CN110919304B - Method for processing grid of vacuum microwave oscillation source - Google Patents
Method for processing grid of vacuum microwave oscillation source Download PDFInfo
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- CN110919304B CN110919304B CN201911335950.9A CN201911335950A CN110919304B CN 110919304 B CN110919304 B CN 110919304B CN 201911335950 A CN201911335950 A CN 201911335950A CN 110919304 B CN110919304 B CN 110919304B
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Abstract
The invention provides a grid processing method of a vacuum microwave oscillation source, which comprises the following steps of 1, preparing a grid wire sheet blank, a substrate blank and a spacer; step 2, carrying out structural processing on the grid wire sheet blank and the substrate blank according to the grid specification; step 3, assembling the processed grid wire sheet, the substrate and the spacer; step 4, carrying out mechanical processing on the grid obtained in the previous step; step 5, etching the grid; and 6, carrying out subsequent treatment process. The manufacturing method provided by the invention solves the processing problem of the grid with special shape, is not limited by the size of the grid wire of the grid, can process both large and small grid wires, and can realize the grid wire width of micron order; the manufacturing method can process a plurality of grids at one time, thereby improving the processing efficiency and saving the time and the cost; the special L-shaped grid wire shape produced by the manufacturing method provided by the invention can reduce the high-order mode in the oscillation source, prevent the high-frequency field from radiating to the cathode region from the resonant cavity, and the oscillation source is easy to start oscillation and has high frequency spectrum purity.
Description
Technical Field
The invention mainly relates to the technical field of microwave electronics, in particular to a method for processing a grid of a vacuum microwave oscillation source.
Background
In the microwave field, a microwave oscillation source is widely used as a microwave signal generator in the fields of radar, electronic countermeasure, communication and the like. The microwave oscillation source generally comprises a vacuum triode, a reflection klystron, a solid-state device and the like.
The microwave oscillation source consists of a cathode, a grid and a reflector, wherein the grid plays a role in adjusting electron emission. The grid usually has the shape of spoke grid, honeycomb grid, grid and the like, and the grid can only have the shape as shown in figure 1 due to the design limitation. Because of the shape of the grid mesh, conventional grid processing methods, such as laser cutting, exposure corrosion, electric spark processing, and the like, are not sufficient, a processing method is needed to solve the problem of processing the L-shaped grid mesh.
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a method for processing a grid mesh of a vacuum microwave oscillation source, wherein the L-shaped grid mesh manufactured by the method can reduce a high-order mode in the oscillation source, prevent a high-frequency field from radiating to a cathode region from a resonant cavity, and the oscillation source is easy to start oscillation and high in frequency spectrum purity.
Technical scheme
The technical scheme adopted by the invention for solving the technical problems is as follows: a processing method of a vacuum microwave oscillation source grid comprises the following steps:
step 1, preparing a grid wire sheet blank, a substrate blank and a spacer;
step 2, carrying out structural processing on the grid wire sheet blank and the substrate blank according to the grid specification;
step 3, assembling the processed grid wire sheet, the substrate and the spacer;
step 5, etching the grid;
and 6, carrying out subsequent treatment process.
Further, the specific operation method of step 2 is as follows:
step 2.1, determining grid specifications, wherein a is the width of grid wires, b is the interval of the grid wires, c is the thickness of the grid wires, d is the outer diameter of the grid and e is the inner diameter of the grid;
step 2.2, the width of the grid wire sheet blank is expressed by f, the grid wire sheet blank is bent at 90 degrees in a centering way to form an L shape, and the width of the bent grid wire sheet is a;
and 2.3, processing the substrate blank, wherein the diameter of the substrate blank is represented by h, and h is larger than the diameter d of the grid mesh.
Further, the specific operation method of step 3 is as follows: and (3) separating the grid wire sheets obtained in the step (2) by using a spacer, and brazing the grid wire sheets, the substrate and the spacer together by using a tool, wherein the width of the spacer is the interval b of the grid wires.
Further, the specific operation method of step 4 is as follows: and machining the welded grid mesh into a cylinder, wherein the outer diameter of the cylinder is the diameter d required by the grid mesh, and the height of the cylinder is f.
Further, the specific operation method of step 5 is as follows:
step 5.1, performing linear cutting on the grid mesh cylinder obtained in the step 4 along the direction vertical to the axis, and cutting the grid mesh cylinder into a plurality of grid mesh blanks, wherein the thickness of the cut blanks is the thickness c required by the grid mesh, and the size f is far larger than the size c;
and 5.2, coating a protective film between the diameter d and the diameter e of the periphery of the grid blank, and putting the grid blank into a solution capable of etching copper.
Further, the specific operation method of step 6 is as follows: and (5) carrying out processes of film removal, cleaning, annealing and detection on the grid obtained in the step (5) to obtain the grid meeting the requirements.
Advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
the manufacturing method provided by the invention solves the processing problem of the grid with special shape, is not limited by the size of the grid wire of the grid, can process both large and small grid wires, and can realize the grid wire width of micron order; the manufacturing method can process a plurality of grids at one time, thereby improving the processing efficiency and saving the time and the cost; the special L-shaped grid wire shape produced by the manufacturing method provided by the invention can reduce the high-order mode in the oscillation source, prevent the high-frequency field from radiating to the cathode region from the resonant cavity, and the oscillation source is easy to start oscillation and has high frequency spectrum purity.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic view of a grid structure according to the present invention;
FIG. 2 is a schematic diagram of a grid wire sheet blank according to the present invention;
FIG. 3 is a diagram of a quarter substrate blank according to the present invention;
FIG. 4 is an assembly diagram of the grid wire sheet, the substrate and the spacer according to the present invention;
FIG. 5 is a diagram of a machined grid according to the present invention;
fig. 6 is a schematic diagram of the etched grid according to the present invention.
Detailed Description
Reference will now be made in detail to various exemplary embodiments of the invention, the detailed description should not be construed as limiting the invention but as a more detailed description of certain aspects, features and embodiments of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made in the specific embodiments of the present disclosure without departing from the scope or spirit of the disclosure. Other embodiments will be apparent to those skilled in the art from consideration of the specification. The specification and examples are exemplary only.
Example 1
A processing method of a vacuum microwave oscillation source grid comprises the following steps:
step 1, preparing a grid wire sheet blank, a substrate blank and a spacer; generally, the blank material of the grid wire sheet is high-temperature metal tungsten or molybdenum, the blank material of the substrate is oxygen-free copper, and the material of the spacer is oxygen-free copper.
Step 2, carrying out structural processing on the grid wire sheet blank and the substrate blank according to the grid specification;
step 2.1, grid specification is determined, wherein a is grid wire width, b is grid wire interval, c is grid wire thickness, d is grid outer diameter, e is grid inner diameter, the specific grid size is different according to different working voltages, currents and working frequencies, the grid is formed by combining 4 groups of L-shaped grid wires, the designed grid wire width a is smaller than the grid wire interval b, and the grid wire interval b is smaller than the grid wire longitudinal size c, as shown in fig. 1;
step 2.2, the grid wire sheet blank is generally square or rectangular, the width of the grid wire sheet blank is represented by f, the grid wire sheet blank is bent by 90 degrees in a centering way to form an L shape, and the width of the bent grid wire sheet is a, as shown in fig. 2;
and 2.3, processing the substrate blank, wherein the diameter of the substrate blank is represented by h, h is larger than the diameter d of the grid mesh, and the figure 3 is a diagram of one fourth of the substrate blank and four same blanks are processed for standby.
Step 3, assembling the processed grid wire sheet, the substrate and the spacer, wherein the assembly schematic diagram is shown in fig. 4, the thermal resistance between the grid wire and the base material is small, and the grid wire can be cooled through the base so as to ensure that the grid wire works at normal temperature;
and (3) separating the grid wire sheets obtained in the step (2) by using a spacer, and brazing the grid wire sheets, the substrate and the spacer together by using a tool, wherein the width of the spacer is the interval b of the grid wires.
and machining the welded grid mesh into a cylinder, wherein the outer diameter of the cylinder is the diameter d required by the grid mesh, and the height of the cylinder is f.
Step 5, etching the grid, wherein the schematic diagram of the etched grid is shown in FIG. 6;
step 5.1, performing linear cutting on the grid mesh cylinder obtained in the step 4 along the direction of a vertical axis, wherein the thickness of a cut blank is the thickness c required by the grid mesh, and one grid mesh cylinder can cut a plurality of grid mesh blanks because the size f is far larger than the size c;
and 5.2, coating a protective film between the peripheral diameter d and the peripheral diameter e of the grid mesh blank, putting the grid mesh blank into a solution capable of etching copper, wherein the spacer which is not coated with the protective film is corroded due to the fact that the spacer is made of a copper material, and the grid wire material is tungsten, molybdenum and the like and is not reacted with the etching solution and is reserved.
Step 6, a subsequent treatment process;
the specific operation method of the step 6 is as follows: and (5) carrying out processes of film removal, cleaning, annealing and detection on the grid obtained in the step (5) to obtain the grid meeting the requirements.
Thus, the manufacturing of the L-shaped grid net is completed.
The foregoing is merely an illustrative embodiment of the present invention, and any equivalent changes and modifications made by those skilled in the art without departing from the spirit and principle of the present invention should fall within the protection scope of the present invention.
Claims (6)
1. A method for processing a grid of a vacuum microwave oscillation source is characterized by comprising the following steps: the method comprises the following steps:
step 1, preparing a grid wire sheet blank, a substrate blank and a spacer;
step 2, performing structural processing on the grid wire sheet blank and the substrate blank according to the grid specification, wherein the grid wire sheet blank is bent at 90 degrees in a centering way to form an L shape;
step 3, assembling the processed grid wire sheet, the substrate and the spacer; particularly, the grid wire sheets obtained in the step 2 are separated by spacers, and the grid wire sheets, the substrate and the spacers are brazed together through a tool;
step 4, machining the grid obtained in the previous step, and machining the welded grid into a cylinder;
step 5, grid etching, wherein:
step 5.1, performing linear cutting on the grid mesh cylinder obtained in the step 4 along the direction vertical to the axis, and cutting the grid mesh cylinder into a plurality of grid mesh blanks;
step 5.2, coating a protective film between the outer diameter and the inner diameter of the grid mesh blank, and putting the grid mesh blank into a solution capable of etching copper;
and 6, carrying out subsequent treatment process.
2. The method for processing the grid of the vacuum microwave oscillation source according to claim 1, wherein the method comprises the following steps: the specific operation method of the step 2 is as follows:
step 2.1, determining the grid specification, which respectively comprises the following steps: grid wire width a, grid wire interval b, grid wire thickness c, grid mesh outer diameter d and grid mesh inner diameter e;
step 2.2, the width of the grid wire sheet blank is expressed by f, the grid wire sheet blank is bent at 90 degrees in a centering way to form an L shape, and the width of the bent grid wire sheet is the width a of the grid wire;
and 2.3, processing the substrate blank, wherein the diameter of the substrate blank is represented by h, and h is larger than the outer diameter d of the grid mesh.
3. The method for processing the grid of the vacuum microwave oscillation source according to claim 2, wherein the method comprises the following steps: in the step 3, the width of the spacer is the grid wire interval b.
4. The method for processing the grid of the vacuum microwave oscillation source according to claim 3, wherein the method comprises the following steps: in the step 4, the outer diameter of the cylinder is the diameter d of the grid, and the height is f.
5. The method for processing the grid of the vacuum microwave oscillation source according to claim 4, wherein the method comprises the following steps: in said step 5.1, the thickness of the cut grid blank is the grid thickness c, wherein the dimension f is much larger than the dimension c.
6. The method for processing the grid of the vacuum microwave oscillation source according to claim 1, wherein the method comprises the following steps: the specific operation method of the step 6 is as follows: and (5) carrying out processes of film removal, cleaning, annealing and detection on the grid obtained in the step (5) to obtain the grid meeting the requirements.
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| CN201911335950.9A CN110919304B (en) | 2020-01-09 | 2020-01-09 | Method for processing grid of vacuum microwave oscillation source |
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| CN201911335950.9A CN110919304B (en) | 2020-01-09 | 2020-01-09 | Method for processing grid of vacuum microwave oscillation source |
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