CN110828632A - LED insertion bubble manufacturing method and LED insertion bubble thereof - Google Patents
LED insertion bubble manufacturing method and LED insertion bubble thereof Download PDFInfo
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- CN110828632A CN110828632A CN201911004168.9A CN201911004168A CN110828632A CN 110828632 A CN110828632 A CN 110828632A CN 201911004168 A CN201911004168 A CN 201911004168A CN 110828632 A CN110828632 A CN 110828632A
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- Prior art keywords
- circuit substrate
- glass shell
- led
- bubble
- positive
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- 238000003780 insertion Methods 0.000 title claims description 32
- 230000037431 insertion Effects 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000011521 glass Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 16
- 239000004332 silver Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 15
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED inserting bubble manufacturing method and an LED inserting bubble thereof, wherein based on the characteristic of higher melting point of silver paste, the welding positions of positive and negative pins in a circuit substrate are subjected to spot welding by the silver paste, so that the circuit substrate can be directly packaged in a glass shell according to the traditional high-temperature packaging method, the LED inserting bubble with the same shape as the traditional tungsten wire inserting bubble is obtained, the shell assembly is avoided, and the stability of the inserting bubble and the consistency of the appearance size are improved.
Description
Technical Field
The invention relates to the field of LED lamps, in particular to an LED inserting bubble manufacturing method and an LED inserting bubble thereof.
Background
The automobile lamp usually uses to insert the bubble as luminous unit, it has two kinds of forms to insert the bubble at present, one kind is with the tradition of tungsten filament as luminous main part to insert the bubble, another kind is with the novel bubble of inserting of LED chip as luminous main part, need high temperature processing because insert in the bubble encapsulation process, solder joint in the LED chip can't maintain stably and probably drop in the high temperature, consequently the novel bubble of inserting of present LED chip form all uses the shell to assemble into the shape that the bubble was inserted to the tradition, thereby avoid high temperature processing, but the shell is independent part, easy unstability, the product external dimension and the shape of making also hardly keep unanimous with the bubble is inserted to the tradition.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide an LED insertion bubble and a method for fabricating the same, which can use a glass package of a conventional insertion bubble to package an LED chip, and can directly replace the conventional insertion bubble, thereby avoiding the problems of instability and unsatisfactory external dimension of the insertion bubble of the conventional LED chip.
The technical scheme adopted by the invention for solving the problems is as follows:
the first aspect of the embodiment of the invention provides a method for manufacturing an LED insertion infusion, which comprises the following steps:
respectively fixing a plurality of LED chips and a control IC on the circuit substrate, wherein the LED chips are fixed through die bond adhesive, and the control IC is fixed through die bond silver adhesive;
baking the circuit substrate until the die bond adhesive and the die bond silver adhesive are dried;
forming an electric loop for the LED chip and the control IC bonding wire, and sintering the positive electrode and the negative electrode of the input point on the circuit substrate by using silver paste to fix the positive electrode pin and the negative electrode pin;
encapsulating the circuit substrate with fluorescent glue;
baking the circuit substrate until the fluorescent glue is dried;
and extending the positive and negative pins to exceed the inner cavity of the glass shell, and loading the circuit substrate into the glass shell and packaging into a plug bubble.
The LED inserting and soaking manufacturing method at least has the following beneficial effects: based on the characteristic of high melting point of silver paste, the welding positions of the positive and negative electrode pins in the circuit substrate are subjected to spot welding by the silver paste, so that the circuit substrate can be directly packaged in the glass shell according to a traditional high-temperature packaging method, the LED insertion bubble with the same shape as that of the traditional tungsten wire insertion bubble is obtained, the advantages of the traditional tungsten wire insertion bubble can be kept, the waterproof, dustproof and shockproof effects are achieved, the shell assembly is avoided, and the stability and the appearance size consistency of the insertion bubble are improved.
According to a first aspect of the embodiments of the present invention, there is provided a method for manufacturing an LED interposer, before encapsulating the circuit substrate with a fluorescent glue, the method further includes:
and placing the circuit substrate finished by the bonding wires in a test fixture for lighting test, and removing defective products.
According to a first aspect of the embodiments of the present invention, before extending the positive and negative pins of the circuit substrate to exceed the inner cavity of the glass housing, a method for manufacturing an LED interposer is provided, which further includes:
dividing the circuit substrate in the connection plate state into single circuit boards by using a slicing jig;
and carrying out lighting test on the single circuit board to eliminate defective products.
According to a first aspect of the embodiments of the present invention, there is provided a method for manufacturing an LED interposer, where extending the positive and negative pins beyond an inner cavity of a glass housing, and loading the circuit substrate into the glass housing and packaging the circuit substrate into an interposer includes:
welding one end of a lead on the positive and negative pins by using a butt-welding machine, wherein the other end of the lead is a free end;
vacuumizing the glass shell, and filling inert gas into the glass shell;
carrying out bubble sealing treatment on the glass shell;
and bending the lead towards the direction of the glass shell.
According to a first aspect of embodiments of the present invention, there is provided a method of making an LED interposer, the inert gas comprising one or more of helium, hydrogen, and nitrogen.
The second aspect of the embodiment of the invention provides an LED insertion bulb using the LED insertion bulb manufacturing method, which includes a glass shell and a circuit substrate carrying the LED chip and the control IC, wherein the tail of the glass shell is pressed into a plate shape due to encapsulation, and positive and negative electrode pins of the circuit substrate extend out along the tail of the glass shell.
The LED insertion bubble at least has the following beneficial effects: the shape of glass shell inserts the bubble encapsulation according to traditional tungsten filament, and the afterbody is flat platelike promptly, and positive negative pole pin also buckles according to the mode that traditional tungsten filament inserted the bubble simultaneously for the LED of this application inserts the bubble and can directly replace traditional tungsten filament and insert the bubble, has good popularization prospect.
Drawings
The invention is further illustrated by the following figures and examples.
FIG. 1 is a flow chart of a method of making an embodiment of the present invention;
FIG. 2 is a detailed flowchart of step S600 according to an embodiment of the present invention;
FIG. 3 is a diagram of an LED blister configuration according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It should be noted that, if not conflicted, the various features of the embodiments of the invention may be combined with each other within the scope of protection of the invention.
Referring to fig. 1, a first aspect of an embodiment of the present invention provides a method for manufacturing an LED interposer, including the steps of:
s100, fixing a plurality of LED chips and a control IC on a circuit substrate 200 respectively, wherein the LED chips are fixed through die bond adhesive, and the control IC is fixed through die bond silver adhesive;
s200, baking the circuit substrate 200 until the die bond adhesive and the die bond silver adhesive are dried;
s300, forming an electric loop for the LED chip and the control IC bonding wire, and sintering the positive electrode and the negative electrode of the input point on the circuit substrate 200 by using silver paste to fix the positive electrode pin and the negative electrode pin 300;
s400, sealing the circuit substrate 200 with fluorescent glue;
s500, baking the circuit substrate 200 until the fluorescent glue is dried;
s600, extending the positive and negative pins 300 to exceed the inner cavity of the glass shell, and placing the circuit substrate 200 into the glass shell 100 and packaging into a plug bubble.
Wherein the circuit substrate 200 is a sapphire substrate, and a circuit is printed in advance, after the LED chip and the control IC are die-bonded on the circuit substrate 200, the LED chip and the control IC are connected to a circuit on the circuit substrate 200 by a bonding wire, thereby forming an electrical circuit, wherein the step S200 is a first baking, the baking temperature is about 180 ℃, the baking time is about two hours, it is noted that the die-bonding of the LED chip and the control IC is performed respectively, and the first baking can bake the LED chip and the control IC at the same time.
The fluorescent glue in step S400 is placed in a deaerator in advance for vacuum deaeration, and then the fluorescent glue is uniformly coated on the circuit substrate 200 by using a dispenser to cover the LED chip and the control IC. Before step S400, the method further includes:
the circuit substrate 200 after wire bonding is placed in a test fixture for lighting test, and defective products are removed, so that the test is performed once before the dispensing process, and fluorescent glue is prevented from being wasted on the defective products.
And S500, baking for the second time, wherein the baking temperature is about 180 ℃, the baking time is about eight hours, and the fluorescent glue is dried.
In an embodiment, the circuit substrate 200 is a connection board, that is, a plurality of identical single circuit boards are arranged side by side on the circuit substrate 200, and before step S600, the method further includes:
dividing the circuit substrate 200 in the connection plate state into single circuit boards by using a slicing jig;
and carrying out lighting test on the single circuit board to eliminate defective products.
In the present embodiment, when the circuit board 200 is a connection board, all the positive and negative electrodes of the input points on the circuit board 200 need to be sintered by using silver paste, and the subsequent extension pins 300 are also operated for the positive and negative electrodes of the input points.
Referring to fig. 2, step S600 specifically includes the following steps:
s610, welding one end of the lead on the positive and negative electrode pins 300 by using a butt-welding machine, wherein the other end is a free end;
s620, carrying out vacuum-pumping treatment on the glass shell 100, and filling inert gas into the glass shell 100;
s630, performing a bubble sealing process on the glass housing 100;
s640, bending the lead in the direction of the glass package 200.
In step S620, the inert gas includes one or more of helium, hydrogen, and nitrogen, and the glass envelope 100 is barium glass.
It should be understood that, after step S600, a burn-in test is also included, and the burn-in test specifically includes: after the packaging is finished, the LED plug is electrified with direct current to be lightened and aged for 24 hours, and the voltage of the direct current is set according to the power supply voltage of the LED chip, and is usually 12V and 24V.
Referring to fig. 3, a second aspect of an embodiment of the present invention provides an LED socket using the above LED socket manufacturing method, including a glass housing 100 and a circuit substrate carrying an LED chip and a control IC, wherein a tail portion of the glass housing 100 is pressed into a plate shape due to encapsulation, and positive and negative electrode pins 300 of the circuit substrate extend along the tail portion of the glass housing 100.
The distance between the positive and negative pins 300 is determined according to the size of the insertion bubble, and is usually 3.95mm and 8.3mm, the shape of the glass shell 100 is encapsulated according to the traditional tungsten filament insertion bubble, namely the tail part is in a flat plate shape, and meanwhile, the positive and negative pins 300 are also bent according to the traditional tungsten filament insertion bubble mode, so that the LED insertion bubble can directly replace the traditional tungsten filament insertion bubble, and has good popularization prospect.
According to the embodiment of the invention, based on the characteristic of high silver paste melting point, the welding positions of the positive and negative electrode pins 300 in the circuit substrate 200 are subjected to spot welding by using the silver paste, so that the circuit substrate 200 can be directly packaged in the glass shell 100 according to the traditional high-temperature packaging method, the LED insertion bubble with the same shape as the traditional tungsten wire insertion bubble is obtained, shell assembly is avoided, and the stability of the insertion bubble is improved. Compared with the traditional tungsten wire insertion bulb, the LED insertion bulb provided by the embodiment of the invention has the advantages that the energy is saved by 80%, the brightness can be improved by 100%, the service life can be prolonged by 100 times, the tungsten wire insertion bulb has the advantages of water resistance and dust resistance, the appearance size can be made to be consistent with that of the traditional tungsten wire insertion bulb, the tungsten wire insertion bulb can be directly replaced and upgraded, compared with the novel combined shell type LED insertion bulb, the LED insertion bulb provided by the embodiment of the invention has the advantages that the production cost is low, the bulb is good in integrity, the problems of shell aging and the like can not occur after long-term.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and the present invention shall fall within the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means.
Claims (6)
1. An LED insertion making method is characterized in that: the method comprises the following steps:
respectively fixing a plurality of LED chips and a control IC on the circuit substrate, wherein the LED chips are fixed through die bond adhesive, and the control IC is fixed through die bond silver adhesive;
baking the circuit substrate until the die bond adhesive and the die bond silver adhesive are dried;
forming an electric loop for the LED chip and the control IC bonding wire, and sintering the positive electrode and the negative electrode of the input point on the circuit substrate by using silver paste to fix the positive electrode pin and the negative electrode pin;
encapsulating the circuit substrate with fluorescent glue;
baking the circuit substrate until the fluorescent glue is dried;
and extending the positive and negative pins to exceed the inner cavity of the glass shell, and loading the circuit substrate into the glass shell and packaging into a plug bubble.
2. The method of claim 1, wherein the method comprises: before the circuit substrate is packaged by the fluorescent glue, the method further comprises the following steps:
and placing the circuit substrate finished by the bonding wires in a test fixture for lighting test, and removing defective products.
3. The method of claim 1, wherein the method comprises: the extension still includes before the positive negative pole pin of circuit substrate makes it surpass the inner chamber of glass shell:
dividing the circuit substrate in the connection plate state into single circuit boards by using a slicing jig;
and carrying out lighting test on the single circuit board to eliminate defective products.
4. The method of claim 1, wherein the method comprises: the extending the positive and negative pins to exceed the inner cavity of the glass shell, and the loading the circuit substrate into the glass shell and packaging into a blister comprises:
welding one end of a lead on the positive and negative pins by using a butt-welding machine, wherein the other end of the lead is a free end;
vacuumizing the glass shell, and filling inert gas into the glass shell;
carrying out bubble sealing treatment on the glass shell;
and bending the lead towards the direction of the glass shell.
5. The method of claim 4, wherein the LED insert is manufactured by: the inert gas includes one or more of helium, hydrogen, and nitrogen.
6. An LED insert using the method of any one of claims 1 to 5, wherein: the LED lamp comprises a glass shell and a circuit substrate bearing the LED chip and the control IC, wherein the tail part of the glass shell is pressed into a plate shape due to packaging, and positive and negative electrode pins of the circuit substrate extend out along the tail part of the glass shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911004168.9A CN110828632A (en) | 2019-10-22 | 2019-10-22 | LED insertion bubble manufacturing method and LED insertion bubble thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911004168.9A CN110828632A (en) | 2019-10-22 | 2019-10-22 | LED insertion bubble manufacturing method and LED insertion bubble thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110828632A true CN110828632A (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911004168.9A Pending CN110828632A (en) | 2019-10-22 | 2019-10-22 | LED insertion bubble manufacturing method and LED insertion bubble thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN110828632A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115435254A (en) * | 2022-10-14 | 2022-12-06 | 佛山克莱汽车照明股份有限公司 | Vehicle LED lamp insertion preparation method |
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| GB2520345A (en) * | 2013-11-19 | 2015-05-20 | Kosnic Uk Ltd | LED lighting apparatus |
| CN106594544A (en) * | 2017-02-04 | 2017-04-26 | 江苏银晶光电科技发展有限公司 | LED lamp bead capable of replacing halogen lamp and manufacturing process thereof |
| CN106764560A (en) * | 2016-12-24 | 2017-05-31 | 惠州市圣士照明有限公司 | A kind of manufacture method of LED |
| CN107527990A (en) * | 2017-10-03 | 2017-12-29 | 浙江中宙光电股份有限公司 | A kind of Novel LED lamp bulb and preparation method thereof |
-
2019
- 2019-10-22 CN CN201911004168.9A patent/CN110828632A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103225757A (en) * | 2013-04-26 | 2013-07-31 | 李文雄 | LED lamp bulb and manufacturing method thereof |
| GB2520345A (en) * | 2013-11-19 | 2015-05-20 | Kosnic Uk Ltd | LED lighting apparatus |
| CN106764560A (en) * | 2016-12-24 | 2017-05-31 | 惠州市圣士照明有限公司 | A kind of manufacture method of LED |
| CN106594544A (en) * | 2017-02-04 | 2017-04-26 | 江苏银晶光电科技发展有限公司 | LED lamp bead capable of replacing halogen lamp and manufacturing process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115435254A (en) * | 2022-10-14 | 2022-12-06 | 佛山克莱汽车照明股份有限公司 | Vehicle LED lamp insertion preparation method |
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Application publication date: 20200221 |