CN110763979A - LED wafer point measurement automatic system based on MES system - Google Patents
LED wafer point measurement automatic system based on MES system Download PDFInfo
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- CN110763979A CN110763979A CN201911055851.5A CN201911055851A CN110763979A CN 110763979 A CN110763979 A CN 110763979A CN 201911055851 A CN201911055851 A CN 201911055851A CN 110763979 A CN110763979 A CN 110763979A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/46—Multiprogramming arrangements
- G06F9/54—Interprogram communication
- G06F9/543—User-generated data transfer, e.g. clipboards, dynamic data exchange [DDE], object linking and embedding [OLE]
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Abstract
The invention discloses an LED wafer spot test automation system based on an MES system, which adopts the thinking of system management to carry out real-time data interaction between an LED chip testing machine and the MES system, so that the MES system can acquire the running state of testing equipment in real time, thereby carrying out statistical analysis and management.
Description
Technical Field
The invention relates to the technical field of LED chip test production, in particular to an LED wafer spot test automation system based on an MES system.
Background
The LED wafer is the core part of the LED, and in fact, the wavelength, brightness, forward voltage, and other major optoelectronic parameters of the LED basically depend on the wafer material. Processing and fabrication of the related circuit elements of the LED are all completed on the wafer, so the wafer technology and equipment are the key points of the wafer manufacturing technology.
The conventional LED wafer testing process generally includes the steps of establishing a testing program in an LED chip testing machine by an equipment engineer, checking whether the parameters are correct by the process engineer, and then starting production. After production is finished, an operator moves test result data to a folder designated by an engineer in the file server, and then a background system is triggered to perform data processing. The running state of the equipment in the production process is recorded by an operator paper file, or the operator triggers the MES system to record.
However, in the actual production process, the process engineer can only ensure that the first input test parameters of each test device are correct, and after a plurality of subsequent tests, if the test parameters of the devices are intentionally or accidentally repaired, the continuous accuracy of the parameters in the subsequent production process cannot be ensured.
At present, the number of devices in a medium-scale LED chip test plant is usually more than 300, and in the process of mass production, the examination of program parameters before each program of each device is called consumes too much energy of engineers, so that the device is a tedious work without value increment. After the test is finished, an operator moves the test result data, and the risk of missing or shifting the wrong position exists; moving test result data is also an unadditive and time consuming task.
There is therefore an urgent need for improvements to existing MES systems.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an automatic LED wafer spot measurement system based on an MES system to solve the problems.
In order to achieve the purpose, the invention adopts the technical scheme that:
an automatic LED wafer spot measurement system based on an MES system comprises the following steps:
1) networking an LED chip testing machine participating in point measurement production of the LED wafer with an MES system, and performing real-time data interaction;
2) registering a reference file of the program parameters of the LED chip testing machine in an MES system;
3) establishing a parameter input program and a production calling program in an LED chip testing machine, inputting corresponding testing parameters through the parameter input program, and opening the production calling program after the parameters are input;
4) after a production calling program is opened, testing parameters input by an MES system calling parameter input program are compared with the memorability of a reference file in the MES system, when the input testing parameters cannot correspond to the parameters in the reference file, equipment reports errors, production is stopped, when the input testing parameters are correctly matched with the parameters in the reference file, an LED chip testing machine loads the testing parameters, and an operator presses an equipment starting button to start testing production;
5) in the test production process, the equipment continuously collects the test data of the LED wafer and compares the test data with the input test parameters, when the equipment does not collect the test data, the production is abnormal, the equipment reports errors, when the equipment continuously records the detection data, the production process is normally carried out until all the products are detected;
6) when all the LED wafers are detected, the LED chip testing machine sends an instruction to the MES system in a Port command mode, and the system automatically starts to acquire current wafer testing result data.
In a further technical scheme, in step 4), when the input test parameters do not correspond to the parameters in the reference file, an Error Message frame Error Message is popped out from an operating system of the LED chip tester, and a red character indicating that the machine data information judgment is wrong is displayed.
In a further technical scheme, the program parameters entered into the MES system in the step 2) at least comprise machine type, test items, parameter maximum value and parameter minimum value.
Compared with the prior art, the method has the advantages that: the invention adopts the thinking of system management, and the LED chip testing machine and the MES system carry out real-time data interaction, so that the MES system can acquire the running state of the testing equipment in real time, thereby carrying out statistical analysis and management.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a block flow diagram of the present invention;
FIG. 2 is a schematic diagram of the present invention entering a reference file;
FIG. 3 is a diagram illustrating error reporting of the system of the present invention.
Detailed Description
The technical solutions of the present invention are described clearly and completely below, and it is obvious that the described embodiments are some, not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 shows an automatic LED wafer spot measurement system based on MES system, which includes the following steps:
and (4) networking the LED chip testing machine participating in the point measurement production of the LED wafer with an MES system, and carrying out real-time data interaction.
As shown in fig. 2, according to the actual requirements of the test items and standards of each product, the process engineer registers a reference file of program parameters of the LED chip tester in the MES system, and the program parameters entered into the MES system at least include a machine type, a test item, a maximum value and a minimum value of the parameters.
The MES system assigns a production task, a process engineer establishes a parameter input program and a production calling program in the LED chip testing machine, corresponding testing parameters are input through the parameter input program according to the assigned task of the MES system, and the production calling program is opened after the input of the parameters is finished.
As shown in fig. 3, after the production calling program is opened, the test parameters input by the MES system calling parameter input program are compared with the notability of the reference file in the MES system, when the input test parameters cannot correspond to the parameters in the reference file, the equipment reports an Error, an Error information frame Error Message is popped out from the operating system of the LED chip tester, and a red character of "machine data information judgment Error" is displayed, and the production is stopped; when the input test parameters are correctly matched with the parameters in the reference file, the LED chip testing machine loads the test parameters, and an operator presses an equipment start button to start test production.
In the test production process, the equipment continuously collects the test data of the LED wafer and compares the test data with the input test parameters, when the equipment does not collect the test data, the production is abnormal, the equipment reports errors, when the equipment continuously records the detection data, the production process is normally carried out until the products are completely detected.
When all the LED wafers are detected, the LED chip testing machine sends an instruction to the MES system in a Port command mode, and the system automatically starts to acquire current wafer testing result data.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (3)
1. An automatic LED wafer spot measurement system based on an MES system is characterized by comprising the following steps:
1) networking an LED chip testing machine participating in point measurement production of the LED wafer with an MES system, and performing real-time data interaction;
2) registering a reference file of the program parameters of the LED chip testing machine in an MES system;
3) establishing a parameter input program and a production calling program in an LED chip testing machine, inputting corresponding testing parameters through the parameter input program, and opening the production calling program after the parameters are input;
4) after a production calling program is opened, testing parameters input by an MES system calling parameter input program are compared with the memorability of a reference file in the MES system, when the input testing parameters cannot correspond to the parameters in the reference file, equipment reports errors, production is stopped, when the input testing parameters are correctly matched with the parameters in the reference file, an LED chip testing machine loads the testing parameters, and an operator presses an equipment starting button to start testing production;
5) in the test production process, the equipment continuously collects the test data of the LED wafer and compares the test data with the input test parameters, when the equipment does not collect the test data, the production is abnormal, the equipment reports errors, when the equipment continuously records the detection data, the production process is normally carried out until all the products are detected;
6) when all the LED wafers are detected, the LED chip testing machine sends an instruction to the MES system in a Port command mode, and the system automatically starts to acquire current wafer testing result data.
2. The automatic LED wafer spot-testing system based on MES as claimed in claim 1, wherein in step 4), when the inputted test parameters do not correspond to the parameters in the reference file, an Error Message box Error Message is popped up from the operating system of the LED chip tester and a red word indicating "machine data information Error" is displayed.
3. The automated LED wafer spot test system of claim 1, wherein the program parameters entered into the MES system in step 2) comprise at least machine type, test item, parameter maximum and minimum.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911055851.5A CN110763979A (en) | 2019-10-31 | 2019-10-31 | LED wafer point measurement automatic system based on MES system |
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| CN201911055851.5A CN110763979A (en) | 2019-10-31 | 2019-10-31 | LED wafer point measurement automatic system based on MES system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112967942A (en) * | 2020-08-07 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Wafer testing method and device, computer storage medium and computer equipment |
| CN113281679A (en) * | 2021-05-20 | 2021-08-20 | 上海贝恩科电缆有限公司 | Wire harness continuity electrical performance test system and method supporting MES system |
| CN113780753A (en) * | 2021-08-20 | 2021-12-10 | 深圳市广和通无线股份有限公司 | Data processing method, data processing device, computer equipment and storage medium |
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2019
- 2019-10-31 CN CN201911055851.5A patent/CN110763979A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112967942A (en) * | 2020-08-07 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Wafer testing method and device, computer storage medium and computer equipment |
| CN112967942B (en) * | 2020-08-07 | 2023-03-10 | 重庆康佳光电技术研究院有限公司 | Wafer testing method and device, computer storage medium and computer equipment |
| CN113281679A (en) * | 2021-05-20 | 2021-08-20 | 上海贝恩科电缆有限公司 | Wire harness continuity electrical performance test system and method supporting MES system |
| CN113780753A (en) * | 2021-08-20 | 2021-12-10 | 深圳市广和通无线股份有限公司 | Data processing method, data processing device, computer equipment and storage medium |
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