CN110752169A - 一种晶圆处理装置和上下料方法 - Google Patents
一种晶圆处理装置和上下料方法 Download PDFInfo
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- CN110752169A CN110752169A CN201911001569.9A CN201911001569A CN110752169A CN 110752169 A CN110752169 A CN 110752169A CN 201911001569 A CN201911001569 A CN 201911001569A CN 110752169 A CN110752169 A CN 110752169A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911001569.9A CN110752169B (zh) | 2019-10-21 | 2019-10-21 | 一种晶圆处理装置和上下料方法 |
Applications Claiming Priority (1)
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CN201911001569.9A CN110752169B (zh) | 2019-10-21 | 2019-10-21 | 一种晶圆处理装置和上下料方法 |
Publications (2)
Publication Number | Publication Date |
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CN110752169A true CN110752169A (zh) | 2020-02-04 |
CN110752169B CN110752169B (zh) | 2022-03-22 |
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CN201911001569.9A Active CN110752169B (zh) | 2019-10-21 | 2019-10-21 | 一种晶圆处理装置和上下料方法 |
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CN (1) | CN110752169B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112388496A (zh) * | 2020-11-26 | 2021-02-23 | 西安奕斯伟硅片技术有限公司 | 应用于双面抛光设备的物料管理方法、系统及存储介质 |
Citations (20)
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---|---|---|---|---|
JPS57138575A (en) * | 1981-02-16 | 1982-08-26 | Hitachi Ltd | Grinding machine |
CN1170655A (zh) * | 1996-05-31 | 1998-01-21 | Memc电子材料有限公司 | 晶片自动研磨系统 |
JP2000031245A (ja) * | 1998-07-08 | 2000-01-28 | Kobe Steel Ltd | ウェーハノッチ位置検出装置 |
US6135854A (en) * | 1998-01-21 | 2000-10-24 | Shin-Etsu Handotai Co., Ltd. | Automatic workpiece transport apparatus for double-side polishing machine |
US6296554B1 (en) * | 1999-10-22 | 2001-10-02 | Industrial Technology Research Institute | Non-circular workpiece carrier |
US20030010887A1 (en) * | 2001-07-11 | 2003-01-16 | Eberhard Potempka | Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
US20040037675A1 (en) * | 2000-09-27 | 2004-02-26 | Jan Zinger | Wafer handling system |
CN101164148A (zh) * | 2005-04-19 | 2008-04-16 | 日本微涂料株式会社 | 半导体晶片周缘的研磨装置及方法 |
CN101665919A (zh) * | 2008-09-04 | 2010-03-10 | 东京毅力科创株式会社 | 成膜装置、基板处理装置、成膜方法 |
CN101934497A (zh) * | 2010-08-11 | 2011-01-05 | 中国电子科技集团公司第四十五研究所 | 硅片单面化学机械抛光方法和装置 |
CN102019581A (zh) * | 2009-09-18 | 2011-04-20 | 不二越机械工业株式会社 | 晶圆研磨装置和晶圆的制造方法 |
CN102903658A (zh) * | 2011-07-29 | 2013-01-30 | 大日本网屏制造株式会社 | 基板处理装置、基板保持装置及基板保持方法 |
CN103328164A (zh) * | 2011-03-16 | 2013-09-25 | 株式会社爱发科 | 运送装置及真空装置 |
CN103715123A (zh) * | 2013-12-31 | 2014-04-09 | 上海集成电路研发中心有限公司 | 用于半导体制造工艺中的硅片定位系统 |
CN104517878A (zh) * | 2013-09-26 | 2015-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘原点定位系统及托盘原点定位方法 |
CN205380555U (zh) * | 2015-03-02 | 2016-07-13 | K.C.科技股份有限公司 | 化学机械抛光装置 |
US20170059311A1 (en) * | 2015-08-26 | 2017-03-02 | Industrial Technology Research Institute | Surface measurement device and method thereof |
CN107112225A (zh) * | 2014-11-18 | 2017-08-29 | Lg矽得荣株式会社 | 晶片抛光设备的晶片装载装置以及调整晶片装载位置的方法 |
CN108155126A (zh) * | 2017-12-26 | 2018-06-12 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆转移装置及晶圆清洗装置 |
CN110047746A (zh) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | 平坦化方法 |
-
2019
- 2019-10-21 CN CN201911001569.9A patent/CN110752169B/zh active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138575A (en) * | 1981-02-16 | 1982-08-26 | Hitachi Ltd | Grinding machine |
CN1170655A (zh) * | 1996-05-31 | 1998-01-21 | Memc电子材料有限公司 | 晶片自动研磨系统 |
US6135854A (en) * | 1998-01-21 | 2000-10-24 | Shin-Etsu Handotai Co., Ltd. | Automatic workpiece transport apparatus for double-side polishing machine |
JP2000031245A (ja) * | 1998-07-08 | 2000-01-28 | Kobe Steel Ltd | ウェーハノッチ位置検出装置 |
US6296554B1 (en) * | 1999-10-22 | 2001-10-02 | Industrial Technology Research Institute | Non-circular workpiece carrier |
US20040037675A1 (en) * | 2000-09-27 | 2004-02-26 | Jan Zinger | Wafer handling system |
US20030010887A1 (en) * | 2001-07-11 | 2003-01-16 | Eberhard Potempka | Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
CN101164148A (zh) * | 2005-04-19 | 2008-04-16 | 日本微涂料株式会社 | 半导体晶片周缘的研磨装置及方法 |
CN101665919A (zh) * | 2008-09-04 | 2010-03-10 | 东京毅力科创株式会社 | 成膜装置、基板处理装置、成膜方法 |
CN102019581A (zh) * | 2009-09-18 | 2011-04-20 | 不二越机械工业株式会社 | 晶圆研磨装置和晶圆的制造方法 |
CN101934497A (zh) * | 2010-08-11 | 2011-01-05 | 中国电子科技集团公司第四十五研究所 | 硅片单面化学机械抛光方法和装置 |
CN103328164A (zh) * | 2011-03-16 | 2013-09-25 | 株式会社爱发科 | 运送装置及真空装置 |
CN102903658A (zh) * | 2011-07-29 | 2013-01-30 | 大日本网屏制造株式会社 | 基板处理装置、基板保持装置及基板保持方法 |
CN104517878A (zh) * | 2013-09-26 | 2015-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘原点定位系统及托盘原点定位方法 |
CN103715123A (zh) * | 2013-12-31 | 2014-04-09 | 上海集成电路研发中心有限公司 | 用于半导体制造工艺中的硅片定位系统 |
CN107112225A (zh) * | 2014-11-18 | 2017-08-29 | Lg矽得荣株式会社 | 晶片抛光设备的晶片装载装置以及调整晶片装载位置的方法 |
CN205380555U (zh) * | 2015-03-02 | 2016-07-13 | K.C.科技股份有限公司 | 化学机械抛光装置 |
US20170059311A1 (en) * | 2015-08-26 | 2017-03-02 | Industrial Technology Research Institute | Surface measurement device and method thereof |
CN108155126A (zh) * | 2017-12-26 | 2018-06-12 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆转移装置及晶圆清洗装置 |
CN110047746A (zh) * | 2018-01-16 | 2019-07-23 | 株式会社迪思科 | 平坦化方法 |
Non-Patent Citations (1)
Title |
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高: "薄片材料边缘位置测量装置 ", 《红外》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112388496A (zh) * | 2020-11-26 | 2021-02-23 | 西安奕斯伟硅片技术有限公司 | 应用于双面抛光设备的物料管理方法、系统及存储介质 |
CN112388496B (zh) * | 2020-11-26 | 2022-03-22 | 西安奕斯伟硅片技术有限公司 | 应用于双面抛光设备的物料管理方法、系统及存储介质 |
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CN110752169B (zh) | 2022-03-22 |
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Effective date of registration: 20211025 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |