CN110849646A - Method for testing temperature stabilization time of product - Google Patents
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- CN110849646A CN110849646A CN201910986611.0A CN201910986611A CN110849646A CN 110849646 A CN110849646 A CN 110849646A CN 201910986611 A CN201910986611 A CN 201910986611A CN 110849646 A CN110849646 A CN 110849646A
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Abstract
The invention belongs to the field of environmental engineering, and relates to a method for testing the temperature stability time of a product during non-working and working. On the basis of meeting the national standard, the method flexibly applies a contact method and a non-contact method, can find out the functional component with the maximum temperature hysteresis effect, and takes the latest time as the temperature stabilization time of the product; the invention provides executable operation method guidance aiming at the complex parts, saves energy, has accurate measurement result and ensures the quality and reliability of products.
Description
Technical Field
The invention belongs to the field of environmental engineering, and relates to a method for testing the temperature stability time of a product during non-working and working.
Background
The temperature environment runs through the whole life cycle of all products, and the temperature test is one of the most commonly-done test projects in laboratory environment tests to be performed at various stages of product development, production, use, maintenance and the like. The key for ensuring the test result of the temperature environment is that the temperature of the tested product is stable at the test temperature.
Due to the wide variety of product structures and materials, different products have different time for reaching temperature stability at the same temperature. When a temperature test is performed in a laboratory, the heat preservation time of a product during non-operation is usually determined according to a gravimetric method, for example, the heat preservation time corresponding to different weight ranges of a test sample is given in section 2.2 of GJB4.3 environmental test for ship electronic equipment. However, for most products, the complexity of the internal structure and the materials of parts are different, the interior has microclimate, and the test according to the weight method can be greatly different from the actual time. The holding time in operation is not guided by standards due to product differences.
The concept of product temperature stabilization although many standards give specific definitions, such as GJB150A, GJB1032, HB6167, etc., none of them have executable operating methods to guide implementation. The temperature test in a laboratory is often over-tested or under-tested, and the over-test-long heat preservation time causes unnecessary waste of resources; the short test-the heat preservation time, the test under the condition of unstable product temperature, causes inaccurate test result, and even influences the quality and reliability of the product.
Disclosure of Invention
In order to accurately test the temperature stabilization time of the product during non-operation and operation, the invention is implemented based on the definition of temperature stabilization in GJB 150A:
GJB150.1A military equipment environmental test method part 1: general requirements chapter 3.5 gives a clear definition of temperature stability. The temperature of the test piece during working is stable: unless otherwise specified, when the temperature change rate of the functional part having the maximum temperature hysteresis effect in the test piece is not more than 2.0 ℃/h, the test piece is considered to have reached the temperature stability at the time of operation. The temperature of the test piece when not working is stable: unless otherwise stated, when the temperature of the functional component having the greatest temperature hysteresis effect in the test piece reaches the test temperature, the test piece is considered to have reached a temperature at which it does not operate.
The technical scheme of the invention is as follows:
a method for testing the temperature stabilization time of a product comprises the following steps:
1) measuring the maximum point of the temperature hysteresis effect on each functional part of the product by adopting a non-contact method;
2) arranging a temperature sensor at the maximum point of each temperature hysteresis effect, measuring the time for the maximum point of each temperature hysteresis effect to reach the temperature stability by a contact method, wherein the functional component which reaches the temperature stability at the latest is the functional component with the maximum temperature hysteresis effect; the latest time is the temperature stabilization time of the product.
Preferably, the step 1) adopts a non-contact method to measure the maximum point of the temperature hysteresis effect on each functional component when the product does not work, and comprises the following steps: and placing the product in an environment which does not exceed the ultimate working temperature of the product, keeping the temperature for a period of time (the heat preservation time is less than the estimated temperature stabilization time of the product), taking the product out of the environment which does not exceed the ultimate working temperature of the product, quickly detaching all functional components, measuring each functional component of the product by using a thermal infrared imager, and finding out the lowest temperature point on each functional component, wherein the functional component with the lowest temperature point is the maximum temperature hysteresis effect point of the functional component.
Preferably, the step 1) adopts a non-contact method to measure the maximum point of the temperature hysteresis effect on each functional component when the product works, and comprises the following steps: and (3) after the product works for a period of time at normal temperature (the product is ensured not to reach the estimated temperature stability), stopping the product, quickly detaching all functional components, and measuring by using a thermal infrared imager to find out the lowest temperature point on each functional component, wherein the lowest temperature point is the maximum temperature hysteresis effect point of the functional components.
Preferably, the temperature sensor is arranged at the maximum point of each temperature hysteresis effect in a manner that: a temperature sensor is disposed at a point where the temperature hysteresis effect of each functional part is maximum.
Preferably, the step of setting an initial temperature is further included after arranging the temperature sensor at the maximum point of each temperature hysteresis effect: the product is placed in an initial temperature environment, each functional component of the product is guaranteed to reach the same initial temperature, then a temperature test is carried out, and the time for each maximum point of temperature hysteresis effect to reach temperature stability is measured through a contact method.
Preferably, the functional component with the latest temperature stability under the non-operating state of the product measured by the contact method is the functional component with the maximum temperature hysteresis effect under the non-operating state of the product; and measuring the temperature change time of the functional component which is latest when the temperature reaches the temperature stability from the initial temperature in the non-operating state of the product by a contact method to be the temperature stability time in the non-operating state of the product.
Preferably, the method for testing the working temperature stabilization time is that after the product reaches the non-working temperature stabilization, the product is electrified, and the time that the temperature change rate of the slowest point of temperature rise/drop is less than or equal to 2 ℃/h in each test point is the working temperature stabilization time of the product at the target temperature value; the component where the test point is located is the functional component with the maximum temperature hysteresis effect when the product works.
Preferably, the device for finishing the temperature rise and the heat preservation of the product is a temperature test box.
By adopting the technical scheme, the invention has the following beneficial effects:
on the basis of meeting the national standard definition, a contact method and a non-contact method are flexibly applied, the functional component with the maximum temperature hysteresis effect can be found, the latest time is the temperature stabilization time of the product, the executable operation method guidance is provided for the complex parts, the energy is saved, the measurement result is accurate, and the quality and the reliability of the product are ensured.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a thermal infrared imager determining the lowest temperature point of a functional module of a product.
FIG. 2 is a schematic diagram of a contact test layout according to the present invention.
FIG. 3 is a graph showing the temperature of the product at an elevated temperature of 70 ℃ as a function of time.
Fig. 4 is a schematic diagram of the temperature sensor 4 at a high temperature of 70 c as a function of time.
Wherein: 1-lowest temperature point of functional component, 2-temperature test box, 3-temperature sensor line, 4-automatic temperature test system, 5-product, 6-shelf, 7-product electrified cable, 8-product power supply, 9-test curve of temperature sensor, and 10-test curve of temperature sensor.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The specific test method of the invention operates as follows:
1) non-contact testing to find the point of maximum temperature hysteresis on a functional part
Because the definition of temperature stability is divided into the working and non-working of the test piece, the maximum temperature hysteresis effect point of each functional component during power-on and power-off is firstly found out.
And (3) the product 5 is not electrified, the product 5 is kept at a high temperature (not exceeding the working temperature) for a period of time (ensuring that all internal components cannot reach stable temperature), then the product 5 is taken out of the temperature test box 2, all functional components are quickly detached, and the thermal infrared imager is used for measuring to find out the point with the lowest temperature on each functional component.
And (3) powering on the product 5, namely powering on the product 5 for a period of time at normal temperature (ensuring that all internal components cannot reach stable temperature), then powering off the product 5, quickly detaching all functional components, and measuring by using a thermal infrared imager to find out the point with the lowest temperature on each functional component.
The lowest point of the temperature measured by the two test schemes is the point with the largest temperature hysteresis effect and is also the selection point of the temperature sensor arranged by the contact test method.
2) Contact test method for finding out functional part with maximum temperature hysteresis effect and obtaining temperature stabilization time
The product 5 is placed in the active volume in the temperature test chamber 2 and the cover of the product 5 is opened to attach a temperature sensor at the point of maximum hysteresis effect of the temperature of each functional component. And covering the cover plate, connecting the cable of the product 5, and closing the box door. And meanwhile, starting the automatic temperature testing system 4 to record the temperature of the functional component in real time.
And setting the temperature test box 2 to be at the initial normal temperature, and starting. The automatic temperature test system 4 is monitored so that all test point temperatures reach this temperature.
Setting parameters of the temperature test box 2, target temperature and temperature change rate, starting the temperature test box 2 to raise/lower temperature, and recording the temperature value of each sensor by the automatic temperature test system 4.
In each test point, the time of reaching the target temperature value finally is the non-working temperature stabilization time of the product 5 from the initial normal temperature to the target temperature value; and finally, the component where the test point reaching the target temperature is located is the functional component with the maximum temperature hysteresis effect when the product 5 does not work.
After the product 5 reaches the non-working temperature and is stable, the product 5 is electrified, and the automatic temperature testing system 4 records the temperature value of each sensor. In each test point, the time that the temperature change rate of the slowest point of temperature rise/drop is less than or equal to 2 ℃/h is the working temperature stabilization time of the product 5 at the target temperature value; the component where the test point is located is the functional component of the maximum temperature hysteresis effect when the product 5 works.
Selecting a certain product 5, testing the temperature stability time of the product at the high temperature of 70 ℃ when the product does not work and the temperature stability time of the product when the product works, wherein the process is as follows:
1) non-contact test procedure-product 5 non-energized test
a) And removing the cover plate screws of the product 5, taking down the cover plate, loosening the screws of the first, second, third and fourth functional components in the cover plate respectively, and covering the upper cover plate of the case.
b) The product 5 is placed on a shelf 6 inside the temperature test chamber 2.
c) And opening the temperature test box 2, raising the temperature to 50 ℃ at the temperature change rate of 3 ℃/min, and preserving the temperature for 20 min.
d) And after the heat preservation time is up, stopping the operation of the temperature test box 2.
e) Opening the box door, quickly taking down the cover plate of the product 5, pulling out the internal functional components, and taking out the functional components from the temperature test box 2; and quickly covering a cover plate of the product 5, and closing the door 2 of the temperature test box.
f) The functional part was photographed with a thermal infrared imager and the lowest point 1 of the temperature of the functional part was found, as shown in fig. 1.
g) And e) repeating the steps e) to f), and finding out the lowest temperature points 1 of the functional components of the second functional component, the third functional component and the fourth functional component by using a thermal infrared imager.
2) Non-contact test procedure-product 5 Power-on test
a) And removing the cover plate screws of the product 5, taking down the cover plate, loosening the screws of the functional parts to be tested in the cover plate respectively, and covering the upper cover plate of the case.
b) The product 5 and the powered device are connected by a cable.
c) And after the connection is confirmed to be correct, electrifying and keeping the electrified state for 15 min.
d) After electrifying for 15min, powering down.
e) Quickly taking down a cover plate of the product 5, and pulling out a first internal functional part; and then quickly covering the upper cover plate of the case.
f) And (4) shooting the first functional component by using a thermal infrared imager, and finding out the lowest temperature point 1 of the first functional component.
g) And e) repeating the steps e) to f), and finding out the lowest temperature points 1 of the functional components of the second functional component, the third functional component and the fourth functional component by using a thermal infrared imager.
3) Contact test procedure-high temperature 70 ℃ off-stream test
a) As shown in fig. 2, the product 5 is placed centrally on the shelf 6 of the temperature test chamber 2, and the distance between the product 5 and the inner wall of the test chamber should be at least 15cm to ensure the normal circulation of air.
b) And (3) disassembling a cover plate of the product 5, penetrating the temperature sensor wire 3 from a test hole of the temperature test box 2, and respectively pasting the temperature sensors on the four functional parts according to the maximum temperature hysteresis effect point found by the non-contact test. After the cover plate is stuck, the cover plate is installed again. Since the temperature sensor wire 3 extends from the inside of the product 5, a gap is formed between the cover plate of the product 5 and the cabinet, and the gap can be sealed by a paper tape.
c) The product electrifying cable 7 penetrates through the test hole of the temperature test box 2 and is connected with the product 5 and the power supply.
d) And closing the box door, blocking the test hole of the temperature test box 2 by the plug, starting the automatic temperature test system 4, and recording the temperature of each temperature sensor in real time.
d) The temperature test chamber 2 was set to 25 ℃ and started. The temperature automatic test system 4 was monitored until all test points reached 25 ℃.
e) The temperature test chamber 2 was set to 70 ℃ and the rate of temperature change was set to 3 ℃/min, causing the temperature test chamber 2 to rise. Meanwhile, the automatic temperature test system 4 records the temperature of each temperature sensor.
f) The temperature profile of each temperature sensor over time is analyzed by the automatic temperature test system 4, as shown in fig. 3. As can be seen from fig. 3, the test curve 9 of the temperature sensor four showed the slowest temperature rise. As can be seen from FIG. 4, the temperature sensor IV finally reached 70 deg.C, taking 106 min. Namely, the temperature stabilization time of the product 5 when the product does not work from 25 ℃ to 70 ℃ is 106min, and the functional component IV where the temperature sensor IV is located is the functional component with the maximum temperature hysteresis effect when the product does not work.
4) Contact test procedure-high temperature 70 ℃ working test
a) After the product 5 reaches 70 ℃ and the temperature is stable when not working, the product 5 is powered on through the product power supply 8.
b) The temperature profile of each temperature sensor over time is analyzed by the automatic temperature test system 4, as shown in fig. 3. As can be seen from fig. 3, the test curve 10 of the third temperature sensor has the slowest temperature rise. According to actual test results, the time that the temperature change rate of the temperature sensor III is less than or equal to 2 ℃/h is 37min, namely the temperature stabilization time of the product at 570 ℃ during working is 37min, and the functional component III where the temperature sensor III is located is the functional component with the maximum temperature hysteresis effect during working.
Claims (8)
1. A method for testing the temperature stabilization time of a product is characterized by comprising the following steps:
1) measuring the maximum point of the temperature hysteresis effect on each functional part of the product (5) using a non-contact method;
2) arranging a temperature sensor at the maximum point of each temperature hysteresis effect, measuring the time for the maximum point of each temperature hysteresis effect to reach the temperature stability by a contact method, wherein the functional component which reaches the temperature stability at the latest is the functional component with the maximum temperature hysteresis effect; the latest time is the temperature stabilization time of the product (5).
2. A method for testing the temperature stability time of a product according to claim 1, wherein the step 1) uses a non-contact method to measure the maximum point of the temperature hysteresis effect on each functional component when the product (5) does not work by: placing the product (5) in an environment which does not exceed the ultimate working temperature of the product (5), keeping the temperature for a period of time (the heat preservation time is less than the estimated temperature stabilization time of the product (5)), taking the product (5) out of the environment which does not exceed the ultimate working temperature of the product (5), quickly detaching all functional components, measuring each functional component of the product (5) by using an infrared thermal imager, and finding out the lowest temperature point on each functional component, wherein the functional component with the lowest temperature point is the maximum temperature hysteresis effect point of the functional component.
3. A method for testing the temperature stability time of a product according to claim 1, wherein the step 1) uses a non-contact method to measure the maximum point of the temperature hysteresis effect on each functional component when the product (5) is in operation: and (3) after the product (5) works for a period of time at normal temperature (the product (5) is ensured not to reach the estimated temperature stability), stopping the product (5) from working, quickly detaching all the functional components, and measuring by using a thermal infrared imager to find out the lowest temperature point on each functional component, wherein the lowest temperature point is the maximum temperature hysteresis effect point of the functional components.
4. A method for testing the temperature stability time of a product according to claim 2 or 3, wherein the temperature sensor is arranged at the maximum point of each temperature hysteresis in such a way that: a temperature sensor is disposed at a point where the temperature hysteresis effect of each functional part is maximum.
5. The product temperature stabilization time testing method of claim 1, further comprising a step of setting an initial temperature after arranging a temperature sensor at a maximum point of each temperature hysteresis effect: and (3) placing the product (5) in an initial temperature environment to ensure that each functional component of the product (5) reaches the same initial temperature, then performing a temperature test, and measuring the time for each maximum point of temperature hysteresis effect to reach temperature stability by a contact method.
6. A method for testing the temperature stability time of a product according to claim 2 or 5, wherein: the functional component which reaches the latest temperature stability in the non-operating state of the product (5) measured by the contact method is the functional component with the maximum temperature hysteresis effect in the non-operating state of the product (5); and measuring the temperature change time of the functional component with the latest temperature stabilization from the initial temperature under the non-operating state of the product (5) by a contact method as the temperature stabilization time under the non-operating state of the product (5).
7. A method for testing the temperature stability time of a product according to claim 1, wherein: the method for testing the working temperature stabilization time comprises the steps that after the product (5) reaches the non-working temperature stabilization, the product (5) is electrified, and the time that the temperature change rate of the slowest point of temperature rising/cooling is less than or equal to 2 ℃/h in each test point is the working temperature stabilization time of the product (5) at the target temperature value; the part where the test point is located is a functional part with the maximum temperature hysteresis effect when the product (5) works.
8. A method of testing the temperature stability time of a product according to claim 2 or 3, wherein: the device for finishing the temperature rise and heat preservation of the product (5) is a temperature test box (2).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112285595A (en) * | 2020-10-15 | 2021-01-29 | 厦门多彩光电子科技有限公司 | Cyclic test method for LED lamp beads |
| CN114280097A (en) * | 2021-11-17 | 2022-04-05 | 中国航空工业集团公司洛阳电光设备研究所 | Temperature stability time accelerated test method based on Arrhenius model |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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