CN110913671A - Heat dissipation protection device of electromechanical device - Google Patents
Heat dissipation protection device of electromechanical device Download PDFInfo
- Publication number
- CN110913671A CN110913671A CN201911269807.4A CN201911269807A CN110913671A CN 110913671 A CN110913671 A CN 110913671A CN 201911269807 A CN201911269807 A CN 201911269807A CN 110913671 A CN110913671 A CN 110913671A
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- CN
- China
- Prior art keywords
- heat dissipation
- water tank
- temperature sensor
- air outlet
- protection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a heat dissipation protection device of electromechanical equipment, which comprises a body; a cooling mechanism is arranged on one side of the body; a first heat dissipation cover and a second heat dissipation cover are arranged on the other side of the body; a cabinet door is arranged on the body; a control panel is arranged on the cabinet door; the body is connected with an upper water tank and a lower water tank in a clamping manner. The invention has high heat dissipation efficiency and good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation protection device for electromechanical equipment.
Background
The electromechanical device generates heat seriously during working, particularly in hot summer, although the electromechanical device is provided with a heat dissipation device, the heat in the electromechanical device cannot be controlled in time due to the limitation of a shell, the electromechanical device is in a heating or even scalding state for a long time, the electromechanical device is easy to cause faults of the electromechanical device, the working efficiency is influenced, in addition, the surface of the electromechanical device can be easily scalded, and certain potential safety hazards exist. Electromechanical device if block terminal, the control box, the cubical switchboard, computer case can produce a large amount of heats when equipment moves, in order to make electromechanical device can normal operation, the block terminal has been guaranteed, equipment such as control box can not damage because of high temperature, install water-cooling heat abstractor additional usually, present water-cooling heat abstractor heat dissipation capacity is certain, cool down through the hydrologic cycle, the temperature of water itself is not low enough, as the medium of cooling, its cooling effect is poor, and the speed of cooling is also slow, lead to electromechanical device unable timely heat dissipation and burn out easily.
Therefore, in view of the above current situation, there is an urgent need to develop a heat dissipation protection device for an electromechanical device with a good heat dissipation effect.
Disclosure of Invention
The present invention is directed to a heat dissipation protection device for an electromechanical device, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a heat dissipation protection device of electromechanical equipment comprises a body; a cooling mechanism is arranged on one side of the body; a first heat dissipation cover and a second heat dissipation cover are arranged on the other side of the body; a cabinet door is arranged on the body; a control panel is arranged on the cabinet door; the body is connected with an upper water tank and a lower water tank in a clamping manner.
As a further scheme of the invention: the upper water tank is provided with a water inlet, a first temperature sensor and a pressure sensor; and a second temperature sensor is arranged on the lower water tank.
As a further scheme of the invention: a semiconductor refrigerator is arranged at the top end of the first temperature sensor; the semiconductor refrigerator comprises a cold end and a hot end; the hot end of the semiconductor refrigerator extends into the upper water tank; the upper water tank is respectively communicated with the lower water tank through a lower water pipe and an upper water pipe.
As a further scheme of the invention: the cooling mechanism comprises a refrigerator; one side of the refrigerator is connected with the mounting box; a driving motor is arranged in the installation box; the refrigerator penetrates through the installation box through a first air pipe and is communicated with the rotating box; the driving motor is connected with the rotating blade through a coupler; an air outlet is formed in the rotary box; the air outlet comprises a first air outlet and a second air outlet; the first air outlet is formed in the top end of the rotary box; and one end of the rotary box, which is far away from the first air pipe, is provided with a second air outlet.
As a further scheme of the invention: the cooling mechanism is provided with a second air pipe corresponding to the semiconductor refrigerator; no. two tuber pipes fixed connection air outlet No. one.
As a further scheme of the invention: control panel electric connection temperature sensor, pressure sensor, No. two temperature sensor, No. three temperature sensor, humidity transducer, water pump and driving motor.
As a further scheme of the invention: the bottom end in the body is provided with a radiating fin.
Compared with the prior art, the invention has the beneficial effects that: the temperature and the pressure in the upper water tank and the lower water tank are accurately detected through a first temperature sensor, a second temperature sensor and a pressure sensor; through the arrangement of the upper water tank, the semiconductor refrigerator, the lower water pipe, the upper water pipe, the water pump and the lower water tank, the heat generated by internal parts of the device can be effectively absorbed; through the arrangement of the third temperature sensor, the refrigerator, the first air pipe, the driving motor, the rotating blades and the air outlet, when the temperature is too high, the cold air inlet speed can be increased, and the heat dissipation rate is further increased; the heat dissipation fin absorbs the heat inside the device and then is discharged through the second heat dissipation cover, and the heat dissipation efficiency is further improved through the arrangement of the heat dissipation fin and the second heat dissipation cover. In conclusion, the invention has high heat dissipation efficiency and good heat dissipation effect.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic cross-sectional structure of the present invention.
Fig. 3 is a schematic structural view of a cooling mechanism in the present invention.
In the figure: 1-body, 2-cabinet door, 3-cooling mechanism, 4-water feeding tank, 5-first temperature sensor, 6-pressure sensor, 7-control panel, 8-water discharging tank, 9-second temperature sensor, 10-first heat dissipation cover, 11-second heat dissipation cover, 12-semiconductor refrigerator, 13-second air pipe, 14-third temperature sensor, 15-humidity sensor, 16-water discharging pipe, 17-water feeding pipe, 18-water pump, 19-heat dissipation plate, 20-refrigerator, 21-first air pipe, 22-driving motor, 23-rotating blade, 24-rotating box and 25-air outlet.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Example 1
Referring to fig. 1 to 3, in an embodiment of the present invention, a heat dissipation protection device for an electromechanical device includes a body 1; a cooling mechanism 3 is arranged on one side of the body 1; a first heat dissipation cover 10 and a second heat dissipation cover 11 are mounted on the other side of the body 1; a cabinet door 2 is arranged on the body 1; the cabinet door 2 is provided with a control panel 7; the upper water tank 4 and the lower water tank 8 are clamped on the body 1.
Further, a water inlet, a first temperature sensor 5 and a pressure sensor 6 are arranged on the upper water tank 4; a second temperature sensor 9 is arranged on the lower water tank 8; the temperature and pressure inside the upper water tank 4 and the lower water tank 8 are accurately detected by the first temperature sensor 5, the second temperature sensor 9, and the pressure sensor 6.
Further, a semiconductor refrigerator 12 is installed at the top end of the first temperature sensor 5; the semiconductor refrigerator 12 includes a cold end and a hot end; the lower the hot end temperature, the lower the cold end temperature; the hot end of the semiconductor refrigerator 12 extends into the upper water tank 4; the upper water tank 4 is respectively communicated with the lower water tank 8 through a lower water pipe 16 and an upper water pipe 17; the water pump 18 is arranged on the sewer pipe 16; the upper water tank 4, the lower water pipe 16, the water pump 18, the lower water tank 8 and the upper water pipe 17 form a circulating system; the arrangement of the upper water tank 4, the semiconductor refrigerator 12, the lower water pipe 16, the upper water pipe 17, the water pump 18 and the lower water tank 8 can effectively absorb heat generated by internal parts of the device.
Further, the cooling mechanism 3 includes a refrigerator 20; one side of the refrigerator 20 is connected to the installation box; a driving motor 22 is arranged in the installation box; the refrigerator 20 penetrates through the installation box through a first air pipe 21 and is communicated with a rotary box 24; the driving motor 22 is connected with the rotating blade 23 through a coupler; an air outlet 25 is arranged on the rotary box 24; the air outlet 25 comprises a first air outlet and a second air outlet; the first air outlet is formed in the top end of the rotary box 24; one end of the rotary box 24, which is far away from the first air pipe 21, is provided with a second air outlet; the driving motor 22 is electrically connected with the third temperature sensor 14; through the setting of No. three temperature sensor 14, refrigerator 20, No. one tuber pipe 21, driving motor 22, rotating vane 23 and air outlet 25, when the temperature was too high, can promote cold wind admission speed, further improve the radiating rate.
Further, the cooling mechanism 3 is provided with a second air pipe 13 corresponding to the semiconductor refrigerator 12; the second air pipe 13 is fixedly connected with the first air outlet; the temperature of the hot end of the semiconductor refrigerator 12 can be quickly reduced through the second air pipe 13, and the heat dissipation efficiency is improved.
Further, control panel 7 electric connection temperature sensor 5, pressure sensor 6, No. two temperature sensor 9, No. three temperature sensor 14, humidity transducer 15, water pump 18 and driving motor 22, can control the work of a temperature sensor 5, pressure sensor 6, No. two temperature sensor 9, No. three temperature sensor 14, humidity transducer 15, water pump 18 and driving motor 22.
Example 2
Referring to fig. 2, a heat sink 19 is installed at the bottom end inside the body 1; the heat sink 19 absorbs the heat inside the device and then is exhausted through the second heat dissipation cover 11, and the heat dissipation efficiency is further improved through the arrangement of the heat sink 19 and the second heat dissipation cover 11.
The working principle of the invention is as follows: the temperature and the pressure inside the upper water tank 4 and the lower water tank 8 are accurately detected through the first temperature sensor 5, the second temperature sensor 9 and the pressure sensor 6; through the arrangement of the upper water tank 4, the semiconductor refrigerator 12, the lower water pipe 16, the upper water pipe 17, the water pump 18 and the lower water tank 8, the heat generated by internal parts of the device can be effectively absorbed; through the arrangement of the third temperature sensor 14, the refrigerator 20, the first air pipe 21, the driving motor 22, the rotating blades 23 and the air outlet 25, when the temperature is too high, the cold air inlet speed can be increased, and the heat dissipation rate is further increased; the heat sink 19 absorbs the heat inside the device and then is exhausted through the second heat dissipation cover 11, and the heat dissipation efficiency is further improved through the arrangement of the heat sink 19 and the second heat dissipation cover 11. In conclusion, the invention has high heat dissipation efficiency and good heat dissipation effect.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A heat dissipation protection device of electromechanical equipment comprises a body (1); the device is characterized in that a cooling mechanism (3) is arranged on one side of the body (1); a first heat dissipation cover (10) and a second heat dissipation cover (11) are mounted on the other side of the body (1); a cabinet door (2) is arranged on the body (1); a control panel (7) is arranged on the cabinet door (2); an upper water tank (4) and a lower water tank (8) are clamped on the body (1).
2. The heat dissipation protection device of the electromechanical device according to claim 1, wherein the upper water tank (4) is provided with a water inlet, a first temperature sensor (5) and a pressure sensor (6); and a second temperature sensor (9) is arranged on the lower water tank (8).
3. The thermal dissipation protection device of electromechanical equipment according to claim 1, wherein a semiconductor refrigerator (12) is mounted on the top end of the first temperature sensor (5); the semiconductor refrigerator (12) comprises a cold end and a hot end; the hot end of the semiconductor refrigerator (12) extends into the upper water tank (4); the upper water tank (4) is respectively communicated with the lower water tank (8) through a lower water pipe (16) and an upper water pipe (17).
4. The thermal protection device for electromechanical apparatuses according to claim 1, characterized in that said cooling means (3) comprise a refrigerator (20); one side of the refrigerator (20) is connected with the mounting box; a driving motor (22) is arranged in the mounting box; the refrigerator (20) penetrates through the installation box through a first air pipe (21) and is communicated with the rotary box (24); the driving motor (22) is connected with the rotating blade (23) through a coupling; an air outlet (25) is arranged on the rotary box (24); the air outlet (25) comprises a first air outlet and a second air outlet; the first air outlet is formed in the top end of the rotary box (24); and a second air outlet is formed in one end, far away from the first air pipe (21), of the rotary box (24).
5. The heat dissipation protection device of the electromechanical device according to claim 4, wherein the cooling mechanism (3) is provided with a second air duct (13) corresponding to the semiconductor refrigerator (12); and the second air pipe (13) is fixedly connected with the first air outlet.
6. The heat dissipation protection device of the electromechanical device according to claim 1, wherein the control panel (7) is electrically connected to a first temperature sensor (5), a pressure sensor (6), a second temperature sensor (9), a third temperature sensor (14), a humidity sensor (15), a water pump (18), and a driving motor (22).
7. The thermal protection device for an electromechanical device according to claim 1, characterized in that a heat sink (19) is mounted at the bottom end inside the body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911269807.4A CN110913671A (en) | 2019-12-11 | 2019-12-11 | Heat dissipation protection device of electromechanical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911269807.4A CN110913671A (en) | 2019-12-11 | 2019-12-11 | Heat dissipation protection device of electromechanical device |
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| Publication Number | Publication Date |
|---|---|
| CN110913671A true CN110913671A (en) | 2020-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911269807.4A Pending CN110913671A (en) | 2019-12-11 | 2019-12-11 | Heat dissipation protection device of electromechanical device |
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| Country | Link |
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| CN (1) | CN110913671A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244802A (en) * | 2020-03-26 | 2020-06-05 | 广东中兴电器开关股份有限公司 | Alternating-current low-voltage power distribution cabinet convenient for intelligent management |
| CN111511142A (en) * | 2020-05-12 | 2020-08-07 | 重庆工程职业技术学院 | Cloud computing server platform based on big data |
| CN111542180A (en) * | 2020-03-31 | 2020-08-14 | 驻马店职业技术学院 | Automatic control cabinet for electric appliance |
| CN111683490A (en) * | 2020-06-05 | 2020-09-18 | 孙勉 | Railway traffic signal control box |
| CN112739162A (en) * | 2020-12-23 | 2021-04-30 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
| CN115636379A (en) * | 2022-10-09 | 2023-01-24 | 美通重工有限公司 | Arm type high-altitude vehicle steering gear |
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| CN206892786U (en) * | 2017-03-29 | 2018-01-16 | 江西现代职业技术学院 | A kind of computer water-cooling radiating device |
| CN109688752A (en) * | 2019-02-18 | 2019-04-26 | 广州市望高泵业有限公司 | A kind of frequency-conversion control cabinet of dual frequency converter control |
| CN208969598U (en) * | 2018-11-24 | 2019-06-11 | 宁丹丹 | A kind of automated computer cooling device |
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2019
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Patent Citations (4)
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| EP2279720A1 (en) * | 2009-07-27 | 2011-02-02 | ABATEC Electronic AG | Electric sauna heater including a control unit |
| CN206892786U (en) * | 2017-03-29 | 2018-01-16 | 江西现代职业技术学院 | A kind of computer water-cooling radiating device |
| CN208969598U (en) * | 2018-11-24 | 2019-06-11 | 宁丹丹 | A kind of automated computer cooling device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244802A (en) * | 2020-03-26 | 2020-06-05 | 广东中兴电器开关股份有限公司 | Alternating-current low-voltage power distribution cabinet convenient for intelligent management |
| CN111542180A (en) * | 2020-03-31 | 2020-08-14 | 驻马店职业技术学院 | Automatic control cabinet for electric appliance |
| CN111511142A (en) * | 2020-05-12 | 2020-08-07 | 重庆工程职业技术学院 | Cloud computing server platform based on big data |
| CN111683490A (en) * | 2020-06-05 | 2020-09-18 | 孙勉 | Railway traffic signal control box |
| CN111683490B (en) * | 2020-06-05 | 2021-05-28 | 文登市有利成套电源设备有限公司 | Railway traffic signal control box |
| CN112739162A (en) * | 2020-12-23 | 2021-04-30 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
| CN112739162B (en) * | 2020-12-23 | 2023-01-03 | 江苏明茂新能源科技有限公司 | High-efficient photovoltaic fills electric pile |
| CN115636379A (en) * | 2022-10-09 | 2023-01-24 | 美通重工有限公司 | Arm type high-altitude vehicle steering gear |
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Application publication date: 20200324 |
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