CN110858514A

CN110858514A - Reflective capacitor

Info

Publication number: CN110858514A
Application number: CN201810974830.2A
Authority: CN
Inventors: 叶盛松; 陆美
Original assignee: Nantong Sancon Electronic Technology Corp
Current assignee: Nantong Sancon Electronic Technology Corp
Priority date: 2018-08-24
Filing date: 2018-08-24
Publication date: 2020-03-03

Abstract

The embodiment of the application discloses reflection of light condenser, including capacitor body and reflection of light sleeve pipe, reflection of light sleeve pipe cover is established capacitor body is outside. The light reflecting sleeve may contain a light reflecting material, and the light reflecting material may include at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate and titanium dioxide. This application makes the condenser surface have the reflection of light function through set up the reflection of light sleeve pipe in the capacitor body outside to can reduce luminous flux's decay when making the condenser use in luminescent device.

Description

Reflective capacitor

Technical Field

The application relates to the field of capacitors, in particular to a reflective capacitor.

Background

A capacitor is generally mounted in a light emitting device (e.g., an LED lamp). The capacitor may act as a filter, decoupling and/or compensation, etc.

Disclosure of Invention

The application provides a reflective capacitor can make the condenser surface have the reflection of light function through setting up condenser reflection of light sleeve pipe to can reduce the decay of luminescent device luminous flux when making the condenser use in luminescent device.

One of the embodiments of the present application provides a reflective capacitor, including capacitor body and reflection of light sleeve pipe, reflection of light sleeve pipe cover is established capacitor body is outside.

In some embodiments, the light reflecting sleeve comprises a light reflecting material, and the light reflecting material comprises at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate and titanium dioxide.

In some embodiments, the reflective sleeve comprises a glass bead reflective material, the diameter of the glass bead is 30um to 50um, and the refractive index of the glass bead is 1.9 to 1.95.

In some embodiments, the reflective sleeve includes a sleeve body and a reflective layer wrapped around the sleeve body.

In some embodiments, the light-reflective layer is a light-reflective coating comprising at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.

In some embodiments, the light reflecting layer is a light reflecting outer cover comprising at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.

In some embodiments, the reflective sleeve comprises polyvinyl chloride or polyethylene terephthalate.

In some embodiments, the reflective sleeve has a reflective mark on its outer surface.

In some embodiments, the capacitor is a card capacitor or a chip capacitor.

One of the embodiments of the present application provides a condenser reflection of light sleeve, reflection of light sleeve cover is established at the condenser body outside, contain reflecting material in the reflection of light sleeve, reflecting material includes at least one in the following material: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.

Drawings

The present application will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

fig. 1 is a schematic structural diagram of a patch capacitor according to some embodiments of the present application;

FIG. 2 is a schematic diagram of a construction of a card capacitor according to some embodiments of the present application;

FIG. 3 is a schematic cross-sectional view of a reflective capacitor according to some embodiments of the present application;

FIG. 4 is a schematic cross-sectional view of a reflective capacitor according to another embodiment of the present application;

FIG. 5 is a schematic diagram of a capacitor identification shown in accordance with some embodiments of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

On the contrary, this application is intended to cover any alternatives, modifications, equivalents, and alternatives that may be included within the spirit and scope of the application as defined by the appended claims. Furthermore, in the following detailed description of the present application, certain specific details are set forth in order to provide a better understanding of the present application. It will be apparent to one skilled in the art that the present application may be practiced without these specific details.

The present application relates to a reflective capacitor that may be applied to various light emitting devices (e.g., LED lamps, etc.). For example, the light emitting mechanism of the light emitting device may include: photoluminescence, electroluminescence, radioluminescence, chemiluminescence, bioluminescence, sonoluminescence, photothermal luminescence, triboluminescence, hydroluminescence, radioluminescence, crystallography, electroluminesence, and the like, or any combination thereof. Specifically, the Light Emitting device may include a Light Emitting Diode (LED), a semiconductor Laser (LD), a gas Laser, a solid Laser, an electron beam display device, a liquid crystal display device, a plasma display device, or the like, or any combination thereof. Specifically, the Light Emitting Diode may include a semiconductor Light Emitting Diode, an Organic Light-Emitting Diode (OLED), a photodiode, a point contact type Diode, a surface contact type Diode, a planar type Diode, or the like, or any combination thereof. The semiconductor lasers may include heterostructure lasers, stripe structure lasers, GaAIAs/GaAs lasers, InGaAsP/InP lasers, visible light lasers, far infrared lasers, dynamic single mode lasers, distributed feedback lasers, quantum well lasers, surface emitting lasers, microcavity lasers, and the like, or any combination thereof. The gas lasers may include atomic gas lasers, ionic gas lasers, molecular gas lasers, excimer lasers, and the like, or any combination thereof. The plasma device may include an ac type plasma display panel, a dc type plasma display panel, or the like, or a combination thereof.

In some embodiments, the reflective capacitor may involve multiple capacitor types. For example, the reflective capacitor may be a chip capacitor and/or a card capacitor. The patch capacitor may include a patch ceramic capacitor, a patch tantalum capacitor, a patch aluminum electrolytic capacitor, or any combination thereof. The interposer capacitors may include interposer aluminum electrolytic capacitors, interposer tantalum electrolytic capacitors, polyester film capacitors, polypropylene film capacitors, mica capacitors, ceramic capacitors, multilayer ceramic capacitors, polystyrene capacitors, metalized film (polyester and polypropylene) capacitors, supercapacitors, tunable capacitors, and the like, or any combination thereof. In some embodiments, the reflective capacitor may be installed on a control board of the light emitting device (e.g., an LED lamp), when the light source (e.g., an LED lamp bead) emits light, the light of the light source or the reflected light (e.g., reflected by a lampshade) may irradiate onto the reflective capacitor, and the reflective capacitor may reflect most of the light irradiated onto the reflective capacitor, so that the light (luminous flux) emitted from the light emitting device is not attenuated too much due to the light absorption of the capacitor.

Fig. 1 is a schematic diagram of a patch capacitor according to some embodiments of the present application. Fig. 2 is a schematic diagram of a structure of a card capacitor according to some embodiments of the present application. As shown in fig. 1-2, a capacitor (e.g., the chip capacitor 100, the plug-in capacitor 200, etc.) may include a capacitor body (e.g., the chip capacitor body 110, the plug-in capacitor body 210, etc.) and a sleeve (e.g., the chip capacitor sleeve 120, the plug-in capacitor sleeve 220, etc.), which is disposed outside the capacitor body. In some embodiments, the capacitor body may include one or more of two metal electrodes, an insulating dielectric, an electrolytic paper, an electrolyte, a conductive foil, a tape, a cover plate, a lead, a gasket, a ceramic sheet, a barrier layer, a dielectric material, a terminal, an adhesive, a dielectric film, a protective film, and the like. Specifically, the capacitor body may be a part of any existing capacitor without a bushing, and the present application does not limit the part. For the reflective capacitor, the sleeve sleeved outside the capacitor body can be set as a reflective sleeve.

FIG. 3 is a schematic cross-sectional view of a reflective capacitor according to some embodiments of the present application. As shown in fig. 3, the reflective capacitor may include a capacitor body 310 and a reflective sleeve 320. In this embodiment, the reflective sleeve 320 may include a reflective material therein. Specifically, when light emitted from the light source in the light emitting device irradiates an insulating sleeve (such as PVC or PET material) on the surface of a conventional capacitor (non-reflective capacitor), a substantial portion of the light is absorbed by the insulating sleeve, resulting in less light reflected by the surface of the sleeve (e.g., a light reflection rate of 10% to 40%), thereby reducing the luminance (or luminous flux, which is positively correlated with the light emitted from the light emitting device). The application adds the reflective material (such as glass beads) to the insulating sleeve to form the reflective sleeve 320, and when light irradiates the surface of the capacitor, the light reflection (for example, the reflective rate is 70% -95%) can be enhanced through the reflective sleeve 320, and then the brightness of the light-emitting device can be ensured.

In some embodiments, the reflective material in the reflective sleeve may include one or a combination of glass bead reflective material, microprismatic reflective material, micro-foamed reflective plate (MCPET), titanium dioxide, and the like. Specifically, the glass bead reflective material may include solid glass beads and/or hollow glass beads. In some embodiments, the glass microspheres may have a diameter of 10 to 300 um. Preferably, the glass beads may have a diameter of 30 to 50 um. In some embodiments, the glass microspheres may have a refractive index of 1.8 to 2.14. Preferably, the refractive index of the glass beads may be 1.9 to 1.95. In some alternative embodiments, the reflective material in the reflective sleeve may also include particulate materials such as any combination of one or more of zinc oxide, zinc sulfide, zinc phosphate, calcium carbonate, aluminum oxide, silicon dioxide, silicon nitride, antimony oxide, barium sulfate, lithopone (a co-precipitate of barium sulfate and zinc oxide), calcined kaolin, lead carbonate, magnesium oxide, and the like.

In some embodiments, the sleeve material (i.e., the body material of the sleeve) may be made of polyvinyl chloride (PVC) and/or Polyethylene terephthalate (PET) materials. For example, glass bead reflective material, microprismatic reflective material, titanium dioxide and/or other particulate material may be added to the sleeve material (PVC and/or PET).

In some embodiments, the light reflecting material may be dispersed in the sleeve material by blending, intercalation, in-situ polymerization, and the like. Specifically, the blending method may be performed by adding a reflective material (e.g., glass beads, etc.) to a sleeve material (e.g., PVC and/or PET) in a molten state and mixing uniformly, thereby obtaining a reflective sleeve material. The intercalation may include stirring, ultrasonics, etc. to cause the reflective material to enter into the molecular layers of the sleeve material (e.g., PVC and/or PET) from which the reflective sleeve material may be derived. The in situ polymerization process may include dispersing the retroreflective material in a casing material (e.g., PVC and/or PET) to provide a retroreflective casing material. It should be noted that, the person skilled in the art may also mix (or fuse) the reflective material with the casing material by any method available to obtain the reflective casing material, which is not limited in this application. In some embodiments, the mass ratio of the reflective sleeve material may be: 100 parts of sleeve material, 5-100 parts of reflecting material (such as glass bead reflecting material, microprism reflecting material and the like); for example, the mass ratio of the reflective sleeve material may be: 100 parts of sleeve material and 10-20 parts of reflective material. In some embodiments, the reflective sleeve material may further include one or more of a plasticizer, a heat stabilizer, a lubricant, a processing modifier, an impact modifier, a light stabilizer, a pigment, and the like, which is not limited in this application.

In some embodiments, the reflective sleeve may be made directly from a reflective material. For example, a micro-foamed reflective plate (MCPET), a reflective film, or the like may be used to form the reflective sleeve. Specifically, a reflective film, a reflective paint, or the like may be disposed on the surface of the capacitor body 310 by coating, pasting, electroplating, spraying, spin coating, inkjet printing, or the like.

Fig. 4 is a schematic cross-sectional view of a reflective capacitor according to another embodiment of the present application. As shown in fig. 4, the reflective capacitor may include a capacitor body 410 and a reflective sleeve 420. In this embodiment, the reflective sleeve 420 may include a sleeve body 422 and a reflective layer 424. In particular, the light reflecting layer 424 may be wrapped around the exterior of the sleeve body 422. In some embodiments, the sleeve body 422 may be made of polyvinyl chloride and/or polyethylene terephthalate materials.

In some embodiments, the light reflecting layer 424 may be a light reflecting coating. The reflective coating material can comprise one or more of glass bead reflective material, microprism reflective material, micro-foaming reflective plate, titanium dioxide, metal reflective material and the like in any combination. The metal light reflecting material may include one or more of silver (Ag), aluminum (Al), copper (Cu), gold (Au), platinum (Pt), zinc (Zn), tin (Sn), indium (In), and the like In any combination. In some embodiments, the light reflecting coating may also include a solvent blend, for example, the light reflecting coating material may be dispersed in the solvent blend to form the light reflecting coating. The mixed solvent may contain a binder, a curing agent, a catalyst, and the like, or a combination thereof. In some embodiments, the material weight ratio of the reflective coating may be: the weight parts of the reflective coating material are 10-60 parts, and the weight parts of the mixed solvent are 40-90 parts. In some embodiments, a reflective coating may be applied to the surface of the sleeve body 422 by coating, dipping, or the like. In some embodiments, the reflective coating may form a dry film thickness on the surface of the sleeve body 422 of 10-30 microns. In some embodiments, commercially available reflective coatings, such as reflective paint, may be directly used as the reflective coating.

In some embodiments, the light reflecting layer 424 may be a light reflecting outer cover. The reflecting outer cover material can comprise one or more of glass bead reflecting materials, microprism reflecting materials, micro-foaming reflecting plates, titanium dioxide, metal reflecting materials and the like in any combination. In some embodiments, the reflective outer cover may also be a reflective film. Specifically, a reflective cover (such as a reflective film) may be disposed on the outer surface of the sleeve body 422 by adhering, adsorbing, or the like.

FIG. 5 is a schematic diagram of a capacitor identification shown in accordance with some embodiments of the present application. As shown in fig. 5, the capacitor 100 may include a capacitor body 110 and a bushing 120. In some embodiments, the sleeve 120 may be a reflective sleeve or a non-reflective sleeve. In this embodiment, the outer surface of the sleeve 120 may also be provided with a mark 510 (e.g., "6.8 uf 400V" as shown in fig. 5). The indicia 510 may be used to indicate the symbol, material (or classification), packaging, capacitor parameters, brand, etc., or any combination thereof, of the capacitor. Specifically, the capacitor symbol may include C, CN, BC, TC, and the like. The material (or class) identification may include a home capacitive material identification, an imported capacitive material identification, and the like. The domestic capacitor mark can comprise nonpolar films such as A-tantalum electrolysis, B-polystyrene and the like, C-high frequency ceramics, D-aluminum electrolysis, E-other material electrolysis, G-alloy electrolysis, H-composite medium, I-glass glaze, J-metallized paper, polar organic films such as L-terylene and the like, N-niobium electrolysis, O-glass films, Q-paint films, T-low frequency ceramics, V-mica paper, Y-mica, Z-paper and the like. Import capacitance material identification can include CM (CB, DM) -mica capacitors, cl (clr) -non-solid tantalum electrolytic capacitors, CC (CK, CKB) -ceramic dielectric capacitors, cy (cyr) -glass glaze capacitors, CE (CV, NDS) -aluminum electrolytic capacitors, CA (CN, CP) -paper dielectric capacitors, CS (CSR, NDS) -solid tantalum electrolytic capacitors, ch (chr) -metallized paper dielectric containers, and the like. The packaging mode can include: sealed, unsealed, etc. The capacitor parameters may include: one or more of capacitance, rated voltage, withstand voltage, insulation resistance, loss, tolerance, temperature coefficient, frequency characteristics, and the like. For example, as indicated by "6.8 uf 400V" shown in fig. 5, it can be said that the capacitance of the capacitor is 6.8uf and the withstand voltage is 400V.

In this embodiment, the logo 510 may be a reflective logo. The material of the reflective mark may be any one of the reflective materials described in this application, and is not limited herein. Specifically, the material of the reflective marker may be identical or not identical to the reflective sleeve. In some embodiments, the marker 510 may be various colors or a combination of colors, e.g., gold, gray, black, brown, white, silver, red, etc. Specifically, the color of the indicator 510 may not be consistent with the color of the reflective sleeve. In some embodiments, the reflective mark may be disposed on the outer surface of the sleeve by printing, pasting, coating, spraying, spin coating, inkjet printing, or the like, and the application is not limited to the manner of disposing the reflective mark.

It should be noted that fig. 5 is only illustrated by using the patch capacitor 100 as an example, but those skilled in the art should understand that the reflective mark may also be applied to any other suitable capacitor (e.g., patch capacitor), and the application is not limited thereto. In addition, only a cylindrical capacitor is shown in the embodiments of the drawings in the application, and in practice, the external shape of the capacitor may further include: circular, tubular, laminated, monolithic, through, post, etc., as the present application does not limit.

In one embodiment, an LED lamp rated at 5 watts was used as the subject, and when a conventional capacitor (i.e., a non-reflective capacitor) was used, the luminous flux was measured to be 341 lumens (rounded); when a reflective capacitor (whose sleeve is made of glass beads as a reflective material) of the same parameters was used, the luminous flux was measured to be 347 lumens (rounded) under the same conditions. Under the same experimental conditions and experimental objects, the luminous flux of the light-emitting device (LED lamp) is improved by 1.8% by replacing the conventional capacitor with the reflective capacitor related to the embodiment of the application.

The beneficial effects that may be brought by the embodiments of the present application include, but are not limited to: (1) the outer surface of the capacitor has a light reflecting effect; (2) the absorption of the outer surface of the capacitor to light is reduced, and the brightness of the light-emitting device is ensured. It is to be noted that different embodiments may produce different advantages, and in different embodiments, any one or combination of the above advantages may be produced, or any other advantages may be obtained.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The reflective capacitor is characterized by comprising a capacitor body and a reflective sleeve, wherein the reflective sleeve is sleeved outside the capacitor body.

2. The reflective capacitor of claim 1, wherein the reflective sleeve comprises a reflective material, the reflective material comprising at least one of: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate and titanium dioxide.

3. The reflective capacitor of claim 1, wherein the reflective sleeve comprises a reflective material of glass beads, the diameter of the glass beads is 30-50 um, and the refractive index of the glass beads is 1.9-1.95.

4. The reflective capacitor of claim 1, wherein said reflective sleeve comprises a sleeve body and a reflective layer, said reflective layer being wrapped around the exterior of said sleeve body.

5. The reflective capacitor of claim 4, wherein said reflective layer is a reflective coating comprising at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.

6. The reflective capacitor of claim 4, wherein said reflective layer is a reflective coating comprising at least one of the following materials: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.

7. The reflective capacitor of claim 1 wherein said reflective sleeve comprises polyvinyl chloride or polyethylene terephthalate.

8. The reflective capacitor according to any one of claims 1 to 7, wherein a reflective mark is provided on an outer surface of the reflective sleeve.

9. The reflective capacitor according to any one of claims 1 to 7, wherein the reflective capacitor is a card type capacitor or a patch type capacitor.

10. The utility model provides a condenser reflection of light sleeve which characterized in that, reflection of light sleeve cover is established outside the capacitor body, contain reflecting material in the reflection of light sleeve, reflecting material includes at least one of following material: glass bead reflecting material, microprism reflecting material, micro-foaming reflecting plate, titanium dioxide and metal reflecting material.