CN110880459A - Vacuum pipeline protection system and method - Google Patents

Vacuum pipeline protection system and method Download PDF

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Publication number
CN110880459A
CN110880459A CN201811031683.1A CN201811031683A CN110880459A CN 110880459 A CN110880459 A CN 110880459A CN 201811031683 A CN201811031683 A CN 201811031683A CN 110880459 A CN110880459 A CN 110880459A
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China
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gas
vacuum
vacuum pipeline
pipeline
vacuum line
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Chinese (zh)
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不公告发明人
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Priority to CN201811031683.1A priority Critical patent/CN110880459A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The invention provides a vacuum pipeline protection system and a method, wherein the protection system comprises a reaction cavity, a main pump matched with the reaction cavity, a backing pump and a vacuum pipeline; the reaction cavity is hermetically connected with the main pump, and first gas is contained in the reaction cavity; the main pump is connected with the backing pump through a vacuum pipeline; wherein, a first injection point is arranged on the pipe wall of the vacuum pipeline, and the second gas is injected into the vacuum pipeline through the first injection point and is used for diluting the concentration of the first gas pumped into the vacuum pipeline from the reaction cavity to be below the lower explosion limit of the first gas. The invention can more accurately and controllably regulate and monitor the concentration of the first gas in the vacuum pipeline, and when the gas supply of the second gas is abnormal, the machine station is controlled to stop, so as to ensure that the concentration of the first gas in the vacuum pipeline is always lower than the lower explosion limit, thereby not only avoiding the risk of explosion of the vacuum pipeline and ensuring the safety of personnel and the machine station, but also saving the cost for installing an explosion-proof blanket and saving the cost.

Description

Vacuum pipeline protection system and method
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a vacuum pipeline protection system and a method.
Background
In a semiconductor manufacturing process, various flammable and explosive gases are used, such as a Carbonyl Sulfide (COS) gas used in an etching process, the COS is a colorless flammable and explosive gas with a self-ignition or explosion concentration of about 11.9% to 29%, and the COS proportion in a mixed gas used in a currently known silicon dioxide DRY etching (OX DRY ETCH) station in a semiconductor manufacturing process, Recipe (secret Recipe in industrial automation manufacturing, the content of which may include a plurality of steps in a process manufacturing process and various process parameter values of each step and the duration of the step) reaches 13.15%, which means that a safety risk of self-ignition or explosion is reached in a region from a molecular pump (Turbo pump) to a vacuum pump (DRY pump).
However, passive methods are adopted in the prior art to reduce the risk of accidents. Fig. 1 is a schematic diagram of a vacuum pipeline protection system in the prior art, which includes a reaction chamber 1 ' of a machine, a main pump 2 ' matched with the reaction chamber 1 ', a backing pump 5 ' and a vacuum pipeline 3 '; the reaction cavity 1 ' is hermetically connected with the main pump 2 ', and combustible gas is contained in the reaction cavity 1 '; the main pump 2 ' is connected with the backing pump 5 ' through the vacuum pipeline 3 '; the vacuum pipeline 3 'comprises vacuum pipelines 32' and sealing rings 33 ', the vacuum pipelines 32' are sequentially connected, and two adjacent vacuum pipelines 32 'are hermetically connected through the sealing rings 33'; the combustible gas discharged by the backing pump 5 'is diluted to be below the lower explosion limit of the combustible gas at an exhaust port connected with the backing pump 5' and then is introduced into a tail gas treatment device for further treatment; in order to prevent spontaneous combustion and explosion in the area of the vacuum pipeline 3 ', a perfluorinated ring seal ring is adopted to prevent gas leakage in the vacuum pipeline 3' so as to reduce the risk occurrence probability, and an explosion-proof blanket 4 'is arranged at the connecting part of the main pump 2' and the vacuum pipeline 3 'and each vacuum pipeline 32' so as to reduce the loss caused by accidents.
The passive method adopted in the prior art to reduce the accident risk has at least the following disadvantages: firstly, in the process of manufacturing a semiconductor, a molecular pump and a dry pump of a machine are generally distributed on different floors, a vacuum pipeline for communicating the molecular pump and the dry pump is long, a plurality of vacuum pipeline connecting parts exist, a plurality of explosion-proof blankets need to be installed, the price of the explosion-proof blankets is high, the cost is high, and the production cost is additionally increased; secondly, potential safety hazards still exist, the occurrence of spontaneous combustion or explosion accidents of combustible gas in the vacuum pipeline cannot be avoided, once an accident occurs, the whole etching machine needs to be stopped for maintenance, the production progress is influenced, the personal safety of operators is threatened, equipment at the position of the accident point is damaged, and the loss is immeasurable; in addition, high-altitude operation is needed during maintenance, the maintenance is difficult, and certain safety risks exist during maintenance of maintenance personnel.
Therefore, finding a vacuum pipeline protection system capable of effectively monitoring and adjusting the concentration of combustible gas in a vacuum pipeline of a machine station so as to avoid spontaneous combustion or explosion caused by too high concentration of combustible gas in the vacuum pipeline becomes an important technical problem to be solved by the technical staff in the field.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a vacuum pipeline protection system and method, in which an injection point is disposed on a pipe wall of a vacuum pipeline, and a second gas is injected into the vacuum pipeline to dilute a first gas pumped from a reaction chamber into the vacuum pipeline to a value below an explosion lower limit thereof, so as to solve the technical problems of high cost, potential safety hazard and inconvenient maintenance when an etching machine platform adopts a passive protection manner to reduce the risk of spontaneous combustion or explosion accident of the first gas in the vacuum pipeline.
For convenience of the following description, some basic definitions of terms are first given.
Explosion limit: combustible gas, combustible steam or combustible dust and air (or oxygen) are uniformly mixed in a certain concentration range to form premixed gas, and the premixed gas can explode when meeting a fire source, wherein the concentration range is called as an explosion limit or an explosion concentration limit;
lower explosive limit: refers to the lowest concentration of premix gas at which detonation can occur.
To achieve the above and other related objects, the present invention provides a vacuum line protection system, comprising:
the device comprises a reaction cavity, a main pump, a backing pump and a vacuum pipeline, wherein the main pump, the backing pump and the vacuum pipeline are matched with the reaction cavity;
the reaction cavity is hermetically connected with the main pump, and a first gas is contained in the reaction cavity;
the main pump is connected with the backing pump through the vacuum pipeline;
the tube wall of the vacuum pipeline is provided with a first injection point, and second gas is injected into the vacuum pipeline through the first injection point and is used for diluting the concentration of the first gas entering the vacuum pipeline from the reaction cavity.
In the present invention, optionally, the first gas comprises a combustible gas comprising one or a combination of carbonyl sulfide, hydrogen sulfide, methane and silane.
As an improvement to the above vacuum line protection system of the present invention, the concentration of the first gas in the vacuum line diluted by the second gas is lower than the lower explosion limit thereof.
As an improvement of the above vacuum line protection system of the present invention, in order to dilute the concentration of the first gas in the vacuum line below its lower explosion limit, the first injection point is connected to a gas supply source for supplying the second gas.
As an improvement of the above vacuum line protection system of the present invention, in order to more accurately and controllably adjust the diluted concentration of the first gas in the vacuum line, the injection flow rate of the second gas injected into the vacuum line is controlled by a gas flow meter disposed between the first injection point and the gas supply source of the second gas.
As an improvement of the vacuum pipeline protection system of the present invention, the vacuum pipeline protection system further includes a first console, and the first console is connected to the gas flowmeter, and is configured to monitor and adjust an injection flow rate of the second gas injected into the vacuum pipeline through the first injection point in real time, and control a machine station to which the reaction cavity belongs to stop when the injection flow rate of the second gas is abnormal.
As an improvement of the vacuum pipeline protection system of the present invention, the system further includes a flow monitoring module and a second console, wherein the flow monitoring module is respectively connected to the second console and the gas supply source, and is configured to monitor whether gas supply of the gas supply source is abnormal; and the second control console is used for controlling the machine station to which the reaction cavity belongs to stop when the gas supply of the gas supply source is abnormal.
As an improvement of the vacuum pipeline protection system, the flow monitoring module can select the equipment of the reaction cavity, so that the cost is saved.
As an improvement of the vacuum pipeline protection system of the present invention, the flow monitoring module includes an alarm device, which is used for giving an alarm and triggering the second console to control the machine station to which the reaction chamber belongs to stop when the gas supply of the gas supply source is abnormal.
As an improvement to the vacuum circuit protection system of the present invention, in order to prevent the first gas in the vacuum circuit from flowing back into the gas supply source, a check valve is disposed between the first injection point and the gas supply source.
As an improvement to the above vacuum pipeline protection system of the present invention, one or a combination of a ball valve, a pressure reducing valve and a pressure gauge is further disposed between the first injection point and the gas supply source.
In one embodiment, the vacuum pipeline comprises vacuum pipelines and sealing rings, each vacuum pipeline is connected in sequence, and two adjacent vacuum pipelines are connected in a sealing mode through the sealing rings.
In the present invention, the vacuum pipe includes one or a combination of a bellows pipe and a rigid pipe.
In a particular embodiment, the material of the sealing ring comprises polytetrafluoroethylene.
In one embodiment, the sealing ring and the peripheral part of part or all of the vacuum pipeline adjacent to the sealing ring are provided with explosion-proof blankets.
As an improvement to the above vacuum line protection system of the present invention, the exhaust port of the backing pump is connected to an exhaust gas treatment device.
As an improvement to the above vacuum pipeline protection system of the present invention, a second injection point is disposed on a pipeline between the exhaust port of the backing pump and the exhaust gas treatment device, and the second gas is injected into the pipeline through the first injection point to further dilute the first gas pumped out by the backing pump.
In the invention, the reaction cavity comprises one of a reaction cavity of an etching machine, a reaction cavity of a furnace tube machine, a reaction cavity of an ion injection machine and a reaction cavity of a thin film preparation machine.
In one embodiment, the second gas comprises nitrogen or a noble gas.
As an improvement of the vacuum pipeline protection system, a heating device is arranged at the joint of the main pump and the vacuum pipeline.
As an improvement to the above vacuum pipeline protection system of the present invention, in order to further reduce the risk of explosion of the first gas in the vacuum pipeline when the first gas flows through the vacuum pipeline, the first injection point is disposed on a pipe wall of the vacuum pipeline near one end of the main pump, and is configured to reduce the exothermic concentration of the first gas in the vacuum pipeline to below the lower explosion limit at a position near an exhaust port of the main pump.
It should be noted that the vacuum pipeline protection system can be applied to a plurality of reaction chambers of a machine or a plurality of reaction chambers of a plurality of machines
The invention also provides a vacuum pipeline protection method, wherein the vacuum pipeline is respectively connected with a main pump and a backing pump, the main pump is connected with a reaction cavity, and a first gas is contained in the reaction cavity, the method comprises the following steps:
arranging a first injection point on the pipe wall of the vacuum pipeline;
and injecting a second gas into the vacuum pipeline through the first injection point, wherein the second gas is used for diluting the concentration of the first gas entering the vacuum pipeline from the reaction cavity.
In the present invention, the first gas comprises a combustible gas; the concentration of the first gas in the vacuum line diluted by the second gas is lower than the lower explosion limit thereof.
In the present invention, the combustible gas comprises one or a combination of carbonyl sulfide, hydrogen sulfide, methane and silane.
As an improvement of the above-described vacuum line protection method of the present invention, an injection flow rate of the second gas injected into the vacuum line is controlled by a gas flow meter provided between the first injection point and a gas supply source of the second gas.
As an improvement to the above-mentioned vacuum line protection method of the present invention, the method further comprises:
the first control console receives flow data of the gas flowmeter to monitor and adjust the injection flow of the second gas injected into the vacuum pipeline in real time, and when the injection flow of the second gas is abnormal, the first control console controls the machine station to which the reaction cavity belongs to stop. In one embodiment, the injection flow rate of the second gas injected into the vacuum line is 500 sccm.
As an improvement to the above-mentioned vacuum line protection method of the present invention, the method further comprises:
monitoring whether the gas supply of the gas supply source of the second gas is abnormal or not through a flow monitoring module, and triggering an alarm device when the gas supply of the gas supply source is abnormal; and the second control console controls the machine table to which the reaction cavity belongs to stop. In one embodiment, the injection flow rate of the second gas injected into the vacuum pipeline is between 1000sccm and 2000 sccm.
As an improvement of the method for protecting a vacuum line according to the present invention, the backflow of the first gas in the vacuum line to the gas supply source of the second gas is prevented by a check valve disposed between the first injection point and the gas supply source of the second gas.
As an improvement of the above vacuum line protection method of the present invention, the supply of the second gas is opened or shut off by a ball valve disposed between the first injection point and the gas supply source of the second gas; adjusting an injection flow rate of the second gas by a pressure reducing valve provided between the first injection point and the gas supply source of the second gas.
As an improvement to the above-mentioned vacuum line protection method of the present invention, the method further comprises:
and introducing the first gas pumped by the backing pump into a tail gas treatment device for tail gas treatment.
As an improvement of the method for protecting the vacuum pipeline, the step of pumping the first gas from the backing pump and introducing the first gas into the tail gas treatment device for tail gas treatment comprises the following steps:
injecting the second gas into the pipeline through a second injection point arranged on the pipeline between the exhaust port of the backing pump and the tail gas treatment device, and further diluting the first gas in the pipeline;
and introducing the first gas which is further diluted into a tail gas treatment device for tail gas treatment.
As an improvement of the above-described method for protecting a vacuum line of the present invention, a sum of the flow rate of the second gas injected into the vacuum line and the flow rate of the second gas injected into a line between the exhaust port of the backing pump and the exhaust gas treatment device is a constant value.
As an improvement of the vacuum pipeline protection method of the present invention, the reaction cavity includes one of a reaction cavity of an etching machine, a reaction cavity of a furnace tube machine, a reaction cavity of an ion implantation machine, and a reaction cavity of a thin film preparation machine.
As an improvement of the above-mentioned vacuum line protection method of the present invention, the second gas includes nitrogen or a rare gas.
As an improvement of the protection method for the vacuum pipeline, the vacuum pipeline comprises vacuum pipelines and sealing rings, the vacuum pipelines are sequentially connected, and two adjacent vacuum pipelines are hermetically connected through the sealing rings; the material of the sealing ring comprises polytetrafluoroethylene.
As an improvement to the above vacuum pipeline protection method of the present invention, an explosion-proof blanket is disposed on the sealing ring and the outer circumference of part or all of the vacuum pipeline adjacent to the sealing ring.
As an improvement of the above-mentioned vacuum pipeline protection method of the present invention, a heating device is disposed at the connection between the main pump and the vacuum pipeline.
It should be noted that the vacuum pipeline protection method can be applied to the vacuum pipeline protection of a plurality of reaction cavities of one machine or the vacuum pipeline protection of a plurality of reaction cavities of a plurality of machines.
As described above, the vacuum pipeline protection system and method of the present invention have the following beneficial effects:
according to the system and the method, the first injection point is arranged on the pipe wall of the vacuum pipeline, the second gas is injected into the vacuum pipeline through the first injection point, the concentration of the first gas pumped into the vacuum pipeline from the reaction cavity is diluted to be below the lower explosion limit of the first gas, the explosion risk of the vacuum pipeline is reduced, and the safety of personnel and machines is ensured; compared with the prior art, the number of the explosion-proof blankets arranged on the vacuum pipeline can be reduced, so that the cost for installing the explosion-proof blankets is saved, later-stage high-altitude maintenance operation can be avoided, the maintenance is easy, and the safety of later-stage maintenance personnel is ensured;
further, by introducing a gas flow meter between the gas supply source and the first injection point to monitor the flow rate of the second gas injected into the vacuum pipeline through the first injection point, the diluted concentration of the first gas in the vacuum pipeline can be more accurately and controllably adjusted;
furthermore, whether the gas supply of the gas supply source is abnormal or whether the flow of the protective gas injected into the vacuum pipeline is abnormal is monitored, when the abnormality occurs, an alarm is triggered, and the console controls the machine table to which the reaction cavity belongs to be shut down, so that the risk of explosion of the vacuum pipeline is avoided.
Drawings
Fig. 1 is a schematic diagram of a vacuum line protection system in the prior art.
FIG. 2 is a schematic view of a vacuum line protection system according to the present invention.
Fig. 3 shows a schematic diagram of the introduction of a gas flow meter in the vacuum line protection system of the present invention.
FIG. 4 is a schematic view of a vacuum line protection system according to a first embodiment of the present invention.
FIG. 5 is a schematic view of a vacuum line protection system according to a second embodiment of the present invention.
Fig. 6 is a schematic view of the vacuum line protection system of the present invention for multiple vacuum line protection.
FIG. 7 is a flow chart of the vacuum line protection method of the present invention.
Description of the element reference numerals
1, 1' reaction chamber
2, 2' main pump
3, 3' vacuum pipeline
31, 31' connecting part
311, 311' heating device
32, 32' vacuum pipe
33, 33' sealing ring
34 first injection point
4, 4' explosion-proof blanket
5, 5' backing pump
6, 6' second injection point
7, 7' tail gas treatment device
8 gas supply pipeline
81 gas flowmeter
811 electronic gas flowmeter
812 mechanical gas flowmeter
82 ball valve
83 pressure reducing valve
84 check valve
85 pressure gauge
9 control desk
91 first control desk
92 second control desk
10 flow monitoring module
11 gas supply source
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1-5. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
For convenience of the following description, some basic definitions of terms are first given.
Explosion limit: combustible gas, combustible steam or combustible dust and air (or oxygen) are uniformly mixed in a certain concentration range to form premixed gas, and the premixed gas can explode when meeting a fire source, wherein the concentration range is called as an explosion limit or an explosion concentration limit;
lower explosive limit: refers to the lowest concentration of premix gas at which detonation can occur.
As shown in fig. 2, the vacuum pipeline protection system of the present invention is suitable for an etching machine for preventing flammable gas from spontaneous combustion or explosion in a vacuum pipeline of the etching machine, and it should be noted that the vacuum pipeline protection system of the present invention can also be applied to vacuum pipelines of other machines, such as a reaction cavity of a furnace tube machine, a reaction cavity of an ion implantation machine, and a reaction cavity of a thin film preparation machine.
Fig. 2 shows a schematic diagram of the vacuum line protection system of the present invention, which comprises a reaction chamber 1, and a main pump 2, a backing pump 5 and a vacuum line 3 which are matched with the reaction chamber 1; the reaction cavity 1 is hermetically connected with the main pump 2, and first gas is contained in the reaction cavity 1; the main pump 2 is connected with the backing pump 5 through the vacuum pipeline 3; a first injection point 34 is arranged on the tube wall of the vacuum tube 3, and a second gas is injected into the vacuum tube 3 through the first injection point 34, so as to dilute the concentration of the first gas entering the vacuum tube 3 from the reaction chamber 1.
Specifically, the first gas comprises a combustible gas; and injecting the second gas into the vacuum pipeline through the first injection point, and diluting the concentration of the first gas entering the vacuum pipeline from the reaction cavity to be below the lower explosion limit of the first gas. The first gas may be a combustible vapor or a gas containing combustible dust, but is not limited thereto.
As an example, the first gas comprises one or a combination of hydroxysulfide, hydrogen sulfide, methane, and silane.
It should be noted that, for convenience of illustration, only one reaction chamber 1 is shown in fig. 2, and the vacuum line protection system of the present invention is also applicable to a plurality of reaction chambers.
As an example, the main pump 2 may employ a molecular pump; the backing pump 5 may be a Dry pump (Dry pump).
As shown in fig. 2, the first injection point 34 is connected to a gas supply source 11 through a gas supply line 8, and the gas supply source 11 is used for supplying the second gas; the second gas may be nitrogen or a rare gas.
In one embodiment, the exhaust of the backing pump 5 is connected directly to the exhaust gas treatment device 7.
In another embodiment, a second injection point 6 is provided in the conduit between the exhaust of the backing pump 5 and the exhaust gas treatment device 7, for example, the second injection point 6 is connected to the gas supply 11, and the gas supply 11 injects the second gas into the conduit through the second injection point 6 for further diluting the first gas pumped by the backing pump 5. It should be noted that the second injection point may also be connected to another inert gas supply 11 different from the second gas for further diluting the first gas pumped by the backing pump 5.
As shown in fig. 2, the vacuum pipeline 3 includes vacuum pipes 32 and sealing rings 33, each vacuum pipe 32 is connected in sequence, and two adjacent vacuum pipes 32 are connected in a sealing manner by the sealing rings 33; as an example, polytetrafluoroethylene having excellent chemical stability and corrosion resistance may be used as the material of the sealing ring 33.
As shown in fig. 2, the main pump 2 is hermetically connected with a connecting part 31 on the vacuum pipeline 3, and the connecting part 31 forms a connection part; the connecting part 31 comprises one or a combination of a plurality of corrugated pipes, rigid pipes and sealing rings; the rigid pipe is an inextensible pipe.
For safety reasons, an explosion-proof blanket is disposed on the outer circumference of the sealing ring 33 of the connecting member 31 and a part or all of the vacuum pipe 32 adjacent thereto. For example, as shown in fig. 2, in order to reduce damage caused by explosion due to leakage of the first gas from the connecting member 31, the outer wall of the connecting member 31 is provided with an explosion-proof blanket 4.
As shown in fig. 2, a heating device 311 is disposed between the outer wall of the connecting part 31 and the explosion-proof blanket 4 for heating the connecting part 31, so as to prevent the process product in the reaction chamber 3 from adhering to the vacuum pipeline 3 and causing contamination and blockage of the vacuum pipeline.
As shown in fig. 2, in order to further reduce the risk of explosion of the first gas in the vacuum pipeline 3 when the vacuum pipeline 3 flows, the first injection point 34 is disposed on the wall of the vacuum pipeline 3 near the end of the connecting component 31, and is used for reducing the concentration of the first gas in the vacuum pipeline 3 below the lower explosion limit at a position near the exhaust port of the main pump 2.
Further, for more accurate and controllable adjustment of the diluted concentration of the first gas in the vacuum line, as shown in fig. 3, a gas flow meter 81 may be provided on the gas supply pipe 8 between the first injection point and the gas supply source 11 for controlling the injection flow rate of the second gas injected into the vacuum line 3 through the first injection point 34.
It should be noted that the gas flow meter 81 can adopt an electronic gas flow meter 811 and a mechanical gas flow meter 812, wherein the electronic gas flow meter 811 can transmit the flow value to a system (such as a receiving and monitoring system FDC mentioned below) in real time to realize real-time monitoring, and the flow control precision is high; the mechanical gas flow meter 812 cannot transmit the flow value to the system and the flow control error is large. There are two different embodiments, depending on the gas meter used, and the details are given below.
Fig. 4 shows a schematic diagram of a first embodiment of the vacuum line protection system according to the present invention, wherein an electronic gas flow meter 811 is arranged on the gas supply conduit 8 between the first injection point 34 and the gas supply source 11 for controlling the flow rate of the second gas injected into the vacuum line 3 through the first injection point 34. The electronic gas flowmeter 811 is connected to the first console 91 in a wired or wireless manner, and the first console 91 monitors and adjusts the flow rate of the second gas injected into the vacuum pipeline 3 through the first injection point 34 in real time by receiving the flow rate value transmitted by the electronic gas flowmeter 811, and controls the etching machine to stop when the flow rate of the second gas is abnormal.
In an embodiment, the first console 91 can adjust the injection flow rate of the second gas into the vacuum pipeline 3 through the first injection point 34 by a regulating valve of the electronic gas flowmeter.
In another embodiment, a flow-driven solenoid valve connected to the first console 91 may be disposed on the gas supply pipeline, and the injection flow rate of the second gas into the vacuum pipeline 3 through the first injection point 34 may be adjusted by the flow-driven solenoid valve.
In one embodiment, as shown in fig. 4, in order to prevent the combustible material in the vacuum line 3 from flowing back into the gas supply source 11 and causing the second gas in the gas supply source 11 to be contaminated, a check valve 84 is disposed on the gas supply pipe 8 between the first injection point 34 and the gas supply source 11.
As shown in fig. 4, in an embodiment, at least one of a ball valve 82, a pressure reducing valve 83, and a pressure gauge 85 (not shown in fig. 3, see fig. 5) is disposed on the gas supply pipe 8 between the first injection point and the gas supply source 11; the ball valve 82 is used to open or shut off the supply of the second gas, the pressure reducing valve 83 is used to adjust the flow rate of the second gas injected into the vacuum line 3 through the first injection point, and the pressure gauge 85 is used to display the pressure in the gas supply line 8 in the line.
It should be noted that the check valve 84, the ball valve 82, and the pressure reducing valve 83 are connected in series in the air supply pipeline 8, and the pressure gauge 85 is installed on a pipe wall on one side in the air supply pipeline 8.
A ball valve (not shown), a pressure reducing valve (not shown), a pressure gauge (not shown), a check valve (not shown), and a gas flow meter (not shown) may be provided in the gas supply line 8 between the second injection point 6 and the gas supply source.
Fig. 5 shows a schematic view of a second embodiment of the vacuum line protection system of the present invention, which employs the mechanical gas flow meter 812, in a substantially similar configuration, as compared to the first embodiment of fig. 3. Since the mechanical gas flowmeter 812 cannot transmit the flow value to the corresponding system to realize real-time monitoring, once the flow of the second gas injected into the vacuum pipeline 3 through the first injection point 34 is abnormal (for example, the gas supply of the gas supply source 11 is insufficient), effective early warning cannot be realized, and there is still a risk that the combustible gas in the vacuum pipeline 3 explodes.
For this reason, the gas supply state of the gas supply source 11 can be detected to give an early warning, and explosion of the combustible gas in the vacuum pipeline 3 caused by insufficient gas supply of the gas supply source 11 can be avoided. Specifically, as shown in fig. 5, a flow rate monitoring module 10 is connected to the gas supply source 11 for monitoring whether the gas supply of the gas supply source 11 is abnormal, and the flow rate monitoring module 10 is connected to a second console 92 for controlling the shutdown of the machine to which the reaction chamber 1 belongs when the gas supply of the gas supply source 11 is abnormal.
Specifically, the flow monitoring module 10 includes an alarm device (not shown) for giving an alarm when the gas supply of the gas supply source 11 is abnormal and triggering the second console 92 to control the machine station to which the reaction chamber belongs to stop.
It should be noted that, in the conventional etching machine, the flow rate monitoring module 10 for monitoring whether the gas supply of the gas supply source 11 is abnormal is generally installed in the original factory design, and therefore, the flow rate monitoring module 10 can be directly used without being specially installed. For example, there is in the reaction chamber 1 of etching board with the wafer temporary storage area that gas supply source 11 links to each other, gas supply source 11 is used for wafer temporary storage area air feed, have being used for the control that is taken oneself in the original factory design of wafer temporary storage area gas supply source 11's flow monitoring module 10, and the flow monitoring module 10 of wafer temporary storage area is connected with host computer control computer UPC (second control cabinet 92), when the flow monitoring module 10 of wafer temporary storage area detects that the air feed of gas supply source 11 appears unusually, sends alarm signal for host computer control computer UPC, control etching board and shut down.
The vacuum pipeline protection system is also suitable for a plurality of reaction cavities 1 of the same etching machine and a plurality of reaction cavities 1 of a plurality of etching machines, a first injection point 34 is respectively arranged in the vacuum pipeline 3 matched with each reaction cavity 1, second gas with certain flow is respectively introduced into each vacuum pipeline 3 according to the property of the first gas in each vacuum pipeline 3, and the concentration of the first gas in each vacuum pipeline 3 is diluted to be below the lower explosion limit of the first gas.
As an example, a gas injection method as shown in fig. 6 may be adopted, wherein the gas supply source 11 supplies gas to the equipment source and the vacuum pipeline 3, respectively, and a check valve 84 is disposed between the gas supply pipeline 8 supplying gas to the equipment source and the gas supply pipeline 8 supplying gas to the vacuum pipeline 3, and is used for preventing the first gas in the vacuum pipeline 3 from flowing backwards to pollute the gas supply to the equipment source. Fig. 6 shows that 3 equipment sources and 5 vacuum lines 3 are supplied with gas, respectively, although the number of equipment sources and vacuum lines 3 may be varied at will; the five pipelines in fig. 6 are respectively connected to the first injection points on the vacuum pipelines matched with the five reaction cavities, and the five reaction cavities may belong to five reaction cavities of one etching machine or five reaction cavities of a plurality of etching machines.
As shown in fig. 7, the present invention further provides a vacuum pipeline protection method, where the vacuum pipeline 3 is connected to a main pump 2 and a backing pump 5, respectively, the main pump 1 is connected to a reaction chamber 1, and a first gas is contained in the reaction chamber 1, the method includes the following steps:
step S10 is executed to set a first injection point 34 on the tube wall of the vacuum tube 3.
Step S20 is performed to inject a second gas into the vacuum line 3 through the first injection point 34 to dilute the first gas concentration entering the vacuum line 3 from the reaction chamber 1.
In one embodiment, the first gas comprises a combustible gas; the concentration of the first gas in the vacuum line 3 diluted with the second gas is below its lower explosive limit. Of course, the first gas may also be a combustible vapor or a gas containing combustible dust, but not limited thereto.
As an example, the first gas comprises one or a combination of carbonyl sulfide, hydrogen sulfide, methane, and silane.
It should be noted that the injection flow rate of the first gas injected into the vacuum pipeline 3 needs to be considered comprehensively according to the amount of the first gas in the vacuum pipeline 3, the size of the space of the vacuum pipeline 3, the laminar exhaust flow, the control accuracy of the injection flow rate, and other factors, and the injection flow rate is too large, which easily causes damage to the main pump 2 or causes instability of the vacuum degree in the reaction chamber 1, which affects the related quality performance of the product, and the injection flow rate is too small, which easily causes the concentration of the first gas in the vacuum pipeline 3 to be higher than the lower explosion limit due to fluctuation of the injection flow rate, thereby causing a risk of explosion.
Specifically, the second gas is supplied by a gas supply source 11, and the second gas includes nitrogen or a rare gas.
In one embodiment, the method further comprises preventing backflow of the first gas in the vacuum line 3 to the gas supply source 11 by a check valve 84 disposed between the first injection point 34 and the gas supply source 11.
In an embodiment, the method further comprises controlling an injection flow of the second gas into the vacuum line 3 by means of a gas flow meter 81 arranged between the first injection point 34 and the gas supply source 11. It should be noted that the gas flow meter 81 can adopt an electronic gas flow meter 811 and a mechanical gas flow meter 812, wherein the electronic gas flow meter 811 can transmit the flow value to a system (such as a receiving and monitoring system FDC mentioned below) in real time to realize real-time monitoring, and the flow control precision is high; the mechanical gas flow meter 812 cannot transmit the flow value to the system and the flow control error is large.
In an embodiment, in step S20, the method further includes that the first console 91 monitors and adjusts the injection flow rate of the second gas injected into the vacuum pipeline in real time by receiving flow data of the electronic gas flow meter 811, and when the injection flow rate of the second gas is abnormal, the first console controls the machine station to which the reaction chamber belongs to be shut down. Monitoring and adjusting the flow rate of the second gas injected into the vacuum pipeline 3 through the first injection point 34 in real time, and when the flow rate of the second gas injected into the vacuum pipeline 3 through the first injection point 34 is abnormal, controlling the machine station to which the reaction chamber 1 belongs to be stopped by the first console 91, which corresponds to the first embodiment shown in fig. 4.
In step S20, the method further includes monitoring whether the gas supply from the gas supply source 11 is abnormal, and when the gas supply from the gas supply source 11 is abnormal, the second console 92 receives the abnormal signal and controls the machine station to which the reaction chamber 1 belongs to stop, which corresponds to the second embodiment shown in fig. 5.
Step S30 is executed to perform an off-gas treatment on the combustible gas pumped out by the backing pump 5.
Further dilution of the combustible gas withdrawn by the backing pump 5 with the second gas is included prior to treatment of the exhaust gas.
In order to control the cost, the sum of the flow rate of the second gas injected into the vacuum line and the flow rate of the second gas injected into the line between the exhaust port of the backing pump and the exhaust gas treatment device is a constant value.
It should be noted that the connecting part 31 of the vacuum line 3 is hermetically connected to the main pump 2. In order to further reduce the risk of explosion of the first gas in the vacuum line 3 when the vacuum line 3 flows, the first injection point 34 is disposed on the wall of the vacuum line 3 near the end of the connecting member 31, and is used for reducing the concentration of the first gas in the vacuum line 3 below the lower explosion limit at a position near the exhaust port of the main pump 2.
It should be noted that, for safety, the vacuum pipeline protection method of the present invention may also include disposing an explosion-proof blanket (sealing ring) on the sealing ring 33 and the outer circumference of part or all of the adjacent vacuum pipeline 32, and disposing an explosion-proof blanket 4, and adopting a dual protection technology of active protection and passive protection. For example, in order to reduce damage caused by an explosion due to leakage of the first gas from the connecting member 31, the outer wall of the connecting member 31 is provided with an explosion-proof blanket 4.
In order to prevent the process products in the reaction chamber 3 from adhering to the tube wall of the vacuum tube 3 and causing contamination and blockage of the vacuum tube 3, a heating device 311 is disposed between the outer wall of the connecting member 31 and the explosion-proof blanket 4 for heating the connecting member 31, so that the process products are not easily adhered to the tube wall of the vacuum tube 3.
It should be noted that the vacuum pipeline protection method of the present invention can be applied to the vacuum pipeline protection of multiple reaction chambers of one machine or the vacuum pipeline protection of multiple reaction chambers of multiple machines.
The present invention will be described below with reference to specific examples and comparative examples.
With the currently known silicon dioxide DRY etching (OX DRY ETCH) station in the semiconductor manufacturing process, the estimated value of the concentration of the COS gas of hydroxy sulfur in the vacuum line 3 before dilution in the existing semiconductor manufacturing process is 13.15% (the auto-ignition or explosion concentration of the COS gas of hydroxy sulfur is about 11.9% -29%) as shown in table 1, which means that there is a safety risk of reaching auto-ignition or explosion between the molecular pump (Turbo pump) and the vacuum line 3 of the DRY pump (DRY pump).
TABLE 1 prediction of COS concentration in undiluted vacuum line
Gas (es) Flow rate
Oxygen pumped by main pump 175
Nitrogen gas pumped out by main pump 10
Hydroxy sulphur pumped by main pump 28
Mixed gas of vacuum pipeline 213
Concentration of hydroxysulfide in vacuum line 13.15％
Example 1
The vacuum pipeline protection system adopting the first embodiment as shown in fig. 4 adopts an electronic gas flowmeter 811, wherein the electronic gas flowmeter 811 has the function of a common mechanical gas flowmeter 812, and has the characteristics that ① the electronic gas flowmeter 811 is compatible with a receiving value and monitoring system FDC (first console 91) in a factory and can perform data interaction, the numerical value of nitrogen flow can be transmitted to the receiving value and monitoring system FDC in real time, the receiving value and monitoring system FDC can monitor the nitrogen flow in real time, when the nitrogen flow is abnormal, the receiving value and monitoring system FDC immediately controls an etching machine to stop through a host console control computer connected with the receiving value and monitoring system FDC, so that the product quality is prevented from being influenced or dangerous accidents occur, and ② the electronic gas flowmeter 811 controls the flow more accurately and can control the flow in real time compared with the common gas flowmeter 81.
Table 2 predicted value of COS concentration in vacuum line after dilution in the first embodiment
Figure BDA0001789911120000131
Figure BDA0001789911120000141
The electronic gas flow meter 811 controls the flow rate of the nitrogen injected into the vacuum pipeline through the first injection point 34 to be 500sccm (first set flow rate), the concentration predicted value of the COS of the hydroxyl sulfur in the vacuum pipeline after dilution is 3.9% as shown in table 2, and the value is lower than the lower explosion limit of the COS gas of the hydroxyl sulfur, so that spontaneous combustion or explosion in the vacuum pipeline interval can be avoided; as an example, the upper threshold of the nitrogen flow is set to be 550sccm, the lower threshold is set to be 450sccm, the upper threshold and the lower threshold are set to receive and judge the nitrogen flow uploaded by the electronic gas flow meter 811 in real time, and if the nitrogen flow is not within the threshold, the etching machine is controlled to stop. The diluted COS gas is pumped out by a backing pump 5, and 39500sccm (second set flow rate) of nitrogen is introduced into the pipeline between the exhaust port of the backing pump 5 and the exhaust gas treatment device 7 through the second injection point 6 for further dilution, after dilution, the pre-estimated value of the COS concentration of the hydroxyl sulfur in the second injection point 6 is 0.07% as shown in table 3, and then the COS concentration is introduced into the exhaust gas treatment device 7 for treatment, the sum of the first set flow rate and the second set flow rate is 40000sccm, and of course, the first set flow rate and the second set flow rate can be optimized and adjusted according to actual conditions, and the non-uniform list is limited herein.
It should be noted that, in the present embodiment, only one explosion proof blanket 4 needs to be installed at the connecting member 31.
Table 3 predicted COS concentration value at second injection point after dilution in the first embodiment
Gas (es) Flow rate (sccm)
Oxygen pumped by main pump 175
Nitrogen gas pumped out by main pump 10
Hydroxy sulphur pumped by main pump 28
Nitrogen gas of the first injection point 500
Nitrogen gas injected in the second injection point 39500
Mixed gas in the second injection point 40213
Concentration of hydroxysulfide in the second injection point 0.07％
Example 2
In the vacuum pipeline protection system according to the second embodiment shown in fig. 5, a mechanical gas flowmeter 812 is selected, the mechanical gas flowmeter 812 cannot transmit a flow value to the monitoring platform, the flow control is not accurate as compared with the first gas flowmeter 81, and the flow of the introduced nitrogen needs to be increased for safety.
For example, the flow rate of the COS gas of the hydroxyl sulfur in the reaction chamber 1 of the etching machine is controlled by the electronic gas flow meter 811 to be 1000-; since the flow rate of the introduced nitrogen gas cannot be monitored in real time, the amount of the nitrogen gas injected into the vacuum line 3 is likely to be abnormal due to the abnormal gas supply from the gas supply source 11, and when the gas supply from the gas supply source is insufficient, the COS gas concentration of the hydroxysulfide in the vacuum line 3 is higher than the lower explosion limit thereof, which poses the risk of explosion and spontaneous combustion. In order to solve the problem, the flow monitoring module 10 provided in the wafer buffer of the etching tool reaction chamber is used to detect whether the gas supply of the gas supply source 11 is abnormal, because the gas supply source 11 is also used to provide nitrogen gas as the second gas for the wafer buffer, so that detecting whether the second gas supply in the wafer buffer is abnormal can reflect whether the gas supply of the gas supply source 11 is abnormal; the flow monitoring module 10 of the wafer temporary storage area is connected to a host computer UPC (second control board 92), and when the flow monitoring module 10 of the wafer temporary storage area detects that the gas supply of the gas supply source 11 is abnormal, the host computer UPC controls the etching machine to stop. The diluted COS gas is pumped out by a backing pump 5, nitrogen of 38000 and 39000sccm (second set flow rate) is introduced into a pipeline between an exhaust port of the backing pump 5 and the tail gas treatment device 7 through the second injection point 6 for further dilution, the estimated concentration value of the COS gas of the diluted COS gas of the hydroxyl sulfur in the second injection point 6 is 0.07 percent as shown in table 5, and then the COS gas of the hydroxyl sulfur is introduced into the tail gas treatment device 7 for treatment, wherein the first set flow rate and the second set flow rate are maintained at 40000 sccm.
It should be noted that, the flow rate monitoring module 10 of the etching machine may be selected to directly monitor whether the gas supply from the gas supply source 11 is abnormal, so as to detect whether the gas supply from the gas supply source 11 is abnormal, which is not limited to the embodiment.
It should be noted that, in the present embodiment, only one explosion proof blanket 4 needs to be installed at the connecting member 31.
TABLE 4 estimated COS concentration in vacuum line after dilution in the second embodiment
Gas (es) Flow rate (sccm)
Oxygen pumped by main pump 175
Nitrogen gas pumped out by main pump 10
Hydroxy sulphur pumped by main pump 28
First injection point nitrogen gas 1000-2000
Mixed gas in vacuum pipeline 1213-2213
Concentration of hydroxysulfide in vacuum line 1.27％-2.31％
TABLE 5 estimated COS concentration at the diluted second injection point in the second embodiment
Figure BDA0001789911120000151
Figure BDA0001789911120000161
Comparative example 1
A vacuum line protection system as shown in figure 1 is employed. In the prior art corresponding to fig. 1 (detailed description in the background section), in order to prevent spontaneous combustion and explosion in the vacuum pipeline section, a perfluoro ring seal ring is used to prevent gas leakage in the vacuum pipeline to reduce the risk, and an explosion-proof blanket is installed at the outer surface of the connecting part connecting the main pump and the vacuum pipeline and the connecting part of each vacuum pipeline to reduce the loss caused by accidents
In comparative example 1, 7 explosion-proof blankets need to be installed, while in examples 1 and 2, only one explosion-proof blanket is needed, which is equivalent to six explosion-proof blankets, the price of each explosion-proof blanket is $ 2100, the cost saved by the vacuum pipeline matched with each reaction chamber is shown in table 6, and in a production workshop, a plurality of etching machines are included, and each etching machine comprises a plurality of reaction chambers, so that the cost is greatly saved.
Table 6 cost comparison of examples 1 and 2 with prior art solutions
Figure BDA0001789911120000162
In summary, the present invention provides a vacuum pipeline protection system and method, the vacuum pipeline protection system includes a reaction chamber, a main pump, a backing pump and a vacuum pipeline, wherein the main pump, the backing pump and the vacuum pipeline are matched with the reaction chamber; the reaction cavity is hermetically connected with the main pump, and first gas is contained in the reaction cavity; the main pump is connected with the backing pump through the vacuum pipeline; wherein, be provided with a first injection point on the pipe wall of vacuum pipeline, second gas is poured into in the vacuum pipeline through the first injection point for dilute to its explosion lower limit the concentration of drawing into in the vacuum pipeline from the reaction chamber. According to the system and the method, the first injection point is arranged on the pipe wall of the vacuum pipeline, the second gas is injected into the vacuum pipeline through the first injection point, the concentration of the first gas pumped into the vacuum pipeline from the reaction cavity is diluted to be below the lower explosion limit of the first gas, the explosion risk of the vacuum pipeline is reduced, and the safety of personnel and machines is ensured; compared with the prior art, the number of the explosion-proof blankets arranged on the vacuum pipeline can be reduced, so that the cost for installing the explosion-proof blankets is saved, later-stage high-altitude maintenance operation can be avoided, the maintenance is easy, and the safety of later-stage maintenance personnel is ensured; the flow rate of the second gas injected into the vacuum pipeline through the first injection point is controlled by introducing a gas flow meter between a gas supply source and the first injection point, so that the diluted concentration of the first gas in the vacuum pipeline can be more accurately and controllably adjusted; whether the gas supply of the gas supply source is abnormal or whether the flow of the second gas injected into the vacuum pipeline is abnormal is monitored, when the abnormality occurs, the console controls the machine table to which the reaction cavity belongs to be shut down, and the risk of explosion of the vacuum pipeline is avoided. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (18)

1. A vacuum line protection system, comprising:
the device comprises a reaction cavity, a main pump, a backing pump and a vacuum pipeline, wherein the main pump, the backing pump and the vacuum pipeline are matched with the reaction cavity;
the reaction cavity is hermetically connected with the main pump, and a first gas is contained in the reaction cavity;
the main pump is connected with the backing pump through the vacuum pipeline;
the tube wall of the vacuum pipeline is provided with a first injection point, and second gas is injected into the vacuum pipeline through the first injection point and is used for diluting the concentration of the first gas entering the vacuum pipeline from the reaction cavity.
2. The vacuum line guard system of claim 1, wherein the first gas comprises a combustible gas.
3. The vacuum line guard system of claim 2, wherein the concentration of the first gas in the vacuum line diluted with the second gas is below its lower explosive limit.
4. The vacuum line guard system of claim 1 wherein the first injection point is connected to a gas supply source with a gas flow meter disposed therebetween.
5. The vacuum pipeline protection system according to claim 4, further comprising a first console connected to the gas flow meter, for monitoring and adjusting the injection flow rate of the second gas injected into the vacuum pipeline through the first injection point in real time, and controlling the machine station to which the reaction chamber belongs to stop when the injection flow rate of the second gas is abnormal.
6. The vacuum line protection system of claim 4, further comprising a flow monitoring module and a second console, wherein the flow monitoring module is connected to the second console and the gas supply source respectively, for monitoring whether the gas supply from the gas supply source is abnormal; and the second control console is used for controlling the machine station to which the reaction cavity belongs to stop when the gas supply of the gas supply source is abnormal.
7. The vacuum line protection system of claim 1, wherein the vacuum line comprises vacuum pipes and sealing rings, and two adjacent vacuum pipes are connected in a sealing manner through the sealing rings; and explosion-proof blankets are arranged on the sealing rings and the partial or whole peripheral parts of the vacuum pipelines adjacent to the sealing rings.
8. The vacuum line guard system of claim 1, wherein the exhaust port of the backing pump is coupled to an exhaust gas treatment device, and a second injection point is disposed in a conduit between the exhaust port of the backing pump and the exhaust gas treatment device, wherein the second gas is injected into the conduit through the second injection point to further dilute the first gas pumped by the backing pump.
9. The vacuum line guard system of claim 1 wherein said first injection point is located on a wall of said vacuum line at an end thereof proximate said main pump.
10. The vacuum line protection system of any one of claims 1-9, wherein the vacuum line protection system is applied to a plurality of reaction chambers of one machine or a plurality of reaction chambers of a plurality of machines.
11. A vacuum pipeline protection method is characterized in that a vacuum pipeline is respectively connected with a main pump and a backing pump, the main pump is connected with a reaction cavity, and a first gas is contained in the reaction cavity, and the method comprises the following steps:
arranging a first injection point of a second gas on the pipe wall of the vacuum pipeline;
and injecting a second gas into the vacuum pipeline through the first injection point, wherein the second gas is used for diluting the concentration of the first gas entering the vacuum pipeline from the reaction cavity.
12. The vacuum line protection method of claim 11, wherein the first gas comprises a combustible gas; the concentration of the first gas in the vacuum line diluted by the second gas is lower than the lower explosion limit thereof.
13. The vacuum line protection method of claim 11, wherein the injection flow rate of the second gas into the vacuum line is controlled by a gas flow meter disposed between the first injection point and a gas supply source of the second gas.
14. The vacuum line protection method of claim 13, further comprising:
the first control console receives flow data of the gas flowmeter to monitor and adjust the injection flow of the second gas injected into the vacuum pipeline in real time, and when the injection flow of the second gas is abnormal, the first control console controls the machine station to which the reaction cavity belongs to stop.
15. The vacuum line protection method of claim 13, further comprising:
monitoring whether the gas supply of the gas supply source of the second gas is abnormal or not through a flow monitoring module, and triggering an alarm device when the gas supply of the gas supply source is abnormal; and the second control console controls the machine table to which the reaction cavity belongs to stop.
16. The vacuum line protection method of claim 11, further comprising:
an exhaust port of the backing pump is connected with an exhaust gas treatment device, and the second gas is injected into the pipeline through a second injection point arranged on the pipeline between the exhaust port of the backing pump and the exhaust gas treatment device to further dilute the first gas in the pipeline;
and introducing the first gas which is further diluted into a tail gas treatment device for tail gas treatment.
17. The vacuum line protection method according to claim 11, wherein the vacuum line comprises vacuum pipes and sealing rings, and two adjacent vacuum pipes are connected in a sealing manner through the sealing rings; and explosion-proof blankets are arranged on the sealing rings and the partial or whole peripheral parts of the vacuum pipelines adjacent to the sealing rings.
18. The vacuum line protection method according to any one of claims 11-17, wherein the vacuum line protection method is applied to a plurality of reaction chambers of one machine or a plurality of reaction chambers of a plurality of machines.
CN201811031683.1A 2018-09-05 2018-09-05 Vacuum pipeline protection system and method Pending CN110880459A (en)

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