CN110757352A - Drying-free preparation formula and process of ceramic bond abrasive product - Google Patents
Drying-free preparation formula and process of ceramic bond abrasive product Download PDFInfo
- Publication number
- CN110757352A CN110757352A CN201911102858.8A CN201911102858A CN110757352A CN 110757352 A CN110757352 A CN 110757352A CN 201911102858 A CN201911102858 A CN 201911102858A CN 110757352 A CN110757352 A CN 110757352A
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- CN
- China
- Prior art keywords
- abrasive
- drying
- ceramic bond
- free preparation
- preparing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
Abstract
The invention relates to the field of preparation of ceramic bond abrasive, in particular to a drying-free preparation formula and a drying-free preparation process for preparing ceramic bond abrasive, wherein the formula comprises 80-94% of abrasive and ceramic bond, 1-5% of liquid paraffin wetting agent and 4-16% of solid paraffin binder according to percentage content. The paraffin system is used as a wetting agent and a temporary binder to replace dextrin or a resin system in the preparation process of the ceramic bond abrasive product, so that the complexity of the production process is reduced, and the production efficiency and the stability of the product are improved; the uniformity, the fluidity and the molding stability of a system are improved by adjusting the content of different components in the wetting agent and the temporary binder, and the ceramic bonding agent product with good uniformity and high quality stability is prepared under the conditions of no need of adjusting the humidity of the premix and no need of a drying process.
Description
Technical Field
The invention relates to the field of preparation of ceramic bond abrasives, in particular to a drying-free preparation formula and a drying-free preparation process for preparing the ceramic bond abrasives.
Background
Most of the existing ceramic bond abrasive products are produced by a cold pressing-sintering process. In the preparation process, wetting agents and temporary binders are required to be added to improve the bonding strength of powder and maintain the appearance of products in the process, and dextrins and resins are common temporary binders and are used after being dissolved in proper solvents. After being uniformly mixed with the wetting agent and the temporary bonding agent, the grinding material, the bonding agent and other auxiliary materials need to be stored at a certain temperature and humidity so as to adjust the dryness and humidity of the premix. The premix has short storage life, is easy to agglomerate and harden, and influences the subsequent process. The intermediate product obtained by cold pressing needs to be dried and pre-sintered under certain temperature control conditions to remove volatile components and temporary binders.
The prior art has higher requirements on the operating environment and the process time, the strength of the cold-pressed blank is low, the breakage rate in the material transfer process is high, the process cost is high, the product stability is poor, and the amplification of the capacity is limited.
Disclosure of Invention
In order to solve the problems, the invention provides a drying-free preparation formula for preparing the ceramic bond abrasive, which uses a paraffin system as a wetting agent and a temporary binder to replace a dextrin or resin system in the preparation process of a ceramic bond abrasive product, thereby reducing the complexity of the production process and improving the production efficiency and the stability of the product.
In order to achieve the purpose, the invention adopts the technical scheme that: a drying-free preparation formula for preparing ceramic bond abrasive comprises, by percentage, 80-94% of abrasive and ceramic bond, 1-5% of liquid paraffin wetting agent and 4-16% of solid paraffin binder. The composition and content of the abrasive and the ceramic bond are produced according to the conventional process, and the abrasive can be a single abrasive or a mixed abrasive, which is not limited herein.
Specifically, the percentage content of the abrasive and the ceramic bond in the abrasive and the ceramic bond is 80-94%, and the percentage content of the abrasive and the ceramic bond is 32-38% and 48-56% respectively.
Wherein, the grinding material is one, two, three or more of diamond, cubic boron nitride, silicon carbide and corundum.
Wherein the liquid paraffin is common liquid paraffin or modified liquid paraffin.
Wherein the solid paraffin is one, two, three or more of polyethylene wax, polypropylene wax, microcrystalline wax and beeswax.
The invention also provides a drying-free preparation process for preparing the ceramic bond abrasive, which realizes the preparation of the ceramic bond product with good uniformity and high quality stability under the conditions of no need of adjusting the drying humidity of the premix and no need of a drying process. The process comprises the following steps:
s1, taking materials according to the ingredients and the percentage in the formula;
s2, mixing the ingredients;
s3, pressing and forming the mixed ingredients;
s4, putting the ingredients subjected to compression molding into a sintering furnace for high-temperature degreasing;
and S5, sintering by adopting the conventional sintering process after high-temperature degreasing.
Specifically, in S2, if the particle size of the abrasive is less than 40 μm, the wetting agent is added into the abrasive to be mixed, then the binder is added, the mixture is uniformly mixed at 50-100 ℃, then the ceramic binder is added, and the mixture is continuously uniformly stirred and mixed; if the abrasive particle size is more than or equal to 40 mu m, the wetting agent is directly added into the mixture of the abrasive and the ceramic bond, then the adhesive is added, and the mixture is uniformly stirred and mixed at the temperature of 50-100 ℃.
Specifically, in S4, the press-formed ingredients are transferred to a ceramic sagger, and then are loaded into a sintering furnace and heated to 500 ℃ for degreasing for 1-3 hours.
Wherein, the temperature is heated to 300-500 ℃ in a sintering furnace at a heating rate of 3-15 ℃ per minute.
The invention has the beneficial effects that: the paraffin system is used as a wetting agent and a temporary binder to replace dextrin or a resin system in the preparation process of the ceramic bond abrasive product, so that the complexity of the production process is reduced, and the production efficiency and the stability of the product are improved; the uniformity, the fluidity and the molding stability of a system are improved by adjusting the content of different components in the wetting agent and the temporary binder, and the ceramic bonding agent product with good uniformity and high quality stability is prepared under the conditions of no need of adjusting the humidity of the premix and no need of a drying process; the manufactured ceramic bond abrasive product can be applied to the fields of cutting tools, bearings, air cylinders and the like which need to use superhard material products as grinding and surface polishing tools, and has wide application range.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention relates to a drying-free preparation formula for preparing a ceramic bond abrasive, which comprises 1-5% of a wetting agent and 5-20% of a binder, wherein the total amount of the abrasive and a ceramic bond is 100%.
Wherein, the grinding material is one or more of diamond, cubic boron nitride, silicon carbide and corundum; the liquid paraffin is common liquid paraffin or modified liquid paraffin; the solid paraffin is one or more of common paraffin, polyethylene wax, polypropylene wax, microcrystalline wax and beeswax. The composition and content of the abrasive and the ceramic bond can be determined according to the conventional production process, and the abrasive can be a single abrasive or a mixed abrasive, and is not limited herein.
In the embodiment, the paraffin has a certain lubricating effect, so that a lubricating layer can be formed on the surface of the powder, and the mixing uniformity of different powders in the system is improved; the paraffin is a non-polar substance, and a non-polar isolating layer can be formed on the surface of the powder, so that the moisture absorption of the material is reduced, and the influence of the environmental humidity on the production stability is reduced.
The following is a further description by way of specific preparation process examples.
Example one
The preparation process of ceramic bond and 20 micron diamond abrasive material without drying includes the following steps:
s1, respectively weighing diamond powder, auxiliary abrasive and ceramic bond according to the formula;
s2, adding the diamond powder and the auxiliary abrasive powder into a mixer, adding liquid paraffin according to 5 percent of the total amount of the diamond powder, the auxiliary abrasive and the ceramic bond, and premixing for 10 minutes in the mixer;
s3, adding No. 54 refined paraffin into the mixer according to 12 percent of the total amount of the diamond powder, the auxiliary abrasive and the ceramic bond, and heating to 60 ℃. After the temperature reaches 60 ℃, continuously mixing for 10 minutes;
s4, adding the ceramic bond into a mixer, continuously mixing for 15 minutes, and taking out;
s5, cooling the mixture to room temperature, and sieving the mixture for three times by using a 80-mesh sieve;
s6, calculating the monomer feeding amount according to the target product, and then performing compression molding to obtain a blank body;
s7, after a layer of 60-mesh silicon carbide is uniformly spread at the bottom of the sintering sagger, transferring the green body into the sagger, and filling the silicon carbide until the green body is uniformly covered;
and S8, transferring the sagger into a sintering furnace, heating to 400 ℃ at a heating rate of 5 ℃ per minute, keeping the temperature for 90 minutes, heating to 680 ℃, keeping the temperature for 2 hours, naturally cooling to room temperature along with the furnace, and taking out.
Example two
The preparation process of ceramic bond and 200 or 230 micron diamond abrasive material without drying includes the following steps:
s1, respectively weighing diamond powder, auxiliary abrasive powder and ceramic bond according to the formula;
s2, adding the diamond powder, the auxiliary abrasive powder and the ceramic bond into a mixer, adding liquid paraffin according to 3 percent of the total amount, and premixing for 15 minutes in the mixer;
s3, adding No. 54 refined paraffin into the mixer according to 10% of the total amount of the diamond powder, the auxiliary abrasive powder and the ceramic bond, heating to 60 ℃, and continuing mixing for 20 minutes after the temperature reaches 60 ℃;
s4, cooling the mixture to room temperature, and sieving the mixture for three times by using a 80-mesh sieve;
s5, calculating the monomer feeding amount according to the target product, and then performing compression molding to obtain a blank body;
s6, after a layer of 60-mesh silicon carbide is uniformly spread at the bottom of the sintering sagger, transferring the green body into the sagger, and filling the silicon carbide until the green body is uniformly covered;
and S7, transferring the sagger into a sintering furnace, heating to 400 ℃ at a heating rate of 5 ℃ per minute, keeping the temperature for 90 minutes, heating to 680 ℃, keeping the temperature for 2 hours, naturally cooling to room temperature along with the furnace, and taking out.
EXAMPLE III
The preparation process of ceramic bond, 140 or 170 micron cubic boron nitride abrasive without drying includes the following steps:
s1, respectively weighing cubic boron nitride powder, auxiliary abrasive powder and ceramic bond according to the formula;
s2, adding cubic boron nitride powder, auxiliary abrasive powder and ceramic bond into a mixer, adding liquid paraffin according to 3% of the total amount, and premixing for 15 minutes in the mixer;
s3, adding 5% of polyethylene wax and 5% of No. 52 refined paraffin wax into the mixer according to the total amount of the cubic boron nitride powder, the auxiliary abrasive powder and the ceramic bond, heating to 85 ℃, and continuing to mix for 20 minutes after the temperature reaches 85 ℃;
s4, cooling the mixture to room temperature, and sieving the mixture for three times by using a 80-mesh sieve;
s5, calculating the monomer feeding amount according to the target product, and then performing compression molding to obtain a blank body;
s6, after a layer of 60-mesh silicon carbide is uniformly spread at the bottom of the sintering sagger, transferring the green body into the sagger, and filling the silicon carbide until the green body is uniformly covered;
and S7, transferring the sagger into a sintering furnace, heating to 400 ℃ at a heating rate of 5 ℃ per minute, keeping the temperature for 90 minutes, heating to 750 ℃, keeping the temperature for 2 hours, naturally cooling to room temperature along with the furnace, and taking out.
Compared with the prior art, the preparation process of the specific embodiment has the following advantages:
1. under the condition of normal temperature, the paraffin does not generate physical or chemical changes, and the mixed material does not need a special storage environment, so that the process requirement can be reduced, and the stability of the product is facilitated;
2. after mixing, the system state is dry particles, the particle size distribution is uniform, the fluidity is good, and the charging uniformity in a die is improved;
3. after cold press molding, the product has high bonding strength, is not easy to break in the transferring and carrying processes, and reduces the operation requirement;
4. under the condition of medium temperature, the paraffin is directly sublimated into gas state to be volatilized, and the carbonization and oxidation processes of cyclodextrin and resin are not needed, so that the temperature control process can be simplified.
The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (10)
1. A drying-free preparation formula for preparing ceramic bond abrasive is characterized in that: the abrasive comprises 80-94% of abrasive and ceramic bond, 1-5% of liquid paraffin wetting agent and 4-16% of solid paraffin binder according to percentage content.
2. The drying-free preparation formula for preparing the ceramic bond abrasive according to claim 1, wherein the drying-free preparation formula comprises the following components in percentage by weight: the percentage content of the abrasive and the ceramic bond is 80-94%, and the percentage content of the abrasive and the ceramic bond is 32-38% and 48-56% respectively.
3. The drying-free preparation formula for preparing the ceramic bond abrasive according to claim 1, wherein the drying-free preparation formula comprises the following components in percentage by weight: the abrasive is one, two or three of diamond, cubic boron nitride, silicon carbide and corundum.
4. The drying-free preparation formula for preparing the ceramic bond abrasive according to claim 1, wherein the drying-free preparation formula comprises the following components in percentage by weight: the liquid paraffin is common liquid paraffin or modified liquid paraffin.
5. The drying-free preparation formula for preparing the ceramic bond abrasive according to claim 1, wherein the drying-free preparation formula comprises the following components in percentage by weight: the solid paraffin is one, two or three of polyethylene wax, polypropylene wax, microcrystalline wax and beeswax.
6. A drying-free preparation process for preparing ceramic bond abrasive is characterized by comprising the following steps: the process comprises the following steps:
s1, taking the ingredients and percentages in the formulation of claim 1;
s2, mixing the ingredients;
s3, pressing and forming the mixed ingredients;
s4, putting the ingredients subjected to compression molding into a sintering furnace for high-temperature degreasing;
and S5, degreasing at high temperature and sintering.
7. The drying-free preparation process for preparing the ceramic bond abrasive according to claim 6, which is characterized in that: in S2, if the particle size of the abrasive is less than 40 μm, the wetting agent is added into the abrasive to mix, then the adhesive is added, after mixing evenly at 50-100 ℃, the ceramic bond is added, and the mixture is stirred evenly.
8. The drying-free preparation process for preparing the ceramic bond abrasive according to claim 6, which is characterized in that: if the abrasive particle size is more than or equal to 40 mu m, the wetting agent is directly added into the mixture of the abrasive and the ceramic bond, then the adhesive is added, and the mixture is uniformly stirred and mixed at the temperature of 50-100 ℃.
9. The drying-free preparation process for preparing the ceramic bond abrasive according to claim 6, which is characterized in that: in S4, the mixture is transferred into a ceramic sagger and then is placed into a sintering furnace and heated to 500 ℃ for degreasing for 1-3 hours.
10. The drying-free preparation process for preparing the ceramic bond abrasive according to claim 9, is characterized in that: heating to 300-500 ℃ in a sintering furnace at a heating rate of 3-15 ℃ per minute.
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| CN201911102858.8A CN110757352A (en) | 2019-11-12 | 2019-11-12 | Drying-free preparation formula and process of ceramic bond abrasive product |
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| CN201911102858.8A CN110757352A (en) | 2019-11-12 | 2019-11-12 | Drying-free preparation formula and process of ceramic bond abrasive product |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110340813A (en) * | 2019-05-30 | 2019-10-18 | 合肥工业大学 | A kind of monocrystalline sapphire processing grinding tool and preparation method thereof |
| CN113084720A (en) * | 2021-05-18 | 2021-07-09 | 白鸽磨料磨具有限公司 | Ceramic bond double-layer grinding wheel and preparation method thereof |
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