CN110773832A - Eutectic welding device and application thereof - Google Patents
Eutectic welding device and application thereof Download PDFInfo
- Publication number
- CN110773832A CN110773832A CN201911058217.7A CN201911058217A CN110773832A CN 110773832 A CN110773832 A CN 110773832A CN 201911058217 A CN201911058217 A CN 201911058217A CN 110773832 A CN110773832 A CN 110773832A
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- CN
- China
- Prior art keywords
- eutectic
- gas
- working area
- bonding device
- eutectic bonding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An eutectic bonding device and applications thereof, the eutectic bonding device comprising: the upper surface of the hot table is provided with an eutectic working area; the gas nozzle is arranged above the eutectic working area, is provided with an exhaust hole, faces the eutectic working area and is used for blowing protective gas to the eutectic working area; the support frame is arranged between the gas spray head and the hot table and is used for fixedly connecting the gas spray head with the hot table; the support frame is internally provided with a through cavity, and the cavity is communicated with the gas nozzle to form a path for conveying shielding gas to the gas nozzle. The invention provides a gas nozzle arranged on a hot table and used for blowing the eutectic working area, so that the effect of gas protection is achieved, the phenomenon that solder is oxidized due to the contact with air is avoided, the gas nozzle is suitable for eutectic welding of small-scale chips, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of eutectic welding of chips, in particular to an eutectic welding device and application thereof.
Background
Eutectic welding is also called low-melting-point alloy welding, is a common welding technology in the field of chip welding, and is widely applied to the field of electronic packaging. At present, a vacuum and controllable atmosphere eutectic furnace can realize eutectic without using soldering flux, has the functions of vacuumizing and filling inert gas, and is suitable for large-scale eutectic welding. Most of the existing small eutectic welding heating platforms are simple in structure and lack of a gas protection device, and solder easily contacts with air in the eutectic welding process to cause oxidation, so that the eutectic effect is finally influenced. Therefore, the eutectic furnace is expensive, is not suitable for small-scale chip eutectic bonding, and is lack of a gas protection device in the traditional heat station suitable for small-scale chip eutectic bonding.
Disclosure of Invention
In view of the above, the present invention is directed to a eutectic soldering device and an application thereof, which are designed to at least partially solve at least one of the above-mentioned problems.
To achieve the above object, as one aspect of the present invention, there is provided a eutectic bonding device including:
the upper surface of the hot table is provided with an eutectic working area;
the gas nozzle is arranged above the eutectic working area, is provided with an exhaust hole, faces the eutectic working area and is used for blowing protective gas to the eutectic working area;
the support frame is arranged between the gas spray head and the hot table and is used for fixedly connecting the gas spray head with the hot table;
the support frame is internally provided with a through cavity, and the cavity is communicated with the gas nozzle to form a path for conveying shielding gas to the gas nozzle.
As another aspect of the invention, the invention also provides an application of the eutectic welding device in the eutectic welding field of chips
Based on the technical scheme, the invention at least has one or part of the following beneficial effects:
(1) in consideration of the problem that the eutectic welding process is easy to oxidize due to the fact that solder is easy to contact with air to affect the eutectic effect, the invention provides that a gas nozzle is arranged on a hot table and used for blowing the eutectic working area, so that the effect of gas protection is achieved, and the phenomenon that the solder and the metal corner of the chip are oxidized due to the fact that the solder and the metal corner of the chip contact with air is avoided, so that the eutectic welding process is suitable for the eutectic welding of small-scale chips, and the production;
(2) the gaseous safety cover of gas shower nozzle dustcoat cooperatees with gas shower nozzle, and gas shower nozzle exhaust protective gas is used for sweeping the air on the one hand, avoids solder and air contact and causes the oxidation, and the gaseous safety cover of on the other hand plays isolated air's effect, reaches duplicate protection's effect with gas shower nozzle.
Drawings
FIG. 1 is a schematic view of an internal structure of a eutectic bonding device according to an embodiment of the present invention;
FIG. 2 is a schematic view of an overall structure of a eutectic bonding device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a gas showerhead according to an embodiment of the present invention.
In the above drawings, the reference numerals have the following meanings:
1. heating the platform; 11. a temperature adjusting knob; 12. a gas flow knob; 13. a heat insulating pad; 14. a eutectic working area; 15. a hot table groove; 2. a gas shower; 21. a fixing hole; 22. an exhaust hole; 23. an illuminating lamp; 24. a support frame; 25. an air inlet; 26. a rubber gasket; 3. a gas-tight enclosure; 31. a transparent top; 32. an operation port; 33. a handle; 4. a microscope; 5. wrist pad.
Detailed Description
In an embodiment of the present invention, there is provided a eutectic bonding device, as shown in fig. 1, including:
a eutectic working area is arranged on the upper surface of the heating table;
the gas nozzle is arranged above the eutectic working area, is provided with an exhaust hole facing the eutectic working area and is used for blowing protective gas to the eutectic working area;
the support frame is arranged between the gas spray head and the hot table and is used for fixedly connecting the gas spray head with the hot table;
wherein, the support frame is internally provided with a through cavity which is communicated with the gas nozzle to form a path for conveying the protective gas to the gas nozzle.
In the embodiment of the invention, the technical effects are achieved as follows: the gas nozzle is arranged on the hot table and used for blowing the eutectic working area, so that a gas protection effect is provided, and the phenomenon that the solder is oxidized due to the contact with air is avoided, so that the method is suitable for eutectic welding of small-scale chips.
In some embodiments of the invention, a base is arranged at one end of the support frame connected with the hot table, and a fixing hole is arranged on the base and used for fixing the base with the hot table; wherein, the hot platform is connected in the fixed orifices through the screw bolt between the base.
In some embodiments of the present invention, the base is further provided with an air inlet hole communicated with the cavity, and the hot stage is provided with an air outlet hole communicated with the air inlet hole corresponding to the air inlet hole, so as to form a delivery end for delivering the shielding gas to the gas nozzle.
It is worth mentioning that in some preferred embodiments of the present invention, a rubber gasket is installed between the air inlet hole and the air outlet hole of the heat stage, and mainly functions to ensure the air tightness of the connection between the heat stage and the base.
The protective gas may be an inert gas, but is not limited thereto, and may also be nitrogen, which is selected according to the actual situation. And the flow of the protective gas is adjusted through a gas flow knob arranged on the hot table, so that the operation is simple and convenient.
In some embodiments of the invention, the gas shower is provided in a tubular shape, and the plurality of exhaust holes are arranged in an axial array along the gas shower; the arrangement of a plurality of exhaust holes ensures that the sweeping action area is large and the protection effect is good.
Wherein, the gas nozzle is also provided with a lighting lamp. The illumination lamp may be, but is not limited to, an LED lamp. The light is used for lightening the eutectic workspace, and is convenient for observation and welding operation.
In some embodiments of the invention, a gas-shielded enclosure is disposed above the corresponding eutectic operating region, the gas-shielded enclosure having a transparent top for viewing the eutectic operating region within the gas-shielded enclosure; among them, it is worth mentioning that the transparent top is preferably flat to facilitate better penetration and avoid deformation of the visible object due to excessive convexity.
Wherein, the symmetrical two sides of the gas protection cover are respectively provided with an operation opening for welding;
wherein, the side wall of the gas protection cover is also provided with a handle; the gas protection cover is convenient to take away at high temperature so as to rapidly cool the hot platform.
In some embodiments of the present invention, a heat block groove is disposed at the periphery of the eutectic working area of the heat block for matching and embedding with the bottom of the gas shield.
In some embodiments of the invention, the two sides of the heat station are provided with backing plates corresponding to the operation openings, and the backing plates are made of plastic materials. It can be understood that the backing plate is made of plastic materials, so that the cost is reduced.
In some embodiments of the invention, a microscope is positioned over the corresponding transparent top of the gas shield, the microscope being connected to the hot stage by a mounting bracket.
It is worth mentioning that the microscope does not directly emit a light source, so as to avoid emitting light above the gas shield which influences the eutectic operation.
In some embodiments of the present invention, a heat insulation pad is disposed on the upper surface of the heat block corresponding to the eutectic working area for adjusting the temperature of the eutectic working area and preventing the temperature of the eutectic working area from being too high.
As another aspect of the invention, the invention also provides an application of the eutectic bonding device in the eutectic bonding field of chips.
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
Examples
In the embodiment of the invention, a heating table and a gas protection device suitable for eutectic bonding of chips are provided, as shown in fig. 1, the device comprises a heating table for eutectic bonding, and the heating table 1 is provided with a temperature adjusting knob 11 and a gas flow knob 12 which have the functions of adjusting temperature and gas flow. The upper surface of the heating platform 1 is provided with a layer of heat insulation pad 13, the heat insulation pad 13 is made of polyimide, the middle part of the heat insulation pad 13 is a cuboid, and the cuboid is a chip eutectic area 14. The upper part of the heating table 1 is provided with a heating table air outlet.
As shown in fig. 2 and 3, a thermal station and gas shield apparatus suitable for eutectic die bonding includes a gas showerhead 2 having an array of gas vents 22. The gas nozzle 2 is arranged above the hot platform 1, and inert gas or nitrogen is exhausted through the exhaust hole 22 to form gas protection for the eutectic working area 14. The gas spray head 2 realizes the adjustment of the gas flow through a gas flow knob 12 on the heat station 1. The support frame 24 is made of plastic materials, and the angle and the position of the gas nozzle 2 can be adjusted according to the eutectic working area 14. An LED illumination lamp 23 is arranged below the air outlet 22 and is used for illuminating the eutectic working area 14. The supporting frame 24 is fixedly connected with the heating platform 1 in the fixing hole 21 through a screw. And a rubber gasket 26 is arranged between the air inlet hole 25 and the air outlet hole of the hot table to ensure air tightness.
As shown in FIG. 2, the heat station and gas shield apparatus suitable for eutectic bonding of chips further comprises a gas shield 3, wherein the gas shield 3 is disposed in a circular heat station groove 15 above the heat station 1. The gas protection cover 3 is a semicircular transparent shell. Above the gas shield 3 is a transparent top 31 of flat design. The left side and the right side of the gas protection cover 3 are respectively provided with an operation opening 32 with a circular hole, and left and right hands can extend into an operation area during eutectic welding. The gas shield 3 has an elongated ear-type handle 33.
As shown in fig. 1-2, the thermal platform and gas shield apparatus suitable for eutectic bonding of chips further comprises a microscope 4, wherein a mounting frame of the microscope 4 is arranged behind the thermal platform 1, and the microscope 4 is opposite to the center of the thermal platform 1. The eutectic operating area 14 is clearly visible through the microscope 4 and the flat transparent top 31 above the lower gas shield 3.
As shown in fig. 1-2, a thermal platform and gas shield apparatus suitable for eutectic bonding of chips further includes a pair of elbow pads 5 (i.e., pad plates), wherein the elbow pads 5 are respectively disposed on two sides of the gas shield 3. The elbow pad 5 is designed by human engineering, when eutectic welding is carried out, the left and right small arms can be directly placed on the elbow pad 5, and meanwhile, the elbow pad 5 can move left and right to adjust the position according to the length of the arm of an operator.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An eutectic bonding device, comprising:
the upper surface of the hot table is provided with an eutectic working area;
the gas nozzle is arranged above the eutectic working area, is provided with an exhaust hole, faces the eutectic working area and is used for blowing protective gas to the eutectic working area;
the support frame is arranged between the gas spray head and the hot table and is used for fixedly connecting the gas spray head with the hot table;
the support frame is internally provided with a through cavity, and the cavity is communicated with the gas nozzle to form a path for conveying shielding gas to the gas nozzle.
2. The eutectic bonding device of claim 1, wherein a base is disposed at an end of the support frame connected to the heat block, and the base is provided with a fixing hole for fixing to the heat block.
3. The eutectic bonding device of claim 2, wherein the base further comprises an air inlet hole communicated with the cavity, and the hot stage is provided with an air outlet hole communicated with the air inlet hole corresponding to the air inlet hole, so as to form a delivery end for delivering shielding gas to the gas nozzle.
4. The eutectic bonding device of claim 1, wherein the gas showerhead is configured in a tubular shape, and a plurality of the exhaust holes are arranged in an axial array along the gas showerhead;
wherein, still set up the light on the gas shower nozzle.
5. The eutectic bonding device of claim 1, wherein a gas shield is disposed above the corresponding eutectic working area, the gas shield having a transparent top with a flat shape for viewing the eutectic working area within the gas shield;
wherein, the symmetrical two sides of the gas protection cover are respectively provided with an operation opening for welding;
wherein, still set up the handle on the lateral wall of gaseous safety cover.
6. The eutectic bonding device of claim 5, wherein backing plates are provided on both sides of the heat block at positions corresponding to the access openings, the backing plates being made of plastic.
7. The eutectic bonding device of claim 5, wherein a microscope is positioned above the corresponding transparent top of the gas shield, the microscope being connected to the hot stage by a mounting bracket.
8. The eutectic bonding device of claim 5, wherein a heat block recess is provided in the periphery of the eutectic working area of the heat block for mating engagement with the bottom of the gas shield.
9. The eutectic bonding device of claim 1, wherein an insulating pad is disposed on the upper surface of the heat block corresponding to the eutectic working area for regulating the temperature of the eutectic working area.
10. Use of the eutectic bonding device according to any one of claims 1 to 9 in the field of eutectic bonding of chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911058217.7A CN110773832B (en) | 2019-10-31 | 2019-10-31 | Eutectic welding device and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911058217.7A CN110773832B (en) | 2019-10-31 | 2019-10-31 | Eutectic welding device and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110773832A true CN110773832A (en) | 2020-02-11 |
| CN110773832B CN110773832B (en) | 2021-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911058217.7A Active CN110773832B (en) | 2019-10-31 | 2019-10-31 | Eutectic welding device and application thereof |
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| CN (1) | CN110773832B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114429927A (en) * | 2022-01-26 | 2022-05-03 | 深圳市锐博自动化设备有限公司 | Automatic eutectic machine for semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114429927A (en) * | 2022-01-26 | 2022-05-03 | 深圳市锐博自动化设备有限公司 | Automatic eutectic machine for semiconductor chip |
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| CN110773832B (en) | 2021-03-23 |
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