CN110903603A - Resin composition and application thereof - Google Patents

Resin composition and application thereof Download PDF

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Publication number
CN110903603A
CN110903603A CN201911232109.7A CN201911232109A CN110903603A CN 110903603 A CN110903603 A CN 110903603A CN 201911232109 A CN201911232109 A CN 201911232109A CN 110903603 A CN110903603 A CN 110903603A
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epoxy resin
resin composition
fiber
resin
parts
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CN110903603B (en
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霍国洋
李莎
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SHAANXI SHENGYI SCI TECH Co Ltd
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SHAANXI SHENGYI SCI TECH Co Ltd
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2262/06—Vegetal fibres
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/06—Vegetal fibres
    • B32B2262/062—Cellulose fibres, e.g. cotton
    • B32B2262/065—Lignocellulosic fibres, e.g. jute, sisal, hemp, flax, bamboo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B32B2307/736—Shrinkable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16—Fibres; Fibrils

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  • Laminated Bodies (AREA)

Abstract

The application discloses a resin composition and application thereof, and in the process of preparing a metal foil-clad laminated plate by using the resin composition, the resin composition and reinforcing fibers are not separately designed but integrally formed, so that the process of impregnating the fibers with the resin composition is avoided, and the problem of interlayer adhesion reduction caused by stacked filler layers is also avoided. In addition, the prepreg prepared by the resin composition can be randomly laminated with the traditional prepreg, so that the performance deficiency of the traditional metal foil-clad laminate can be improved. The reinforcing fiber in the resin combination can be any one or the combination of at least two fibers, so that the diversification of the fibers in the plate is increased, and the design condition is created for improving the product performance by giving play to the advantages of various fibers through the compounding of different fibers.

Description

Resin composition and application thereof
Technical Field
The application relates to the technical field of metal-clad laminates, in particular to a resin composition, and also relates to a prepreg, a laminate, a metal-clad laminate and a circuit board which are manufactured by adopting the resin composition.
Background
The traditional copper clad laminate is formed by impregnating a reinforcing material with a resin composition to prepare a prepreg, laminating the prepreg by a plurality of sheets and covering copper foils on two surfaces or one surface of the prepreg by hot pressing, the design of the reinforcing material and the resin composition in the traditional copper clad laminate is not synchronous, so that the space for impregnating the resin composition in the reinforcing material is limited because the reinforcing material is preformed, further, the design of components and dosage in the resin composition is greatly restricted, especially, the use limit of a filler is maximum, the filler is easy to be blocked on the surface of the reinforcing material by the increase of the dosage or the increase of the particle size, and a plurality of interlayer defects are caused, and therefore, the defect needs to be improved.
Disclosure of Invention
The present invention has an object to provide a novel resin composition for a metal-clad laminate, which does not require impregnation of a reinforcing material with a resin composition in the process of producing a metal-clad laminate, and which does not have a problem of an interlayer interface caused by insufficient penetration of the resin composition into the reinforcing material due to an increase in the amount of a filler or an increase in the particle size.
The prepreg prepared from the resin composition has the advantages of large single weight range, strong bonding force, high filler filling rate and the like.
It is still another object of the present invention to provide a metal-clad laminate sheet having high heat resistance, high interlayer reliability, low water absorption, low shrinkage, high insulation, excellent alkali resistance, excellent arc resistance, excellent breakdown voltage resistance, and excellent processability, which is produced using the above resin composition.
In a first aspect, the present application provides a resin composition, which is characterized by comprising the following raw materials in parts by weight: 100 parts of epoxy resin, 1-60 parts of curing agent, 0.1-5 parts of accelerator, 3200 parts of reinforcing fiber 200-3200 parts and 20-950 parts of filler.
Optionally, the reinforcing fibers have a fiber diameter of 3 to 50 microns.
Optionally, the reinforcing fibers have a fiber length of 2000 microns to 50000 microns.
Optionally, the reinforcing fiber is selected from one or a mixture of at least two of glass fiber, carbon fiber, boron fiber, alumina fiber, basalt fiber, wood pulp fiber, cotton pulp fiber, aramid fiber and ramie fiber.
Alternatively, the resin composition has a gelation time of 80 to 300 seconds at 171 ℃.
Optionally, the epoxy equivalent of the epoxy resin is 100-700 g/eq.
Optionally, the epoxy resin is selected from one or a mixture of at least two of o-cresol novolac epoxy resin, phenol novolac epoxy resin, DCPD phenol novolac epoxy resin, BPA novolac epoxy resin, XYLOK novolac epoxy resin, trifunctional novolac epoxy resin, bisphenol a epoxy resin, silicone modified epoxy resin, phosphate modified epoxy resin, polyurethane modified epoxy resin, polybutadiene epoxy resin, brominated epoxy resin, DOPO modified epoxy resin, cyclotriphosphazene modified epoxy resin, diphenylphosphine oxide epoxy resin, triglycidyl isocyanurate epoxy resin, p-aminophenol epoxy resin, diaminodiphenylmethane epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, bisphenol F epoxy resin, o-cresol epoxy resin.
Optionally, the curing agent is one or a combination of at least any two of dicyandiamide, modified dicyandiamide, phenol novolac, o-cresol novolac, biphenyl phenol novolac, benzoxazine, phosphorus-containing phenol novolac, DDM and DDS.
Optionally, the filler is selected from one or a combination of at least any two of aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, silica, calcium carbonate, aluminum nitride, boron nitride, calcium nitride, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, mica, boehmite, talc, or kaolin; the particle size distribution of the filler is 1-50 microns.
Preferably, the accelerator is one or a combination of at least any two selected from 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylimidazole.
In a second aspect, the present application also provides a prepreg, a laminate, a metal foil-clad laminate and a circuit board prepared by using the above resin composition. The metal foil-clad laminate manufactured by using the resin composition comprises a laminate and metal foils laminated on one side or two sides of the laminate. The laminated board is formed by laminating a plurality of final prepregs singly or by mixing and laminating a plurality of prepregs prepared by a traditional dipping method for the metal foil-clad laminated board, and then hot-pressing, so that the laminated board contains at least one final prepreg.
The resin composition of the present application includes the following advantageous effects:
1. in the resin composition, the epoxy resin and the reinforcing fiber are not separately designed but integrally formed, so that the process of impregnating the fiber with the resin composition is avoided, and the problem of interlayer bonding force reduction caused by stacking of fillers among layers is also avoided, so that the type and the dosage of the fillers can be randomly designed according to performance requirements;
2. the metal-clad laminate manufactured by using the resin composition has high heat resistance, high interlayer reliability, low water absorption, low shrinkage, high insulation, excellent alkali resistance, arc resistance, breakdown voltage resistance and processability;
3. the prepreg in the application can be optionally superposed with the traditional prepreg, so that the performance deficiency of the traditional metal foil-clad laminate can be improved by using the prepreg in the application;
4. the reinforcing fiber in the application can be any one or the combination of at least two fibers, the diversification of the fibers in the board is increased, and design conditions are created for improving the product performance by the composition of different fibers and exerting the advantages of various fibers.
Detailed Description
For the purpose of making the purpose, technical solutions and advantages of the present application more apparent, the present application is described in further detail with reference to the following embodiments, and it should be understood that the specific embodiments are only used for explaining the present application and are not used for limiting the present application.
In order to achieve the above object, the present application provides a resin composition, comprising the following raw materials in parts by weight: 100 parts of epoxy resin, 1-60 parts of curing agent, 0.1-5 parts of accelerator, 3200 parts of reinforcing fiber 200-3200 parts and 20-950 parts of filler.
In the application, the fiber diameter of the reinforcing fiber is 3-50 microns, and the fiber length of the reinforcing fiber is 2000-50000 microns. The reinforcing fiber is selected from one or a mixture of at least two of glass fiber, carbon fiber, boron fiber, alumina fiber, basalt fiber, wood pulp fiber, cotton pulp fiber, aramid fiber and ramie fiber.
In the present application, the resin composition has a gelation time of 80 to 300 seconds at 171 ℃.
In the application, the epoxy equivalent of the epoxy resin is 100-700 g/eq. The epoxy resin is selected from one or a mixture of at least two of phenol novolac epoxy resin, DCPD phenol novolac epoxy resin, BPA novolac epoxy resin, XYLOK novolac epoxy resin, trifunctional novolac epoxy resin, bisphenol A epoxy resin, organosilicon modified epoxy resin, phosphate modified epoxy resin, polyurethane modified epoxy resin, polybutadiene epoxy resin, brominated epoxy resin, DOPO modified epoxy resin, cyclotriphosphazene modified epoxy resin, diphenylphosphine oxide epoxy resin, triglycidyl isocyanurate epoxy resin, p-aminophenol epoxy resin, diaminodiphenylmethane epoxy resin, aliphatic epoxy resin, alicyclic epoxy resin, bisphenol F epoxy resin and o-cresol epoxy resin.
In the application, the curing agent is one or a combination of at least any two of dicyandiamide, modified dicyandiamide, phenol novolac, o-cresol novolac, biphenyl phenol formaldehyde, benzoxazine, phosphorus-containing phenol formaldehyde, DDM (4' diaminodiphenylmethane), DDS (4, 4-diaminodiphenylsulfone).
Herein, the filler is selected from one or a combination of at least any two of aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, silica, calcium carbonate, aluminum nitride, boron nitride, calcium nitride, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, mica, boehmite, talc, or kaolin; the particle size distribution of the filler is 1-50 microns;
in the present application, the accelerator is one or a combination of at least any two selected from the group consisting of 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylimidazole.
The application also provides a prepreg, a laminated board, a metal foil-clad laminated board and a circuit board prepared by adopting the resin composition.
The metal clad laminate prepared using the resin composition of the present application was tested for thermal stress at 288 ℃, T260 thermal delamination time, bake time at 240 ℃, peel strength, flexural strength, dimensional stability, breakdown voltage, alkali resistance, volume resistivity, arc resistance, punching, water absorption, dip soldering resistance after PCT 1 hour, and water absorption, as further illustrated and described in detail in the examples below.
Reference is made to examples 1-9 and comparative examples 1-3, wherein examples 1-9 are metal foil clad test plaques made by the method of the present application and comparative examples 1-3 are metal foil clad test plaques made by conventional methods. The fabrics in comparative examples 1 to 9 and examples 1 to 3 are glass cloth-based fabrics manufactured by a conventional method, and specifically, the fabrics are S1141 glass cloth-based prepregs which are good-tech. The following examples are given in detail, but the scope of the present application is not limited thereto.
The performance test methods are as follows:
a: thermal stress at 288 ℃: measured according to the IPC-TM-6502.4.13.1 method.
B: t260 thermal stratification time: the measurement was carried out according to the IPC-TM-6502.4.24.1 method.
C: drying at 240 ℃ for plate drying time: means that a metal foil-clad laminate having metal foils on both sides of a plate is baked at 240 c, and when bubbles are layered, the corresponding time is recorded.
D: peel strength: measured according to the IPC-TM-6502.4.8 method.
E: bending strength: the measurement was carried out according to the IPC-TM-6502.4.4 method.
F: dimensional stability: measured according to the IPC-TM-6502.4.3.9 method.
G: punching property: measured according to the method of GB/T4722-20177.5.
H: water absorption: the measurement was carried out according to the IPC-TM-6502.6.2.1 method.
I: dip soldering resistance and water absorption after 1 hour of PCT. The measurement was carried out according to the IPC-TM-6502.6.16 method.
J: alkali resistance: measured according to the method of GB/T4722-20176.2.
K: volume resistivity: measured according to the method of GB/T4722-20178.3.
L: arc resistance: measured according to the method of GB/T4722-20178.6.
M: breakdown voltage: measured according to the method of GB/T4722-20178.1.
TABLE 1 materials and dosage illustrations for examples 1-9
Figure BDA0002303840450000031
Figure BDA0002303840450000041
TABLE 2 materials and dosage description of comparative examples 1-3
Figure BDA0002303840450000042
TABLE 3 technical parameters for the production of metal-clad laminates of examples 1 to 9
Figure BDA0002303840450000043
TABLE 4 production parameters of the metal-clad laminates of comparative examples 1 to 3
Figure BDA0002303840450000044
Table 5 test results of examples of metal-clad laminates according to examples 1 to 9
Figure BDA0002303840450000045
Figure BDA0002303840450000051
TABLE 6 test results of comparative examples of metal-clad laminates of comparative examples 1 to 3
Figure BDA0002303840450000052
As can be seen from the test results of comparative examples and comparative examples, the metal-clad laminate manufactured using the resin composition of the present application has high heat resistance, high inter-layer reliability, low water absorption, low shrinkage, high insulation, excellent alkali resistance, arc resistance, breakdown voltage resistance, and processability, as compared to conventional metal-clad laminates.
Different from the traditional preparation method of the metal-clad laminate, in the process of preparing the metal-clad laminate by adopting the resin composition, the resin composition and the reinforcing fibers are not separately designed but integrally formed, so that the process of impregnating the fibers with the resin composition is avoided, and the problem of interlayer bonding force reduction caused by stacking of fillers among layers is also avoided. In addition, the prepreg prepared by the resin composition can be randomly laminated with the traditional prepreg, so that the performance deficiency of the traditional metal foil-clad laminate can be improved. The reinforcing fiber in the resin combination can be any one or the combination of at least two fibers, so that the diversification of the fibers in the plate is increased, and the design condition is created for improving the product performance by giving play to the advantages of various fibers through the compounding of different fibers.
The above-described embodiments of the present application do not limit the scope of the present application.

Claims (10)

1. The resin composition is characterized by comprising the following raw materials in parts by weight: 100 parts of epoxy resin, 1-60 parts of curing agent, 0.1-5 parts of accelerator, 3200 parts of reinforcing fiber 200-3200 parts and 20-950 parts of filler.
2. The resin composition according to claim 1, wherein the reinforcing fiber has a fiber diameter of 3 to 50 μm.
3. The resin composition according to claim 1 or 2, wherein the reinforcing fiber has a fiber length of 2000 to 50000 μm.
4. The resin composition according to claim 1, wherein the reinforcing fiber is selected from one or a mixture of at least two of glass fiber, carbon fiber, boron fiber, alumina fiber, basalt fiber, wood pulp fiber, cotton pulp fiber, aramid fiber, and ramie fiber.
5. The resin composition according to claim 1, wherein the resin composition has a gelation time of 80 to 300 seconds at 171 ℃.
6. The resin composition as claimed in claim 1, wherein the epoxy resin has an epoxy equivalent of 100-700 g/eq.
7. The resin composition according to claim 1, wherein the epoxy resin is selected from one or a mixture of at least two of phenol novolac epoxy resin, DCPD phenol novolac epoxy resin, BPA novolac epoxy resin, XYLOK novolac epoxy resin, trifunctional novolac epoxy resin, bisphenol a epoxy resin, silicone modified epoxy resin, phosphate modified epoxy resin, polyurethane modified epoxy resin, polybutadiene epoxy resin, brominated epoxy resin, DOPO modified epoxy resin, cyclotriphosphazene modified epoxy resin, diphenylphosphine oxide epoxy resin, triglycidyl isocyanurate epoxy resin, p-aminophenol epoxy resin, diaminodiphenylmethane epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, bisphenol F epoxy resin, o-cresol epoxy resin.
8. The resin composition according to claim 1, wherein the curing agent is one or a combination of at least any two of dicyandiamide, modified dicyandiamide, phenol novolac, o-cresol novolac, biphenyl phenol novolac, benzoxazine, phosphorus-containing phenol novolac, DDM and DDS.
9. The resin composition according to claim 1, wherein the filler is selected from one or a combination of at least any two of aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, silica, calcium carbonate, aluminum nitride, boron nitride, calcium nitride, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, mica, boehmite, talc, and kaolin; the particle size distribution of the filler is 1-50 microns;
preferably, the accelerator is one or a combination of at least any two selected from 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylimidazole.
10. Prepregs, laminates, metal foil clad laminates and circuit boards prepared from the resin compositions according to claims 1-9.
CN201911232109.7A 2019-12-05 2019-12-05 Resin composition and application thereof Active CN110903603B (en)

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