CN110890474A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN110890474A CN110890474A CN201911184259.5A CN201911184259A CN110890474A CN 110890474 A CN110890474 A CN 110890474A CN 201911184259 A CN201911184259 A CN 201911184259A CN 110890474 A CN110890474 A CN 110890474A
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- 239000002184 metal Substances 0.000 claims abstract description 144
- 239000010410 layer Substances 0.000 claims abstract description 139
- 238000005192 partition Methods 0.000 claims abstract description 115
- 238000001704 evaporation Methods 0.000 claims abstract description 58
- 230000008020 evaporation Effects 0.000 claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 claims abstract description 47
- 239000002346 layers by function Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims description 75
- 239000010409 thin film Substances 0.000 claims description 24
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 29
- 238000000576 coating method Methods 0.000 abstract description 29
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 abstract description 15
- 239000001301 oxygen Substances 0.000 abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel and a display device.A periphery of a containing hole is surrounded with at least one partition groove, a second evaporation coating functional layer and a first evaporation coating functional layer positioned at the bottom of the partition groove are formed when the evaporation coating functional layer is formed due to the existence of the partition groove, and the first evaporation coating functional layer is not connected with the second evaporation coating functional layer, so that a permeation path of water vapor and oxygen can be blocked. One side of the evaporation coating functional layer deviating from the substrate is provided with a film packaging layer, one side of the film packaging layer deviating from the evaporation coating functional layer is provided with a first metal layer, and a first metal packaging part of the first metal layer further packages the first side wall of the partition groove to avoid water vapor and oxygen from permeating into the display panel.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
In the process of producing the display panel, in order to prevent moisture and oxygen from penetrating into the components to cause component failure, Thin-Film Encapsulation (TFE) is performed on the display panel, and the Thin-Film Encapsulation technology is a technology for realizing the functions of water resistance and oxygen resistance by utilizing one or more layers of inorganic materials or inorganic/organic materials.
Among the prior art, for improving display device's screen ratio, can adopt the mode of digging the hole at display module's effective display area (be AA district) to provide the holding hole for the camera, inside the pore wall infiltration of avoiding steam and oxygen by the holding hole to components and parts, can cut off the stronger coating by vaporization functional layer of hydroscopicity among the display module to cut off the infiltration route of steam and oxygen, reduce the infiltration of steam and oxygen.
Disclosure of Invention
The embodiment of the invention provides a display panel and a display device, which are used for solving the problem that when thin film packaging is carried out after evaporation functional layer partition, packaging failure is easily generated at the partition.
An embodiment of the present invention provides a display panel, including: the display device comprises a display area, a non-display area surrounded by the display area, and a containing hole surrounded by the non-display area;
a substrate;
the non-display area comprises a partition area surrounding the accommodating hole, and the partition area comprises at least one partition groove surrounding the accommodating hole; the evaporation function layer comprises a first evaporation function layer and a second evaporation function layer, the first evaporation function layer is positioned at the bottom of the partition groove, and the first evaporation function layer is not connected with the second evaporation function layer;
the partition groove comprises a first side wall and a second side wall which are oppositely arranged, and the first side wall is positioned on one side of the second side wall close to the display area;
the thin film packaging layer is positioned on one side, away from the substrate, of the evaporation function layer;
the first metal layer comprises a first metal packaging part, the first metal packaging part at least covers the first side wall of the partition groove, and the first side wall of the partition groove extends to the bottom of the partition groove.
In one implementation manner, an orthographic projection of the thin film encapsulation layer on the substrate covers the partition groove, and the first metal encapsulation part is in direct contact with the thin film encapsulation layer.
In one implementation, the display panel further includes:
the insulating layer is arranged on one side, away from the thin film packaging layer, of the first metal layer;
the touch electrode layer is arranged on one side, away from the first metal layer, of the insulating layer and comprises a plurality of first touch electrodes, the first touch electrodes extend along a first direction and are arranged along a second direction, and the first direction and the second direction are crossed;
the first touch electrode comprises two first sub-touch electrodes which are positioned on two opposite sides of the containing hole in the first direction, and the first sub-touch electrodes are electrically connected through the first metal packaging part.
In one implementation, the first metal layer includes a second metal encapsulation portion, an orthographic projection of the second metal encapsulation portion on the substrate is located in the partition region, and the second metal encapsulation portion is electrically insulated from the first metal encapsulation portion;
the touch electrode layer comprises a plurality of second touch electrodes, the second touch electrodes extend along the second direction and are arranged along the first direction; the second touch electrode is insulated from the first touch electrode;
the second touch electrode comprises two second sub-touch electrodes which are positioned on two opposite sides of the containing hole in the second direction, and the second sub-touch electrodes are electrically connected through the second metal packaging part.
In one implementation manner, the second metal packaging part is located on one side of the first metal packaging part close to the accommodating hole.
In one implementation manner, the first touch electrode and the second touch electrode in the touch electrode layer are disposed on the same layer.
In one implementation, the touch electrode layer includes:
the first touch electrode comprises a plurality of electrode blocks, the first metal layer comprises a first touch electrode bridging metal part, and two adjacent electrode blocks are connected through the first touch electrode bridging metal part.
In an implementation manner, the first touch electrode and the second touch electrode are located on a second metal layer, and an orthographic projection of the second metal layer on the substrate at least partially covers the partition area.
In one implementation manner, the distance between the first sidewall and the second sidewall of the partition groove gradually decreases along the direction of the substrate toward the evaporation functional layer.
In an implementation manner, the display panel comprises at least one retaining wall, the retaining wall is located between the display area and the partition area, and the first metal packaging part at least partially covers the retaining wall.
The embodiment of the invention provides a display device which is provided with the display panel and the imaging module provided by the embodiment of the invention;
the orthographic projection of the imaging module on the plane of the display panel is located in the containing hole.
The invention has the following beneficial effects:
according to the display panel and the display device provided by the embodiment of the invention, the periphery of the accommodating hole is surrounded by at least one partition groove, the existence of the partition groove enables a second evaporation coating functional layer and a first evaporation coating functional layer positioned at the bottom of the partition groove to be formed when the evaporation coating functional layer is formed, and the first evaporation coating functional layer is not connected with the second evaporation coating functional layer, so that a water vapor and oxygen permeation path can be blocked. The side of the evaporation function layer, which is far away from the substrate, is provided with a film packaging layer, the side of the film packaging layer, which is far away from the evaporation function layer, is provided with a first metal layer, a first metal packaging part of the first metal layer at least covers a first side wall of the partition groove and extends to the bottom of the partition groove from the first side wall of the partition groove, at least one part of the bottom of the partition groove is covered, and the first side wall of the partition groove is packaged. Due to the special appearance of the partition groove, the section difference between the side wall of the partition groove and the bottom of the partition groove is large, and the partition groove is a weak point in the packaging process. In the display panel provided by the embodiment of the invention, the partition groove area surrounded by the periphery of the containing hole is further encapsulated by the first metal encapsulating part, so that water vapor and oxygen are prevented from permeating into the display panel from the containing hole, and the reliability of the display panel is improved.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic view of the cross-sectional structure B-B' of FIG. 1;
FIG. 3 is an enlarged view at H of FIG. 2;
FIG. 4 is a schematic cross-sectional view of B-B' of FIG. 1;
FIG. 5 is a schematic view of a touch electrode and a receiving hole according to an embodiment of the invention;
FIG. 6 is another schematic view of a touch electrode and a receiving hole according to an embodiment of the invention;
FIG. 7 is a schematic view of the cross-sectional structure C-C' of FIG. 6;
FIG. 8 is a schematic view of the cross-sectional structure D-D' of FIG. 6;
fig. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
In the prior art, in order to improve the screen occupation ratio of the display device, the AA area of the display module is dug to form a hole for accommodating the camera, however, the arrangement of the hole brings about a new problem when the screen occupation ratio of the display device is improved. The evaporation coating functional layer is formed by evaporation coating on the whole surface, the accommodating holes are formed by cutting, water vapor and oxygen in the environment easily permeate into the display panel from the hole walls of the accommodating holes through the evaporation coating functional layer, and in order to solve the problem, the currently adopted mode is to separate the evaporation coating functional layer so as to cut off permeation paths of the water vapor and the oxygen. However, while this approach cuts off the moisture and oxygen permeation path, the partitions are prone to package failure when the film is packaged, which also adversely affects the display panel.
The embodiment of the invention provides a display panel and a display device, and aims to solve the problem that packaging failure is easily caused at a partition part when a thin film is packaged after the evaporation functional layer is partitioned in the prior art. In order to make the objects, technical solutions and advantages of the present invention clearer, specific embodiments of a display panel and a display device according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and a display panel 100 according to an embodiment of the present invention includes: a display area AA, a non-display area NA surrounded by the display area AA, and a housing hole 1 surrounded by the non-display area NA.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic cross-sectional view along the direction BB' in fig. 1. The display panel 100 includes: a substrate 10; the evaporation coating functional layer 20 is positioned on one side of the substrate 10, the non-display area NA comprises a partition area D surrounding the accommodating hole 1, and the partition area D comprises at least one partition groove 30 surrounding the accommodating hole 1; the evaporation function layer 20 includes a first evaporation function layer 201 and a second evaporation function layer 202, the first evaporation function layer 201 is located at the bottom of the partition groove 30, and the first evaporation function layer 201 is not connected to the second evaporation function layer 202. Referring to fig. 3, fig. 3 is a schematic view of a portion of the enlarged structure at H in fig. 2. As shown in fig. 3, the partition groove 30 includes a first sidewall 301 and a second sidewall 302 oppositely disposed, and the first sidewall 301 is located on a side of the second sidewall 302 close to the display area AA; the display panel 100 further includes: the thin film packaging layer 40 is positioned on one side of the evaporation function layer 20, which is far away from the substrate 10; the first metal layer 50 is located on a side of the film encapsulation layer 40 away from the evaporation functional layer 20, the first metal layer 50 includes a first metal encapsulation portion 501, the first metal encapsulation portion 501 at least covers the first sidewall 301 of the partition groove 30, and extends from the first sidewall 301 of the partition groove 30 to the bottom of the partition groove 30, that is, the first metal encapsulation portion 501 at least covers a part of the bottom of the partition groove 30 and the whole first sidewall 301.
In the film forming process of the inorganic layer, the partition groove has a special shape, and the section difference between the side wall of the partition groove and the bottom of the partition groove is large and is a weak point in the packaging process of the thin film packaging layer 40; because of the problem of film forming process, the package failure is easily generated at the side wall of the partition groove 30 and the joint of the side wall and the bottom of the partition groove.
Optionally, with continued reference to fig. 2, an orthographic projection of the thin film encapsulation layer 40 on the substrate 10 covers the isolation groove 30, and the first metal encapsulation portion 501 is in direct contact with the thin film encapsulation layer 40. The film packaging layer covering the side wall and the bottom of the partition groove 30 has certain packaging and filling effects on the partition groove, so that the first metal packaging part can more easily form continuous and complete coverage at the connection part of the side wall and the bottom of the partition groove, and the packaging reliability of the display panel is favorably improved. It can be understood that, in the embodiment of the present application, the thin film encapsulation layer 40 is firstly fabricated in the partition groove 30, and then the first metal encapsulation portion is fabricated, so that the partition groove is doubly encapsulated, and the encapsulation reliability of the display panel 100 is improved.
In the display panel 100 provided in the embodiment of the present invention, the receiving hole 1 may be a camera receiving hole, or may be a hole for other purposes, for example, at least one device of a headphone, a speaker, and an infrared sensor is disposed in the receiving hole, and in the implementation of the present invention, the receiving hole 1 is taken as a camera receiving hole for example.
Referring to fig. 3, in the display panel 100 according to the embodiment of the present invention, optionally, the distance between the first sidewall 301 and the second sidewall 302 of the partition groove 30 gradually decreases along the direction of the substrate 10 pointing to the evaporation functional layer 20. It can be understood that, the partition groove 30 is made into a structure with a narrow upper part and a wide lower part, which is beneficial to the formation of the evaporation coating functional layer by evaporation coating, the first evaporation coating functional layer 201 falls into the bottom of the partition groove 30 and is separated from the second evaporation coating functional layer 202 outside the partition groove 30, so that the first evaporation coating functional layer 201 is not connected with the second evaporation coating functional layer 202, and the path of water vapor entering the display panel from the side wall of the accommodating hole via the evaporation coating functional layer is blocked. Further, the distance between the first sidewall 301 and the second sidewall 302 is gradually reduced along the direction of the substrate 10 pointing to the evaporation coating functional layer 20, and there is no sudden change, which is beneficial to uniform packaging of the thin film packaging layer 40 and the first metal layer 50 and the second metal layer, and is beneficial to achieving a better packaging effect, and reducing the possibility of water vapor and oxygen permeation.
It should be noted that the first vapor deposition functional layer 201 and the second vapor deposition functional layer 202 which are not connected to each other may be formed in other manners, and embodiments of the present invention are not particularly limited. The partition area D surrounds the accommodating hole 1, and the partition area D may include one partition groove 30 surrounding the accommodating hole 1, or may include a plurality of partition grooves 30 surrounding the accommodating hole 1, for example: two, three, or four, etc. Obviously, when the partition region D includes a plurality of partition grooves 30 surrounding the accommodating hole 1, each partition groove 30 is sequentially disposed around the accommodating hole 1, and the number and the disposition manner of the partition grooves 30 are not particularly limited in the present invention.
The first metal encapsulation part 501 covers at least a part of the bottom of the partition groove 30 and the whole first sidewall 301, in other implementations, the first metal encapsulation part 501 may cover the first sidewall 301 of the partition groove 30 and the whole bottom of the partition groove 30 at the same time, or cover the whole partition groove 30; specifically, when the partition region D has a plurality of partition grooves 30, the first metal encapsulation part 501 may cover the partition grooves 30 in various ways, please refer to fig. 4, and fig. 4 is another schematic cross-sectional structure of the display panel along BB' in fig. 1. The first metal encapsulation part 501 may cover one complete partition groove 30, and may cover several complete partition grooves 30; further, in some other embodiments, the first metal encapsulation part 501 may cover the complete partition groove 30 and also cover the first sidewall 301 of one partition groove 30 close to the receiving hole 1 and a portion of the bottom of the partition groove 30, which is not particularly limited in the present invention.
Optionally, in one implementation, the thin film encapsulation layer 40 includes at least one inorganic layer. Further, in order to reduce the thickness of the display panel 100, so that the display panel 100 better meets the current requirement of light and thin, the thin film encapsulation layer 40 may be reused as a buffer layer between the thin film encapsulation layer and the first metal encapsulation portion 501, and at this time, the first metal encapsulation portion 501 may be in direct contact with the portion of the thin film encapsulation layer 40 located in the partition groove. In another implementation, a buffer layer is disposed between the thin film encapsulation layer 40 and the first metal layer 50.
Optionally, with continued reference to fig. 4, the non-display region further includes a retaining wall 90, and the display panel 100 includes at least one retaining wall 90. The display panel is encapsulated by a thin film in which inorganic layers and organic layers are sequentially stacked, Ink-jet printing (Ink-jet printer) is one of the common processes for preparing organic layers, and the dam 90 is designed to allow Ink material to be printed in a designated area. In one embodiment, the cross-sectional shape of the retaining wall 90 may be trapezoidal, and the end of the retaining wall with the larger size is close to the substrate 10.
In order to achieve a better packaging effect, the first metal packaging part 501 at least partially covers the retaining wall, specifically, when the retaining wall is one, the first metal packaging part 501 partially covers the side wall of the retaining wall on the side facing the accommodating hole 1, the first metal packaging part 501 partially covers the top of the retaining wall and the side wall of the retaining wall on the side facing the accommodating hole 1, or the first metal packaging part 501 partially covers the entire retaining wall; when the retaining wall is multiple, the portion of the first metal packaging part 501 may cover the sidewall of the retaining wall close to the accommodating hole 1 on the side facing the accommodating hole 1, the portion of the first metal packaging part 501 may cover the top of the retaining wall close to the accommodating hole 1 and the sidewall of the retaining wall on the side facing the accommodating hole 1, the portion of the first metal packaging part 501 may cover the entire retaining wall close to the accommodating hole 1, or the portion of the first metal packaging part 501 may cover the entire retaining wall close to the accommodating hole 1 and at least cover a portion of the retaining wall adjacent to the retaining wall. In this embodiment, the number of the retaining walls and the specific situation that the first metal packaging part 501 covers the retaining walls are not specifically limited.
Alternatively, in a specific implementation manner, the first metal packaging part 501 may be a whole body, and includes a portion for covering the partition groove 30 and a portion for covering the retaining wall; in another specific implementation, the first metal encapsulation part 501 includes a portion for covering the partition groove 30 and a portion for covering the retaining wall, and the portion for covering the partition groove 30 and the portion for covering the retaining wall are not connected.
Referring to fig. 4 and 5, fig. 5 is a schematic structural diagram of a touch electrode and a containing hole in an embodiment of the invention. The display panel 100 further includes an insulating layer 60 disposed on a side of the first metal layer 50 away from the film encapsulation layer 40, and a touch electrode layer 70 disposed on a side of the insulating layer 60 away from the first metal layer 50, where the touch electrode layer 70 includes a plurality of first touch electrodes 710 and a plurality of second touch electrodes 720, the first touch electrodes 710 extend along a first direction X and are arranged along a second direction Y, the second direction Y intersects the first direction X, the first touch electrodes 710 include two first sub-touch electrodes 711/712 located on two opposite sides of the accommodating hole 1 in the first direction X, that is, the first touch electrodes 710 include a first sub-touch electrode 711 located on one side of the accommodating hole 1 in the first direction and a first sub-touch electrode 712 located on the other side of the accommodating hole 1 in the first direction. The second touch electrode 720 is insulated from the first touch electrode 710, and the second touch electrode 720 extends along the second direction Y and is arranged along the first direction X. Specifically, one of the first touch electrode 710 and the second touch electrode 720 may be a sensing electrode, and the other is a driving electrode.
It can be understood that, in general, the diameter of the accommodating hole 1 for placing the camera is about 3mm, and the width of one electrode block in the touch electrode is about 3mm, so the accommodating hole 1 on the display panel can just occupy the space of one electrode block. With reference to fig. 5, in an alternative embodiment, the first touch electrode 710 and the second touch electrode 720 are disposed on the same layer, and the accommodating hole 1 occupies one electrode block of the first touch electrode 710, at this time, the two first sub-touch electrodes 711/712 may be electrically connected through the first metal encapsulation portion 501; of course, in other implementation manners, the accommodating hole may also occupy one electrode block of the second touch electrode 720, and at this time, the two second sub-touch electrodes may be electrically connected through the first metal encapsulation portion. In the two arrangements, an additional layer for connecting the two first sub-touch electrodes or the two second sub-touch electrodes is not required, which is beneficial to reducing the thickness of the display panel 100. It can be understood that, when the first metal encapsulation portion is located on the first metal layer, the first touch electrode and the second touch electrode are arranged on the same layer, and can be located on the second metal layer at the same time, at this time, the orthographic projection of the second metal layer on the substrate at least partially covers the partition region D, and the second metal layer can play a certain encapsulation role on the partition region D, and can increase the strength of the partition region D. The first touch electrode 710 and the second touch electrode 720 may also be disposed on different metal layers, at this time, the accommodating hole 1 occupies one electrode block of the first touch electrode 710, at this time, the first touch electrode 710 and the first metal encapsulation portion 501 may both be located on the first metal layer 50, and the first touch electrode 710 is electrically connected at the accommodating hole through the first metal encapsulation portion 501, so that the first touch electrode 710 does not need a winding design at the accommodating hole 1, the touch structure design is simpler, and the manufacturing process is simplified. The first metal encapsulation portion 501 improves the encapsulation reliability of the display panel and simplifies the connection manner of the touch electrode.
It can be understood that the first metal layer 50 can be reused as a bridge-spanning metal layer of the touch electrode, and the first metal layer includes a first touch electrode bridge metal portion, so that the first metal encapsulation portion and the bridge metal portion of the touch electrode are disposed on the same layer, and the film thickness of the display panel is reduced.
Referring to fig. 4, the lap joint hole of the first metal layer 50 and the touch electrode layer 70 is located in the flat region between the retaining wall 90 and the partition region D, it can be understood that, in the retaining wall or the partition region, during the photolithography process for fabricating the lap joint hole, the thickness of the photoresist may have a non-uniform problem, which results in that the via hole cannot be completely exposed and formed. And the arrangement of the lap joint holes in the flat areas is beneficial to the realization of the lap joint holes.
Optionally, as shown in fig. 6, the first metal layer 50 further includes a second metal encapsulation portion 502 electrically insulated from the first metal encapsulation portion 501, and optionally, an orthographic projection of the second metal encapsulation portion 502 on the substrate 10 is located in the partition region D. The first touch electrode 710 and the second touch electrode 720 are disposed in the same layer, and the accommodating hole is located at the intersection of the first touch electrode 710 and the second touch electrode 720, at this time, as shown in fig. 6 and 7, the two first sub-touch electrodes may be electrically connected through the first metal encapsulation portion 501, and as shown in fig. 6 and 8, the two second sub-touch electrodes may be electrically connected through the second metal encapsulation portion 502. In the embodiment of the present invention, the first touch electrode 710 and the second touch electrode 720 are electrically connected through the first metal encapsulation portion 501 and the second metal encapsulation portion 502, so that an additional winding design is not required for connecting the two first sub-touch electrodes on the two sides of the accommodating hole 1 and the two second sub-touch electrodes on the two sides of the accommodating hole 1, which is beneficial to simplifying the touch electrode design in the display panel, and on the other hand, the second metal encapsulation portion 502 also has a certain encapsulation effect on the partition area, which is beneficial to improving the encapsulation reliability of the display panel. It is understood that, in other embodiments, one pair of the two second sub-touch electrodes and the two first sub-touch electrodes may be electrically connected through the corresponding first metal encapsulation portion or the second metal encapsulation portion, and the other pair may be electrically connected through the routing.
In some optional embodiments, the first touch electrode 710 and the second touch electrode 720 are disposed in different layers, and the accommodating hole is located at the intersection of the first touch electrode 710 and the second touch electrode 720. At this time, the first touch electrode and the first metal encapsulation 501 may be located on the first metal layer 50, the second touch electrode and the second metal encapsulation are located on the second metal layer, the two first sub-touch electrodes may be electrically connected through the first metal encapsulation, and the two second sub-touch electrodes may be electrically connected through the second metal encapsulation. Or the first touch electrode is positioned on the first metal layer, the second touch electrode is positioned on the second metal layer, and the first metal packaging part and the second metal packaging part are both positioned on the first metal layer. In the above embodiments, it is only necessary to electrically connect the first touch electrode and the second touch electrode in the first direction and the second direction, respectively, and the specific arrangement manner is not limited in the present invention.
It should be noted that fig. 5 and 6 only provide one embodiment of the first direction and the second direction, and other embodiments may have other angles between the first direction and the second direction.
In a specific implementation, the second metal encapsulation portion 502 may be located on a side of the first metal encapsulation portion 501 close to the receiving hole 1.
In another implementation, the second metal encapsulation portion may be located on a side of the first metal encapsulation portion 501 facing away from the receiving hole 1.
Further, in the touch electrode layer 70: in a specific implementation manner, in the first touch electrode 710, the two adjacent electrode blocks may be connected by a first metal layer 50, optionally, the first metal layer 50 includes a first touch electrode bridging metal portion, and in the first touch electrode 710, except for the two first sub-touch electrodes, the two adjacent electrode blocks are connected by the first touch electrode bridging metal portion.
Similarly, in the touch electrode layer 70: the second touch electrode 720 includes a plurality of electrode blocks, two adjacent electrode blocks need to be electrically connected to each other, when the first touch electrode and the second touch electrode are on the same layer, in order to reduce the number of layers in the display panel 100 and thus reduce the thickness of the display panel 100, in a specific implementation manner, two adjacent electrode blocks in the second touch electrode 720 may be connected by the first metal layer 50, specifically, the first metal layer 50 includes a second touch electrode bridging metal portion, and in the second touch electrode 720, except for the two second sub-touch electrodes, two adjacent electrode blocks are connected by the second touch electrode bridging metal portion.
The first touch electrode 710 and the second touch electrode 720 are both located on the second metal layer, and in order to achieve a better packaging effect, in a specific implementation manner, an orthographic projection of the second metal layer on the substrate 10 may at least partially cover the partition region D. Specifically, the orthogonal projection of the second metal layer on the substrate 10 may cover the partition groove 30, and there are various cases, for example: the orthographic projection of the second metal layer on the substrate 10 covers the first sidewall 301 of a certain partition groove 30, or the orthographic projection of the second metal layer on the substrate 10 covers the first sidewall 301 of a certain partition groove 30 and the bottom of the partition groove 30, or the orthographic projection of the second metal layer on the substrate 10 covers a complete partition groove 30, or the orthographic projection of the second metal layer on the substrate 10 covers several complete partition grooves 30, or the orthographic projection of the second metal layer on the substrate 10 covers the complete partition groove 30 and simultaneously covers the first sidewall 301 of a partition groove 30 close to the containing hole 1, and extends from the first sidewall 301 of the partition groove 30 to the bottom of the partition groove 30.
Based on the same inventive concept, the embodiment of the invention also provides a display device. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention.
Specifically, as shown in fig. 9, the display device provided by the embodiment of the present invention is provided with the display panel 100 and the imaging module 200 provided by the embodiment of the present invention, and the orthographic projection of the imaging module 200 on the plane where the display panel 100 is located in the accommodating hole 1. The display effect of the full-face screen is favorably realized, and the high integration of the display device is favorably realized.
In the display panel and the display device provided by the embodiment of the invention, at least one partition groove is arranged around the periphery of the accommodating hole, the partition groove partitions the evaporation functional layer, and the evaporation functional layer is partitioned into the first evaporation functional layer and the second evaporation functional layer which are not connected, so that a water vapor permeation path and an oxygen permeation path are blocked. One side of deviating from the base plate at the coating by vaporization functional layer is provided with the film encapsulation layer, it is equipped with first metal level to deviate from coating by vaporization functional layer one side at the film encapsulation layer, the first metal encapsulation portion of first metal level covers the first lateral wall that separates the groove at least, and extend to the wall tank bottom by the first lateral wall that separates the groove, partly and the first lateral wall that separates the groove to the wall tank bottom have carried out the encapsulation, avoid steam and oxygen from holding the inside that the hole permeates display panel, can improve the problem that the easy production encapsulation of department of separating of avoiding the coating by vaporization functional layer became invalid even.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A display panel, comprising: the display device comprises a display area, a non-display area surrounded by the display area, and a containing hole surrounded by the non-display area;
a substrate;
the non-display area comprises a partition area surrounding the accommodating hole, and the partition area comprises at least one partition groove surrounding the accommodating hole; the evaporation function layer comprises a first evaporation function layer and a second evaporation function layer, the first evaporation function layer is positioned at the bottom of the partition groove, and the first evaporation function layer is not connected with the second evaporation function layer;
the partition groove comprises a first side wall and a second side wall which are oppositely arranged, and the first side wall is positioned on one side of the second side wall close to the display area;
the thin film packaging layer is positioned on one side, away from the substrate, of the evaporation function layer;
the first metal layer comprises a first metal packaging part, the first metal packaging part at least covers the first side wall of the partition groove, and the first side wall of the partition groove extends to the bottom of the partition groove.
2. The display panel according to claim 1, wherein an orthographic projection of the thin film encapsulation layer on the substrate covers the partition groove, and the first metal encapsulation part is in direct contact with the thin film encapsulation layer.
3. The display panel according to claim 1, characterized in that the display panel further comprises:
the insulating layer is arranged on one side, away from the thin film packaging layer, of the first metal layer;
the touch electrode layer is arranged on one side, away from the first metal layer, of the insulating layer and comprises a plurality of first touch electrodes, the first touch electrodes extend along a first direction and are arranged along a second direction, and the first direction and the second direction are crossed;
the first touch electrode comprises two first sub-touch electrodes which are positioned on two opposite sides of the containing hole in the first direction, and the two first sub-touch electrodes are electrically connected through the first metal packaging part.
4. The display panel according to claim 3, wherein the first metal layer comprises a second metal encapsulation portion, an orthographic projection of the second metal encapsulation portion on the substrate is located at the partition region, and the second metal encapsulation portion is electrically insulated from the first metal encapsulation portion;
the touch electrode layer comprises a plurality of second touch electrodes, the second touch electrodes extend along the second direction and are arranged along the first direction; the second touch electrode is insulated from the first touch electrode;
the second touch electrode comprises two second sub-touch electrodes which are positioned on two opposite sides of the containing hole in the second direction, and the two second sub-touch electrodes are electrically connected through the second metal packaging part.
5. The display panel according to claim 4, wherein the second metal sealing part is located on one side of the first metal sealing part close to the receiving hole.
6. The display panel according to claim 4, wherein the first touch electrode and the second touch electrode in the touch electrode layer are disposed on the same layer.
7. The display panel according to claim 6, wherein the touch electrode layer comprises:
the first touch electrode comprises a plurality of electrode blocks, the first metal layer comprises a first touch electrode bridging metal part, and two adjacent electrode blocks are connected through the first touch electrode bridging metal part.
8. The display panel according to claim 6, wherein the first touch electrode and the second touch electrode are located on a second metal layer, and an orthographic projection of the second metal layer on the substrate at least partially covers the partition area.
9. The display panel according to claim 1, wherein a distance between the first sidewall and the second sidewall of the partition groove is gradually decreased in a direction in which the substrate is directed to the evaporation functional layer.
10. The display panel according to claim 1, comprising at least one retaining wall, wherein the retaining wall is located between the display area and the partition area, and the first metal encapsulation part at least partially covers the retaining wall.
11. A display device characterized in that the display panel according to any one of claims 1 to 10 and an imaging module are provided;
the orthographic projection of the imaging module on the plane of the display panel is located in the containing hole.
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