CN110890062A - 显示装置 - Google Patents

显示装置 Download PDF

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CN110890062A
CN110890062A CN201911151405.4A CN201911151405A CN110890062A CN 110890062 A CN110890062 A CN 110890062A CN 201911151405 A CN201911151405 A CN 201911151405A CN 110890062 A CN110890062 A CN 110890062A
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circuit board
display device
printed circuit
driving chip
data driving
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傅晓立
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TCL China Star Optoelectronics Technology Co Ltd
TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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Priority to CN201911151405.4A priority Critical patent/CN110890062A/zh
Priority to US16/625,373 priority patent/US11191194B2/en
Priority to PCT/CN2019/122356 priority patent/WO2021097904A1/zh
Publication of CN110890062A publication Critical patent/CN110890062A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
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Abstract

本发明提供一种显示装置。所述显示装置包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。

Description

显示装置
技术领域
本发明涉及显示技术领域，尤其涉及一种显示装置。
背景技术
随着显示技术的发展，平板显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。现有的平面显示装置主要包括液晶显示装置(Liquid Crystal Display，LCD)及有机发光二极管显示装置(Organic Light EmittingDisplay，OLED)。
其中，液晶显示装置通常包括液晶显示面板及背光模组(backlight module)，液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，通过两片玻璃基板之间施加电压来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。
而OLED显示装置的发光原理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED显示面通常采用ITO像素电极和金属电极分别作为器件的阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
无论是液晶显示装置还是OLED显示装置均需要通过外部电路进行驱动。如图1所示，现有的显示装置包括印刷电路板100(Printed Circuit Board，PCB)、芯片承载薄膜200(Chip On Film，COF)、设置在芯片承载薄膜上的数据驱动芯片300(Source IC)、显示面板400(Panel)，芯片承载薄膜的输入端及输出端分别连接印刷电路板100及显示面板400。进一步地，数据驱动芯片300在工作过程中经常会有温度过高的问题，为了解决该问题，通常在芯片承载薄膜上增加散热贴进行改善，但是散热贴的散热能力有限，很多情形下并不能保证将数据驱动芯片300的温度降低并保持在正常的芯片工作温度，并且增加散热贴会导致产品的生产成本的增加。
发明内容
本发明的目的在于提供一种显示装置，能够提升芯片散热效果，降低生产成本，简化生产工艺。
为实现上述目的，本发明提供一种显示装置，包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；
所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区。
所述数据驱动芯片在所述印刷电路板上的水平投影的面积小于所述露铜区的面积。
所述露铜区远离所述数据驱动芯片的一侧表面上还设有辅助散热层。
所述辅助散热层的材料为石墨烯。
所述辅助散热层包括间隔排列的多个散热条。
所述显示装置还包括至少一个导热体，所述印刷电路板上设有至少一个过孔，每一个过孔内均设有一个导热体，所述导热体一端与所述露铜区接触，另一端与数据驱动芯片接触。
所述导热体的材料为铜。
所述导热体的材料为石墨烯。
所述数据驱动芯片包括至少一个置空引脚，每一个置空引脚均与一个导热体接触。
所述导热体填满所述过孔。
本发明的有益效果：本发明提供一种显示装置。所述显示装置包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的显示装置的示意图；
图2为本发明的显示装置的示意图；
图3为本发明的显示装置的印刷电路板的背面的示意图；
图4为图2中A-A处的剖面图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2及图3，本发明提供一种显示装置，包括：显示面板1、柔性电路板4、印刷电路板2及数据驱动芯片(Source IC)3，所述印刷电路板2通过所述柔性电路板4连接所述显示面板1；
所述数据驱动芯片3绑定于所述印刷电路板2的正面，所述印刷电路板2的背面与所述驱动芯片3相对的区域设有露铜区21。
需要说明的是，相比于现有的COF技术，本发明采用印刷电路板上绑定芯片(Chipon Board，COB)技术，将数据驱动芯片3直接绑定在印刷电路板2上，并且在印刷电路板2的背面，与数据驱动芯片3相对应的位置增加露铜设计(即形成露铜区21)，露铜区21的散热效率相比于现有技术中的散热片有明显提升，能够保证芯片的散热效果，有效解决现有技术中散热差导致芯片温度过高的问题。
与此同时，由于采用的露铜区21进行散热，因此也就不需要额外增加散热片，省下了散热片的成本，与此同时，由于柔性电路板4上不再具有数据驱动芯片3，因而柔性电路板4的尺寸也就可以做的比现有技术更短，相应的柔性电路板4的成本也更低。
更进一步地，数据驱动芯片3及印刷电路板2均是硬质结构，在绑定时，采用的是“硬绑硬”技术，而柔性电路板4是柔性结构，在绑定时，采用的是“硬绑软”技术，相比于“硬绑软”技术，“硬绑硬”技术更加成熟，工艺也更加简单，良率高，生产效率也更高。
进一步地，如图3所示，为了在本发明的一些实施例中，所述数据驱动芯片3在所述印刷电路板2上的水平投影的面积小于所述露铜区21的面积，也就是说露铜区21完全覆盖所述数据驱动芯片3，露铜区21的面积较大，从而散热面积也更大，可以提升数据驱动芯片3的散热效果，更好的保障数据驱动芯片3的工作稳定性。
可选地，如图3及图4所示，在本发明的一些实施例中，所述露铜区21远离所述数据驱动芯片3的一侧表面上还设有辅助散热层5，所述辅助散热层5采用导热性能比铜更优的材料制作，利用辅助散热层5辅助散热，可以增强散热能力，减少热量积聚，提升散热效果，提升数据驱动芯片3的运行稳定性和可靠性，延长使用寿命。
优选地，所述辅助散热层5的材料为石墨烯，当然所述辅助散热层5还可以为其他导热性能比铜更优的材料。
具体地，如图3及图4所示，所述辅助散热层5包括间隔排列的多个散热条51，通过设置多个间隔排列的散热条51组成所述辅助散热层5，实现分散散热，相比整面覆盖，能够提升散热的均匀性。
进一步地，如图3及图4所示，在本发明的一些实施例中，所述显示装置还包括至少一个导热体6，对应所述导热体6，所述印刷电路板2上设有至少一个过孔7；每一个过孔7内均设有一个导热体6，所述导热体6一端与所述露铜区21接触，另一端与数据驱动芯片3接触。
需要说明的是，通过设置所述导热体6，在所述数据驱动芯片3以及露铜区21之间进行热量传递，能够提升导热效率，进一步地提升散热效果。
可选地，所述导热体6的材料可以选择与所述印刷电路板的导电材料相同，即所述导热体6的材料为铜，也可以设置为比铜的导热性能更好的材料，例如石墨烯。
值得一提的是，如图2及图4所示，所述数据驱动芯片3通常包括多个引脚(Pin)，具体应用到显示装置中时，所述多个引脚并非均有信号接入，通常均会有一些没有接入信号引脚31，该些没有接入信号引脚即为置空引脚(Dummy Pin)31，在本发明的一些实施例中，所述数据驱动芯片3包括至少一个置空引脚31，每一个置空引脚31均与一个导热体6接触，将导热体6与所述置空引脚31直接接触，能够进一步地提升热传递效率，优化散热效果。
可选地，在本发明的一些实施例中，所述导热体6会填满所述过孔7，以保证热传递效果。
具体地，所述显示面板1为OLED显示面板或液晶显示面板。
综上所述，本发明提供一种显示装置。所述显示装置包括：显示面板、柔性电路板、印刷电路板及数据驱动芯片，所述印刷电路板通过所述柔性电路板连接所述显示面板；所述数据驱动芯片绑定于所述印刷电路板的正面，所述印刷电路板的背面与所述驱动芯片相对的区域设有露铜区，能够提升芯片散热效果，降低生产成本，提升产品的工作稳定性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

1.一种显示装置，其特征在于，包括：显示面板(1)、柔性电路板(4)、印刷电路板(2)及数据驱动芯片(3)，所述印刷电路板(2)通过所述柔性电路板(4)连接所述显示面板(1)；
所述数据驱动芯片(3)绑定于所述印刷电路板(2)的正面，所述印刷电路板(2)的背面与所述数据驱动芯片(3)相对的区域设有露铜区(21)。
2.如权利要求1所述的显示装置，其特征在于，所述数据驱动芯片(3)在所述印刷电路板(2)上的水平投影的面积小于所述露铜区(21)的面积。
3.如权利要求1所述的显示装置，其特征在于，所述露铜区(21)远离所述数据驱动芯片(3)的一侧表面上还设有辅助散热层(5)。
4.如权利要求3所述的显示装置，其特征在于，所述辅助散热层(5)的材料为石墨烯。
5.如权利要求3所述的显示装置，其特征在于，所述辅助散热层(5)包括间隔排列的多个散热条(51)。
6.如权利要求1所述的显示装置，其特征在于，还包括至少一个导热体(6)，所述印刷电路板(2)上设有至少一个过孔(7)，每一个过孔(7)内均设有一个导热体(6)，所述导热体(6)一端与所述露铜区(21)接触，另一端与数据驱动芯片(3)接触。
7.如权利要求6所述的显示装置，其特征在于，所述导热体(6)的材料为铜。
8.如权利要求6所述的显示装置，其特征在于，所述导热体(6)的材料为石墨烯。
9.如权利要求6所述的显示装置，其特征在于，所述数据驱动芯片(3)包括至少一个置空引脚(31)，每一个置空引脚(31)均与一个导热体(6)接触。
10.如权利要求6所述的显示装置，其特征在于，所述导热体(6)填满所述过孔(7)。
CN201911151405.4A 2019-11-21 2019-11-21 显示装置 Pending CN110890062A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022198793A1 (zh) * 2021-03-25 2022-09-29 Tcl华星光电技术有限公司 显示面板及显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1816261A (zh) * 2005-02-03 2006-08-09 中华映管股份有限公司 显示装置及其可拆卸式散热结构
US20150173176A1 (en) * 2013-12-17 2015-06-18 Samsung Display Co., Ltd. Display device
CN106061099A (zh) * 2016-06-28 2016-10-26 广东欧珀移动通信有限公司 印刷电路板和具有其的移动终端
CN106982544A (zh) * 2017-05-31 2017-07-25 江苏兆能电子有限公司 一种高功率密度开关电源的散热结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6556268B1 (en) * 1999-03-31 2003-04-29 Industrial Technology Research Institute Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
KR20140025743A (ko) * 2012-08-22 2014-03-05 삼성디스플레이 주식회사 표시 장치
US20160105949A1 (en) * 2014-10-14 2016-04-14 Shenzhen China Star Optoelectronics Technology Co. Ltd. Printed circuit board and display device
KR20200112068A (ko) * 2019-03-20 2020-10-05 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1816261A (zh) * 2005-02-03 2006-08-09 中华映管股份有限公司 显示装置及其可拆卸式散热结构
US20150173176A1 (en) * 2013-12-17 2015-06-18 Samsung Display Co., Ltd. Display device
CN106061099A (zh) * 2016-06-28 2016-10-26 广东欧珀移动通信有限公司 印刷电路板和具有其的移动终端
CN106982544A (zh) * 2017-05-31 2017-07-25 江苏兆能电子有限公司 一种高功率密度开关电源的散热结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022198793A1 (zh) * 2021-03-25 2022-09-29 Tcl华星光电技术有限公司 显示面板及显示装置

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