CN109768188A - Make the method and organic luminous panel of the open-celled structure of organic luminous panel - Google Patents
Make the method and organic luminous panel of the open-celled structure of organic luminous panel Download PDFInfo
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Abstract
A method of the open-celled structure making organic luminous panel, comprising forming organic film on the glass substrate, to form underlay substrate；Array substrate layer is formed on organic film；A predetermined position on array substrate layer carries out laser and removes technique, to penetrate array substrate layer and organic film, and then forms one and surrounds the slot formed by array substrate layer and organic film.On the array substrate layer with slot, evaporation process is carried out using metal light cover and electroluminescent material, to form whole face organic luminous layer.Thin film encapsulation processes are carried out using metal light cover, and form thin-film encapsulation layer.Directly the coating of water suction packaging plastic and curing process are carried out in the cross section place of slot.Laser lift-off is carried out to glass substrate, and removes the film layer structure corresponded to below slot, slot is made to penetrate the glass substrate.
Description
[technical field]
The invention relates to a kind of display technologies, in particular to a kind of open-celled structure for making organic luminous panel
Method and organic luminous panel.
[background technique]
With the continuous development of science and technology, requirement of the people to display device is higher and higher.It is well known that organic light-emitting diodes
(organic light emitting diode, OLED) display device is managed, because its frame is narrow, it is light-weight, rollable, easy to be made
In many advantages such as carryings, the extensive concern of people is received.Nowadays the mainstream for being designed to the epoch of " screen comprehensively ", it is each to supply
Quotient's unit is answered all to be absorbed in the research and development screen higher comprehensive screen products of accounting.Recess (Notch) and circular hole the cutting (O- risen in the recent period
Cut it) designs, the two is compared, and " O-Cut " more levels off to shields effect comprehensively, and wherein the size of O-Cut, only considers front camera
?.Therefore the region O-Cut makes comprehensive screen of camera under O-Cut screen much smaller than the space of entire panel shared by the region Notch
Advantage becomes apparent.
In the processing procedure of conventional flexible organic LED panel, given birth to generally according to following home site
It produces: array substrate (Array) production → vapor deposition (Evaporation) operation → thin-film package (TFE) → mould composing type
(module includes the rear processing procedures such as O-Cutting).It is primarily present two in carrying out cutting process for O-Cut panel and asks
Topic: firstly, because electroluminescent (electroluminescence, EL) organic film carries out vapor deposition shape using metal mask plate
At, O-Cut remove edges of regions cross section place, have electroluminescent organic layer presence, in turn result in aqueous vapor and enter from the position
It invades, makes failure of face slab.Although TFE uses metal mask plate secondly, the inorganic layer of Array can carry out evacuation design
Learn vapor deposition (CVD) technique, the inorganic layer of TFE can not be avoided, and cutting process in easily cause the inorganic layer of TFE
Crackle occurs, crackle may will do it extension, cause package failure.
[summary of the invention]
The purpose of the present invention is to provide a kind of method of open-celled structure for making organic luminous panel and organic light emission faces
Plate, in such a way that processing procedure adjusts and optimizes, make circular hole cutting technique not and will cause panel itself film layer structure crackle and
The intrusion of aqueous vapor.
To achieve the above object, the method for the open-celled structure of production organic luminous panel of the invention includes: in glass base
Organic film is formed on plate, to form underlay substrate；Array substrate layer is formed on the organic film；In the array base
A predetermined position on plate layer carries out laser and removes technique, to penetrate the array substrate layer and the organic film, in turn
It forms one and the slot formed is surrounded by the array substrate layer and the organic film；In the array substrate layer with the slot
On, evaporation process is carried out using metal light cover and electroluminescent material, to form whole face organic luminous layer, wherein described organic
Luminescent layer is truncated naturally in the slot position；Thin film encapsulation processes are carried out using metal light cover, and form thin-film encapsulation layer,
Described in thin-film encapsulation layer correspond at the organic film in the slot and be truncated naturally；Directly in the cross section place of the slot
Carry out the coating of water suction packaging plastic and curing process；And laser lift-off is carried out to the glass substrate, and remove and correspond to institute
The film layer structure below slot is stated, the slot is made to penetrate the glass substrate.
A preferred embodiment according to the present invention, when forming the array substrate layer on the organic film, more in institute
State the predetermined position setting anti-cracking structure and barricade of array substrate layer.
Another preferred embodiment according to the present invention, after the array substrate layer is formed, further in the array substrate
The predetermined position of layer is coated with photoresist, to protect the array substrate layer.
Another preferred embodiment according to the present invention, the laser remove the cleaning that technique includes remover, wherein described
Remover includes the particle removing of the cross section place of the slot, and after the cleaning of the remover, by the glass substrate
On photoresist removal.
Another preferred embodiment according to the present invention, the organic film is made for polyimides, and the array substrate
Layer includes film crystal pipe die group.
The present invention additionally provides a kind of methods of open-celled structure for making organic luminous panel, include: on the glass substrate
Organic film is formed, to form underlay substrate, and laser is carried out in the predetermined position of the underlay substrate and removes technique, to
It penetrates the organic film and forms a slot；Array substrate layer is formed on the underlay substrate with the slot, wherein institute
Array substrate layer is stated in slot position natural fracture；On the array substrate layer with the slot, metal light cover is utilized
And electroluminescent material carries out evaporation process, to form whole face organic luminous layer, wherein the organic luminous layer is in the slot
Hole site is truncated naturally；Thin film encapsulation processes are carried out using metal light cover, and form thin-film encapsulation layer, wherein the thin-film package
Layer is corresponded in the slot and is truncated naturally at the organic film；Directly water suction packaging plastic is carried out in the cross section place of the slot
Coating and curing process；And laser lift-off is carried out to the glass substrate, and remove the film corresponded to below the slot
Layer structure, makes the slot penetrate the glass substrate.
A preferred embodiment according to the present invention, when forming the array substrate layer on the organic film, more in institute
State the predetermined position setting anti-cracking structure and barricade of array substrate layer.
Another preferred embodiment according to the present invention, after the array substrate layer is formed, further in the array substrate
The predetermined position of layer is coated with photoresist, to protect the array substrate layer.
Another preferred embodiment according to the present invention, the laser remove the cleaning that technique includes remover, wherein described
Remover includes the particle removing of the cross section place of the slot, and after the cleaning of the remover, by the glass substrate
On photoresist removal.
The present invention additionally provides a kind of organic luminous panel, including a transparence display region and surround the transparence display area
The effective display area domain in domain, the transparence display region include: underlay substrate, array substrate, organic luminous layer, thin-film package
Layer and a slot, wherein the slot removes the film layer structure that technique penetrates the transparence display region using laser, and described
The section part of slot is equipped with water suction packaging plastic, and the array substrate corresponds to and is equipped with anti-cracking structure and gear around the slot
Wall.
The method that the present invention makes the open-celled structure of organic luminous panel is realized and shields lower camera design, and utilizes laser
Technique is removed, after the organic film or array substrate layer of substrate machine plate are formed, round slot is just formed in advance, then at slot
The preparation and packaging technology of luminescent layer are sequentially carried out on the film layer structure in hole, and then make organic smooth luminescent layer vapor deposition and encapsulated layer
Preparation process can be truncated naturally in slot cross section place, can cut processing procedure to avoid the circular hole of traditional module set section and cause internal membrane
The generation of layer structural crack, and aqueous vapor is caused to be invaded by circular hole region.The present invention effectively solves conventional organic luminescence panel in system
The last module set section of standby process carries out circular hole cutting, will cause aqueous vapor from the intrusion of the organic luminous layer of circular hole section or Yu Yuan
When hole is cut, metallic film encapsulated layer is caused to crack, and then cause package failure, aqueous vapor air infiltration enters and makes failure of face slab
Problem.
[Detailed description of the invention]
Figure 1A to 1G is respectively that the part of the open-celled structure of the organic luminous panel of a preferred embodiment according to the present invention is disconnected
Face schematic diagram.
Fig. 2 is the process according to the method for the open-celled structure of the production organic luminous panel of a preferred embodiment of the present invention
Figure.
Fig. 3 A to 3F is respectively the part of the open-celled structure of the organic luminous panel of another preferred embodiment according to the present invention
Sectional schematic diagram.
Fig. 4 is the process according to the method for the open-celled structure of the production organic luminous panel of another preferred embodiment of the present invention
Figure.
Fig. 5 is the floor map according to the organic luminous panel of a preferred embodiment of the present invention.
[specific embodiment]
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.
The present invention is the method and organic luminous panel of a kind of open-celled structure for making organic luminous panel, wherein described have
Machine luminescent panel is also known as organic light emitting display panel.Figure 1A to 1G is respectively the organic light emission of a preferred embodiment according to the present invention
The partial cut-away schematic diagram of the open-celled structure of panel can also be used as the manufacturing process for illustrating open-celled structure of the invention.Fig. 2 is
The flow chart of the method for the open-celled structure of the production organic luminous panel of a preferred embodiment according to the present invention.Please refer to Figure 1A extremely
1G simultaneously cooperates Fig. 2 to close it.As shown in Fig. 2, the production method of the open-celled structure of organic luminous panel of the invention includes step
S11-S17, detailed description are as follows.
Step S11: organic film 12 is formed on glass substrate 11, to form underlay substrate 1 (as shown in Figure 1A).In
In this preferred embodiment, the material of the organic film 12 is polyimides (polyimide, PI).
Step S12: forming array substrate layer 2 on the organic film 12, and the array substrate layer 2 includes inorganic functional
Layer 21 and the film crystal pipe die group 22 (as shown in Figure 1B) on the inorganic functional layer 21.It illustrates, in shape
When at the array substrate layer 2, anti-cracking structure 23 and gear are set more at the periphery in a predetermined position of the array substrate layer 2
Wall 24.In addition, after the array substrate layer 2 formation light blockage coating or protective film attaching (not shown) can be carried out, to protect
The array substrate layer avoids that problem is polluted and destroyed caused by because of subsequent be made.
Step S13: the predetermined position on the array substrate layer 2 carries out laser removing (laser cleaning) work
Skill to penetrate the array substrate layer 2 and the organic film 12, and then forms one by the array substrate layer 2 and described
Organic film 12 is around the round slot 3 (as shown in Figure 1 C) formed.In another specific implementation, laser cutting work also can be used
The excavation of skill progress slot.The purpose that the laser removes technique is to remove the array substrate layer 2 and the organic film 12
It removes, the cross section place of the slot 3 is made to form apparent offset.It illustrates, it includes removal that the laser, which removes technique,
The cleaning of object, wherein the particle that the remover includes the cross section place of the slot 3 is removed, and in the cleaning of the remover
Afterwards, the photoresist on the glass substrate 11 is removed.It illustrates, the anti-cracking structure is set in abovementioned steps S12
23 purpose is the extension in order to cause slight crack when laser being stopped to remove and be cut by laser to circular, and structure is will be inorganic
Layer scrapes out strip, and organic material is filled inside strip.
Step S14: on the array substrate layer 2 with the slot 3, metal light cover (not shown) and electroluminescent are utilized
(electroluminescence, EL) material carries out evaporation process, to form whole face organic luminous layer 4 (as shown in figure iD),
Wherein the organic luminous layer 4 is truncated naturally in 3 position of slot.The organic luminous layer 4 has general organic light emission film
The structure of layer, that is, including anode layer, luminescent layer and cathode layer (not shown).Due to the shape before the organic luminous layer 4
At the slot 3, therefore the metal light cover needs not move through special designing and is directly deposited, and can make the organic light emission
Layer 4 is truncated naturally in 3 position of slot, and then realizes the production of circular hole panel.
Step S15: utilizing metal light cover, carries out thin-film package with chemical vapor deposition machine method cooperation inkjet printing technology
(thin film encapsulation, TFE) technique, and thin-film encapsulation layer 5 (as referring to figure 1E) is formed, wherein the film
Encapsulated layer 5 is truncated naturally at the corresponding organic film 12 of the slot 3.Due to the shape before the thin-film encapsulation layer 5
At the slot 3, therefore the formation of thin-film encapsulation layer of the present invention 5, avoidable tradition circular hole cut processing procedure due in panel
It makes last module set section to carry out, cracking slight crack (crack) phenomenon of the inorganic layer of caused metallic film encapsulation.It illustrates
, abovementioned steps S12 be arranged 24 purpose of barricade be in order to which block film encapsulated layer (i.e. metallic film encapsulated layer) is excessive,
Reducing circular hole cutting region needs the substance of laser cleaning, wherein 24 structure of the barricade is formed using the stacking of organic layer.
Step S16: the coating of water suction packaging plastic 31 and curing process directly are carried out (as schemed in the cross section place of the slot 3
Shown in 1F).It illustrates, since the processing procedure of the thin-film package is to carry out in a nitrogen environment, and have water sorption
Water sucting glue also need to coat and solidify under oxygen-free environment, the characteristics of using preceding environmental condition, the water suction packaging plastic 31 can be straight
The cross section place connect in the slot 3 carries out coating and curing process.
Step S17: laser lift-off (laser lift off, LLO) technique, and removing pair are carried out to the glass substrate 11
The film layer structure of 3 lower section of slot, makes the slot 3 penetrate the glass substrate 11 (as shown in Figure 1 G) described in Ying Yu.
Fig. 3 A to 3F is respectively the part of the open-celled structure of the organic luminous panel of another preferred embodiment according to the present invention
Sectional schematic diagram.Fig. 4 is the method according to the open-celled structure of the production organic luminous panel of another preferred embodiment of the present invention
Flow chart.It please refers to Fig. 3 A to 3F and Fig. 4 is cooperated to close it.As shown in figure 4, the organic luminous panel of another embodiment of the present invention
The production method of open-celled structure includes step S21-S26, and detailed description are as follows.
Step S21: organic film 12 is formed on glass substrate 11, to form underlay substrate 1, and in the substrate base
The predetermined position of plate 1 carries out laser and removes technique, to penetrate the organic film 12 and form a slot 3 (such as Fig. 3 A institute
Show).In this preferred embodiment, the material of the organic film 12 is polyimides.Specifically, the laser of the present embodiment is clear
Except laser energy needed for technique is smaller relative to Fig. 2 the embodiment described, laser process is relatively easy, and residual particles are small,
It is easy to wash.
Step S22: array substrate layer 2 is formed on the underlay substrate 1 with the slot 3, wherein the array substrate
Layer 2 is in the 3 position natural fracture (as shown in Figure 3B) of slot.
Step S23: on the array substrate layer 2 with the slot 3, metal light cover (not shown) and electroluminescent are utilized
Material carry out evaporation process, to form whole face organic luminous layer 4, wherein the organic luminous layer 43 position of slot from
So truncation (as shown in Figure 3 C).
Step S24: carrying out thin film encapsulation processes using metal light cover, and form thin-film encapsulation layer 5, wherein the film seals
It fills layer 5 and (as shown in Figure 3D) is truncated naturally at the corresponding organic film 12 of the slot 3.
Step S25: the coating of water suction packaging plastic and curing process (such as Fig. 3 E directly are carried out in the cross section place of the slot 3
It is shown).
Step S26: carrying out laser lift-off to the glass substrate 11, and removes and correspond to 3 lower section of slot
Film layer structure makes the slot 3 penetrate the glass substrate 11.(as illustrated in Figure 3 F).
The present invention shown in Fig. 4 makes the method for the open-celled structure of organic luminous panel and the main region of method shown in Fig. 2
Be not: laser removes technique after the formation of organic film 12 with regard to carrying out, that is, the laser is removed technique and had only for described
Machine film layer 12 is removed, and the slot 3 is just initially formed before preparing the array substrate layer 2.Other than aforementioned difference, other figures
The step of production method of open-celled structure shown in 4, is entirely identical to production method shown in Fig. 2, and organic hair of Fig. 3 A to 3F
The open-celled structure of optic panel is identical to the open-celled structure of the organic luminous panel of Figure 1A to 1G, no longer repeats in this.
Fig. 5 is the floor map according to the organic luminous panel of a preferred embodiment of the present invention.The present invention additionally provides
A kind of organic luminous panel.The organic luminous panel is including a transparence display region 101 and surrounds the transparence display region
101 effective display area domain 102 has the picture shielded comprehensively to provide electronic product.The transparence display region 101 includes
The open-celled structure as shown in Fig. 1 G and Fig. 3 F, that is, include underlay substrate 1, array substrate 2, organic luminous layer 4, thin-film encapsulation layer 5,
And slot 3.The slot 3 removes the film layer structure that technique penetrates the transparence display region 101, and the slot using laser
3 section part is equipped with water suction packaging plastic 31, and is equipped with anti-cracking structure 23 around the corresponding slot 3 of the array substrate layer 2
And barricade 24.It illustrates, the slot 3 is the camera for electronic product to be arranged.
The method that the present invention makes the open-celled structure of organic luminous panel is realized and shields lower camera design, and utilizes laser
Technique is removed, after the organic film or array substrate layer of substrate machine plate are formed, round slot is just formed in advance, then at slot
The preparation and packaging technology of luminescent layer are sequentially carried out on the film layer structure in hole, and then make organic smooth luminescent layer vapor deposition and encapsulated layer
Preparation process can be truncated naturally in slot cross section place, can cut processing procedure to avoid the circular hole of traditional module set section and cause internal membrane
The generation of layer structural crack, and aqueous vapor is caused to be invaded by circular hole region.The present invention effectively solves conventional organic luminescence panel in system
The last module set section of standby process carries out circular hole cutting, will cause aqueous vapor from the intrusion of the organic luminous layer of circular hole section or Yu Yuan
When hole is cut, metallic film encapsulated layer is caused to crack, and then cause package failure, aqueous vapor penetrates into and makes asking for failure of face slab
Topic.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of method for the open-celled structure for making organic luminous panel, characterized by comprising: be formed on the glass substrate
Machine film layer, to form underlay substrate；
Array substrate layer is formed on the organic film；
A predetermined position on the array substrate layer carries out laser and removes technique, to penetrate the array substrate layer and institute
Organic film is stated, and then forms one and the slot formed is surrounded by the array substrate layer and the organic film；
On the array substrate layer with the slot, evaporation process is carried out using metal light cover and electroluminescent material, to
Whole face organic luminous layer is formed, wherein the organic luminous layer is truncated naturally in the slot position；
Thin film encapsulation processes are carried out using metal light cover, and form thin-film encapsulation layer, wherein the thin-film encapsulation layer is in the slot
Hole corresponds to and is truncated naturally at the organic film；
Directly the coating of water suction packaging plastic and curing process are carried out in the cross section place of the slot；And
Laser lift-off is carried out to the glass substrate, and removes the film layer structure corresponded to below the slot, is made described
Slot penetrates the glass substrate.
2. the method for the open-celled structure of production organic luminous panel as claimed in claim 1, which is characterized in that in the organic film
When the upper formation array substrate layer, anti-cracking structure and barricade more are set in the predetermined position of the array substrate layer.
3. the method for the open-celled structure of production organic luminous panel as claimed in claim 1, which is characterized in that the array substrate layer
After formation, it further is coated with photoresist in the predetermined position of the array substrate layer, to protect the array substrate layer.
4. the method for the open-celled structure of production organic luminous panel as claimed in claim 3, which is characterized in that the laser removes work
Skill includes the cleaning of remover, wherein the particle that the remover includes the cross section place of the slot is removed, and is gone in described
After the cleaning of object, the photoresist on the glass substrate is removed.
5. the method for the open-celled structure of production organic luminous panel as claimed in claim 1, which is characterized in that the organic film is
Polyimides is made, and the array substrate layer includes film crystal pipe die group.
6. a kind of method for the open-celled structure for making organic luminous panel, characterized by comprising: be formed on the glass substrate
Machine film layer to form underlay substrate, and carries out laser in the predetermined position of the underlay substrate and removes technique, to penetrate
It states organic film and forms a slot；
Array substrate layer is formed on the underlay substrate with the slot, wherein the array substrate layer is in the slot position
Natural fracture；
On the array substrate layer with the slot, evaporation process is carried out using metal light cover and electroluminescent material, to
Whole face organic luminous layer is formed, wherein the organic luminous layer is truncated naturally in the slot position；
Thin film encapsulation processes are carried out using metal light cover, and form thin-film encapsulation layer, wherein the thin-film encapsulation layer is in the slot
Hole corresponds to and is truncated naturally at the organic film；
Directly the coating of water suction packaging plastic and curing process are carried out in the cross section place of the slot；And
Laser lift-off is carried out to the glass substrate, and removes the film layer structure corresponded to below the slot, is made described
Slot penetrates the glass substrate.
7. the method for the open-celled structure of production organic luminous panel as claimed in claim 6, which is characterized in that in the organic film
When the upper formation array substrate layer, anti-cracking structure and barricade more are set in the predetermined position of the array substrate layer.
8. the method for the open-celled structure of production organic luminous panel as claimed in claim 6, which is characterized in that the array substrate layer
After formation, it further is coated with photoresist in the predetermined position of the array substrate layer, to protect the array substrate layer.
9. the method for the open-celled structure of production organic luminous panel as claimed in claim 8, which is characterized in that the laser removes work
Skill includes the cleaning of remover, wherein the particle that the remover includes the cross section place of the slot is removed, and is gone in described
After the cleaning of object, the photoresist on the glass substrate is removed.
10. a kind of organic luminous panel, including a transparence display region and around the effective display area in the transparence display region
Domain, which is characterized in that the transparence display region includes: underlay substrate, array substrate, organic luminous layer, thin-film encapsulation layer, and
One slot, wherein the slot removes the film layer structure that technique penetrates the transparence display region, and the slot using laser
Section part be equipped with water suction packaging plastic, and the array substrate correspond to around the slot equipped with anti-cracking structure and barricade.
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| CN201910148527.1A CN109768188B (en) | 2019-02-28 | 2019-02-28 | Method for manufacturing open pore structure of organic light-emitting panel and organic light-emitting panel |
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| CN201910148527.1A CN109768188B (en) | 2019-02-28 | 2019-02-28 | Method for manufacturing open pore structure of organic light-emitting panel and organic light-emitting panel |
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| US11569472B2 (en) | 2019-11-26 | 2023-01-31 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Electroluminescent display substrate, manufacturing method thereof and electroluminescent display apparatus |
| CN110890474A (en) * | 2019-11-27 | 2020-03-17 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110890474B (en) * | 2019-11-27 | 2022-04-26 | 武汉天马微电子有限公司 | Display panel and display device |
| CN111725267A (en) * | 2020-06-02 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN111740028A (en) * | 2020-06-29 | 2020-10-02 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| US12016204B2 (en) | 2020-06-29 | 2024-06-18 | Mianyang Boe Optoelectronics Technology Co., Ltd. | Display panels and manufacturing methods thereof and display apparatuses |
| CN112397675A (en) * | 2020-11-18 | 2021-02-23 | 合肥维信诺科技有限公司 | Display panel preparation method and display panel |
| CN113539127A (en) * | 2021-07-09 | 2021-10-22 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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