CN110785035A

CN110785035A - Shell of electronic equipment and manufacturing method of shell

Info

Publication number: CN110785035A
Application number: CN201911000636.5A
Authority: CN
Inventors: 吴伟杰; 赵梦龙; 何谦; 张斌
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-02-11

Abstract

The application provides a shell of electronic equipment and a manufacturing method of the shell, wherein the shell is used for the electronic equipment and comprises a plastic lining and a shell, the shell comprises a frame and a back plate located at an open end of the frame, one of the frame and the back plate is made of metal, and the other is made of ceramic. In order to increase the reliability of the combination of the frame, the backboard and the plastic lining, and avoid the easy glue-off and falling off of the frame, the backboard and the plastic lining after being connected, the integrated structures formed by nanometer injection molding are arranged between the plastic lining and the frame and between the plastic lining and the backboard, namely the integrated structure formed by nanometer injection molding is arranged between the plastic lining and the shell. And in the casing of integral type structure, the cohesion between frame and backplate and the plastic inside lining is all bigger, therefore, can avoid frame and backplate and plastic inside lining to be connected the problem that the back is split easily and is glued and drop, improves the reliability that frame and backplate and plastic inside lining combine.

Description

Shell of electronic equipment and manufacturing method of shell

Technical Field

The present disclosure relates to the field of electronic device accessory technologies, and in particular, to a housing of an electronic device and a method for manufacturing the housing.

Background

Electronic equipment's casing includes frame, backplate and inside lining usually, and the inside lining is the plastic material usually, and one of frame and the backplate is the metal material, and another is the ceramic material, during the equipment, frame and backplate and inside lining bonding or joint are in order to constitute the casing, however, when frame and backplate and inside lining bonding or joint, relatively poor with the inside lining associativity of plastic material, take place easily between frame and backplate and the inside lining that use above-mentioned electronic equipment at the user and split to glue and drop.

Disclosure of Invention

The application provides an electronic equipment's casing to avoid frame and backplate to be connected the back and split easily and drop with the inside lining, improve the reliability that frame and backplate and inside lining combine.

In a first aspect, the present application specifically provides a housing for an electronic device, where the housing is used for an electronic device, and includes a plastic liner and a housing, and specifically, the housing further includes a frame and a back plate located at an open end of the frame, where one of the frame and the back plate is made of a metal material, and the other is made of a ceramic material. In order to increase the reliability that frame and backplate and plastic inside lining combine, avoid frame and backplate and plastic inside lining to be connected the back and split easily and drop, in this embodiment, all have the nanometer between plastic inside lining and the frame and between plastic inside lining and the backplate and mould plastics the integral type structure that forms, have the nanometer between plastic inside lining and the shell promptly and mould plastics the integral type structure that forms. And in the casing of integral type structure, the cohesion between frame and backplate and the plastic inside lining is all bigger, therefore, can avoid frame and backplate and plastic inside lining to be connected the problem that the back is split easily and is glued and drop, improves the reliability that frame and backplate and plastic inside lining combine.

In one implementation mode, in order to increase the buffering between the frame and the backboard, the part made of the ceramic material is prevented from being broken when falling, when the frame and the backboard are specifically arranged, the joint of the frame and the backboard can be provided with the buffering body, and the buffering body is attached to the frame and the backboard. The buffer body is attached to the frame and the backboard at the joint of the frame and the backboard, namely the buffer body blocks the gap at the joint of the frame and the backboard, so that the buffer body plays a role in buffering. Simultaneously, the setting of buffering body also can prevent that the nanometer from moulding plastics when forming the plastic inside lining that the plastic spills over the outward appearance face of casing, can also prevent that external dust etc. from getting into the inboard of casing.

When the buffering body is specifically arranged, the frame may have a first step surface for matching with the back plate, a connection surface is formed at one end of the back plate connected with the frame, and the buffering body is located between the first step surface and the connection surface. The first step surface comprises a first wall surface and a second wall surface which are intersected and form an angle with each other, and in one implementation mode, the buffer body can be positioned between the first wall surface and the back plate; in another implementation manner, the buffer body may be located between the second wall surface and the back plate; in another implementation, a buffer may be disposed between each of the first wall and the second wall and the back plate. When the buffer body is positioned between the first wall surface and the back plate or between the second wall surface and the back plate, the buffer function can be achieved, and the arrangement is simple and convenient; when all having the buffer between first wall and second wall and the backplate, the buffer all can play the cushioning effect between the two contact surfaces of frame and backplate, and the cushioning effect is better.

The specific structure of the buffer body is not limited, and in a specific technical scheme, the buffer body may include a double-sided adhesive tape adhered to the frame; in another specific technical scheme, the buffer body can comprise a glue layer coated on the frame, and the double-sided glue and the glue layer are used as the buffer body, so that the operation is simple and easy to operate during setting; in another specific technical scheme, the buffer body may include a plastic layer, and the plastic layer and the frame may have an integrated structure formed by nano injection molding in order to increase a bonding force between the plastic layer and the frame.

In order to further increase the binding force between the back plate and the plastic lining, in a specific technical scheme, the back plate is provided with an inverted buckle structure facing the plastic lining, the plastic lining is provided with a clamping hook hermetically matched with the inverted buckle structure, and the back plate and the plastic lining are integrally connected and clamped with the clamping hook, so that the binding force between the back plate and the plastic lining is further increased.

In order to further increase the bonding force between the frame and the plastic lining, in a specific technical scheme, one end of the frame, which is far away from the joint of the frame and the back plate, is provided with a second step surface used for being matched with the plastic lining, and the plastic lining is provided with a first bulge part used for being in sealing fit with the second step surface; in another concrete technical scheme, the frame is formed with a plurality of depressed parts towards the surface of plastic inside lining, perhaps, the frame is formed with a plurality of second bellyings towards the surface of plastic inside lining, perhaps, the frame is formed with a plurality of depressed parts and a plurality of second bellyings simultaneously towards the surface of plastic inside lining, among several kinds of above-mentioned technical scheme, all increased the combination area of frame and plastic inside lining, therefore can increase the cohesion between frame and the plastic inside lining.

In a second aspect, the application provides a manufacturing method of the housing, in the technical scheme, when the housing is manufactured, the frame and the back plate can be spliced firstly, then the spliced frame and the spliced back plate are placed into a mold for plastic nano injection molding, and a plastic lining is integrally formed on the inner sides of the frame and the back plate. The casing structure as an organic whole that adopts this technical scheme preparation, the cohesion between frame and backplate and the plastic inside lining is all bigger, therefore, can avoid frame and backplate and plastic inside lining to be connected the problem that the back is split easily and is glued and drop, improves the reliability that frame and backplate and plastic inside lining combine. In one implementation, in order to increase the buffer between the frame and the back plate, a buffer body may be formed at a portion of the frame for splicing with the back plate before splicing the frame and the back plate.

The specific mode of forming the buffer body on the frame is not limited, in a specific technical scheme, a plastic layer can be formed on the frame or the back plate through injection molding by a plastic nano injection molding process to form the buffer body, the plastic layer is formed on the frame or the back plate through nano injection molding, and the corresponding frame or the back plate and the plastic layer are of an integral structure and have stronger bonding force; in another specific technical scheme, glue can be coated on the part of the frame for splicing with the backboard or the part of the backboard for splicing with the frame to form the buffer body, double-faced adhesive tape can be adhered on the part of the frame for splicing with the backboard or the part of the backboard for splicing with the frame to form the buffer body, the glue layer or the double-faced adhesive tape is used as the buffer body, and the buffer body is more conveniently arranged on the corresponding frame or backboard.

Drawings

FIG. 1 is an exploded view of a prior art housing;

FIG. 2 is a schematic view of a housing and a plastic liner in accordance with an embodiment of the present disclosure;

FIG. 3 is a schematic view of the embodiment of FIG. 2 showing another angle of the housing and the plastic liner;

FIG. 4 is a schematic view of a housing and a plastic liner of another embodiment of the present application;

FIG. 5 is a schematic view of a housing and a plastic liner of another embodiment of the present application;

FIG. 6 is a schematic view of a housing and a plastic liner of another embodiment of the present application;

FIG. 7 is an exploded view of the outer shell and plastic liner of FIG. 6;

FIG. 8 is a schematic view of a back plate and a plastic liner in accordance with an embodiment of the present disclosure;

FIG. 9 is a schematic view of a configuration of a frame and a plastic liner according to an embodiment of the present disclosure;

fig. 10 is a flowchart illustrating a method for manufacturing a housing according to an embodiment of the present disclosure.

Reference numerals:

1-a housing;

11-a frame;

111-a first step face;

1111-a first wall;

1112-a second wall;

112-a second step surface;

1121-third wall surface;

1122-fourth wall;

12-a back plate;

121-attachment face;

122-a flip-flop structure;

1201-first part;

1202-second section;

2-plastic lining;

21-hook;

22-a first boss;

3-buffer body.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

The shell is an important component of electronic equipment such as a mobile phone and a tablet personal computer, and can effectively protect internal elements of the electronic equipment so as to prolong the service life of the electronic equipment. In the prior art, as shown in fig. 1, the casing generally includes a frame 11, a back plate 12 connected to an open end of the frame 11, and a plastic lining 2 disposed inside the frame 11 and the back plate 12, specifically, one of the frame 11 and the back plate 12 is made of metal, and the other is made of ceramic, for example: the frame 11 is made of metal and the back plate 12 is made of ceramic, or the frame 11 is made of ceramic and the back plate 12 is made of metal. Frame 11, backplate 12 and plastic inside lining 2 adopt and divide a design, bond or detain the position connection through glue between the part, and frame 11 and backplate 12 are all relatively poor with plastic inside lining 2's combination reliability in above-mentioned two kinds of connected modes, and in electronic equipment's use, take place easily between the part of inter combination in the casing to split to glue and drop. In order to solve the above problems, the present application provides a housing of an electronic device and a method for manufacturing the housing, and the following describes embodiments of the present application in detail with reference to the accompanying drawings.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of this application and the appended claims, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

The shell provided by the embodiment of the application can be applied to electronic equipment, and the electronic equipment can be a mobile phone, a notebook computer or a tablet computer and the like. Referring to fig. 2 and 3, the housing provided in the embodiment of the present application includes an outer shell 1 and a plastic liner 2 located inside the outer shell 1, wherein, the shell 1 comprises a frame 11 with an opening and a back plate 12 positioned at the opening end of the frame 11, one of the frame 11 and the back plate 12 is a metal component, the other is a ceramic component, in particular, in order to enhance the reliability of the combination between the frame 11 and the back plate 12 and the plastic lining 2 in the housing and avoid the situation that the frame 11 and the back plate 12 are easy to be separated from the plastic lining 2 after being connected, in the embodiment, the plastic lining 2 and the frame 11 and the plastic lining 2 and the back plate 12 are integrated structures formed by nano injection molding, under the structure, the binding force between the frame 11 and the back plate 12 and the plastic liner 2 is larger, the binding reliability is stronger, therefore, the situation that the frame 11 and the back plate 12 are easy to be separated from the plastic liner 2 after being connected can be avoided.

One of the frame 11 and the back plate 12 is a ceramic member, which is easily broken when colliding with the outside, and in order to protect the ceramic member, in one implementation, as shown in fig. 4, a buffer body 3 may be disposed at the joint of the ceramic components that easily collide with the outside during the assembly process of the housing 1, namely, the buffer body 3 is arranged at the joint of the frame 11 and the back plate 12, so as to increase the buffer between the frame 11 and the back plate 12, thereby avoiding the parts made of ceramic materials from cracking when falling, obviously, the buffer body 3 is jointed with the frame 11 and the back plate 12, the buffer body 3 is jointed with the frame 11 and the back plate 12, so that the buffer body 3 can seal the gap at the joint of the frame 11 and the back plate 12, make the buffer 3 also can avoid the nanometer to spill over the outward appearance face of casing when moulding plastics when playing the cushioning effect, prevent simultaneously that outside dust etc. from getting into inside the casing.

In this embodiment, the position of the buffer 3 is not limited, please refer to fig. 4 again, the frame 11 has a first wall 1111 and a second wall 1112 which are mutually angled and intersect, the first wall 1111 and the second wall 1112 form a first step surface 111 for cooperating with the backplate 12, the buffer 3 can be located between the first wall 1111 and the backplate 12, at this time, a surface of the backplate 12 opposite to the first wall 1111 at the end for connecting with the frame 11 is a connection surface 121, in another implementation manner, as shown in fig. 5, the buffer 3 can be located between the second wall 1112 and the backplate 12, at this time, a surface of the backplate 12 opposite to the second wall 1112 at the end for connecting with the frame 11 is a connection surface 121, and the connection surface 121 can be parallel to the second wall 1112; in another implementation, as shown in fig. 6, the buffer 3 may be L-shaped, and the buffer 3 is disposed between the first wall 1111 and the second wall 1112 and the back plate 12, in this case, the end of the back plate 12 connected to the frame 11 is the connecting surface 121 opposite to the first wall 1111 and the second wall 1112. When the buffer 3 is located between the first wall 1111 or the second wall 1112 and the back plate 12, the setting is more convenient, and when the buffer 3 is located between the first wall 1111 and the back plate 12 and between the second wall 1112 and the back plate 12, the buffer 3 is isolated at the contact position between the frame 11 and the back plate 12, so that the buffering effect is better. Specifically, the first wall 1111 may be perpendicular to the second wall 1112.

The specific structure of the buffer body 3 is not limited, and in a specific technical scheme, the buffer body 3 may be a double-sided adhesive tape adhered to the frame 11 or the back plate 12; in another specific technical scheme, the buffer body 3 may be a glue layer coated on the frame 11 or the back plate 12, that is, the double-sided glue and the glue layer may be used as the buffer body 3; in another specific technical solution, the buffer body 3 may include a plastic layer, and in order to increase the bonding force between the plastic layer and the bonding portion, an integrated structure formed by nano injection molding may be provided between the plastic layer and the frame 11 or the back plate 12, that is, the plastic layer and the frame 11 or the back plate 12 are integrated.

As shown in fig. 7, when the back plate 12 is specifically disposed, in order to further increase the bonding force between the back plate 12 and the plastic liner 2 and further increase the bonding force between the housing 1 and the plastic liner 2, in one implementation manner, one side of the back plate 12 facing the plastic liner 2 may have an inverted structure 122, the plastic liner 2 has a hook 21 hermetically matched with the inverted structure 122, and on the basis of the integrated structure of the back plate 12 and the plastic liner 2, the inverted structure 122 is connected with the hook 21 in a clamping manner, so that the bonding area between the back plate 12 and the plastic liner 2 is larger and the bonding force is larger. Specifically, the back plate 12 may include a first portion 1201 at the open end of the frame 11 and a second portion 1202 at the same end as one side of the frame 11, and the first portion 1201 and the second portion 1202 are integrally connected. With reference to fig. 7, in a specific embodiment, the inverse-buckled structure 122 may be located at an end of the second portion 1202 of the back plate 12 away from the first portion 1201, and in other embodiments, as shown in fig. 8, the inverse-buckled structure 122 may also be located at other positions of the second portion 1202 or at the first portion 1201; the hook 21 is disposed corresponding to the inverted structure 122.

In order to further increase the coupling force between the frame 11 and the plastic liner 2 and further increase the coupling force between the housing 1 and the plastic liner 2, as shown in fig. 9, in a specific embodiment, an end of the frame 11 away from the joint with the back plate 12 has a third wall 1121 and a fourth wall 1122 that form an angle and intersect with each other, the third wall 1121 and the fourth wall 1122 form a second step 112 for being engaged with the plastic liner 2, the plastic liner 2 has a first protrusion 22 for being sealingly engaged with the second step 112, and specifically, the third wall 1121 may be perpendicular to the fourth wall 1122. In another specific embodiment, the surface of the frame 11 facing the plastic liner 2 may be formed with a plurality of concave portions (not shown), or a plurality of second protrusions (not shown), or a plurality of recesses and a plurality of second protrusions are formed on the surface of the frame 11 facing the plastic liner 2, the plastic liner 2 is formed on the inner sides of the frame 11 and the back plate 12 by nano-injection molding, the injection molding material, i.e., the plastic, is bonded to the inner walls of the frame 11 and the back plate 12 without any gap, so that, when the surface of the frame 11 facing the plastic liner 2 is formed with the concave portion and/or the second convex portion, when the plastic liner 2 is formed on the frame 11, it forms a structure matching with the corresponding concave part and/or second convex part, therefore, the bonding area between the plastic liner 2 and the frame 11 can be increased, and the bonding force between the plastic liner 2 and the housing 1 can be increased.

As shown in fig. 10, based on the same technical concept, the present application provides a manufacturing method for manufacturing the housing, and specifically, when the housing is manufactured by using the manufacturing method, the manufacturing method includes step S102: splicing the back plate 12 at the opening of the frame 11; step S103: and placing the spliced frame 11 and the back plate 12 into a mold for plastic nano injection molding, so that the plastic liner 2 is integrally formed on the inner sides of the frame 11 and the back plate 12, and the shell is prepared. The shell manufactured by the method is of an integral structure, and the binding force between the frame 11 and the plastic lining 2 and the binding force between the back plate 12 and the plastic lining 2 are larger, so that the problem that the frame 11 and the back plate 12 are easy to glue and fall off after being connected with the plastic lining 2 can be avoided, and the reliability of the binding between the frame 11 and the plastic lining 2 and the reliability of the back plate 12 and the plastic lining 2 are improved. In order to increase the buffer between the bezel 11 and the back panel 12, before step S102, step S101 may be further performed: the cushion body 3 is formed at a portion of the frame 11 for joining with the back plate 12, and there are various methods for forming the cushion body 3 on the frame 11, for example: a plastic layer can be formed on the frame 11 by injection molding through a plastic nano injection molding process to form the buffer body 3, glue can be coated on the part of the frame 11 for splicing with the back plate 12 to form the buffer body 3, and double-sided adhesive can be adhered to the part of the frame 11 for splicing with the back plate 12 to form the buffer body 3; the buffer body 3 is formed on the frame 11 by injection molding through a plastic nano injection molding process, the formed buffer body 3 and the frame 11 are of an integral structure, and the binding force between the buffer body 3 and the frame 11 is stronger; the buffer body 3 is formed by coating glue on the frame 11 or attaching a double-sided tape, so that the buffer body 3 can be more easily installed.

In still other embodiments, the buffer body 3 may be formed at a portion of the back plate 12 for splicing with the frame 11, and there may be a plurality of methods for forming the buffer body 3 on the back plate 12, for example: the buffer body 3 can be formed by injection molding a plastic layer on the back plate 12 through a plastic nano injection molding process, the buffer body 3 can be formed by coating glue on the part of the back plate 12 for splicing with the frame 11, and the buffer body 3 can be formed by sticking double-sided glue on the part of the back plate 12 for splicing with the frame 11.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a casing of electronic equipment which characterized in that, includes the shell and is located the inboard plastic inside lining of shell, wherein, the shell includes frame and backplate, frame with one of backplate is the metal part, and another is ceramic part, the plastic inside lining with the shell has the integral type structure that the nanometer was moulded plastics and is formed.

2. The shell as claimed in claim 1, wherein a buffer body is provided at the junction of the frame and the back plate, and the buffer body is attached to the frame and the back plate.

3. The housing of claim 2, wherein the buffer comprises a double-sided tape or a glue layer.

4. The housing of claim 2, wherein the buffer body comprises a plastic layer, and the plastic layer and the frame have a nano-injection molded integral structure.

5. The housing according to any one of claims 2 to 4, wherein the rim has a first step surface for engaging with the back plate, the back plate is connected to the rim at an end thereof to form a connection surface, and the buffer is located between the first step surface and the connection surface.

6. The housing of any one of claims 1-5, wherein the back plate has an inverted structure facing the plastic liner, the plastic liner having a hook sealingly engaging the inverted structure.

7. The housing of any one of claims 1 to 6, wherein an end of the rim remote from the intersection with the backplate has a second step surface for engaging with the plastic liner, the plastic liner having a first protrusion for sealing engagement with the second step surface.

8. The housing according to any of claims 1 to 6, wherein the surface of the rim facing the plastic inner liner is formed with a plurality of recesses and/or second protrusions.

9. A method of making a housing as claimed in any one of claims 1 to 8, comprising

Splicing the frame and the back plate;

and (3) placing the spliced frame and the spliced back plate into a mold for plastic nano injection molding, and integrally forming a plastic lining on the inner sides of the frame and the back plate.

10. The method of claim 9, further comprising, before the splicing the bezel and the back plate:

and a buffer body is formed at the part of the frame for splicing with the back plate.

11. The method of claim 10, wherein forming a buffer on the frame comprises:

and injection molding a plastic layer on the frame by a plastic nano injection molding process to form the buffer body.

12. The method of claim 10, wherein forming a buffer on the frame comprises:

glue is coated on the part of the frame for splicing with the back plate to form a buffer body; alternatively, the first and second electrodes may be,

and a double-faced adhesive tape is adhered to the part of the frame for splicing with the back plate to form a buffer body.