CN110856369A - High-reliability hybrid circuit printed board and production method thereof - Google Patents
High-reliability hybrid circuit printed board and production method thereof Download PDFInfo
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- CN110856369A CN110856369A CN201911172876.3A CN201911172876A CN110856369A CN 110856369 A CN110856369 A CN 110856369A CN 201911172876 A CN201911172876 A CN 201911172876A CN 110856369 A CN110856369 A CN 110856369A
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- gold
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a high-reliability hybrid circuit printed board which is provided with a graphic circuit area, a chip mounting area and a green oil assembly welding area, wherein the graphic circuit area is composed of a brazing area and a gold-plating area, the brazing area is formed by bonding an insulating substrate layer, a copper layer and an OSP film layer which are sequentially arranged along the direction from bottom to top, and the gold-plating area is formed by bonding the insulating substrate layer, the copper layer and the gold-plating layer which are sequentially arranged along the direction from bottom to top. Also disclosed is a method for producing the printed board. The invention has the beneficial effects that: the thick gold plating in the non-welding area ensures the reliability of gold wire bonding, the soldering pad adopts OSP treatment, the solderable tin of the pad is ensured, and the welding end of the printed board has no gold plating layer, i.e. the soldering pad does not need to remove gold, the bonding process and the soldering process are completely compatible, and the method can be applied to high-reliability products; the method effectively solves the difficult point of gold removal process, reduces the consumption of gold, reduces the processing cost, and coats the welding end of the printed board with OSP.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a high-reliability mixed circuit printed board and a production method thereof.
Background
Gold is widely used in the electronics industry because of its series of advantages such as good chemical stability, difficult oxidation, good weldability, wear resistance, good conductivity and small contact resistance. The gold plating of the printed board is a good surface treatment mode, but a certain reliability risk problem exists in the welding process, namely the phenomenon of 'gold brittleness'. The high-reliability mixed printed circuit board relates to mixed assembly processes such as gold wire bonding, soldering and the like due to the negative miscellaneous property of product assembly. The gold plating thickness of the printed board of the gold wire bonding process is generally more than 2 μm to ensure the reliability of the bonding point, and the soldering is just the opposite, and the content of the gold element of the welding point needs to be reduced.
In high reliability applications, tin-coating and gold-removing treatment is required before welding, and the purpose of gold-removing is to reduce the content of gold elements on a welding end.
For the gold removal of the gold plating printed board by welding, if the manual tin coating and gold removal mode is adopted, the defects are as follows: a. the efficiency is slow. Generally, the printed board has few welding pads, dozens of welding ends and more than thousands of welding ends, and the efficiency is slow by adopting manual tin coating. b. Poor operability: 1. the large grounding bonding pad with fast heat dissipation is not easy to operate, and the bonding pad is not easy to level after gold removal, so that surface mounting assembly of the printed board is influenced; 2. for a hybrid circuit with a micro-assembly process and a soldering process, the distance between a bonding point and a soldering point is close (2 mm or less), and tin coating and gold removing are almost impossible. c. The reliability risk is large: 1. a layer of intermetallic compound (SnCu alloy) is formed on the surface of the welding end due to tin coating of the welding end, the printed board is further provided with a welding procedure, and when the intermetallic compound is thicker (more than 4 mu m), the strength of the welding point is reduced. 2. And the printed board bonding pad is subjected to tin coating and welding for many times, so that the risk of separation of the bonding pad and the printed board substrate is avoided. 3. The gold removal effect is not easily detectable (by elemental analysis) and may not be complete.
In order to avoid the phenomenon of 'gold brittleness', the industry also adopts a tin spraying (hot air leveling) or tin plating mode to replace gold plating. However, the tin spraying has the risk of thicker intermetallic compound, a mixed circuit cannot be adopted due to the requirement of gold wire bonding, the cost is higher, and meanwhile, the tinning of the micro-strip plate affects the performance index of the product due to the skin effect of the high-frequency microwave plate.
The tin-coating and gold-removing mode of the welding end of the printed circuit board has low gold-removing efficiency, high operation difficulty (or incapability of operating), certain reliability risk and difficulty in being applied to mass production and assembly of high-reliability products.
Therefore, a technological method is urgently needed to be found, so that the printed board can meet the bonding requirement and ensure the reliability of soldering points.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-reliability hybrid circuit printed board and a production method thereof, wherein the printed board belongs to a thick gold and local OSP printed board, has good welding performance and is suitable for gold wire bonding, and a gold coating layer is not required at the welding end of the printed board, namely, gold removal is not required, so that the process difficulty of gold removal is effectively solved, the consumption of gold is reduced, and the cost is saved.
The purpose of the invention is realized by the following technical scheme:
a highly reliable hybrid circuit printed board having a pattern wiring area, a chip mounting area and a green oil assembly bonding area, the pattern wiring area being composed of a soldering area and a gold plating area,
the soldering area is formed by bonding an insulating substrate layer, a copper layer and an OSP film layer which are sequentially arranged along the direction from bottom to top,
the gold-plating area is formed by bonding an insulating substrate layer, a copper layer and a gold-plating layer which are sequentially arranged along the direction from bottom to top,
the chip mounting area is a through hole penetrating through the high-reliability hybrid circuit printed board,
the green oil assembly welding area is formed by bonding an insulating base material layer, a copper layer and a solder resist layer which are sequentially arranged along the direction from bottom to top.
The production method of the high-reliability hybrid circuit printed board comprises the following steps:
s1, cutting, S2, copper deposition, plate electroplating, S3, outer layer dry film, S4, pattern transfer, S5, pattern copper plating, S6, pattern tin plating, S7, film stripping, S8, etching, S9, tin stripping, S10, outer layer wet film, S11, secondary pattern transfer, S12, pure gold electroplating, S13, secondary film stripping, S14, OSP film coating, S15, flying probe testing, S16 and electric milling.
Further, after the step S16, the method further includes a cleaning step, an inspection step and a packaging step, which are sequentially performed.
Optionally, the step S2 includes sequentially performing a primary copper deposition, a primary plate electroplating, a secondary copper deposition, a secondary plate electroplating, a sand blasting and a tertiary plate electroplating.
Further, the specific operation method of step S14 is as follows: and (4) sequentially carrying out surface acid washing (oil removal and deoxidation), water washing, same-surface micro etching, water washing, OSP solution pre-soaking, OSP solution dipping, water washing and drying on the circuit printed board which is subjected to the step S12.
The process has the advantages that: 1) the surface is even and flat, the film thickness is 0.2-0.5um, the method is suitable for SMT assembly and is suitable for manufacturing thin wires and thin-spacing printed boards; 2) the aqueous solution operation, the operating temperature is below 80 ℃, and the substrate cannot be warped; 3) the film layer is not brittle and easy to weld, is compatible with any solder and can bear more than three times of thermal shock; 4) high temperature, noise and fire alarm hidden danger in the production process are avoided; 5) the operation cost is more than 50 percent lower than that of the gold plating process; 6) it has a storage life of half a year and is easy to repair.
Further optionally, the OSP solution is F2LX solution, the temperature of the OSP solution during pre-soaking and soaking the OSP solution is 42.5 +/-2.5 ℃, and the OSP solution is horizontally dried at 80 ℃ for 30-60s during drying.
Further, before step S12 or after step S12, a step of applying green oil is further included.
The invention has the following advantages:
according to the invention, the gold is plated in a thick area to ensure the reliability of gold wire bonding, the soldering pad adopts OSP treatment to ensure the solderable tin of the pad, the gold is not required to be removed from the soldering pad, and the bonding process and the soldering process are completely compatible, so that the method can be applied to high-reliability products.
The invention adopts a mode of coating an organic coating (OSP for short) on a bare copper pad on part of a printed board, selectively coats a coating which is simple to operate, low in cost and free from gold plating on the printed board, and plates the rest positions, thereby effectively solving the problem of gold removal without influencing the performance and reliability of the printed board.
The organic coating is formed on the surface of the bare copper by a chemical method to form a layer of hydrophobic organic protective film with the thickness of 0.2-0.5um, and the layer of organic film can block the attack of moisture, can protect the copper surface from oxidation, can withstand high temperature test and keep good activity, and is easy to melt and crack soldering flux, thereby keeping good tin coating capability. The OSP mainly comprises an organic matter containing nitrogen heterocycle, and a layer of organic film is selectively coated on the clean copper of the PCB through complexation and crosslinking reaction, so that the OSP has good selectivity, and no residue is left on a solder mask layer and a gold surface of the PCB.
OSP coating has the characteristics of good weldability, low process complexity and low processing cost. After the gold-plated printed board is partially coated with the OSP, gold is not required to be removed during printed board assembly, the assembly time is greatly saved, the reliability risk is reduced, and the product reliability is improved. Compared with the existing gold removing process, the processing cost is greatly reduced. The thickness of the gold layer of the gold-plated area of the microstrip line is more than 1.5 mu m, and the local position adopts OSP treatment to be perfectly compatible with bonding and brazing processes, thereby solving the problem of gold removal of the brazing welding end of the existing microstrip board.
The invention ensures that the welding end of the printed board has no gold coating, namely, gold removal is not needed, the process difficulty of gold removal is effectively solved, the consumption of gold is reduced, the processing cost is reduced, and the welding end of the printed board is coated with OSP.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Detailed Description
The invention is further described with reference to the accompanying drawings in which:
as shown in fig. 1, a highly reliable hybrid circuit printed board having a pattern wiring area 2, a chip mounting area 5 and a green oil group soldering area 6, the pattern wiring area being composed of a soldering area 3 and a gold plating area 4,
the soldering area 3 is formed by bonding an insulating substrate layer, a copper layer and an OSP film layer which are sequentially arranged along the direction from bottom to top,
the gold-plating area 4 is formed by bonding an insulating substrate layer, a copper layer and a gold-plating layer which are sequentially arranged along the direction from bottom to top,
the chip mounting area 5 is a through hole penetrating through the high-reliability hybrid circuit printed board,
the green oil assembly welding area 6 is formed by bonding an insulating base material layer, a copper layer and a solder resist layer which are sequentially arranged along the direction from bottom to top.
The production method of the high-reliability hybrid circuit printed board comprises the following steps:
s1, cutting, S2, copper deposition, plate electroplating, S3, outer layer dry film, S4, pattern transfer, S5, pattern copper plating, S6, pattern tin plating, S7, film stripping, S8, etching, S9, tin stripping, S10, outer layer wet film, S11, secondary pattern transfer, S12, pure gold electroplating, S13, secondary film stripping, S14, OSP film coating, S15, flying probe testing, S16 and electric milling.
Further, after the step S16, the method further includes a cleaning step, an inspection step and a packaging step, which are sequentially performed.
Optionally, the step S2 includes sequentially performing a primary copper deposition, a primary plate electroplating, a secondary copper deposition, a secondary plate electroplating, a sand blasting and a tertiary plate electroplating.
Further, the specific operation method of step S14 is as follows: and (4) sequentially carrying out surface acid washing (oil removal and deoxidation), water washing, same-surface micro etching, water washing, OSP solution pre-soaking, OSP solution dipping, water washing and drying on the circuit printed board which is subjected to the step S12.
The process has the advantages that: 1) the surface is even and flat, the film thickness is 0.2-0.5um, the method is suitable for SMT assembly and is suitable for manufacturing thin wires and thin-spacing printed boards; 2) the aqueous solution operation, the operating temperature is below 80 ℃, and the substrate cannot be warped; 3) the film layer is not brittle and easy to weld, is compatible with any solder and can bear more than three times of thermal shock; 4) high temperature, noise and fire alarm hidden danger in the production process are avoided; 5) the operation cost is more than 50 percent lower than that of the gold plating process; 6) it has a storage life of half a year and is easy to repair.
Further optionally, the OSP solution is F2LX solution, the temperature of the OSP solution during pre-soaking and soaking the OSP solution is 42.5 +/-2.5 ℃, and the OSP solution is horizontally dried at 80 ℃ for 30-60s during drying.
Before step S12 or after step S12, a step of applying green oil is further included.
According to the invention, the gold is plated in a thick area to ensure the reliability of gold wire bonding, the soldering pad adopts OSP treatment to ensure the solderable tin of the pad, and the soldering end of the printed board has no gold plating layer, i.e. the soldering pad does not need to be subjected to gold removal, and the bonding process and the soldering process are completely compatible, so that the method can be applied to high-reliability products; the method effectively solves the difficult point of gold removal process, reduces the consumption of gold, reduces the processing cost, and coats the welding end of the printed board with OSP.
Claims (9)
1. The utility model provides a high reliable hybrid circuit printed board, its has figure circuit district, chip installation district and green oil assembly welding district, its characterized in that: the pattern circuit area is composed of a soldering area and a gold-plating area, the soldering area is formed by bonding an insulating substrate layer, a copper layer and an OSP (organic solderability preservative) film layer which are sequentially arranged along the direction from bottom to top, and the gold-plating area is formed by bonding an insulating substrate layer, a copper layer and a gold-plating layer which are sequentially arranged along the direction from bottom to top.
2. The high-reliability hybrid circuit printed board according to claim 1, wherein: the chip mounting area is a through hole penetrating through the high-reliability hybrid circuit printed board.
3. The high-reliability hybrid circuit printed board according to claim 1, wherein: the green oil assembly welding area is formed by bonding an insulating base material layer, a copper layer and a solder resist layer which are sequentially arranged along the direction from bottom to top.
4. A method for producing a highly reliable hybrid circuit printed board according to any one of claims 1 to 3, characterized in that: the method comprises the following steps:
s1, cutting, S2, copper deposition, plate electroplating, S3, outer layer dry film, S4, pattern transfer, S5, pattern copper plating, S6, pattern tin plating, S7, film stripping, S8, etching, S9, tin stripping, S10, outer layer wet film, S11, secondary pattern transfer, S12, pure gold electroplating, S13, secondary film stripping, S14, OSP film coating, S15, flying probe testing, S16 and electric milling.
5. The method for producing a highly reliable hybrid circuit printed board according to claim 4, wherein: after the step S16, the method further includes a cleaning step, an inspection step and a packaging step, which are performed in sequence.
6. The method for producing a highly reliable hybrid circuit printed board according to claim 4, wherein: and the step S2 comprises the steps of primary copper deposition, primary plate electroplating, secondary copper deposition, secondary plate electroplating, sand blasting and tertiary plate electroplating which are sequentially carried out.
7. The method for producing a highly reliable hybrid circuit printed board according to claim 4, wherein: the specific operation method of step S14 is as follows: and (4) sequentially carrying out surface acid washing, water washing, same-surface micro etching, water washing, OSP solution pre-soaking, OSP solution soaking, water washing and drying on the circuit printed board which is subjected to the step S12.
8. The method for producing a highly reliable hybrid circuit printed board according to claim 4, wherein: the OSP solution is F2LX solution, the temperature of the OSP solution is 42.5 +/-2.5 ℃ when the OSP solution is presoaked and soaked, and the OSP solution is horizontally dried for 30-60s at 80 ℃ when the OSP solution is dried.
9. The method for producing a highly reliable hybrid circuit printed board according to claim 4, wherein: before step S12 or after step S12, a step of applying green oil is further included.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911172876.3A CN110856369A (en) | 2019-11-26 | 2019-11-26 | High-reliability hybrid circuit printed board and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911172876.3A CN110856369A (en) | 2019-11-26 | 2019-11-26 | High-reliability hybrid circuit printed board and production method thereof |
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| CN110856369A true CN110856369A (en) | 2020-02-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267712A (en) * | 2008-04-25 | 2008-09-17 | 中兴通讯股份有限公司 | A processing method for alleviating Galvanic corrosion of PCB board |
| CN101868125A (en) * | 2010-05-25 | 2010-10-20 | 深圳市深联电路有限公司 | Method for preventing processed PCB board nickel-gold layer from being eroded |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN102427672A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining method of selective immersion gold plate |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
-
2019
- 2019-11-26 CN CN201911172876.3A patent/CN110856369A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101267712A (en) * | 2008-04-25 | 2008-09-17 | 中兴通讯股份有限公司 | A processing method for alleviating Galvanic corrosion of PCB board |
| CN101868125A (en) * | 2010-05-25 | 2010-10-20 | 深圳市深联电路有限公司 | Method for preventing processed PCB board nickel-gold layer from being eroded |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN102427672A (en) * | 2011-11-09 | 2012-04-25 | 金悦通电子（翁源）有限公司 | Machining method of selective immersion gold plate |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
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Application publication date: 20200228 |