CN110804257A - Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof - Google Patents
Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof Download PDFInfo
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- CN110804257A CN110804257A CN201911067346.2A CN201911067346A CN110804257A CN 110804257 A CN110804257 A CN 110804257A CN 201911067346 A CN201911067346 A CN 201911067346A CN 110804257 A CN110804257 A CN 110804257A
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- photovoltaic
- backing plate
- diamond wire
- wire cutting
- styrene
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- 238000005520 cutting process Methods 0.000 title claims abstract description 66
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 66
- 239000010432 diamond Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title claims description 13
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims abstract description 23
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000004793 Polystyrene Substances 0.000 claims abstract description 20
- 229920002223 polystyrene Polymers 0.000 claims abstract description 20
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 9
- 239000000806 elastomer Substances 0.000 claims abstract description 9
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000012745 toughening agent Substances 0.000 claims abstract description 5
- 238000001125 extrusion Methods 0.000 claims description 17
- 239000000314 lubricant Substances 0.000 claims description 14
- 239000003381 stabilizer Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 7
- 238000003490 calendering Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000005469 granulation Methods 0.000 claims description 3
- 230000003179 granulation Effects 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 229920005669 high impact polystyrene Polymers 0.000 abstract description 19
- 239000004797 high-impact polystyrene Substances 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 16
- 229920003023 plastic Polymers 0.000 abstract description 9
- 239000004033 plastic Substances 0.000 abstract description 9
- 238000005336 cracking Methods 0.000 abstract description 2
- 229920003225 polyurethane elastomer Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 230000005484 gravity Effects 0.000 description 11
- 239000008187 granular material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 239000012257 stirred material Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The invention discloses a novel low-cost special backing plate for photovoltaic diamond wire cutting, which takes general-purpose polystyrene and impact-resistant polystyrene as raw materials, and is added with compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer and adhesion promoter thermoplastic polyurethane elastomer. According to the invention, the styrene-butadiene copolymer K glue or the styrene-butadiene-styrene block copolymer SBS plastic and the polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems of brittleness, easy cracking, low tensile strength and impact strength and the like of the GPPS/HIPS plastic plate material are effectively solved, and the surface polarity of the special photovoltaic diamond wire cutting plate is obviously improved, so that the surface adhesive force of the novel low-cost special photovoltaic diamond wire cutting backing plate is improved, and the adhesive strength of the novel low-cost special photovoltaic diamond wire cutting backing plate, the diamond wire adhesive plate glue and the adhesive bar glue is obviously improved and stabilized.
Description
Technical Field
The invention relates to the technical field of silicon wafer cutting in the photovoltaic industry, in particular to a novel low-cost special backing plate for photovoltaic diamond wire cutting and a preparation method thereof.
Background
In the solar silicon wafer cutting process, the backing plate serves as an indispensable cutting auxiliary material and plays an important role in cutting the silicon wafer by the diamond wire, and meanwhile, the problem of high cost of the backing plate also becomes an important factor for rapid development of the photovoltaic industry.
Most of padding plates used for cutting traditional diamond wire silicon wafers are epoxy, phenolic aldehyde, polyester and various thermoplastic resins, and the padding plates have high specific gravity of 1.1-2.0 g/cm in the using process3(ii) a The steel wire is easy to break, break and adhere during cutting; the backing plate has high cost; the thermosetting backing plate is inconvenient for recovering silicon materials and the backing plate, and the like, and the problems are more and more difficult to meet the development trend of reducing the cost and improving the production efficiency of the photovoltaic industry.
Therefore, it is necessary to develop a novel low-cost pad dedicated for photovoltaic diamond wire cutting, which can solve the above problems.
Disclosure of Invention
It is an object of the present invention to address at least the above-mentioned deficiencies and to provide at least the advantages which will be described hereinafter.
The invention also aims to provide a novel low-cost special backing plate for the photovoltaic diamond wire cutting, which has the advantages of light specific gravity, high hardness, low electrical conductivity, high tensile strength and high shear strength.
The invention also aims to provide a novel low-cost special backing plate for photovoltaic diamond wire cutting, which can solve the problems that general-purpose polystyrene (GPPS) plastics are brittle and easy to crack, low in tensile strength and impact strength and easy to break in the processes of processing, carrying and using.
The invention also aims to provide a novel low-cost photovoltaic diamond wire cutting special backing plate which can solve the problems that the surface adhesion of a plate is low due to the weak polarity of general-purpose polystyrene (GPPS), and the bonding strength is unstable after the photovoltaic diamond wire cutting special backing plate is combined with diamond wire bonding plate glue and stick glue for use.
The invention also aims to provide a preparation method of the novel low-cost special backing plate for the linear cutting of the photovoltaic diamond, which has simple steps.
To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a novel low-cost photovoltaic diamond wire cutting special purpose pad, wherein general purpose polystyrene and impact resistant polystyrene are used as raw materials, and a compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer (hereinafter abbreviated as SBS plastic or SBS resin), and an adhesion promoter thermoplastic polyurethane elastomer (TPU) are added.
The method has the advantages that general-purpose polystyrene GPPS and impact-resistant polystyrene (HIPS) are used as raw materials, a compatible toughening agent of styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer SBS plastic and a strong-polarity material thermoplastic polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems of brittleness, easy cracking, low tensile strength and impact strength and the like of the GPPS/HIPS plastic plate material are effectively solved, the surface polarity of the special plate for photovoltaic diamond wire cutting is obviously improved, the surface adhesive force of the novel low-cost special backing plate for photovoltaic diamond wire cutting is improved, and the adhesive strength of the novel low-cost special backing plate for photovoltaic diamond wire cutting and diamond wire adhesive plate glue and stick glue is obviously improved and stable.
Preferably, the novel low-cost photovoltaic diamond wire cutting special backing plate specifically comprises the following component raw materials:
60-80 parts of general-purpose polystyrene, 20-40 parts of impact-resistant polystyrene, 5-15 parts of styrene-butadiene copolymer K glue or 3-5 parts of styrene-butadiene-styrene block copolymer, and 1-5 parts of thermoplastic polyurethane elastomer.
Preferably, the novel low-cost special backing plate for photovoltaic diamond wire cutting further comprises 0.5-2 parts of stabilizer and 0.5-2 parts of lubricant.
A preparation method of a novel low-cost special backing plate for photovoltaic diamond wire cutting comprises the following steps:
uniformly mixing general-grade polystyrene, impact-resistant polystyrene, styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer, a thermoplastic polyurethane elastomer, a stabilizer and a lubricant, granulating, drying, extruding for molding, and finally calendering, cooling and shaping to obtain the novel low-cost special backing plate for the photovoltaic diamond wire cutting.
Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the extrusion temperature during granulation is 180-200 ℃.
Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the drying is carried out for 10-20 minutes at the temperature of 60-80 ℃.
Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the backing plate is extruded and molded at the temperature of 180-200 ℃.
The invention at least comprises the following beneficial effects:
according to the novel low-cost special backing plate for photovoltaic diamond wire cutting, the general-purpose polystyrene GPPS and the impact-resistant polystyrene HIPS are used as raw materials, the compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer SBS plastic and the strong-polarity material thermoplastic polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems that the GPPS/HIPS plastic plate is brittle and easy to crack, low in tensile strength and impact strength and the like are effectively solved, the surface polarity of the special plate for photovoltaic diamond wire cutting is obviously improved, the surface adhesive force of the novel low-cost special backing plate for photovoltaic diamond wire cutting is improved, and the adhesive strength of the novel low-cost special backing plate for photovoltaic diamond wire cutting and the adhesive strength of the diamond wire adhesive is obviously improved and stable.
The specific gravity of the novel low-cost special backing plate for photovoltaic diamond wire cutting is 1-1.1 g/cm3Shore hardness of 83-85 HD, conductivity<20 mu s/cm, tensile strength of 20-25 Mpa, and shear strength of 4-5 Mpa when the aluminum sheet is bonded.
Compared with various resin plates in the prior art, the novel low-cost special backing plate for photovoltaic diamond wire cutting has the advantages of light specific gravity and low production cost, does not adhere to diamond wires when used for cutting silicon wafers, reduces the adhesion of impurities to the diamond wires, reduces the abrasion probability of the diamond wires, reduces the consumption of the diamond wires, saves the cost, improves the quality rate of the silicon wafers, has the characteristic of facilitating the recovery of silicon materials and GPPS/HIPS plastic plates, and can bring obvious benefits of saving energy consumption, reducing the cost, improving the production efficiency and the like.
The preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting is simple in steps and beneficial to large-scale industrial production.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Detailed Description
The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.
The equipment used in the examples is as follows: a mixer (with a speed-adjustable stirring device), a double-screw extrusion granulator (with an automatic temperature control device, a cooling device and a vacuumizing device), a dryer (with a speed-adjustable stirring device, an automatic temperature control device and a cooling device), and a single-screw extrusion forming machine (with an automatic temperature control device, a cooling device and a vacuumizing device).
Before use, a mixer, a double-screw extrusion granulation machine, a dryer and a single-screw extrusion forming machine are cleaned and wiped clean, and other materials or impurities influencing the reaction are ensured to be avoided.
Example 1
The formula of the novel low-cost special backing plate for the photovoltaic diamond wire cutting comprises the following components: GPPS resin 60, HIPS resin 20, K glue 5, TPU resin 1, stabilizer 0.5 and lubricant 0.5; calculated in kilograms.
Novel manufacturing process of special backing plate for low-cost photovoltaic diamond wire cutting: adding GPPS resin, HIPS resin, K glue, an adhesion promoter TPU, a stabilizer, a lubricant and the like into a mixer, starting the mixer to stir for 10min, taking out the stirred material, sending the stirred material into a double-screw extrusion granulator to extrude and granulate at the temperature of 180 ℃, then putting the granulated material into a dryer to dry for 10min while stirring at the temperature of 60 ℃, taking out the material, sending the material into a single-screw extrusion forming machine to extrude and form at the temperature of 180 ℃, calendering by three rollers, cooling and shaping to obtain the novel special backing plate for low-cost photovoltaic diamond wire cutting, sanding and grinding the surface of the novel special backing plate, cutting the backing plate into a required finished product size, finally detecting the technical indexes such as product specific gravity, Shore hardness, tensile strength, shear strength, conductivity and the like, and packaging the qualified backing plate for later use.
Example 2
The formula of the novel low-cost special backing plate for the photovoltaic diamond wire cutting comprises the following components: GPPS resin 80, HIPS resin 40, K glue 15, TPU resin 5, stabilizer 2 and lubricant 2; calculated in kilograms.
Novel manufacturing process of special backing plate for low-cost photovoltaic diamond wire cutting: adding GPPS resin, HIPS resin, K glue, an adhesion promoter TPU, a stabilizer, a lubricant and the like into a mixer, starting the mixer to stir for 15min, taking out the stirred material, feeding the material into a double-screw extrusion granulator to extrude and granulate at the temperature of 180 ℃ and 200 ℃, then putting the granulated material into a dryer to dry for 20min at the temperature of 80 ℃, taking out the material, feeding the material into a single-screw extrusion forming machine to extrude and form at the temperature of 200 ℃, carrying out three-roller calendering, cooling and shaping to obtain the novel low-cost special backing plate for photovoltaic diamond wire cutting, sanding and polishing the surface, cutting the backing plate into a required finished product size, finally detecting the technical indexes such as specific gravity, hardness, tensile strength, shear strength, conductivity and the like of the product, and packaging the qualified backing plate for later use.
Example 3
The formula of the novel low-cost special backing plate for the photovoltaic diamond wire cutting comprises the following components: GPPS resin 70, HIPS resin 30, K glue 10, TPU resin 3, stabilizer 1 and lubricant 1; calculated in kilograms.
Novel manufacturing process of special backing plate for low-cost photovoltaic diamond wire cutting: adding GPPS resin, HIPS resin, K glue, an adhesion promoter TPU, a stabilizer, a lubricant and the like into a mixer, starting the mixer to stir for 10min, taking out the stirred material, sending the material into a double-screw extrusion granulator to extrude and granulate at 190 ℃, then putting the granulated material into a dryer to dry for 15min at 70 ℃, sending the material into a single-screw extrusion forming machine to extrude and form at 190 ℃, carrying out three-roller calendering, cooling and shaping to obtain the novel special backing plate for low-cost photovoltaic diamond wire cutting, sanding and polishing the surface of the novel special backing plate to obtain the required finished product size, finally detecting the technical indexes of product specific gravity, hardness, tensile strength, shearing strength, conductivity and the like, and packaging the qualified finished product for later use.
Example 4
The formula of the novel low-cost special backing plate for the photovoltaic diamond wire cutting comprises the following components: GPPS resin 60, HIPS resin 20, SBS resin 3, TPU resin 1, stabilizer 0.5 and lubricant 0.5; calculated in kilograms.
Novel manufacturing process of special backing plate for low-cost photovoltaic diamond wire cutting: adding GPPS resin, HIPS resin, SBS resin, adhesion promoter TPU, stabilizer, lubricant and the like into a mixer, starting the mixer to stir for 10min, taking out the stirred material, feeding the material into a double-screw extrusion granulator to extrude and granulate at 180 ℃, then putting the granulated material into a dryer to dry for 10min at 60 ℃, feeding the material into a single-screw extrusion moulding machine to extrude and mould at 180 ℃, calendering by three rollers, cooling and shaping to obtain the novel special backing plate for low-cost photovoltaic diamond wire cutting, sanding and polishing the surface, cutting into required finished product size, finally detecting technical indexes such as product specific gravity, hardness, tensile strength, shearing strength and conductivity, and packaging for later use after qualification.
Example 5
The formula of the novel low-cost special backing plate for the photovoltaic diamond wire cutting comprises the following components: GPPS resin 80, HIPS resin 40, SBS resin 5, TPU resin 5, stabilizer 2 and lubricant 2; calculated in kilograms.
Novel manufacturing process of special backing plate for low-cost photovoltaic diamond wire cutting: adding GPPS resin, HIPS resin, SBS resin, adhesion promoter TPU, stabilizer, lubricant and the like into a mixer, starting the mixer to stir for 15min, taking out the stirred material, sending the stirred material into a double-screw extrusion granulator to extrude and granulate at the temperature of 200 ℃, then putting the granulated material into a dryer to dry for 20min at the temperature of 80 ℃, sending the material into a single-screw extrusion forming machine to extrude and form at the temperature of 200 ℃, rolling by three rollers, cooling and shaping to obtain the novel special backing plate for low-cost photovoltaic diamond wire cutting, sanding and polishing the surface to obtain the required finished product size, finally detecting the technical indexes of product specific gravity, hardness, tensile strength, shear strength, conductivity and the like, and packaging for later use after the product is qualified.
Data analysis
Technical indexes of specific gravity, shore strength, electrical conductivity, tensile strength and shear strength of bonding with an aluminum sheet of the novel low-cost photovoltaic diamond wire cutting special backing plate prepared in examples 1 to 5 are respectively recorded, and the results are shown in table 1 below.
TABLE 1
As can be seen from the above Table 1, the specific gravity of the novel special pad plate for low-cost photovoltaic diamond wire cutting prepared in the embodiments 1 to 5 is 1 to 1.1g/cm3Shore hardness of 83-85 HD, conductivity<20 mu s/cm, tensile strength of 20-25 Mpa, shear strength of 4-5 Mpa for bonding with the aluminum sheet, and qualified technical indexes.
While embodiments of the invention have been disclosed above, it is not intended to be limited to the uses set forth in the specification and examples. It can be applied to all kinds of fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art.
Claims (7)
1. A novel low-cost special backing plate for photovoltaic diamond wire cutting is prepared from general-purpose polystyrene and impact-resistant polystyrene as raw materials, as well as styrene-butadiene copolymer (K) adhesive or styrene-butadiene-styrene block copolymer as compatible toughening agent and thermoplastic polyurethane elastomer as adhesion promoter.
2. The novel special pad for low-cost photovoltaic diamond wire cutting as claimed in claim 1, wherein the special pad specifically comprises the following raw materials:
60-80 parts of general-purpose polystyrene, 20-40 parts of impact-resistant polystyrene, 5-15 parts of styrene-butadiene copolymer K glue or 3-5 parts of styrene-butadiene-styrene block copolymer, and 1-5 parts of thermoplastic polyurethane elastomer.
3. The novel special backing plate for low-cost photovoltaic diamond wire cutting as claimed in claim 2, further comprising 0.5-2 parts of stabilizer and 0.5-2 parts of lubricant.
4. The preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting as claimed in any one of claims 1 to 3, wherein the method comprises the following steps:
uniformly mixing general-grade polystyrene, impact-resistant polystyrene, styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer, a thermoplastic polyurethane elastomer, a stabilizer and a lubricant, granulating, drying, extruding for molding, and finally calendering, cooling and shaping to obtain the novel low-cost special backing plate for the photovoltaic diamond wire cutting.
5. The preparation method of the novel special pad plate for the low-cost photovoltaic diamond wire cutting as claimed in claim 4, wherein the extrusion temperature during the granulation is 180-200 ℃.
6. The preparation method of the novel low-cost special backing plate for the wire-electrode cutting of photovoltaic diamond as claimed in claim 4, wherein the drying is carried out for 10-20 minutes at 60-80 ℃.
7. The preparation method of the novel low-cost special backing plate for the wire-electrode cutting of photovoltaic diamond as claimed in claim 4, wherein the extrusion molding is carried out at the temperature of 180-200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911067346.2A CN110804257A (en) | 2019-11-04 | 2019-11-04 | Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911067346.2A CN110804257A (en) | 2019-11-04 | 2019-11-04 | Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof |
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| CN110804257A true CN110804257A (en) | 2020-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911067346.2A Pending CN110804257A (en) | 2019-11-04 | 2019-11-04 | Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof |
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| CN104086911A (en) * | 2014-07-14 | 2014-10-08 | 东莞市德诚塑化科技有限公司 | Transparent impact-resistance polystyrene and preparation method thereof |
| CN105965710A (en) * | 2016-06-28 | 2016-09-28 | 常州大学 | Preparation method and application of resin plate for diamond wire cutting of silicon bar |
| CN107652657A (en) * | 2017-08-08 | 2018-02-02 | 江阴市嘉宇光伏材料有限公司 | A kind of polydiphenyl ether plastics plate available for Buddha's warrior attendant wire cutting and preparation method thereof |
| CN110317427A (en) * | 2019-07-03 | 2019-10-11 | 南宁珀源能源材料有限公司 | Novel special backing plate of photovoltaic buddha's warrior attendant wire-electrode cutting |
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2019
- 2019-11-04 CN CN201911067346.2A patent/CN110804257A/en active Pending
Patent Citations (4)
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|---|---|---|---|---|
| CN104086911A (en) * | 2014-07-14 | 2014-10-08 | 东莞市德诚塑化科技有限公司 | Transparent impact-resistance polystyrene and preparation method thereof |
| CN105965710A (en) * | 2016-06-28 | 2016-09-28 | 常州大学 | Preparation method and application of resin plate for diamond wire cutting of silicon bar |
| CN107652657A (en) * | 2017-08-08 | 2018-02-02 | 江阴市嘉宇光伏材料有限公司 | A kind of polydiphenyl ether plastics plate available for Buddha's warrior attendant wire cutting and preparation method thereof |
| CN110317427A (en) * | 2019-07-03 | 2019-10-11 | 南宁珀源能源材料有限公司 | Novel special backing plate of photovoltaic buddha's warrior attendant wire-electrode cutting |
Non-Patent Citations (1)
| Title |
|---|
| 吕英斌: ""冰箱用高韧性高强度高光泽聚苯乙烯共混合金的制备和性能研究"", 《北京化工大学硕士学位论文》 * |
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