CN110911320B - Cooling device, control method thereof and semiconductor processing equipment - Google Patents
Cooling device, control method thereof and semiconductor processing equipment Download PDFInfo
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- CN110911320B CN110911320B CN201911251679.0A CN201911251679A CN110911320B CN 110911320 B CN110911320 B CN 110911320B CN 201911251679 A CN201911251679 A CN 201911251679A CN 110911320 B CN110911320 B CN 110911320B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Abstract
The embodiment of the application provides a cooling device, a control method thereof and semiconductor processing equipment. The cooling device is used for cooling the tray and comprises a cavity, a driving unit, a cooling unit and a heating unit, wherein the driving unit, the cooling unit and the heating unit are arranged in the cavity; the driving unit is used for driving the tray to move so as to drive the tray to be selectively positioned at a first position or a second position; the cooling unit is used for cooling the tray, cooling the tray at a first speed when the tray is located at a first position, cooling the tray at a second speed when the tray is located at a second position, and the second speed is larger than the first speed; the heating unit is used for selectively heating the tray so as to adjust the cooling rate of the cooling unit on the tray. The embodiment of the application realizes the stable cooling speed of the tray, thereby effectively improving the cooling efficiency and further ensuring that the cooling of the tray is not a bottleneck affecting the productivity.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a cooling device, a control method thereof and semiconductor processing equipment.
Background
Currently, physical vapor deposition (Physical Vapor Deposition, PVD) processes are widely used in the production of Light Emitting Diodes (LEDs), and after aluminum nitride is added in the PVD process, the productivity and chip performance of the LEDs are greatly improved. In the process, the process temperature is 600-700 ℃, but the temperature is required to be reduced to below 60 ℃ after the tray is taken out in consideration of personal safety of production staff, so that a cooling cavity is added to cool the tray.
With the development of technology and the improvement of production efficiency, the required production tact is accelerated to become a bottleneck for cooling the tray. To increase the tact, it is necessary to increase the cooling rate of the cooling, but the increase in the cooling rate increases the risk of breakage of the tray. Therefore, how to improve the cooling rate and reduce the risk of the broken disc at the same time becomes a problem which needs to be solved at present.
Disclosure of Invention
The application provides a cooling device, a control method thereof and semiconductor processing equipment aiming at the defects of the prior art, and aims to solve the technical problems of low cooling efficiency and easiness in occurrence of disc breakage in the prior art.
In a first aspect, an embodiment of the present application provides a cooling device for cooling a tray, including: the chamber, and the driving unit, the cooling unit and the heating unit are arranged in the chamber; the driving unit is used for driving the tray to move so as to drive the tray to be selectively positioned at a first position or a second position; the cooling unit is used for cooling the tray, cooling the tray at a first speed when the tray is located at a first position, cooling the tray at a second speed when the tray is located at a second position, and the second speed is larger than the first speed; the heating unit is used for selectively heating the tray so as to adjust the cooling rate of the cooling unit on the tray.
In an embodiment of the present application, a temperature detection unit is further disposed in the chamber, the temperature detection unit is configured to collect temperature change data of the tray, and the heating unit is configured to adjust heating power of the tray according to the temperature change data.
In an embodiment of the application, the temperature detecting unit includes a plurality of temperature sensors, and the plurality of temperature sensors are arranged at the top of the chamber along the radial direction of the tray, and are respectively used for collecting temperature change data of the middle area and the edge area of the tray.
In an embodiment of the application, the temperature sensor is a non-contact temperature sensor.
In an embodiment of the application, the heating unit includes a first heating unit aligned with a central region of the tray and a second heating unit aligned with an edge region of the tray.
In an embodiment of the application, the first heating unit and the second heating unit each include a plurality of heating lamps, and the plurality of heating lamps are all disposed at the top of the chamber and are circumferentially arranged around the axis of the chamber.
In an embodiment of the application, a reflecting plate is further disposed between the heating unit and the chamber wall for reflecting the heat radiation of the heating unit.
In an embodiment of the application, the cooling unit is located at the bottom of the chamber; the first position is a position above the cooling unit with a space, and the second position is an upper surface of the cooling unit.
In an embodiment of the application, the cooling unit is a cooling platform provided with a liquid cooling pipeline.
In a second aspect, an embodiment of the present application provides a semiconductor processing apparatus comprising a cooling device as provided in the first aspect.
In a third aspect, an embodiment of the present application provides a control method of a cooling apparatus, including: controlling a driving unit to move the tray to a first position or a second position for cooling; the temperature of the tray in the cooling process is monitored in real time to obtain an actual cooling curve; and comparing the actual cooling curve with a preset cooling curve in real time, and controlling the execution rate of the heating unit according to the comparison result.
In an embodiment of the application, the controlling the operation state of the heating unit according to the comparison result includes:
when the actual cooling curve is higher than the preset cooling curve, controlling the heating unit to reduce heating power;
and when the actual cooling curve is lower than the preset cooling curve, controlling the heating unit to increase heating power.
In an embodiment of the present application, the controlling the driving unit to move the tray to the first position or the second position for cooling includes: when the tray is detected to be larger than a first preset temperature, the driving unit is controlled to move the tray to a first position; and when the tray is detected to be smaller than the first preset temperature, controlling the driving unit to move the tray to the second position.
In an embodiment of the present application, the control method further includes: and when the temperature of the tray is detected to reach a second preset temperature, the heating unit is controlled to be closed.
The technical scheme provided by the embodiment of the application has the beneficial technical effects that:
according to the embodiment of the application, the heating unit is arranged, when the tray is positioned at the first position and the second position, the heating unit can heat the tray to adjust the cooling rate of the tray, so that the cooling rate of the tray can be stabilized, the cooling efficiency can be effectively improved, and the cooling of the tray is not a bottleneck affecting the productivity. In addition, due to the heating unit, the tray can be effectively prevented from being broken due to too fast temperature change, so that the risk of broken tray generation can be greatly reduced, the cost of semiconductor manufacturing can be reduced, and the economic benefit can be improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic front sectional view of a cooling device according to an embodiment of the present application;
FIG. 2 is a schematic top cross-sectional view of a cooling device according to an embodiment of the present application;
fig. 3 is a flow chart of a control method of a cooling device according to an embodiment of the present application.
Detailed Description
The present application is described in detail below, examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Further, if detailed description of the known technology is not necessary for the illustrated features of the present application, it will be omitted. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments.
The embodiment of the application provides a cooling device for cooling a tray 10, wherein the tray 10 is provided with a plurality of bearing positions for respectively bearing wafers to be processed. The cooling device has a structure schematically shown in fig. 1, and comprises a chamber 1, a driving unit 2, a cooling unit 3 and a heating unit 4, wherein the driving unit 2, the cooling unit 3 and the heating unit 4 are arranged in the chamber 1; the driving unit 2 is used for driving the tray 10 to move so as to drive the tray 10 to be selectively positioned at the first position 21 or the second position 22; the cooling unit 3 is used for cooling the tray 10, cooling the tray 10 at a first rate when the tray 10 is located at the first position 21, cooling the tray 10 at a second rate when the tray 10 is located at the second position 22, and the second rate is greater than the first rate; the heating unit 4 is used to selectively heat the tray 10 to adjust the rate at which the cooling unit 3 cools the tray 10.
As shown in fig. 1, a hollow cooling cavity may be formed in the chamber 1, and the cooling cavity may be in a vacuum state in practical use. Optionally, a cooling gas may be introduced into the chamber 1 to cool the tray 10. The driving unit 2, the cooling unit 3 and the heating unit 4 may be disposed inside the chamber 1, i.e. may be disposed in the cooling chamber, and the above components may be disposed on the inner wall of the chamber 1, but the embodiment of the application is not limited thereto. The driving unit 2 may be used to carry the tray 10 to drive the tray 10 to selectively be located at the first position 21 or the second position 22. In particular, the first position 21 may be a relatively large distance from the cooling unit 3, while the second position 22 may be a position above and in abutment with the cooling unit 3, the second rate may be greater than the first rate, since the closer to the cooling unit 3 the cooling rate is faster. The heating unit 4 may heat the tray 10 when the tray 10 is located in the first position 21 or the second position 22, thereby realizing adjustment of the cooling rate.
In practical application, as shown in fig. 1, after the tray 10 completes the process in other process chambers 1, due to the higher temperature of the tray 10, the tray 10 can be conveyed into the chambers 1 and driven to the first position 21 by the driving unit 2, the heating unit 4 can be synchronously started at the moment, cooling gas is introduced into the chambers 1, and when the chambers 1 reach a certain pressure, ventilation is stopped, and the rate of stable cooling by adjusting the heating power of the heating unit 4, so that the phenomenon of broken trays caused by too fast cooling is avoided, and meanwhile, the cooling efficiency can be ensured. With the above design, the tray 10 is prevented from being directly located at the second position 22, and the tray is prevented from being broken due to too fast temperature change.
When the tray 10 reaches a certain temperature, the tray 10 can be arranged at the second position 22, that is, the tray 10 is directly contacted with the cooling unit 3, so that the cooling rate can be increased, and the cooling time can be greatly reduced, and as the cooling rate of the tray 10 on the cooling unit 3 is too fast, the temperature of the tray 10 placed on the cooling unit 3 is not easy to be too high, and in the prior art, the tray 10 is placed on the cooling unit 3 at a temperature higher than 200 ℃ so as to easily cause breakage of the tray. However, since the heating unit 4 is provided in the embodiment of the present application, the cooling rate can be adjusted, so that the tray 10 can be placed at the second position 22 when the temperature reaches 250 ℃ to quickly cool and avoid the occurrence of the broken tray phenomenon.
According to the embodiment of the application, the heating unit is arranged, when the tray is positioned at the first position and the second position, the heating unit can heat the tray to adjust the cooling rate of the tray, so that the cooling rate of the tray can be stabilized, the cooling efficiency can be effectively improved, and the cooling of the tray is not a bottleneck affecting the productivity. In addition, due to the heating unit, the tray can be effectively prevented from being broken due to too fast temperature change, so that the risk of broken trays can be greatly reduced, the cost of semiconductor manufacturing can be reduced, and the economic benefit can be improved.
It should be noted that the embodiment of the present application is not limited to the specific heights of the first location 21 and the second location 22, and those skilled in the art may adjust the cooling unit 3 according to the type and the temperature thereof. Therefore, embodiments of the present application are not limited thereto, and those skilled in the art may adjust the cooling rate in other ways. On the other hand, the present embodiment does not necessarily need to change the cooling rate by adjusting the position of the tray 10, and a person skilled in the art may adjust the cooling rate according to the type of the cooling unit 3, so the embodiment of the present application is not limited thereto.
In an embodiment of the present application, a temperature detecting unit 5 is further disposed in the chamber 1, the temperature detecting unit 5 is used for collecting temperature variation data of the tray 10, and the heating unit 4 is used for adjusting heating power of the tray 10 according to the temperature variation data.
As shown in fig. 1 to 2, the temperature detection unit 5 may also be provided inside the chamber 1, for example, the temperature detection unit 5 may be provided at the top of the chamber 1. The temperature detection unit 5 and the heating unit 4 can be electrically connected with a main controller, the temperature detection unit 5 can detect the temperature of the surface of the tray 10 and generate a temperature signal, the temperature detection unit 5 can send the temperature signal to the main controller, and the main controller can control the heating unit 4 according to the temperature signal so as to control the heating unit 4 to heat the tray 10 with different heating powers. For example, when the temperature of the tray 10 drops too fast, it is possible to increase the power of the heating unit 4 so as to avoid the tray 10 from being broken due to too fast temperature change; or when the temperature of the tray 10 is lowered too slowly, the power of the heating unit 4 may be lowered to accelerate the cooling rate of the tray 10, thereby effectively improving the cooling efficiency of the tray 10 while ensuring the stability of the tray 10.
It should be noted that the specific position and arrangement of the temperature detecting unit 5 are not limited in the embodiment of the present application, for example, the temperature detecting unit 5 may be arranged on the side wall of the chamber by bonding or screwing, so long as it can detect the surface temperature of the tray 10. Therefore, the embodiment of the application is not limited to this, and the person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 2, the temperature detecting unit 5 includes a plurality of temperature sensors 51, and the plurality of temperature sensors 51 are arranged on the top of the chamber 1 along the radial direction of the tray 10, and are respectively used for collecting temperature change data of the middle area and the edge area of the tray 10. The number of the temperature sensors 51 may be three, and the three temperature sensors 51 may be arranged in the radial direction of the tray 10, and the temperature sensor 51 arranged in the first may be aligned with the center of the tray 10, and the last may be aligned with the edge of the tray 10. With the above design, since the plurality of temperature sensors 51 can be arranged along the radial direction of the tray 10, the temperature change of different areas of the tray 10 can be monitored in real time, so that the corresponding adjustment of the heating unit 4 can be controlled according to the temperature change data of different areas, the uniformity of the cooling of the tray 10 can be improved, and the risk of breakage of the tray 10 can be further reduced.
It should be noted that, the embodiment of the present application is not limited to a specific number of temperature sensors 51, for example, the temperature sensors 51 may be set to three or more, so that temperature monitoring of how accurately the temperature of the tray 10 is achieved. Therefore, the embodiment of the application is not limited to this, and the person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, as shown in fig. 1 to 2, the temperature sensor 51 is a non-contact temperature sensor 51. Specifically, the temperature sensor 51 may be an infrared temperature sensor or a laser temperature sensor. With the above design, the non-contact temperature sensor 51 can remotely measure the temperature of the tray 10, so that the interference between the temperature sensor 51 and the driving unit 2 can be avoided, and the embodiment of the application has simple structure and reduces the failure rate. On the other hand, by adopting the design, the cooling unit 3 can be prevented from interfering the temperature sensor 51, so that the monitoring precision of the temperature sensor 51 can be effectively improved. It should be noted that the embodiment of the present application is not limited to the specific type of the temperature sensor 51, and a person skilled in the art can adjust the setting according to the actual situation.
In one embodiment of the present application, as shown in fig. 1 to 2, the heating unit 4 includes a first heating unit 41 and a second heating unit 42, wherein the first heating unit 41 is aligned with a middle region of the tray 10, and the second heating unit 42 is aligned with an edge region of the tray 10. Specifically, the heating unit 4 may adjust the heating power according to the temperature change data of the different areas detected by the temperature detecting unit 5. For example, when the temperature of the middle area of the tray 10 changes too fast, the temperature reduction rate of the middle area of the tray 10 can be adjusted by adjusting the heating power of the first heating unit 41; for example, when the temperature of the edge area of the tray 10 is too fast, the temperature reduction rate of the edge area of the tray 10 can be adjusted by adjusting the heating power of the first heating and changing unit. By adopting the design, the first heating unit 41 and the second heating unit 42 are arranged, so that different heating power can be controlled in different areas of the tray 10, the uniformity of the overall temperature of the tray 10 can be effectively improved, and the risk of broken trays of the tray 10 can be effectively reduced.
It should be noted that the embodiment of the present application is not limited to the specific implementation manner of the heating unit 4, for example, the heating unit 4 may further include a plurality of sub-heating units, and the plurality of sub-heating units may respectively heat different fan-shaped areas of the tray 10 with different heating powers, and meanwhile, the temperature detecting unit 5 may also monitor the temperatures of the different fan-shaped areas of the tray 10 in real time. Therefore, the embodiment of the application is not limited to this, and the person skilled in the art can adjust the setting according to the actual situation.
In an embodiment of the present application, the first heating unit 41 and the second heating unit 42 each include a plurality of heating lamps, and the plurality of heating lamps are disposed at the top of the chamber 1 and are circumferentially arranged around the axis of the chamber 1.
As shown in fig. 1 to 2, each of the first heating unit 41 and the second heating unit 42 may include a plurality of heating lamps. Specifically, a plurality of heating lamps may be disposed at the top of the chamber 1 and circumferentially arranged around the axis of the chamber 1, and a specific plurality of heating lamps may be arranged in two turns, wherein one turn on the inner side may constitute the first heating unit 41 and one turn on the outer side may form the second heating unit 42. By adopting the design, the embodiment of the application has simple structure and lower application and maintenance cost due to the arrangement of the plurality of heating lamps. Further use of the heating lamp also enables remote heating of the tray 10, as well as avoiding interference of the heating unit 4 with the drive unit 2. It should be noted that the embodiments of the present application are not limited to the specific embodiments of the first heating unit 41 and the second heating unit 42, and for example, both may use a strip heating lamp and be disposed around the center of the chamber 1. Therefore, the embodiment of the application is not limited to this, and a person skilled in the art can adjust the setting according to the actual working condition.
In an embodiment of the present application, as shown in fig. 1, a reflecting plate 6 is further disposed between the heating unit 4 and the inner wall of the chamber 1, for reflecting the heat radiation of the heating unit 4. The reflecting plate 6 may be a circular plate structure made of stainless steel or molybdenum. The reflecting plate 6 may be disposed at the top of the chamber 1, for example, by bolting or welding, which is not limited to the embodiment of the present application. Alternatively, the heating unit 4 may be disposed under the reflection plate 6, so that the reflection plate 6 may better reflect the heat radiation of the heating unit 4, thereby avoiding the chamber 1 from being directly affected by the heat radiation; in addition, the reflecting plate 6 can also improve the heating efficiency of the heating unit 4, so that the application cost of the embodiment of the application can be further reduced. Alternatively, the temperature detecting unit 5 may be provided on the reflecting plate 6, for example, when the temperature detecting unit 5 includes a plurality of temperature sensors 51, a plurality of mounting holes may be correspondingly provided in the reflecting plate 6 for mounting the plurality of temperature sensors 51. With the above design, the temperature detecting unit 5 can be arranged not right above the heating unit 4, so that the temperature of the tray 10 can be tested, and the heating unit 4 can be prevented from directly irradiating the temperature detecting unit 5, thereby affecting the accuracy of testing the temperature of the tray 10.
It should be noted that the embodiments of the present application are not limited to the specific implementation of the heating plate, but in some other embodiments, the heating plate may be coated on the inner wall of the chamber 1. Therefore, the embodiment of the application is not limited to this, and a person skilled in the art can adjust the setting according to the actual working condition.
In an embodiment of the present application, as shown in fig. 1, the cooling unit 3 is located at the bottom of the chamber 1; the first position 21 is a position above the cooling unit 3 with a space, and the second position 22 is an upper surface of the cooling unit 3. The cooling unit 3 may be disposed at the bottom of the chamber 1, and the first position 21 may be located at a position above the cooling unit 3 with a certain interval, but the embodiment of the present application is not limited to the specific height of the interval, and may be adjusted by a person skilled in the art according to the actual situation. With the above design, the tray 10 can be prevented from directly contacting the cooling unit 3, and the phenomenon of broken trays due to too fast temperature change can be avoided. The second position 22 may be a position on the upper surface of the cooling unit 3, and when the tray 10 is cooled at the first position 21 for a certain period of time, it is moved to the second position 22, so as to further improve the cooling efficiency of the embodiment of the present application. It should be noted that the embodiment of the present application is not limited to the specific positions of the first position 21 and the second position 22, and the driving unit 2 may drive the tray 10 to move by a plurality of positions. Therefore, the embodiment of the application is not limited to this, and a person skilled in the art can adjust the setting according to the actual working condition.
In an embodiment of the present application, as shown in fig. 1, the cooling unit 3 is a cooling platform with liquid cooling pipes. The cooling unit 3 may be disposed at the bottom of the chamber 1, and may be provided therein with a liquid cooling line 7, the liquid cooling line 7 being connected with a cold source for cooling the tray 10. However, it should be noted that the embodiment of the present application is not limited to the specific type of the cooling unit 3, and those skilled in the art can adjust the setting according to the actual situation. Optionally, the bottom of the chamber 1 may be further provided with an air inlet pipe 8 to assist in cooling the tray 10 by delivering cooling air to the chamber 1, but the embodiment of the present application is not limited thereto, and a person skilled in the art may adjust the setting by himself.
Based on the same inventive concept, embodiments of the present application provide a semiconductor processing apparatus including the cooling device provided in each of the above embodiments.
Based on the same inventive concept, an embodiment of the present application provides a control method of a cooling device, a flow chart of the method is shown in fig. 3, and the method includes:
s301: the drive unit 2 is controlled to move the tray 10 to the first position 21 or the second position 22 for cooling.
S302: the temperature of the tray 10 during the cooling process is monitored in real time to obtain an actual cooling profile.
Alternatively, when it is detected that the tray 10 is greater than the first preset temperature, the driving unit 2 is controlled to move the tray 10 to the first position 21; when it is detected that the tray 10 is smaller than the first preset temperature, the drive unit 2 is controlled to move the tray 10 to the second position 22.
S303: the actual cooling curve is compared with a preset cooling curve in real time, and the heating rate of the heating unit 4 is controlled according to the comparison result.
Optionally, when the actual cooling curve is higher than the preset cooling curve, controlling the heating unit 4 to reduce heating power; and when the actual cooling curve is lower than the preset cooling curve, controlling the heating unit 4 to increase heating power.
Optionally, when the temperature of the tray 10 is detected to reach the second preset temperature, the heating unit 4 is controlled to be turned off.
As shown in fig. 1 to 3, a control method of the cooling device will be described below by way of a specific embodiment.
Specifically, a preset cooling curve can be made between the process temperature and the first preset temperature, the temperature of the tray 10 can be tested at intervals of 5 seconds in practice, the temperature change data can be formed into an actual cooling curve, the actual cooling curve is fed back to the main controller, the actual cooling curve is compared with the preset cooling curve, and when the actual cooling curve is lower than the set point, the heating power of the heating unit 4 can be increased.
For example, the process temperature T1, the first preset temperature may be 250 ℃, and the time required for the process temperature to drop to the first preset temperature is reduced to Y1, thereby determining the preset cooling profile. The temperatures of the points on the preset cooling curve are t11, t12, t13, t1n and … …, and the temperature of the tray 10 is high in the initial stage of cooling, so that the heating unit 4 is started in the initial stage. When the n-th point test temperature in the actual cooling curve is lower than t1n, the heating power of the heating unit 4 can be increased, when the n+1th point test temperature is still lower than t1 (n+1), the heating power is increased continuously by the heater, when the n-th point test temperature is higher than t1n, the heating power is reduced by the heating unit 4, when the n+1th point test temperature is still higher than t1 (n+1), the heating power is continuously reduced until the corresponding temperature of the next point test is equal to the preset cooling curve. When the time Y1 arrives and the temperature drops to 250 ℃, the tray 10 can be moved to the second position 22 by the driving unit 2 for cooling, and the tray 10 can be directly placed on the cooling unit 3. In addition, if the temperature difference between the inner and outer rings is large in the cooling process, the temperature uniformity of the tray 10 can be adjusted by adjusting the heating power of the first heating unit 41 and the second heating unit 42, so that the risk of crushing the tray is reduced.
Further, the process and principle of decreasing the first preset temperature to the second preset temperature are the same as those of the above embodiment, and will not be described herein. The second preset temperature may be 150 ℃, and when it is detected that the temperature of the tray 10 is less than the second preset temperature, the heating unit 4 may be turned off, and the tray 10 may be naturally cooled to 60 ℃ to complete the cooling of the tray 10.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the embodiment of the application, the heating unit is arranged, when the tray is positioned at the first position and the second position, the heating unit can heat the tray to adjust the cooling rate of the tray, so that the cooling rate of the tray can be stabilized, the cooling efficiency can be effectively improved, and the cooling of the tray is not a bottleneck affecting the productivity. In addition, due to the heating unit, the tray can be effectively prevented from being broken due to too fast temperature change, so that the risk of broken trays can be greatly reduced, the cost of semiconductor manufacturing can be reduced, and the economic benefit can be improved.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present application, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the application, and are also considered to be within the scope of the application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited in order and may be performed in other orders, unless explicitly stated herein. Moreover, at least some of the steps in the flowcharts of the figures may include a plurality of sub-steps or stages that are not necessarily performed at the same time, but may be performed at different times, the order of their execution not necessarily being sequential, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
The foregoing is only a partial embodiment of the present application, and it should be noted that it will be apparent to those skilled in the art that modifications and adaptations can be made without departing from the principles of the present application, and such modifications and adaptations are intended to be comprehended within the scope of the present application.
Claims (14)
1. The cooling device is used for cooling the tray and is characterized by comprising a cavity, a driving unit, a cooling unit and a heating unit, wherein the driving unit, the cooling unit and the heating unit are arranged in the cavity; the driving unit is used for driving the tray to be positioned at the first position and then to move to the second position; the cooling unit is used for cooling the tray, cooling the tray at a first speed when the tray is located at a first position, cooling the tray at a second speed when the tray is located at a second position, and the second speed is larger than the first speed; the heating unit is used for selectively heating the tray so as to adjust the cooling rate of the cooling unit on the tray;
the heating unit and the cooling unit are respectively positioned at the upper side and the lower side of the cavity,
the first and second locations are located between the cooling unit and the heating unit respectively,
the first location is located relatively close to the heating unit and relatively far from the cooling unit relative to the second location.
2. The cooling device according to claim 1, wherein a temperature detection unit is further disposed in the chamber, the temperature detection unit is configured to collect temperature change data of the tray, and the heating unit is configured to adjust heating power of the tray according to the temperature change data.
3. The cooling device according to claim 2, wherein the temperature detecting unit includes a plurality of temperature sensors, and the plurality of temperature sensors are arranged at the top of the chamber along the radial direction of the tray, and are respectively used for collecting temperature change data of the middle area and the edge area of the tray.
4. A cooling device according to claim 3, wherein the temperature sensor is a non-contact temperature sensor.
5. A cooling device according to claim 3, wherein the heating unit comprises a first heating unit aligned with a central region of the tray and a second heating unit aligned with an edge region of the tray.
6. The cooling device of claim 5, wherein the first heating unit and the second heating unit each comprise a plurality of heating lamps, and the plurality of heating lamps are all arranged at the top of the chamber and are circumferentially arranged around the axis of the chamber.
7. The cooling apparatus according to claim 1, wherein a reflecting plate is further provided between the heating unit and the inner wall of the chamber for reflecting heat radiation of the heating unit.
8. The cooling device of claim 1, wherein the cooling unit is located at a bottom of the chamber; the first position is a position above the cooling unit with a space, and the second position is an upper surface of the cooling unit.
9. The cooling device according to any one of claims 1 to 8, wherein the cooling unit is a cooling platform provided with liquid cooling lines.
10. A semiconductor processing apparatus comprising a cooling device according to any one of claims 1 to 9.
11. A cooling control method of a cooling device according to any one of claims 1 to 9, characterized by comprising: the driving unit is controlled to move the tray to the first position and the second position in sequence for cooling; the temperature of the tray in the cooling process is monitored in real time to obtain an actual cooling curve; and comparing the actual cooling curve with a preset cooling curve in real time, and controlling the heating rate of the heating unit according to the comparison result.
12. The cooling control method according to claim 11, wherein the controlling the heating rate of the heating unit according to the comparison result includes: when the actual cooling curve is higher than the preset cooling curve, controlling the heating unit to reduce heating power; and when the actual cooling curve is lower than the preset cooling curve, controlling the heating unit to increase heating power.
13. The cooling control method according to claim 11, wherein the controlling the driving unit to move the tray to the first position or the second position for cooling includes: when the tray is detected to be larger than a first preset temperature, the driving unit is controlled to move the tray to a first position; and when the tray is detected to be smaller than the first preset temperature, controlling the driving unit to move the tray to the second position.
14. The cooling control method according to claim 11, characterized by further comprising: and when the temperature of the tray is detected to reach a second preset temperature, the heating unit is controlled to be closed.
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