belongs to a fine metal mask. For example, the third sub-mask 201 and the fourth sub-mask 202 may be fixedly connected by welding.
The evaporation system is further configured to: through the evaporation source, the second mask module 200 is adopted to perform evaporation on the substrate to be evaporated so as to form a second evaporation material overlapped with the first evaporation material on the substrate. In an example, the evaporation system uses the second mask module 200 to evaporate a designated area of the second substrate of the substrate to be evaporated by the evaporation source, so as to form a second evaporation material overlapping the first evaporation material in the designated area of the second substrate area of the substrate.
For example, referring to fig. 6, fig. 6 is a diagram illustrating an effect of performing vapor deposition on the substrate to be vapor deposited illustrated in fig. 2 by using the second mask module illustrated in fig. 5 according to an embodiment of the present application, in which a vapor deposition system may perform vapor deposition on the substrate 00 to be vapor deposited, on which a first vapor deposition material is formed, by using the second mask module 200 through a vapor deposition source, so as to form a second vapor deposition material overlapping with the first vapor deposition material on the substrate 00. In fig. 6, the pattern of the dot-shaped filler is a first vapor deposition material, and the pattern of the black filler is a second vapor deposition material.
When the evaporation system is adopted to evaporate the cathode on the substrate to be evaporated, the first evaporation material and the second evaporation material are both cathode materials. The second evaporation material includes: and a lap cathode 003 overlapping the plate-shaped cathode 001 and overlapping the block-shaped cathode 002, the lap cathode 003 serving to electrically connect the plate-shaped cathode 001 and the block-shaped cathode 002 and to electrically connect any two adjacent block-shaped cathodes 002. In this case, when a display substrate is formed subsequently on the substrate 00, it is not necessary to separately connect each of the block-shaped cathodes 001 located in the second substrate area 00b to a cathode power source terminal for applying a voltage to the cathode, which further reduces the manufacturing cost of the display substrate. And the voltage applied on the cathode at each position in the display substrate is consistent, thereby further improving the display effect of the display substrate.
Alternatively, as shown in fig. 5, the fourth sub-mask 202 in the second mask module 200 has a plurality of opening groups 202a ', and each opening group 202 a' includes at least one third opening 202 a. Each of the opening groups 202 a' corresponds to one sub-pixel region in the second substrate region in the substrate to be evaporated. At this time, the peripheral region of the corresponding sub-pixel region in the second substrate region can be vapor-deposited through the third openings 202a in each opening group 202 a' in the fourth sub-mask plate 202.
For example, the third openings 202a in the fourth sub-mask 202 are all rectangular in shape, and each opening group 202 a' includes: four third openings 202 a. Among them, the length direction x2 of two third openings 202a (e.g., the third opening a1 and the third opening a2) is the same as the row arrangement direction of the sub-pixel region in the second substrate region, and the length direction y2 of the other two third openings 202a (e.g., the third opening a3 and the third opening a4) is the same as the column arrangement direction of the sub-pixel region in the second substrate region. Also, any two adjacent aperture groups 202 a' share one third aperture 202 a.
Optionally, as shown in fig. 7, fig. 7 is a schematic structural diagram of another second mask module provided in the embodiment of the present application, and a third sub-mask 201 in the second mask module 200 has a plurality of shielding plates 201 a. The number of the fourth sub-mask plates 202 in the second mask module is plural. Each of the shielding plates 201a corresponds to one of the fourth sub-masks 202, and the third edge region 2021 of each of the fourth sub-masks 202 coincides with the fourth edge region 201a1 of the corresponding shielding plate 201 a. The third edge region 2021 is an edge region of the fourth sub-mask 202 adjacent to the corresponding shielding plate 201 a; the fourth edge region 201a1 is an edge region of the shielding plate 201a adjacent to the corresponding fourth sub-mask 202.
In the embodiment of the present application, each shielding plate 201a in the third sub-mask 201 corresponds to a row of first openings of the first sub-mask. At this time, after the substrate to be vapor-deposited is vapor-deposited by the second mask module 200, the vapor-deposition material can be simultaneously formed in the second substrate region of the substrate without forming the vapor-deposition material in the first substrate region.
In the embodiment of the present application, each fourth sub-mask 202 is shaped like a stripe. The length directions x3 of the plurality of fourth sub-masks 202 are the same, and the length direction x3 of each fourth sub-mask 202 is the same as the length direction of the shielding plate 201 a.
Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of a first mask module according to another embodiment of the present disclosure, and fig. 9 is a schematic structural diagram of a second mask module according to another embodiment of the present disclosure. The second sub-mask 102 in the first mask module 100 further has a fourth opening 102b, and the fourth opening 102b is used for performing evaporation on a non-display area in a second substrate area in the substrate to be evaporated. The fourth sub-mask 202 in the second mask module 200 further has a fifth opening 202b, and the fifth opening 202b is used for performing evaporation on a non-display area in a second substrate area in the substrate to be evaporated.
Wherein the evaporation system is configured to: evaporating a substrate to be evaporated by using a first mask module 100 through an evaporation source, and forming a first evaporation material in a non-display area of a second substrate area of the substrate; the substrate on which the first evaporation material is formed is evaporated by the second mask module 200 using the evaporation source, and a second evaporation material overlapping the first evaporation material is formed in a non-display region of a second substrate region of the substrate.
For example, referring to fig. 10, fig. 10 is a diagram illustrating an effect obtained after a substrate to be vapor-deposited is vapor-deposited by using the first mask module shown in fig. 8 and then the substrate is vapor-deposited by using the second mask module shown in fig. 9 according to an embodiment of the present disclosure. If the evaporation system is used to evaporate the cathode on the substrate to be evaporated, the first evaporation material and the second evaporation material are both cathode materials. In fig. 10, the pattern of the dot-shaped filler is a first vapor deposition material, and the pattern of the black filler is a second vapor deposition material. The first evaporation material may further include: the first peripheral cathode 004 located in the non-display area in the second substrate area 00b, the second evaporation material may further include: and a second peripheral cathode electrode 005 positioned in the non-display region in the second substrate region 00 b. The second peripheral cathode 005 overlaps the first peripheral cathode 004, and the first peripheral cathode 004 also overlaps the overlapping cathode 003. At this time, the cathode 002 in the form of a block located in the second substrate region 00b may be conducted to the cathode power terminal through the first peripheral cathode 004 and the second peripheral cathode 005.
To sum up, the mask system that this application embodiment provided at first, through the coating by vaporization source, adopts first mask module to treat the base plate of coating by vaporization, forms first coating by vaporization material on this base plate, later, through the coating by vaporization source, adopts second mask module to carry out the coating by vaporization to the base plate that is formed with first coating by vaporization material, forms the second coating by vaporization material with first coating by vaporization material overlap joint on this base plate. If the mask system is adopted to carry out evaporation on a substrate to be evaporated so as to form a cathode in the substrate, the first evaporation material comprises a cathode which is positioned in the first substrate area and belongs to a plate-shaped cathode, and a cathode which is positioned in the second substrate area and belongs to a block-shaped cathode, and the second evaporation material comprises a lap joint cathode. At this moment, when the display substrate is formed subsequently on the substrate, on the premise of further reducing the manufacturing cost of the display substrate and improving the display effect of the display substrate, the probability that the cathode in the display substrate reflects or refracts ambient light is reduced, the intensity of light entering the sensing device after penetrating through the second substrate area is effectively improved, and therefore the reliability of the sensing device is improved.
The embodiment of the application also provides an evaporation method, and the evaporation method is applied to the evaporation system in the embodiment. The method can comprise the following steps:
and through the evaporation source, evaporating the substrate to be evaporated by adopting the first mask module, and forming a first evaporation material on the substrate.
Optionally, the method may further include: after a first evaporation material is formed on a substrate to be evaporated, evaporating the substrate by using a second mask module through an evaporation source, and forming a second evaporation material overlapped with the first evaporation material on the substrate.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the working principle of the evaporation method described above may refer to the corresponding content in the embodiment of the structure of the evaporation system, and is not repeated herein.
The embodiment of the application also provides a display substrate. The display substrate may include: a substrate and a light emitting device on the substrate. For example, the light emitting device may be an OLED device, and the light emitting device may include: an anode, an organic light emitting layer, and a cathode laminated in a direction away from the substrate. The cathode is formed by the above vapor deposition method. Illustratively, the display substrate is obtained by performing evaporation on the substrate to be evaporated in the above embodiments, and therefore the display substrate also has a first substrate region and a second substrate region, as shown in fig. 3, the cathode may include: a plate-like cathode 002 located in the first substrate region 00a, and a block-like cathode 001 located in the second substrate region 00 b. Alternatively, as shown in fig. 6, the cathode may further include: and a lap cathode 003 positioned at the second substrate region 00 b.
An embodiment of the present application further provides a display device, which may include: the display substrate in the above embodiments. The display device may be: any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator or a wearable device, and the like. The display substrate has a first substrate area and a second substrate area, wherein the pixel resolution of the first substrate area is greater than the pixel resolution of the second substrate area. The display device may further include: a sensing device located below the display substrate (i.e., on the backlight side of the display substrate), and an orthographic projection of the sensing device on the display substrate is located within a second substrate region in the display substrate. Ambient light outside the display substrate can enter the sensing device through the second substrate region, so that the sensing device can acquire the ambient light. The sensing device may include: at least one of a camera and a light sensor.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
In this application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise.
The above description is intended to be exemplary only, and not to limit the present application, and any modifications, equivalents, improvements, etc. made within the spirit and scope of the present application are intended to be included therein.
Claims (15)
1. A mask module, comprising:
a first sub-mask having a first opening;
the second sub-mask plate is fixedly connected with the first sub-mask plate and is provided with a second opening;
the first opening is configured to evaporate a first substrate area of a substrate to be evaporated, the second opening is configured to evaporate a sub-pixel area in a second substrate area of the substrate, the first substrate area and the second substrate area both have sub-pixel areas, and a pixel resolution of the second substrate area is smaller than a pixel resolution of the first substrate area.
2. The mask module of claim 1,
the first sub-mask plate is provided with a plurality of first openings, the number of second sub-mask plates in the mask module is a plurality of, every second sub-mask plate corresponds to at least one first opening, every first edge region of the second sub-mask plate coincides with a second edge region of a corresponding first opening, the first edge region is an edge region adjacent to the corresponding first opening in the second sub-mask plate, and the second edge region is an edge region adjacent to the corresponding second sub-mask plate in the first opening.
3. The mask module of claim 2,
the plurality of first openings are arranged in multiple rows, each row of first openings corresponds to one second sub-mask plate, and a first edge area of each second sub-mask plate is overlapped with a second edge area of each first opening in the corresponding row of first openings.
4. The mask module of claim 3,
each second sub-mask is strip-shaped, and the length directions of the plurality of second sub-masks are the same.
5. The mask module according to any of claims 1 to 4,
the second sub-mask has a plurality of second openings, and each second opening corresponds to one sub-pixel region in the second substrate region.
6. An evaporation system, comprising: an evaporation source and a first mask module, wherein the first mask module is the mask module of any one of claims 1 to 5;
the evaporation system is configured to: and through the evaporation source, the first mask module is adopted to carry out evaporation on the substrate to be evaporated, and a first evaporation material is formed on the substrate.
7. The evaporation system according to claim 6, further comprising: a second mask module, the second mask module comprising:
a third sub-mask having a shielding plate corresponding to the first opening in the first sub-mask;
a fourth sub-mask plate fixedly connected with the third sub-mask plate, wherein the fourth sub-mask plate is provided with a third opening;
the shielding plate is configured to shield a first substrate area in the substrate, the third opening is configured to perform evaporation on a designated area in a second substrate area in the substrate, and the designated area is a peripheral area of the sub-pixel area;
the evaporation system is further configured to: and evaporating the substrate by adopting the second mask module through the evaporation source to form a second evaporation material overlapped with the first evaporation material on the substrate.
8. The vapor deposition system according to claim 7,
the fourth sub-mask has a plurality of opening groups, each opening group corresponds to one sub-pixel region in the second substrate region, and each opening group includes at least one third opening.
9. The vapor deposition system according to claim 8,
the third opening in the fourth sub-mask is rectangular in shape, and each opening group includes: and four third openings, wherein the length directions of two of the third openings are the same as the row arrangement direction of the sub-pixel regions in the second substrate region, and the length directions of the other two of the third openings are the same as the column arrangement direction of the sub-pixel regions in the second substrate region.
10. The vapor deposition system according to claim 7,
the second sub-mask plate in the first mask module is also provided with a fourth opening, and the fourth sub-mask plate in the second mask module is also provided with a fifth opening;
the fourth opening and the fifth opening are used for evaporating a non-display area in the second substrate area;
the evaporation system is configured to: evaporating the substrate by adopting the first mask module through the evaporation source, and forming a first evaporation material in a non-display area of a second substrate area of the substrate;
and performing evaporation on the substrate by adopting the second mask module through the evaporation source, and forming a second evaporation material overlapped with the first evaporation material in a non-display area of a second substrate area of the substrate.
11. The vapor deposition system according to any one of claims 7 to 10,
the third sub-mask is provided with a plurality of shielding plates, the number of the fourth sub-mask in the second mask module is a plurality of, every one of the shielding plates corresponds to the fourth sub-mask, every third edge area of the fourth sub-mask coincides with the fourth edge area of the corresponding shielding plate, the third edge area is the edge area adjacent to the corresponding shielding plate in the fourth sub-mask, and the fourth edge area is the edge area adjacent to the corresponding fourth sub-mask in the shielding plate.
12. The vapor deposition system according to claim 11,
each fourth sub-mask is strip-shaped, and the length directions of the plurality of fourth sub-masks are the same.
13. An evaporation method applied to the evaporation system according to any one of claims 6 to 12, the method comprising:
and through the evaporation source, the first mask module is adopted to carry out evaporation on the substrate to be evaporated, and a first evaporation material is formed on the substrate.
14. An evaporation method according to claim 13, wherein the evaporation system comprises: the second mask plate module, the second mask plate module includes: the third sub-mask plate is a fourth sub-mask plate fixedly connected with the third sub-mask plate; the third sub-mask is provided with a shielding plate corresponding to the first opening in the first sub-mask; the fourth sub-mask plate is provided with a third opening; the shielding plate is configured to shield a first substrate area in the substrate, and the third opening is configured to evaporate a designated area in a second substrate area in the substrate, wherein the designated area is a peripheral area of the sub-pixel area; the method further comprises the following steps:
and after a first evaporation material is formed on the substrate, evaporating the substrate by using the second mask module through the evaporation source, and forming a second evaporation material overlapped with the first evaporation material on the substrate.
15. A display substrate, comprising: a substrate and a light emitting device on the substrate, the light emitting device comprising: an anode, an organic light-emitting layer, and a cathode laminated in a direction away from the substrate, the cathode being formed by the evaporation method according to claim 13 or 14;
the display substrate has a first substrate region and a second substrate region, and the cathode includes: a plate-shaped cathode located in the first substrate region, and a block-shaped cathode located in the second substrate region.
Priority Applications (1)
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| CN201911293851.9A CN110923625A (en) | 2019-12-16 | 2019-12-16 | Mask module, evaporation system, evaporation method and display substrate |
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| CN201911293851.9A CN110923625A (en) | 2019-12-16 | 2019-12-16 | Mask module, evaporation system, evaporation method and display substrate |
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