CN110729229A - 一种半导体生产用成品检测台 - Google Patents
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Abstract
本发明公开了一种半导体生产用成品检测台,包括底板、平台、支柱、盛放板、卡槽、收废槽、水杯槽、治具槽、钻头槽、盛放台、固定块、套柱、通槽、轴承、固定架、内螺纹套筒、螺纹柱和摇把。本发明结构简单,所设计的内螺纹套筒和螺纹柱可实现将盛放台上下移动的作用,主要是为了将不同检测者的身高可以调整到合适的角度,使检测者在检测的过程中更加舒适,也避免了视线的不合理导致的眼酸,且加装的轴承,为了避免盛放台与螺纹柱一起转动,避免了检测者的检测不便;且加装的卡槽,可放置不同的检测材料,也避免了桌面上乱放治具,杂乱无章,也不便于检测者找到合适的治具,所以卡槽的设置节省了检测者一定的时间。
Description
技术领域
本发明涉及一种检测台,具体是一种半导体生产用成品检测台,属于检测台技术领域。
背景技术
半导体指常温下导电性能介于导体与绝缘体之间的材料。半导体在消费电子、通信系统、医疗仪器等领域有广泛应用,如二极管就是采用半导体制作的器件。无论从科技或是经济发展的角度来看,半导体的重要性都是非常巨大的,今日大部分的电子产品,如计算机、移动电话或是数字录音机当中的核心单元都和半导体有着极为密切的关连。常见的半导体材料有硅、锗、砷化镓等,而硅更是各种半导体材料中,在商业应用上最具有影响力的一种。
但是半导体在检测平台时,不同的检测者身高不同,所以对检测台的高度也有一定的需求,如果高度不合适,检测者也多有不便,对眼睛容易造成眼部疲劳,并且在检测的过程中,检测的治具杂乱的放置,一方面使人看着不舒服,另一方面检测者在寻找所需要的用具时,也难以第一时间寻找到。因此,针对上述问题提出一种半导体生产用成品检测台。
发明内容
本发明的发明目的就在于为了解决上述问题而提供一种半导体生产用成品检测台。
本发明通过以下技术方案来实现上述目的,一种半导体生产用成品检测台,包括底板、平台、升降机构和收纳机构;
所述底板的顶端套接有平台;所述升降机构包括有通槽;所述通槽的内壁套接有内螺纹套筒,所述内螺纹套筒的内部螺纹连接有螺纹柱,所述螺纹柱的底端套接有摇把,所述内螺纹套筒的顶端套接有固定架,所述固定架的顶端套接至轴承的两端,所述轴承的内部套接有套柱,所述套柱的顶端固接有固定块,所述固定块的顶端套接有盛放台;
所述收纳机构包括支柱;所述支柱的顶端套接有盛放板,所述盛放板的内部开有若干个卡槽。
优选的,所述底板的数量为两个,且两个底板套接至平台的底端,且两个底板的表面结构为长方体,平台为长方体结构。
优选的,所述通槽贯通平台的上下端面,且通槽的表面结构为倒凸字型结构,且内螺纹套筒的左右端面与通槽的间隙各为为0.5CM。
优选的,所述支柱的数量为四个,且四个支柱的为圆筒型结构,且四个支柱平放在平台的上端面。
优选的,所述卡槽包括收废槽、水杯槽、治具槽和钻头槽。
优选的,所述盛放台的表面结构呈U字型,且盛放台的左右内外壁厚度相同,且盛放台的左右内外壁厚度小于盛放台后内外壁的厚度,且固定架的表面结构呈U字型,左右两侧的固定架的底端套接至螺纹柱的顶端。
优选的,所述收废槽的表面结构为长方形,所述水杯槽的表面结构为圆形,所述治具槽的数量为若干个,且各个尺寸大小不同,所述钻头槽的表面结构为圆形,且钻头槽的数量为若干个,若干个钻头槽的尺寸相同。
本发明的有益效果是:
1、所设计的内螺纹套筒和螺纹柱可实现将盛放台上下移动的作用,主要是为了将不同检测者的身高可以调整到合适的角度,使检测者在检测的过程中更加舒适,也避免了视线的不合理导致的眼酸;
2、使用时,加装的轴承,为了避免盛放台与螺纹柱一起转动,避免了检测者的检测不便;且加装的卡槽,可放置不同的检测材料,也避免了桌面上乱放治具,杂乱无章,也不便于检测者找到合适的治具。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其它的附图。
图1为本发明立体结构示意图;
图2为本发明主视图全剖结构示意图;
图3为本发明俯视图结构示意图。
图中:1、底板,2、平台,3、支柱,4、盛放板,5、卡槽,501、收废槽,502、水杯槽,503、治具槽,504、钻头槽,6、盛放台,7、固定块,8、套柱,9、通槽,10、轴承,11、固定架,12、内螺纹套筒,13、螺纹柱,14、摇把。
具体实施方式
为使得本发明的目的、特征、优点能够更加的明显和易懂,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,下面所描述的实施例仅仅是本发明一部分实施例,而非全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
在本发明的描述中,需要理解的是,术语“上”、“下”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
请参阅图1-3所示,一种半导体生产用成品检测台,包括底板1、平台2、升降机构和收纳机构;
所述底板1的顶端套接有平台2;所述升降机构包括有通槽9;所述通槽9的内壁套接有内螺纹套筒12,所述内螺纹套筒12的内部螺纹连接有螺纹柱13,所述螺纹柱13的底端套接有摇把14,所述内螺纹套筒12的顶端套接有固定架11,所述固定架11的顶端套接至轴承10的两端,所述轴承10的内部套接有套柱8,所述套柱8的顶端固接有固定块7,所述固定块7的顶端套接有盛放台6;
所述收纳机构包括支柱3;所述支柱3的顶端套接有盛放板4,所述盛放板4的内部开有若干个卡槽5。
所述底板1的数量为两个,且两个底板1套接至平台2的底端,且两个底板1的表面结构为长方体,平台2为长方体结构;所述通槽9贯通平台2的上下端面,且通槽9的表面结构为倒凸字型结构,且内螺纹套筒12的左右端面与通槽9的间隙各为为0.5CM;所述支柱3的数量为四个,且四个支柱3的为圆筒型结构,且四个支柱3平放在平台2的上端面;所述卡槽5包括收废槽501、水杯槽502、治具槽503和钻头槽504;所述收废槽501的表面结构为长方形,所述水杯槽502的表面结构为圆形,所述治具槽503的数量为若干个,且各个尺寸大小不同,所述钻头槽504的表面结构为圆形,且钻头槽504的数量为若干个,若干个钻头槽504的尺寸相同;所述盛放台6的表面结构呈U字型,且盛放台6的左右内外壁厚度相同,且盛放台6的左右内外壁厚度小于盛放台6后内外壁的厚度,且固定架11的表面结构呈U字型,左右两侧的固定架11的底端套接至螺纹柱13的顶端。
本发明在使用时,如需升降盛放台6,只需要摇动摇把14,摇把14带动螺纹柱13在内螺纹套筒12的内部转动,此时内螺纹套筒12带动固定架11一起转动,固定架11带动轴承10一起转动,并且向上移动,此时,套柱8随着轴承10的移动一起向上移动,后套柱8的向上移动带动着固定块7一起向上移动,此时固定块7带动着盛放台6一起向上移动,此时盛放台6上面的检测器具一起向上移动,原理主要是通过螺纹柱13在内螺纹套筒12内部通过螺纹转动上升,同时套柱8不随着旋转,只保持上升,主要是套柱8套接在轴承10的内圈中间位置,加上盛放台6上面的重量不会随之旋转,只会移动;
在检测的过程中,将水杯放置在水杯槽502的内部,将不同的检测治具放置在治具槽503的内部,将不符合检测要求的半导体成品放置在收废槽501的内部,将检测钻头放置在钻头槽的内部,并且如需移动盛放板4,只需要拖动盛放板4的任意一端即可,同时支柱3在平台2的表面移动。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的得同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims (7)
1.一种半导体生产用成品检测台,其特征在于:包括底板(1)、平台(2)、升降机构和收纳机构;
所述底板(1)的顶端套接有平台(2);所述升降机构包括有通槽(9);所述通槽(9)的内壁套接有内螺纹套筒(12),所述内螺纹套筒(12)的内部螺纹连接有螺纹柱(13),所述螺纹柱(13)的底端套接有摇把(14),所述内螺纹套筒(12)的顶端套接有固定架(11),所述固定架(11)的顶端套接至轴承(10)的两端,所述轴承(10)的内部套接有套柱(8),所述套柱(8)的顶端固接有固定块(7),所述固定块(7)的顶端套接有盛放台(6);
所述收纳机构包括支柱(3);所述支柱(3)的顶端套接有盛放板(4),所述盛放板(4)的内部开有若干个卡槽(5)。
2.根据权利要求1所述的一种半导体生产用成品检测台,其特征在于:所述底板(1)的数量为两个,且两个底板(1)套接至平台(2)的底端,且两个底板(1)的表面结构为长方体,平台(2)为长方体结构。
3.根据权利要求1所述的一种半导体生产用成品检测台,其特征在于:所述通槽(9)贯通平台(2)的上下端面,且通槽(9)的表面结构为倒凸字型结构,且内螺纹套筒(12)的左右端面与通槽(9)的间隙各为为0.5CM。
4.根据权利要求1所述的一种半导体生产用成品检测台,其特征在于:所述支柱(3)的数量为四个,且四个支柱(3)的为圆筒型结构,且四个支柱(3)平放在平台(2)的上端面。
5.根据权利要求1所述的一种半导体生产用成品检测台,其特征在于:所述卡槽(5)包括收废槽(501)、水杯槽(502)、治具槽(503)和钻头槽(504)。
6.根据权利要求1所述的一种半导体生产用成品检测台,其特征在于:所述盛放台(6)的表面结构呈U字型,且盛放台(6)的左右内外壁厚度相同,且盛放台(6)的左右内外壁厚度小于盛放台(6)后内外壁的厚度,且固定架(11)的表面结构呈U字型,左右两侧的固定架(11)的底端套接至螺纹柱(13)的顶端。
7.根据权利要求5所述的一种半导体生产用成品检测台,其特征在于:所述收废槽(501)的表面结构为长方形,所述水杯槽(502)的表面结构为圆形,所述治具槽(503)的数量为若干个,且各个尺寸大小不同,所述钻头槽(504)的表面结构为圆形,且钻头槽(504)的数量为若干个,若干个钻头槽(504)的尺寸相同。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030029220A1 (en) * | 2001-08-10 | 2003-02-13 | Hisashi Isozaki | Surface inspection system |
CN101261306A (zh) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | 全自动晶圆测试方法及实现该测试方法的设备 |
CN101396692A (zh) * | 2007-09-28 | 2009-04-01 | 鸿劲科技股份有限公司 | 可自动化进行电子元件外观检测的装置 |
CN203790219U (zh) * | 2014-04-11 | 2014-08-27 | 福州施可瑞光电科技有限公司 | 可升降治疗推车 |
CN104576496A (zh) * | 2015-01-22 | 2015-04-29 | 北京中拓机械集团有限责任公司 | 半导体晶片的托起装置 |
CN205306304U (zh) * | 2016-01-19 | 2016-06-15 | 河北科翔电子设备销售有限公司 | 一种自动升降式多媒体教室控制台 |
CN107497517A (zh) * | 2017-10-11 | 2017-12-22 | 贵州大学 | 一种机电自动化模拟用试验台 |
CN109473372A (zh) * | 2018-12-19 | 2019-03-15 | 长安大学 | 一种led电极自动化检测平台 |
CN209437578U (zh) * | 2018-07-09 | 2019-09-27 | 湖南第一师范学院 | 一种教学用生物解剖台 |
-
2019
- 2019-10-25 CN CN201911022355.XA patent/CN110729229A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030029220A1 (en) * | 2001-08-10 | 2003-02-13 | Hisashi Isozaki | Surface inspection system |
CN101396692A (zh) * | 2007-09-28 | 2009-04-01 | 鸿劲科技股份有限公司 | 可自动化进行电子元件外观检测的装置 |
CN101261306A (zh) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | 全自动晶圆测试方法及实现该测试方法的设备 |
CN203790219U (zh) * | 2014-04-11 | 2014-08-27 | 福州施可瑞光电科技有限公司 | 可升降治疗推车 |
CN104576496A (zh) * | 2015-01-22 | 2015-04-29 | 北京中拓机械集团有限责任公司 | 半导体晶片的托起装置 |
CN205306304U (zh) * | 2016-01-19 | 2016-06-15 | 河北科翔电子设备销售有限公司 | 一种自动升降式多媒体教室控制台 |
CN107497517A (zh) * | 2017-10-11 | 2017-12-22 | 贵州大学 | 一种机电自动化模拟用试验台 |
CN209437578U (zh) * | 2018-07-09 | 2019-09-27 | 湖南第一师范学院 | 一种教学用生物解剖台 |
CN109473372A (zh) * | 2018-12-19 | 2019-03-15 | 长安大学 | 一种led电极自动化检测平台 |
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