CN110883707A - Sponge sand for grinding electronic parts and production method thereof - Google Patents
Sponge sand for grinding electronic parts and production method thereof Download PDFInfo
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- CN110883707A CN110883707A CN201911148385.5A CN201911148385A CN110883707A CN 110883707 A CN110883707 A CN 110883707A CN 201911148385 A CN201911148385 A CN 201911148385A CN 110883707 A CN110883707 A CN 110883707A
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- layer
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- sand
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
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- Polishing Bodies And Polishing Tools (AREA)
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Abstract
The invention discloses sponge sand for grinding electronic parts and a production method thereof, and the technical scheme is that the sponge sand comprises a sponge base layer, a primer layer adhered to the surface of the sponge base layer, an adhesive layer adhered to one side of the primer layer, which is far away from the sponge base layer, and an abrasive layer adhered to one side of the adhesive layer, which is far away from the primer layer; the production method comprises the following steps: a. cutting the anti-sticking adhesive tape; b. laying an anti-sticking adhesive tape; c. coating an adhesive layer; d. planting sand; e. drying the adhesive layer; f. uncovering the anti-sticking adhesive tape; g. laying an elastic layer; h. pressing the adhesive layer; i. drying the bottom glue layer; j. drying; k. cutting; offer the chip groove of a plurality of crisscross distributions on the layer of polishing, the piece that produces in the middle of the process of polishing can enter into in the middle of the chip groove to spill in the middle of the chip groove, make sponge sand piece in the middle of the process of using, be difficult to reduce the effect of polishing.
Description
Technical Field
The invention relates to the technical field of surface treatment, in particular to sponge sand for grinding electronic parts and a production method thereof.
Background
The sponge sand block is also called a sponge grinding block, a polishing module and the like, the sponge is used as a base body, grinding sand is planted on the sponge, the sponge sand block is suitable for polishing a curved surface, and the sponge sand block can absorb water and can keep long-time grinding with water.
Among the prior art, the chinese utility model patent document that the grant bulletin number is CN203426872U discloses a high accuracy sponge sand in the middle of, including the sponge substrate layer, sponge substrate layer upper surface is equipped with the thin layer, the thin layer upper surface is equipped with abrasive material glue mixture layer, abrasive material glue mixture layer includes glue layer and abrasive material layer, the well upper portion on abrasive material layer exposes glue layer.
The existing sponge sand block is in the process of polishing, fragments generated by polishing are easy to store up in the gap of the abrasive material, and along with the accumulation of the fragments, the surface of the sponge sand block can become smooth, so that the polishing effect of the sponge sand block is reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide sponge sand for grinding electronic parts, wherein a plurality of chip grooves distributed in a staggered mode are formed in a grinding layer, and chips generated in the grinding process can enter the chip grooves and then leak out of the chip grooves, so that the grinding effect is not easily reduced in the using process of a sponge sand block.
In order to achieve the purpose, the invention provides the following technical scheme: a sponge sand for grinding electronic parts comprises a sponge base layer, a bottom glue layer adhered to the surface of the sponge base layer, an adhesive layer adhered to one side of the bottom glue layer, which is far away from the sponge base layer, and a grinding material layer adhered to one side of the adhesive layer, which is far away from the bottom glue layer;
a plurality of chip grooves are formed in the abrasive layer, the length directions of the chip grooves are parallel to the bottom glue layer, the chip grooves penetrate through the abrasive layer along the length directions of the chip grooves, the chip grooves are distributed in a staggered mode, and the two chip grooves which are staggered mutually are communicated with each other.
Through adopting above-mentioned technical scheme, in the middle of the process of polishing, the piece that produces of polishing can store up in the middle of the chip groove, and the width of chip groove is far greater than the distance between the two adjacent abrasive materials to make produced piece be discharged in the middle of the process of grinding from the chip groove easily, thereby make produced piece be difficult to deposit in the middle of the process of grinding in the middle of the space between the abrasive material, thereby be difficult to influence the effect of polishing of sponge sand piece.
The invention is further configured to: the bottom rubber is provided with an elastic layer, and the elastic layer is made of spandex fabric woven by spandex silk threads.
Through adopting above-mentioned technical scheme, spandex cloth is made by the spandex fibre, and spandex fibre itself has good elasticity, and the change of the emergence shape that one side that the sponge basic unit is close to the primer layer is frequently sent out to make the one side that the sponge basic unit is close to the primer layer crack easily, and through setting up the spandex cloth, can strengthen the one side that the sponge basic unit is close to the primer layer, make the problem of cracking is difficult to appear in the one side that the sponge basic unit is close to the primer layer.
Another object of the present invention is to provide a method for producing sponge sand for grinding electronic components, the sponge sand produced by the method is not easy to reduce grinding effect during use, and the method comprises the following steps:
a. cutting an anti-sticking adhesive tape: a plurality of rhombic holes are formed in the anti-sticking adhesive tape;
b. laying an anti-sticking adhesive tape: an anti-sticking adhesive tape which is not provided with holes and has the same shape and size as the anti-sticking adhesive tape provided with the diamond holes is flatly laid on the surface of the workbench, and the surface of the workbench is kept flat;
c. coating an adhesive layer: uniformly coating an adhesive layer on the surface of the anti-sticking adhesive tape on the surface of the workbench;
d. sand planting: paving an anti-sticking adhesive tape provided with diamond holes on the surface of the adhesive layer, aligning the side edges of the two adhesive tapes, and then preparing sand on the surface of the adhesive layer by adopting an electrostatic sand planting mode;
e. drying the adhesive layer: after sand planting is finished, drying the adhesive layer by utilizing hot air to realize preconsolidation of the adhesive layer;
f. uncovering the anti-sticking adhesive tape: removing the two anti-sticking adhesive tapes from the adhesive layer;
g. laying an elastic layer: soaking the elastic layer into the adhesive, and after the soaking is finished, flatly paving the elastic layer on the top of the sponge base layer to enable the side edge of the sponge base layer to be aligned with the side edge of the elastic layer;
h. laminating the adhesive layer: flatly paving the adhesive layer on the sponge base layer to enable the side edge of the adhesive layer to be aligned with the side edge of the sponge base layer;
i. drying the bottom glue layer: drying the adhesive by using hot air to realize the preconsolidation of the primer layer;
j. and (3) drying: heating and insulating the sponge sand block until the primer layer and the adhesive layer are completely solidified;
k. cutting: and cutting the sponge sand block according to the required shape and size.
Through adopting above-mentioned technical scheme, in the middle of the process of polishing, the piece that produces of polishing can store up in the middle of the chip groove, and the width of chip groove is far greater than the distance between the two adjacent abrasive materials to make produced piece be discharged in the middle of the process of grinding from the chip groove easily, thereby make produced piece be difficult to deposit in the middle of the process of grinding in the middle of the space between the abrasive material, thereby be difficult to influence the effect of polishing of sponge sand piece.
The invention is further configured to: the four sides of the diamond holes are parallel to the sides of the adjacent four diamond holes close to the diamond holes, and the distance between each diamond hole and the adjacent diamond hole is equal.
By adopting the technical scheme, the distances between each diamond hole and the adjacent diamond holes are controlled to be equal, so that the widths of the chip grooves on the abrasive layer are equal and are distributed in a mutually staggered manner, and chips generated by the abrasives at all positions can enter the chip grooves and are accumulated in gaps of the abrasives; directly plant sand on the sponge, because there is the space of not uniform size in the surface of sponge, the abrasive material of tiny granule enters into the space of sponge under the effect of gravity easily in the middle of, both caused the waste to the abrasive material, still lead to the surperficial unevenness on final fashioned abrasive material layer easily, thereby regard as the end liner earlier antiseized sticky tape to implant the abrasive material in the middle of the viscose layer, can prevent that the abrasive material from entering into the space of sponge, thereby can implant the less abrasive material of granule and can guarantee the level and smooth of the abrasive material layer that forms on the viscose layer.
The invention is further configured to: the adhesive layer is formed by mixing 40-45 parts by weight of phenolic resin and 5-6 parts by weight of styrene-butadiene latex.
Through adopting above-mentioned technical scheme, through mixing phenolic resin and butylbenzene latex, can enough guarantee in the middle of adhering the adhesive layer with the abrasive material when making, can also guarantee after the adhesive layer solidification that the abrasive material is difficult to break away from the adhesive layer.
The invention is further configured to: the primer layer is formed by mixing 70-75 parts by weight of water-soluble phenolic resin and 40-50 parts by weight of heavy calcium sulfate.
By adopting the technical scheme, the primer can be coated more easily by mixing the water-based phenolic resin and the heavy calcium sulfate.
The invention is further configured to: in the step e and the step i, when the adhesive layer and the primer layer are dried, the temperature of hot air is controlled to be 30-40 ℃.
Through adopting above-mentioned technical scheme, through the hot-blast temperature of control, realization that can be quick is to the precuring of viscose layer and primer layer, prevents that the later stage from carrying out the in-process of operating, appearing the shape change of viscose layer and primer layer.
The invention is further configured to: in the step j, the heat preservation temperature is controlled to be 70-80 ℃, and the heat preservation time is controlled to be 1-2 h.
Through adopting above-mentioned technical scheme, through the heat preservation heating for phenolic resin produces the secondary curing reaction, thereby makes the thorough solidification of viscose layer and primer layer, thereby makes what the viscose layer can be firm fix the abrasive material on the viscose layer, and the primer layer then can be firm link together viscose layer and sponge basic unit.
In summary, compared with the prior art, the invention has the following beneficial effects:
1. according to the sponge sand block, the chip discharge grooves are formed, so that chips generated by grinding can be stored in the chip discharge grooves in the grinding process, the width of each chip discharge groove is far larger than the distance between two adjacent grinding materials, the chips generated in the grinding process are easily discharged from the chip discharge grooves, the chips generated in the grinding process are not easily stored in gaps between the grinding materials, and the grinding effect of the sponge sand block is not easily influenced;
2. according to the invention, the anti-sticking adhesive tape is adopted, so that the abrasive material can be prevented from entering the gap of the sponge, the abrasive material with smaller particles can be implanted, and the flatness of the abrasive material layer formed on the adhesive layer can be ensured.
Drawings
FIG. 1 is an isometric view of the completed structure of the first embodiment;
FIG. 2 is a schematic diagram of an embodiment embodying an elastic layer;
fig. 3 is an enlarged view of a portion a of fig. 2.
In the figure: 1. a sponge base layer; 2. a primer layer; 3. an adhesive layer; 4. an abrasive layer; 41. a chip groove; 5. an elastic layer.
Detailed Description
The first embodiment is as follows: a sponge sand for grinding electronic parts is disclosed, referring to figure 1, and comprises a sponge base layer 1, a primer layer 2 adhered on the surface of the sponge base layer 1, an adhesive layer 3 adhered on one side of the primer layer 2, which is far away from the sponge base layer 1, and an abrasive layer 4 adhered on one side of the adhesive layer 3, which is far away from the primer layer 2; a plurality of chip discharge grooves 41 are formed in the abrasive layer 4, the length directions of the chip discharge grooves 41 are parallel to the bottom glue layer 2, the chip discharge grooves 41 penetrate through the abrasive layer 4 along the length directions of the chip discharge grooves 41, the chip discharge grooves 41 are distributed in a staggered mode, and the two chip discharge grooves 41 which are staggered mutually are communicated. When polishing, the chips generated in the polishing process can enter the chip discharge groove 41 and then are discharged from the chip discharge groove 41, so that the chips generated by polishing are not easy to accumulate in the gap of the abrasive, and the polishing effect of the sponge sand block can be ensured.
Referring to fig. 2 and 3, an elastic layer 5 is arranged in the primer, and the elastic layer 5 is spandex cloth woven by spandex silk yarns; the spandex fabric is made of spandex fibers, and the spandex fibers have good elasticity; the sponge basic unit 1 is close to the change of the emergence shape of one side frequent of primer layer 2 to make the easy emergence fracture of one side that sponge basic unit 1 is close to primer layer 2, and through setting up the spandex cloth, can strengthen one side that sponge basic unit 1 is close to primer layer 2, make the difficult problem that the fracture appears in one side that sponge basic unit 1 is close to primer layer 2.
Example two: a production method of sponge sand for grinding electronic parts comprises the following steps:
a. cutting an anti-sticking adhesive tape: a plurality of rhombic holes are formed in the anti-sticking adhesive tape;
b. laying an anti-sticking adhesive tape: an anti-sticking adhesive tape which is not provided with holes and has the same shape and size as the anti-sticking adhesive tape provided with the diamond holes is flatly laid on the surface of the workbench, and the surface of the workbench is kept flat;
c. coating an adhesive layer 3: uniformly coating an adhesive layer 3 on the surface of the anti-sticking adhesive tape on the surface of the workbench, wherein the adhesive layer 3 is formed by mixing 70 parts by weight of water-soluble phenolic resin and 40 parts by weight of heavy calcium sulfate;
d. sand planting: laying the anti-sticking adhesive tape provided with the diamond holes on the surface of the adhesive layer 3, aligning the side edges of the two adhesive tapes, and then preparing sand on the surface of the adhesive layer 3 in an electrostatic sand planting mode;
e. drying the adhesive layer 3: after sand planting is finished, drying the adhesive layer 3 by using hot air at the temperature of 30 ℃ to realize preconsolidation of the adhesive layer 3;
f. uncovering the anti-sticking adhesive tape: removing the two anti-sticking adhesive tapes from the adhesive layer 3;
g. laying an elastic layer 5: soaking the elastic layer 5 into adhesive, wherein the adhesive is formed by mixing 70 parts by weight of water-soluble phenolic resin and 40 parts by weight of heavy calcium sulfate; after the soaking is finished, the elastic layer 5 is flatly laid on the top of the sponge base layer 1, so that the side edge of the sponge base layer 1 is aligned with the side edge of the elastic layer 5;
h. and (3) laminating the adhesive layer: the adhesive layer 3 is flatly laid on the sponge base layer 1, so that the side edge of the adhesive layer 3 is aligned with the side edge of the sponge base layer 1;
i. and (3) drying the primer layer 2: drying the adhesive by hot air at the temperature of 30 ℃ to realize the pre-consolidation of the primer layer 2;
j. and (3) drying: heating and insulating the sponge sand block until the primer layer 2 and the adhesive layer 3 are completely solidified;
k. cutting: cutting the sponge sand block according to the required shape and size, controlling the heat preservation temperature at 70 ℃ and the heat preservation time at 1 h.
Example three: a production method of sponge sand for grinding electronic parts comprises the following steps:
a. cutting an anti-sticking adhesive tape: a plurality of rhombic holes are formed in the anti-sticking adhesive tape;
b. laying an anti-sticking adhesive tape: an anti-sticking adhesive tape which is not provided with holes and has the same shape and size as the anti-sticking adhesive tape provided with the diamond holes is flatly laid on the surface of the workbench, and the surface of the workbench is kept flat;
c. coating an adhesive layer 3: uniformly coating an adhesive layer 3 on the surface of the anti-sticking adhesive tape on the surface of the workbench, wherein the adhesive layer 3 is formed by mixing 72.5 parts by weight of water-soluble phenolic resin and 45 parts by weight of heavy calcium sulfate;
d. sand planting: laying the anti-sticking adhesive tape provided with the diamond holes on the surface of the adhesive layer 3, aligning the side edges of the two adhesive tapes, and then preparing sand on the surface of the adhesive layer 3 in an electrostatic sand planting mode;
e. drying the adhesive layer 3: after sand planting is finished, drying the adhesive layer 3 by using hot air, wherein the temperature of the hot air is 35 ℃, and pre-consolidation of the adhesive layer 3 is realized;
f. uncovering the anti-sticking adhesive tape: removing the two anti-sticking adhesive tapes from the adhesive layer 3;
g. laying an elastic layer 5: soaking the elastic layer 5 into adhesive, wherein the adhesive is formed by mixing 72.5 parts by weight of water-soluble phenolic resin and 45 parts by weight of heavy calcium sulfate; after the soaking is finished, the elastic layer 5 is flatly laid on the top of the sponge base layer 1, so that the side edge of the sponge base layer 1 is aligned with the side edge of the elastic layer 5;
h. and (3) laminating the adhesive layer: the adhesive layer 3 is flatly laid on the sponge base layer 1, so that the side edge of the adhesive layer 3 is aligned with the side edge of the sponge base layer 1;
i. and (3) drying the primer layer 2: drying the adhesive by using hot air at the temperature of 35 ℃ to realize the preconsolidation of the primer layer 2;
j. and (3) drying: heating and insulating the sponge sand block until the primer layer 2 and the adhesive layer 3 are completely solidified;
k. cutting: and cutting the sponge sand block according to the required shape and size, controlling the heat preservation temperature to be 75 ℃ and the heat preservation time to be 1.5 h.
Example four: a production method of sponge sand for grinding electronic parts comprises the following steps:
a. cutting an anti-sticking adhesive tape: a plurality of rhombic holes are formed in the anti-sticking adhesive tape;
b. laying an anti-sticking adhesive tape: an anti-sticking adhesive tape which is not provided with holes and has the same shape and size as the anti-sticking adhesive tape provided with the diamond holes is flatly laid on the surface of the workbench, and the surface of the workbench is kept flat;
c. coating an adhesive layer 3: uniformly coating an adhesive layer 3 on the surface of the anti-sticking adhesive tape on the surface of the workbench, wherein the adhesive layer 3 is formed by mixing 75 parts by weight of water-soluble phenolic resin and 50 parts by weight of heavy calcium sulfate;
d. sand planting: laying the anti-sticking adhesive tape provided with the diamond holes on the surface of the adhesive layer 3, aligning the side edges of the two adhesive tapes, and then preparing sand on the surface of the adhesive layer 3 in an electrostatic sand planting mode;
e. drying the adhesive layer 3: after sand planting is finished, drying the adhesive layer 3 by using hot air, wherein the temperature of the hot air is 40 ℃, and pre-consolidation of the adhesive layer 3 is realized;
f. uncovering the anti-sticking adhesive tape: removing the two anti-sticking adhesive tapes from the adhesive layer 3;
g. laying an elastic layer 5: soaking the elastic layer 5 into adhesive, wherein the adhesive is formed by mixing 75 parts by weight of water-soluble phenolic resin and 40-50 parts by weight of heavy calcium sulfate; after the soaking is finished, the elastic layer 5 is flatly laid on the top of the sponge base layer 1, so that the side edge of the sponge base layer 1 is aligned with the side edge of the elastic layer 5;
h. and (3) laminating the adhesive layer: the adhesive layer 3 is flatly laid on the sponge base layer 1, so that the side edge of the adhesive layer 3 is aligned with the side edge of the sponge base layer 1;
i. and (3) drying the primer layer 2: drying the adhesive by hot air at the temperature of 40 ℃ to realize the pre-consolidation of the primer layer 2;
j. and (3) drying: heating and insulating the sponge sand block until the primer layer 2 and the adhesive layer 3 are completely solidified;
k. cutting: cutting the sponge sand block according to the required shape and size, controlling the heat preservation temperature to be 80 ℃, and controlling the heat preservation time to be 2 h.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. The sponge sand for grinding the electronic parts is characterized in that: comprises a sponge base layer (1), a bottom glue layer (2) adhered to the surface of the sponge base layer (1), an adhesive layer (3) adhered to one side of the bottom glue layer (2) departing from the sponge base layer (1), and an abrasive layer (4) adhered to one side of the adhesive layer (3) departing from the bottom glue layer (2);
a plurality of chip grooves (41) are formed in the abrasive layer (4), the length directions of the chip grooves (41) are parallel to the bottom glue layer (2), the chip grooves (41) penetrate through the abrasive layer (4) along the length directions of the chip grooves (41), the chip grooves (41) are distributed in a staggered mode, and the chip grooves (41) which are staggered mutually are communicated.
2. The sponge sand for grinding electronic parts according to claim 1, wherein: the bottom rubber is internally provided with an elastic layer (5), and the elastic layer (5) is made of spandex fabric woven by spandex silk threads.
3. A method for producing the sponge sand for grinding electronic parts according to any one of claims 1-2, which comprises the steps of: the method comprises the following steps:
a. cutting an anti-sticking adhesive tape: a plurality of rhombic holes are formed in the anti-sticking adhesive tape;
b. laying an anti-sticking adhesive tape: an anti-sticking adhesive tape which is not provided with holes and has the same shape and size as the anti-sticking adhesive tape provided with the diamond holes is flatly laid on the surface of the workbench, and the surface of the workbench is kept flat;
c. coating adhesive layer (3): uniformly coating an adhesive layer (3) on the surface of the anti-sticking adhesive tape on the surface of the workbench;
d. sand planting: paving an anti-sticking adhesive tape provided with diamond holes on the surface of the adhesive layer (3), aligning the side edges of the two adhesive tapes, and then preparing sand on the surface of the adhesive layer (3) in an electrostatic sand planting mode;
e. drying the adhesive layer (3): after sand planting is finished, drying the adhesive layer (3) by utilizing hot air to realize preconsolidation of the adhesive layer (3);
f. uncovering the anti-sticking adhesive tape: removing the two anti-sticking adhesive tapes from the adhesive layer (3);
g. laying an elastic layer (5): soaking the elastic layer (5) into the adhesive, and after the soaking is finished, flatly paving the elastic layer (5) on the top of the sponge base layer (1) to enable the side edge of the sponge base layer (1) to be aligned with the side edge of the elastic layer (5);
h. laminating the adhesive layer (3): flatly paving the adhesive layer (3) on the sponge base layer (1) so that the side edge of the adhesive layer (3) is aligned with the side edge of the sponge base layer (1);
i. drying the bottom glue layer (2): drying the adhesive by utilizing hot air to realize the preconsolidation of the primer layer (2);
j. and (3) drying: heating and insulating the sponge sand block until the primer layer (2) and the adhesive layer (3) are completely solidified;
k. cutting: and cutting the sponge sand block according to the required shape and size.
4. The method for producing the sponge sand for grinding electronic parts as claimed in claim 3, wherein: the four sides of the diamond holes are parallel to the sides of the adjacent four diamond holes close to the diamond holes, and the distance between each diamond hole and the adjacent diamond hole is equal.
5. The method for producing the sponge sand for grinding electronic parts as claimed in claim 3, wherein: the adhesive layer (3) is formed by mixing 40-45 parts of phenolic resin and 5-6 parts of styrene-butadiene latex in parts by weight.
6. The method for producing the sponge sand for grinding electronic parts as claimed in claim 3, wherein: the primer layer (2) is formed by mixing 70-75 parts by weight of water-soluble phenolic resin and 40-50 parts by weight of heavy calcium sulfate.
7. The method for producing the sponge sand for grinding electronic parts as claimed in claim 1, wherein: in the step e and the step i, when the adhesive layer (3) and the primer layer (2) are dried, the temperature of hot air is controlled to be 30-40 ℃.
8. The method for producing the sponge sand for grinding electronic parts as claimed in claim 1, wherein: in the step j, the heat preservation temperature is controlled to be 70-80 ℃, and the heat preservation time is controlled to be 1-2 h.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148385.5A CN110883707B (en) | 2019-11-21 | 2019-11-21 | Sponge sand for grinding electronic parts and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911148385.5A CN110883707B (en) | 2019-11-21 | 2019-11-21 | Sponge sand for grinding electronic parts and production method thereof |
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| CN110883707A true CN110883707A (en) | 2020-03-17 |
| CN110883707B CN110883707B (en) | 2021-05-07 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101829962A (en) * | 2010-03-25 | 2010-09-15 | 湖北玉立砂带集团股份有限公司 | Sanding belt special for metal composite plate and preparation method thereof |
| CN203426872U (en) * | 2013-07-30 | 2014-02-12 | 杜赛清 | High-precision sponge sand |
| CN206084805U (en) * | 2016-08-31 | 2017-04-12 | 杜赛清 | Novel sponge sand |
| CN107553357A (en) * | 2017-09-28 | 2018-01-09 | 苏州远东砂轮有限公司 | Fiberboard dedicated ceramic microcrystal fused alumina coated abrasive tool and its manufacture method |
| CN110315439A (en) * | 2019-08-05 | 2019-10-11 | 衢州学院 | A kind of mirror grinding grinding wheel and preparation method thereof with capillary micropore |
-
2019
- 2019-11-21 CN CN201911148385.5A patent/CN110883707B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101829962A (en) * | 2010-03-25 | 2010-09-15 | 湖北玉立砂带集团股份有限公司 | Sanding belt special for metal composite plate and preparation method thereof |
| CN203426872U (en) * | 2013-07-30 | 2014-02-12 | 杜赛清 | High-precision sponge sand |
| CN206084805U (en) * | 2016-08-31 | 2017-04-12 | 杜赛清 | Novel sponge sand |
| CN107553357A (en) * | 2017-09-28 | 2018-01-09 | 苏州远东砂轮有限公司 | Fiberboard dedicated ceramic microcrystal fused alumina coated abrasive tool and its manufacture method |
| CN110315439A (en) * | 2019-08-05 | 2019-10-11 | 衢州学院 | A kind of mirror grinding grinding wheel and preparation method thereof with capillary micropore |
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| CN110883707B (en) | 2021-05-07 |
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