CN110809374A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN110809374A CN110809374A CN201810886869.9A CN201810886869A CN110809374A CN 110809374 A CN110809374 A CN 110809374A CN 201810886869 A CN201810886869 A CN 201810886869A CN 110809374 A CN110809374 A CN 110809374A
- Authority
- CN
- China
- Prior art keywords
- metal
- substrate
- circuit board
- circuit
- uncured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a circuit board and a manufacturing method thereof, comprising a substrate; forming an uncured metal circuit on a substrate by using metal powder or metal paste, and arranging one or more chips on the uncured metal circuit; and sintering the uncured metal circuit to form a cured metal circuit by the uncured metal circuit, wherein the chip is fixedly connected with the cured metal circuit. The circuit board and the manufacturing method thereof do not use tin paste, so that the welding step can be omitted to simplify the manufacturing process, the manufacturing cost can be reduced, and the environmental protection is facilitated.
Description
Technical Field
The invention relates to a circuit board and a manufacturing method thereof, wherein a chip is fixed on a metal circuit without using solder paste.
Background
Electronic components such as chips are essential elements in electronic circuits, and connecting electronic components to a circuit board is most often performed by using a soldering technique by which the electronic components are electrically connected and supported and fixed on the circuit board. A common bonding method for mounting a chip is Surface Mount Technology (SMT), in which after electronic components such as a chip are attached to a circuit board, the chip is fixedly connected to the circuit board by reflow (reflow), which is a method of heating solder paste to a solder joint and then performing bonding, that is, one type of bonding. The surface welding technology is beneficial to producing light, thin, short and small electronic products and mass production.
Reflow techniques used for surface mount welding include infrared reflow (infrared reflow), vapor phase reflow (vapor phase reflow), immersion solder (soldering dip), and hot air reflow (convection reflow); among them, infrared reflow is an early reflow technique, and hot air reflow is used nowadays.
Solder paste, also called solder paste or dry paste, is used for soldering, and the contents of the solder paste mainly comprise solder powder and soldering flux. The tin powder contains metal alloys such as tin, silver, copper and bismuth (Bi) to improve the firmness after welding. The soldering flux contains chemical agents such as an active agent, rosin, an organic solvent, a thickening agent and the like, and is used for preventing metal alloy of tin powder from being oxidized at high temperature, removing oxides and isolating foreign matters.
In addition, in view of the environmental issue, many manufacturers are dedicated to develop halogen-free and lead-free solder paste to reduce the environmental pollution during the manufacture and recycling of electronic products.
Disclosure of Invention
The reason why the chip is disposed on the circuit board may cause a defective rate is mostly due to poor solder paste printing during soldering. The amount of solder paste used, the height, area, volume and flatness of the printed circuit board can all affect the final product. When the solder paste is printed poorly, the electronic components are damaged, and problems such as bridging, shifting, or height deviation occur. In addition, the solder paste must be selected in consideration of various factors such as surface insulation Resistance (RSI), electromigration, solderability, collapse resistance, flux residue, and copper corrosion.
In order to solve the above problems, the present invention is to provide a method for mounting a chip on a circuit board without solder paste, which can reduce the manufacturing process and manufacturing cost due to the solder paste-free soldering step, and is favorable for environmental protection.
Therefore, an object of the present invention is a method for manufacturing a circuit board, which includes providing a substrate; forming an uncured metal circuit on the substrate by using metal powder or metal paste, and arranging one or more chips on the uncured metal circuit; and sintering the uncured metal circuit to form a cured metal circuit by the uncured metal circuit, wherein the chip is fixedly connected with the cured metal circuit.
Another objective of the present invention is to provide a circuit board with chips, which includes a substrate and one or more chips. The substrate is provided with a metal circuit which is formed by sintering and solidifying uncured metal powder or metal slurry, and the chip is fixedly connected to the substrate through the metal circuit which is formed by sintering.
Further, the sintering temperature is 120-350 ℃; in a preferred embodiment, the sintering temperature is 220-.
Further, the method for forming the surface of the metal line includes inkjet printing, screen printing, lithography, laser metal deposition 3D printing or electron beam 3D printing.
Further, the substrate includes a ceramic substrate, a metal substrate, a ceramic metal composite plate, a rubber substrate, or a glass substrate.
Compared with the manufacturing method of the circuit board in the prior art, the manufacturing method of the circuit board has the advantages that the chip is fixed on the circuit board without using solder paste for welding, so that the welding process and the cost of the solder paste can be saved, and the environment is protected.
Drawings
Fig. 1 shows a method for manufacturing a circuit board according to the present invention.
Fig. 2 is an embodiment of the circuit board with a chip according to the present invention.
Description of reference numerals:
1-substrate
2' -uncured metal line
2-solidified metal wiring
3-ink-jet printer
4-chip
5-electrode
Detailed Description
The inclusion or inclusion of a reference to a component or element does not preclude the presence or addition of one or more other components, steps, operations, and/or elements to the component, steps, operations, and/or elements. A means that the object has one or more (i.e., at least one) grammatical object.
The following embodiments should not be construed to unduly limit the invention. Modifications and variations of the embodiments discussed herein can be made by one of ordinary skill in the art without departing from the spirit or scope of the invention, and still fall within the scope of the invention.
The invention relates to a method for manufacturing a circuit board, which comprises providing a substrate; forming an uncured metal circuit on the substrate by using metal powder or metal paste, and arranging one or more chips on the uncured metal circuit; and sintering the uncured metal circuit to form a cured metal circuit by the uncured metal circuit, wherein the chip is fixedly connected with the cured metal circuit.
In the present invention, the substrate includes a ceramic substrate, a metal ceramic composite substrate, a rubber substrate, or a glass substrate.
In the present invention, the material of the ceramic substrate may be borosilicate glass powder, various metal oxides, carbides, nitrides, borides, silicides, or combinations thereof, for example, silicon carbide (SiC), silicon nitride (Si3N4), aluminum nitride (AIN), aluminum oxide (Al2O3), titanium carbide (TiC), titanium boride (TiB2), boron carbide (B4C), lead zirconate titanate, manganese ferrite, or the like, but the present invention is not limited thereto, and any one or a combination of two or more thereof may be used.
In the present invention, the material of the metal substrate may be copper, aluminum, copper alloy or aluminum alloy, for example, the copper alloy includes copper-zinc alloy, copper-tin alloy, copper-aluminum alloy, copper-silicon alloy or copper-nickel alloy; the aluminum alloy comprises aluminum-silicon alloy, aluminum-magnesium-silicon alloy, aluminum-copper alloy, aluminum-magnesium alloy, aluminum-manganese alloy, aluminum-zinc alloy or aluminum-lithium alloy; among them, aluminum alloy, copper or copper alloy is preferable; the metal of the metal base layer may be any one or a combination of two or more of the foregoing metals, and the invention is not limited thereto.
In the present invention, the metal-ceramic composite substrate may be a substrate formed by combining the ceramic material and the metal material; preferably, the structure of the metal-ceramic composite substrate includes a metal substrate and a ceramic layer disposed outside the metal base layer, and the invention is not limited thereto.
In the present invention, the rubber substrate may be a general resin substrate, and the material of the rubber substrate includes thermosetting resins such as Phenolic resin (Phenolic), Polyimide resin (Polyimide), Epoxy resin (Epoxy), polytetrafluoroethylene (PTFE; TEFLON), or B-triazine resin (BT), and the present invention is not limited thereto.
In the present invention, the material of the glass substrate may be optical glass such as Indium Tin Oxide (ITO) and fluorine-containing tin oxide (SnO2: F) (FTO), and the present invention is not limited thereto.
In the present invention, the method for forming the uncured metal circuit by using the metal powder and the metal paste may be a circuit printing method in the prior art, such as an inkjet printing method, a screen printing method and a lithographic printing method, or a 3D printing of additive manufacturing, such as a laser metal deposition 3D printing and an electron beam 3D printing, and the metal powder for preparing the metal circuit is printed on the surface of the ceramic layer, and the present invention is not limited thereto, and preferably the laser metal deposition 3D printing and the electron beam 3D printing are used; the metal powder and the metal paste include metal, alloy or composite metal, such as one or more of silver, copper, gold, aluminum, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, lead, silver copper, cadmium copper, chromium copper, beryllium copper, zirconium copper, aluminum magnesium silicon, aluminum magnesium iron, aluminum zirconium, iron chromium aluminum alloy, and the like, and the invention is not limited thereto, wherein the metal powder is preferably aluminum, gold, silver and copper.
In the present invention, the thickness of the solidified metal line is 0.5 to 40 μm, for example, 0.5 μm, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm or 40 μm; the width of the wire diameter is more than 0.5 μm, and the solidified metal circuit can be distributed on the whole surface of the substrate.
In the present invention, the chip includes an IC chip, a bare chip, an LED chip, a Free Wheeling Diode (FWD) or an Insulated Gate Bipolar Transistor (IGBT) with different functions, and the present invention is not limited thereto; in addition, the types of chips may include a horizontal chip, a vertical chip, a flip chip, a wafer level package Chip (CSP), and the like, and the present invention is not limited thereto.
In the present invention, the sintering temperature is 120-; among them, 220 ℃ and 320 ℃ are preferred. If the temperature is too high; if the temperature is too low. If the sintering temperature is too high, the chip and the substrate will be damaged, the electrical performance will be affected and the service life will be reduced, and if the sintering temperature is too low, the circuit will be incomplete or broken.
The circuit board of the present invention can be used in any electronic device or electronic product requiring circuit board operation, such as a light emitting diode, a computer, a smart phone, a tablet computer, a sound box, etc., and the present invention is not limited thereto.
Hereinafter, the present disclosure will be described in more detail with reference to specific embodiments. However, the present disclosure is not limited to the following examples.
Example 1: the invention relates to a method for manufacturing a circuit board
Referring to fig. 1, a method for manufacturing a circuit board according to the present invention includes providing a substrate 1; spraying a metal paste on the substrate 1 by using an ink-jet printer 3 to form an uncured metal line 2' on the substrate 1, and disposing a plurality of LED chips 4 on the uncured metal line; subsequently, sintering is performed at 200 ℃, the uncured metal wire 2' forms a cured metal wire 2, and the LED chip 4 is fixedly connected to the substrate with the cured metal wire 2.
Example 2: the circuit board with the chip is used as an LED electronic component
Referring to fig. 2, two electrodes 5 are further disposed on the circuit board obtained in embodiment 1 on two sides of the substrate and electrically connected to the metal lines 2, that is, the LED chip can emit light, so as to obtain an LED electronic component.
In summary, the circuit board and the method for manufacturing the same of the present invention do not need to use solder paste to solder the chip onto the circuit board, which is beneficial to reducing the soldering steps and the cost of solder paste in the manufacturing process and reducing the environmental pollution, so the circuit board and the method for manufacturing the same of the present invention have industrial applicability.
The present invention has been described in detail, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made according to the claims of the present invention should still fall within the scope of the present invention.
Claims (10)
1. A method of manufacturing a circuit board, comprising:
a substrate;
forming an uncured metal circuit on the substrate by using metal powder or metal paste, and arranging one or more chips on the uncured metal circuit; and
and sintering the uncured metal circuit to form a cured metal circuit by the uncured metal circuit, wherein the chip is fixedly connected with the cured metal circuit.
2. The method as claimed in claim 1, wherein the sintering temperature is 120-350 ℃.
3. The method as claimed in claim 2, wherein the sintering temperature is 220-320 ℃.
4. The method of any one of claims 1 to 3, wherein the surface of the metal line is formed by an inkjet printing method, a screen printing method, a lithography method, a laser metal deposition 3D printing method, or an electron beam 3D printing method.
5. The production method according to any one of claims 1 to 3, wherein the substrate comprises a ceramic substrate, a metal substrate, a ceramic-metal composite plate, a rubber substrate, or a glass substrate.
6. A circuit board having a chip, comprising:
a substrate having a metal wiring formed by sintering and solidifying uncured metal powder or metal paste; and
one or more chips are fixedly connected on the substrate through the sintered metal circuit.
7. The circuit board of claim 6, wherein the sintering temperature is 120-350 ℃.
8. The circuit board of claim 6, wherein the sintering temperature is 220-320 ℃.
9. The circuit board of any one of claims 6 to 8, wherein the surface of the metal line is formed by a method comprising ink-jet printing, screen printing, lithography, laser metal deposition 3D printing or electron beam 3D printing.
10. The circuit board of any one of claims 6 to 8, wherein the substrate comprises a ceramic substrate, a metal substrate, a ceramic metal composite plate, a rubber substrate, or a glass substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810886869.9A CN110809374A (en) | 2018-08-06 | 2018-08-06 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810886869.9A CN110809374A (en) | 2018-08-06 | 2018-08-06 | Circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110809374A true CN110809374A (en) | 2020-02-18 |
Family
ID=69487312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810886869.9A Pending CN110809374A (en) | 2018-08-06 | 2018-08-06 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110809374A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816250A (en) * | 2005-02-03 | 2006-08-09 | 阿尔卑斯电气株式会社 | Electronic components packaging substrate |
| CN101147249A (en) * | 2005-03-24 | 2008-03-19 | 松下电器产业株式会社 | Electronic component mounting method and electronic circuit device |
| CN101918505A (en) * | 2008-01-17 | 2010-12-15 | E.I.内穆尔杜邦公司 | Electrically conductive adhesive |
| JP2011018714A (en) * | 2009-07-08 | 2011-01-27 | Panasonic Corp | Electronic component unit, and adhesive for reinforcement |
| CN107828351A (en) * | 2016-09-15 | 2018-03-23 | E·I·内穆尔杜邦公司 | Conducting paste for bonding |
-
2018
- 2018-08-06 CN CN201810886869.9A patent/CN110809374A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816250A (en) * | 2005-02-03 | 2006-08-09 | 阿尔卑斯电气株式会社 | Electronic components packaging substrate |
| CN101147249A (en) * | 2005-03-24 | 2008-03-19 | 松下电器产业株式会社 | Electronic component mounting method and electronic circuit device |
| CN101918505A (en) * | 2008-01-17 | 2010-12-15 | E.I.内穆尔杜邦公司 | Electrically conductive adhesive |
| JP2011018714A (en) * | 2009-07-08 | 2011-01-27 | Panasonic Corp | Electronic component unit, and adhesive for reinforcement |
| CN107828351A (en) * | 2016-09-15 | 2018-03-23 | E·I·内穆尔杜邦公司 | Conducting paste for bonding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200218 |
|
| WD01 | Invention patent application deemed withdrawn after publication |