CN110753481A - Rotatable heat abstractor - Google Patents
Rotatable heat abstractor Download PDFInfo
- Publication number
- CN110753481A CN110753481A CN201911117822.7A CN201911117822A CN110753481A CN 110753481 A CN110753481 A CN 110753481A CN 201911117822 A CN201911117822 A CN 201911117822A CN 110753481 A CN110753481 A CN 110753481A
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- shaped sliding
- heat sink
- pcb
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 25
- 239000004519 grease Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 230000005389 magnetism Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 11
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 6
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a rotatable heat dissipation device, which comprises a PCB (printed circuit board) and a heat dissipation sheet, wherein a chip is arranged on the PCB, and the heat dissipation sheet is arranged at the upper part of the chip; the PCB is provided with a plurality of arc-shaped sliding grooves, the radiating fins are provided with positioning holes which are matched with the arc-shaped sliding grooves, positioning pins are arranged inside the positioning holes, and the lower ends of the positioning pins are inserted into the arc-shaped sliding grooves. According to the invention, the positioning pins are arranged on the radiating fins, the arc-shaped sliding grooves are arranged on the PCB, and the radiating fins are only pressed by the pressing force in the vertical direction, so that the condition that the radiating fins are assembled and deflected due to the pulling force in the horizontal direction is avoided; meanwhile, the use of the traditional elastic hook is avoided, the flexibility of arranging wires or parts on the PCB is improved, and a rotary structure is used for replacing a fixed structure, so that the radiating fins can be fixed without the installation directivity of the radiating device.
Description
Technical Field
The invention belongs to the technical field of heat dissipation devices, and particularly relates to a rotatable heat dissipation device.
Background
The structure of a common heat dissipation device in the market at present is that a stainless steel wire metal elastic arm and a heat dissipation fin body are assembled, and when a heat dissipation module is assembled, elastic hooks at two ends of the stainless steel wire metal elastic arm are buckled and fixed with corresponding elastic hooks on a PCB.
The design mode of the heat dissipation device has the following defects:
1) due to the symmetry of the spring hook manufacturing process, the heat radiating fin is stressed by not only the pressing force in the original vertical direction but also the pulling force in the X-Y direction, so that the heat radiating fin is deflected after being fixed, the chip and the heat radiating fin cannot be attached at the correct position, and the heat radiating effect is influenced;
2) because no fool-proof mechanism is provided during assembly, if the assembly direction of an operator is wrong, the direction needs to be adjusted again, which is relatively time-consuming;
3) if the assembly direction is wrong, the heat-conducting silicone grease coated on the chip is damaged after the position is readjusted, so that the heat dissipation effect of the chip is influenced.
Through retrieval, the chinese patent application with application number CN 201710393513.7 discloses an elastic hook type heat sink structure, and specifically discloses the following features: the method comprises the following steps: the heat dissipation device comprises a heat dissipation sheet, a spring hook and a rotating shaft, wherein one end of the rotating shaft is connected to the heat dissipation sheet, the other end of the rotating shaft is connected to the spring hook, and the spring hook can rotate along the rotating shaft. According to the elastic hook type radiating fin structure provided by the invention, even if horizontal tension is generated after the elastic hook is assembled with the elastic hook in the PCB, the radiating fin body cannot be influenced, and the radiating fin can still keep an original fixed position, so that the condition that the traditional elastic hook type radiating fin is assembled obliquely is improved; however, when the heat sink is used, the two ends of the elastic hook need to extend to the PCB and be assembled with the elastic hook of the PCB, thereby affecting the flexibility of the placement position of the wiring or the parts on the PCB.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a rotatable heat dissipation device.A positioning pin is arranged on a heat dissipation sheet, an arc-shaped sliding groove is arranged on a PCB, and the heat dissipation sheet is only pressed in the vertical direction, so that the condition that the assembly of the heat dissipation sheet is inclined due to the tension in the horizontal direction is avoided; meanwhile, the use of the traditional elastic hook is avoided, the flexibility of arranging wires or parts on the PCB is improved, and a rotary structure is used for replacing a fixed structure, so that the radiating fins can be fixed without the installation directivity of the radiating device.
In order to achieve the purpose, the invention adopts the technical scheme that:
a rotatable heat dissipation device comprises a PCB and a heat dissipation sheet, wherein a chip is mounted on the PCB, and the heat dissipation sheet is arranged at the upper part of the chip; the PCB board is provided with a plurality of arc-shaped sliding grooves, the radiating fin is provided with positioning holes which are matched with the arc-shaped sliding grooves, positioning pins are arranged in the positioning holes, the lower ends of the positioning pins are inserted into the arc-shaped sliding grooves, and when the radiating fin is pressed by the horizontal direction, the positioning pins rotate around the center of the chip in the arc-shaped sliding grooves; the radiating fins are only pressed in the vertical direction, and when the radiating fins are pulled in the horizontal direction, the pulling force is transmitted to the positioning pins, so that the positioning pins rotate around the centers of the chips in the arc-shaped sliding grooves, and the condition that the radiating fins are assembled and deflected due to the pulling force in the horizontal direction is avoided; meanwhile, the use of the traditional elastic hook is avoided, the compactness of the structure of the heat dissipation device is enhanced, the flexibility of the arrangement positions of the wiring or the parts on the PCB is increased, and the rotary structure is used for replacing a fixed structure, so that the heat dissipation device can be fixed with the heat dissipation fins in a non-directional manner in the installation process.
As a further preference of the technical scheme, a groove is formed in the center of the upper part of the radiating fin, and a lifting handle is arranged in the groove, so that the radiating fin is convenient to take and place; the inside screw hole that is equipped with of recess, handle center department is equipped with the counter sink, the inside fastening screw that is equipped with of counter sink, the handle passes through fastening screw and is connected with fin detachable, and the maintenance of the fin of being convenient for, simultaneously, under the limited condition in quick-witted case inner space, pulls down the handle, has strengthened heat abstractor's application range.
As a further optimization of the technical scheme, the two groups of positioning pins are arranged, and the two groups of positioning pins are arranged diagonally, so that the stability of the installation of the radiating fins is enhanced.
As a further preferred option of the technical solution, one side of the lower part of the heat sink is provided with a bearing hole, a bearing is installed in the bearing hole, the lower part of the heat sink is provided with a silicone grease coated plate, the lower part of the silicone grease coated plate is coated with heat-conducting silicone grease, the upper part of the silicone grease coated plate is provided with a rotating shaft, and the upper end of the rotating shaft is installed in the inner ring of the bearing; when the radiating fin is subjected to the pulling force in the horizontal direction, the radiating fin rotates under the action of the positioning pin, and the silicone grease coating plate is fixed relative to the chip, so that the heat-conducting silicone grease is prevented from being damaged when the radiating fin rotates, and the radiating effect is ensured.
As a further optimization of the technical scheme, the locating pin is composed of a limiting cap, an inserting portion and connecting arms, wherein the limiting cap, the inserting portion and the connecting arms are symmetrically arranged, the inserting depth of the locating pin is limited by the limiting cap, the inserting accuracy of the locating pin is guaranteed, the inserting portion sequentially penetrates through the locating hole and the arc-shaped sliding groove, the lower end of each connecting arm is connected with a clamping hook which is arranged in a back direction, when the radiating fins are pressed horizontally, the clamping hooks can slide in the arc-shaped sliding grooves, the lower ends of the clamping hooks are clamped with the lower portions of the arc-shaped sliding grooves, the clamping hooks prevent the locating pin from falling off from the locating hole to cause the falling.
As a further optimization of the technical scheme, the insertion part is in interference fit with the positioning hole, so that the positioning pin is prevented from falling off the heat sink, and the insertion part is in clearance fit with the arc-shaped sliding groove, so that the heat sink is conveniently and rapidly fixed with the PCB.
As a further preferred option of the technical solution, the lower portion of the PCB is provided with a plurality of sinking grooves, the sinking grooves are corresponding to the arc-shaped sliding grooves, the width of the sinking grooves is larger than that of the arc-shaped sliding grooves, the hooks are clamped inside the sinking grooves, the depth of the sinking grooves is equal to the height of the hooks, and the problem that the hooks protrude out of the PCB to cause unstable installation of the PCB is avoided.
As a further preferable mode of the present invention, the PCB is provided with an annular first strong magnet, the lower portion of the heat sink is provided with an annular second strong magnet, the first strong magnet and the second strong magnet are both provided with arc chutes corresponding to the arc chutes of the PCB, and the magnetic properties of the contact surfaces of the first strong magnet and the second strong magnet are opposite; the magnetic force of the first powerful magnet and the second powerful magnet is utilized, so that the mounting stability of the radiating fin is enhanced; the chip is installed inside the ring of first powerful magnet and second powerful magnet, and the high sum of first powerful magnet and second powerful magnet is greater than the height of chip, has avoided the fin to cause the chip to damage to the chip extrusion.
As a further preferred of this technical scheme, all be equipped with the bad conductor of magnetism in the inner circle of first powerful magnet and second powerful magnet, all be equipped with the magnetic ring in the outer lane of first powerful magnet and second powerful magnet, the magnetic ring of the bad conductor of magnetism furthest has weakened the magnetic field intensity of first powerful magnet and second powerful magnet inner circle, and the magnetic ring is outside with magnetic field direction, has avoided magnetic field to influence the normal work of chip and has damaged even.
As a further preferred feature of the present invention, the magnetic poor conductor is made of aluminum, copper, or lead, and the magnetic conductive ring is made of iron, cobalt, or nickel.
The invention has the beneficial effects that:
1) the positioning pins are arranged on the radiating fins, the arc-shaped sliding grooves are arranged on the PCB, and the radiating fins are only pressed in the vertical direction, so that the condition that the radiating fins are assembled and deflected due to the tension in the horizontal direction is avoided; meanwhile, the use of the traditional elastic hook is avoided, the flexibility of arranging wires or parts on the PCB is improved, and a rotary structure is used for replacing a fixed structure, so that the radiating fins can be fixed without the installation directivity of the radiating device.
2) The center of the upper part of the radiating fin is provided with a groove, and a handle is arranged in the groove, so that the radiating fin can be conveniently taken and placed; the inside screw hole that is equipped with of recess, handle center department are equipped with the counter sink, and the inside fastening screw that is equipped with of counter sink, handle pass through fastening screw and fin detachable and be connected, and the maintenance of the fin of being convenient for, simultaneously, under the limited condition in quick-witted case inner space, pull down the handle, strengthened heat abstractor's application range.
3) The locating pin is equipped with two sets ofly, and two sets of locating pins diagonal angle arrange, has strengthened the stability of fin installation.
4) A bearing hole is formed in one side of the lower portion of the radiating fin, a bearing is installed in the bearing hole, a silicone grease coating plate is arranged on the lower portion of the radiating fin, heat-conducting silicone grease is coated on the lower portion of the silicone grease coating plate, a rotating shaft is arranged on the upper portion of the silicone grease coating plate, and the upper end of the rotating shaft is installed in an inner ring of the bearing; when the radiating fin is subjected to the pulling force in the horizontal direction, the radiating fin rotates under the action of the positioning pin, and the silicone grease coating plate is fixed relative to the chip, so that the heat-conducting silicone grease is prevented from being damaged when the radiating fin rotates, and the radiating effect is ensured.
5) The locating pin is by spacing cap, grafting portion and the linking arm that the symmetry set up that from top to bottom connects gradually, and spacing cap has restricted the grafting degree of depth of locating pin, has guaranteed the precision that the locating pin was pegged graft, and grafting portion passes locating hole and arc spout in proper order, the linking arm lower extreme is connected with the pothook, the pothook lower extreme blocks with the lower part of arc spout, and the pothook has avoided the locating pin to drop from the locating hole and has caused the fin to drop, has guaranteed the steadiness of fin installation.
6) The inserting portion is in interference fit with the positioning hole, the positioning pin is prevented from falling off the heat dissipation plate, the inserting portion is in clearance fit with the arc-shaped sliding groove, and the heat dissipation plate is convenient to fix with the PCB quickly.
7) The lower part of the PCB is provided with a plurality of sinking grooves, the positions of the sinking grooves correspond to the arc-shaped sliding grooves, the width of the sinking grooves is larger than that of the arc-shaped sliding grooves, the clamping hooks are clamped inside the sinking grooves, the depth of the sinking grooves is equal to the height of the clamping hooks, and the phenomenon that the PCB is installed unstably because the clamping hooks protrude out of the PCB is avoided.
8) The PCB is provided with an annular first powerful magnet, the lower part of the radiating fin is provided with an annular second powerful magnet, the first powerful magnet and the second powerful magnet are both provided with arc chutes corresponding to the arc chutes of the PCB, and the magnetism of the contact surface of the first powerful magnet and the second powerful magnet is opposite; the magnetic force of the first powerful magnet and the second powerful magnet is utilized, so that the mounting stability of the radiating fin is enhanced; the chip is installed inside the ring of first powerful magnet and second powerful magnet, and the high sum of first powerful magnet and second powerful magnet is greater than the height of chip, has avoided the fin to cause the chip to damage to the chip extrusion.
9) The inner rings of the first powerful magnet and the second powerful magnet are both provided with magnetic poor conductors, the outer rings of the first powerful magnet and the second powerful magnet are both provided with magnetic conductive rings, the magnetic poor conductors are made of aluminum or copper or lead, and the magnetic conductive rings are made of iron or cobalt or nickel; the magnetic field intensity of the inner rings of the first powerful magnet and the second powerful magnet is weakened to the maximum extent by the poor magnetic conductor, and the magnetic conduction ring guides the magnetic field to the outside, so that the influence of the magnetic field on the normal work of the chip is avoided, and the chip is even damaged.
Drawings
FIG. 1 is a diagram illustrating a rotatable heat sink according to the present invention.
Fig. 2 is an exploded view of a rotatable heat sink in accordance with the present invention.
Fig. 3 is a schematic structural view of a second powerful magnet of a rotatable heat dissipation device according to the present invention.
FIG. 4 is a schematic view of the bottom of a PCB board in a rotatable heat sink device according to the present invention.
Fig. 5 is a schematic view of a positioning pin structure of a rotatable heat dissipation device according to the present invention.
FIG. 6 is a schematic diagram of a silicone-coated plate structure in a rotatable heat dissipation device according to the present invention.
FIG. 7 is a schematic view of a heat sink structure of a rotatable heat sink device according to the present invention.
FIG. 8 is a schematic view of a bottom structure of a heat sink in a rotatable heat sink apparatus according to the present invention.
In the figure: 1. a PCB board; 11. a chip; 12. a first powerful magnet; 13. an arc-shaped chute; 14. sinking a groove; 2. a heat sink; 21. a groove; 22. a threaded hole; 23. positioning holes; 24. a bearing bore; 25. a bearing; 26. silicone grease coated panels; 27. a rotating shaft; 28. positioning pins; 281. a limiting cap; 282. a plug-in part; 283. a connecting arm; 284. a hook; 29. a second powerful magnet; 291. a magnetic poor conductor; 292. a magnetic conductive ring; 3. a handle; 31. a countersunk hole; 32. fastening screws;
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 8, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
As shown in fig. 1-2, a rotatable heat dissipation device comprises a PCB board 1 and a heat sink 2, a chip 11 is mounted on the PCB board 1, and the heat sink 2 is disposed on the chip 11; the PCB board 1 is provided with a plurality of arc-shaped sliding grooves 13, the radiating fin 2 is provided with positioning holes 23 which are matched with the arc-shaped sliding grooves 13, positioning pins 28 are arranged inside the positioning holes 23, the lower ends of the positioning pins 28 are inserted into the arc-shaped sliding grooves 13, and when the radiating fin 2 is pressed by the horizontal direction, the positioning pins 28 rotate around the center of the chip 11 inside the arc-shaped sliding grooves 13; the heat radiating fin 2 is only pressed in the vertical direction, when the heat radiating fin 2 is pulled in the horizontal direction, the pulling force is transmitted to the positioning pin 28, so that the positioning pin 28 rotates around the center of the chip 11 in the arc-shaped sliding groove 13, and the condition that the heat radiating fin 2 is assembled and deflected due to the pulling force in the horizontal direction is avoided; meanwhile, the use of the traditional elastic hook is avoided, so that the compactness of the structure of the heat dissipation device is enhanced, and the flexibility of the wiring or the placement position of parts on the PCB 1 is improved.
As shown in fig. 2 and 7, in the present embodiment, a groove 21 is formed in the center of the upper portion of the heat sink 2, and a handle 3 is disposed inside the groove 21, so as to facilitate taking and placing the heat sink 2; the inside screw hole 22 that is equipped with of recess 21, handle 3 center department is equipped with counter sink 31, the inside fastening screw 32 that is equipped with of counter sink 31, handle 3 pass through fastening screw 32 and 2 detachable connections of fin, the maintenance of the fin 2 of being convenient for, simultaneously, under the limited condition in inside space of case, pull down handle 3, strengthened heat abstractor's application range.
As shown in fig. 1-2, in the present embodiment, two sets of positioning pins 28 are provided, and the two sets of positioning pins 28 are arranged diagonally, so as to enhance the stability of the installation of the heat sink 2.
As shown in fig. 6 and 8, in the present embodiment, a bearing hole 24 is formed in one side of a lower portion of the heat sink 2, a bearing 25 is installed inside the bearing hole 24, a silicone grease coated plate 26 is formed in the lower portion of the heat sink 2, a heat conductive silicone grease is coated on the lower portion of the silicone grease coated plate 26, a rotating shaft 27 is formed in the upper portion of the silicone grease coated plate 26, and the upper end of the rotating shaft 27 is installed in an inner ring of the bearing 25; when the heat sink 2 is pulled horizontally, the heat sink 2 rotates under the action of the positioning pin 28, and the silicone grease coated plate 26 is fixed relative to the chip 11, so that the heat-conducting silicone grease is prevented from being damaged when the heat sink 2 rotates, and the heat dissipation effect is ensured.
As shown in fig. 5, in this embodiment, the positioning pin 28 includes a limiting cap 281, an inserting portion 282 and connecting arms 283 symmetrically arranged from top to bottom, the limiting cap 281 limits the inserting depth of the positioning pin 28 and ensures the inserting accuracy of the positioning pin 28, the inserting portion 282 sequentially passes through the positioning hole 23 and the arc-shaped sliding groove 13, the lower end of the connecting arm 283 is connected with a hook 284 arranged back to back, when the heat sink 2 is pressed horizontally, the hook 284 can slide in the arc-shaped sliding groove 13, the lower end of the hook 284 is engaged with the lower portion of the arc-shaped sliding groove 13, the hook 284 prevents the positioning pin 28 from falling from the positioning hole 23 to cause the falling of the heat sink 2, and the installation stability of the heat sink 2 is ensured.
In this embodiment, the insertion portion 282 is in interference fit with the positioning hole 23, so as to prevent the positioning pin 28 from falling off the heat sink 2, and the insertion portion 282 is in clearance fit with the arc-shaped sliding groove 13, so that the heat sink 2 can be rapidly fixed to the PCB board 1.
As shown in fig. 4, in the embodiment, the lower portion of the PCB 1 is provided with a plurality of sinking grooves 14, the positions of the sinking grooves 14 correspond to the arc-shaped sliding grooves 13, the widths of the sinking grooves 14 are greater than the widths of the arc-shaped sliding grooves 13, the hooks 284 are clamped inside the sinking grooves 14, the depths of the sinking grooves 14 are equal to the heights of the hooks 284, and unstable installation of the PCB 1 caused by the hooks 284 protruding out of the PCB 1 is avoided.
As shown in fig. 2, in the present embodiment, an annular first strong magnet 12 is disposed on the PCB 1, an annular second strong magnet 29 is disposed on the lower portion of the heat sink 2, and arc chutes corresponding to the arc chutes 13 of the PCB 1 are disposed on both the first strong magnet 12 and the second strong magnet 29, and the magnetism of the contact surface of the first strong magnet 12 and the second strong magnet 29 is opposite; the stability of the installation of the heat sink 2 is enhanced by the magnetic force of the first powerful magnet 12 and the second powerful magnet 29; the chip 11 is arranged in the circular ring of the first strong magnet 12 and the second strong magnet 29, and the sum of the heights of the first strong magnet 12 and the second strong magnet 29 is greater than the height of the chip 11, so that the chip 11 is prevented from being damaged due to the fact that the heat radiating fin 2 extrudes the chip 11.
As shown in fig. 3, in the present embodiment, the inner rings of the first powerful magnet 12 and the second powerful magnet 29 are both provided with a magnetic poor conductor 291, the outer rings of the first powerful magnet 12 and the second powerful magnet 29 are both provided with a magnetic conductive ring 292, the magnetic poor conductor 291 weakens the magnetic field strength of the inner rings of the first powerful magnet 12 and the second powerful magnet 29 to the greatest extent, and the magnetic conductive ring 292 guides the magnetic field to the outside, so as to avoid the magnetic field from affecting the normal operation of the chip 11 and even being damaged.
In this embodiment, the magnetic poor conductor 291 is made of aluminum, the magnetic conductive ring 292 is made of iron, and the aluminum magnetic poor conductor 291 and the iron magnetic conductive ring 292 are not only low in production cost, but also have good thermal conductivity, thereby enhancing the heat dissipation effect of the heat dissipation device.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the present invention as defined in the accompanying claims.
Claims (10)
1. A rotatable heat dissipation device comprises a PCB and a heat dissipation sheet, wherein a chip is mounted on the PCB, and the heat dissipation sheet is arranged at the upper part of the chip; the PCB is characterized in that a plurality of arc-shaped sliding grooves are formed in the PCB, positioning holes which are matched with the arc-shaped sliding grooves are formed in the radiating fins, positioning pins are arranged in the positioning holes, the lower ends of the positioning pins are inserted into the arc-shaped sliding grooves, and when the radiating fins are pressed by horizontal direction pressing force, the positioning pins rotate around the centers of the chips in the arc-shaped sliding grooves.
2. The rotatable heat sink of claim 1, wherein a recess is formed in the center of the upper portion of the heat sink, and a handle is formed in the recess; the novel radiating fin is characterized in that threaded holes are formed in the grooves, countersunk holes are formed in the centers of the handles, fastening screws are arranged in the countersunk holes, and the handles are detachably connected with the radiating fins through the fastening screws.
3. A rotatable heat sink according to claim 1 wherein there are two sets of locating pins and the two sets of locating pins are arranged diagonally.
4. The rotatable heat sink as claimed in claim 1, wherein a bearing hole is formed at one side of the lower portion of the heat sink, a bearing is installed in the bearing hole, a silicone grease coated plate is arranged at the lower portion of the heat sink, a heat conductive silicone grease is coated at the lower portion of the silicone grease coated plate, a rotating shaft is arranged at the upper portion of the silicone grease coated plate, and the upper end of the rotating shaft is installed in the inner race of the bearing.
5. The rotatable heat sink as claimed in claim 1, wherein the positioning pin comprises a limiting cap, an inserting portion and connecting arms symmetrically arranged from top to bottom, the inserting portion sequentially passes through the positioning hole and the arc-shaped sliding groove, the lower end of the connecting arm is connected with a hook arranged in a back direction, the hook can slide in the arc-shaped sliding groove when the heat sink is pressed in a horizontal direction, and the lower end of the hook is engaged with the lower portion of the arc-shaped sliding groove.
6. The rotatable heat sink of claim 5, wherein the insertion portion is in interference fit with the positioning hole, and the insertion portion is in clearance fit with the arc-shaped sliding groove.
7. The rotatable heat dissipation device of claim 5 or 6, wherein the lower portion of the PCB board is provided with a plurality of sinking grooves, the sinking grooves are corresponding to the arc-shaped sliding grooves, the width of the sinking grooves is greater than that of the arc-shaped sliding grooves, the hooks are clamped inside the sinking grooves, and the depth of the sinking grooves is equal to the height of the hooks.
8. The rotatable heat dissipation device of claim 1, wherein the PCB board is provided with a first strong magnet in an annular shape, the lower portion of the heat dissipation plate is provided with a second strong magnet in an annular shape, and the first strong magnet and the second strong magnet are provided with arc chutes corresponding to the arc chutes of the PCB board, and the magnetism of the contact surfaces of the first strong magnet and the second strong magnet is opposite; the chip is arranged in the circular rings of the first powerful magnet and the second powerful magnet, and the sum of the heights of the first powerful magnet and the second powerful magnet is larger than the height of the chip.
9. The rotatable heat sink of claim 8, wherein the inner rings of the first powerful magnet and the second powerful magnet are each provided with a poor magnetic conductor, and the outer rings of the first powerful magnet and the second powerful magnet are each provided with a magnetic conductive ring.
10. A rotatable heat sink according to claim 9, wherein the poor magnetic conductor is made of aluminum or copper or lead and the magnetic conductive ring is made of iron or cobalt or nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911117822.7A CN110753481B (en) | 2019-11-15 | 2019-11-15 | Rotatable heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911117822.7A CN110753481B (en) | 2019-11-15 | 2019-11-15 | Rotatable heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110753481A true CN110753481A (en) | 2020-02-04 |
| CN110753481B CN110753481B (en) | 2020-08-11 |
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| CN201911117822.7A Active CN110753481B (en) | 2019-11-15 | 2019-11-15 | Rotatable heat abstractor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365484A (en) * | 2021-07-23 | 2021-09-07 | 上海闻泰信息技术有限公司 | Heat dissipation assembly and device of electronic equipment and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN2812093Y (en) * | 2005-07-29 | 2006-08-30 | 讯凯国际股份有限公司 | A radiating module |
| CN101424965A (en) * | 2007-11-02 | 2009-05-06 | 英业达股份有限公司 | Radiator structure |
| CN103135721A (en) * | 2011-11-28 | 2013-06-05 | 国际商业机器公司 | Heat sink with orientable fins |
| CN108934147A (en) * | 2017-05-27 | 2018-12-04 | 南宁富桂精密工业有限公司 | Bullet hooks formula heat radiating fin structure |
| CN209546221U (en) * | 2019-01-17 | 2019-10-25 | 重庆迪普金属材料有限公司 | A kind of cooling fin for electronic component |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113365484A (en) * | 2021-07-23 | 2021-09-07 | 上海闻泰信息技术有限公司 | Heat dissipation assembly and device of electronic equipment and electronic equipment |
| CN113365484B (en) * | 2021-07-23 | 2024-05-31 | 上海闻泰信息技术有限公司 | Heat dissipation assembly and device of electronic equipment and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN110753481B (en) | 2020-08-11 |
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