CN110727148A - Liquid crystal chip packaging structure, method, projection display and projection display system - Google Patents
Liquid crystal chip packaging structure, method, projection display and projection display system Download PDFInfo
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- CN110727148A CN110727148A CN201911029419.9A CN201911029419A CN110727148A CN 110727148 A CN110727148 A CN 110727148A CN 201911029419 A CN201911029419 A CN 201911029419A CN 110727148 A CN110727148 A CN 110727148A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
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Abstract
The invention discloses a liquid crystal chip packaging structure, a method, a projection display and a projection display system, wherein the liquid crystal chip packaging structure comprises: the liquid crystal display comprises a chip, a transparent substrate, a liquid crystal layer, sealant and a support; the transparent substrate is arranged above the chip; the liquid crystal layer is arranged between the chip and the transparent substrate; the sealant is arranged at the periphery of the liquid crystal layer; the support piece is arranged between the chip and the transparent substrate, and the support piece is arranged around the liquid crystal layer to realize the thickness control of the liquid crystal layer. The invention can effectively support the liquid crystal layer, control the thickness of the liquid crystal layer and ensure the display effect of the chip.
Description
Technical Field
The invention relates to the technical field of liquid crystal packaging, in particular to a chip packaging structure, a chip packaging method, a projectable display and a projectable display system.
Background
In the field of Liquid Crystal packaging, for example, LCOS (Liquid Crystal on Silicon, reflective projection display) uses a sealant to seal Liquid Crystal in a certain space, and usually the Liquid Crystal is sealed between a chip and a transparent substrate.
For the liquid crystal chip, the thickness of the liquid crystal layer after packaging has an important influence on the display effect of the liquid crystal chip, and an effective means for the thickness of the liquid crystal layer is lacked at present.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
Disclosure of Invention
Therefore, in order to solve the problem that an effective means for the thickness of the liquid crystal layer is lacked in the packaging process of the liquid crystal chip at present, a liquid crystal chip packaging structure, a method, a projection display and a projection display system are needed to be provided, so that the thickness of the liquid crystal layer can be effectively controlled, and the display effect of the liquid crystal chip is ensured.
In order to achieve the above object, the present invention provides a liquid crystal chip package structure, including:
a chip;
a transparent substrate disposed over the chip;
the liquid crystal layer is arranged between the chip and the transparent substrate;
the sealant is arranged at the periphery of the liquid crystal layer; and
the support piece is arranged between the chip and the transparent substrate, and the support piece is arranged around the liquid crystal layer to support the liquid crystal layer.
Optionally, the height of the support is greater than or equal to the distance between the chip and the transparent substrate, the chip and the transparent substrate are sealed, one end of the support abuts against the upper surface of the chip, and the other end of the support abuts against the lower surface of the transparent substrate.
Optionally, the support member includes a conductive portion, a conductive layer is disposed on a lower surface of the transparent substrate, a conductive region is disposed on the transparent substrate corresponding to the sealant region, and the conductive portion is connected to the conductive layer and the conductive region.
Optionally, the supporting member is disposed on a side of the sealant away from the liquid crystal layer.
Optionally, the supporting member is disposed around the liquid crystal layer, and a crystal filling hole is formed on the surface of the supporting member. .
Optionally, the sealant is an epoxy resin adhesive, and the transparent substrate is a transparent glass plate.
In addition, in order to achieve the above object, the present invention also provides a liquid crystal chip packaging method in which a liquid crystal layer is provided between a chip and a transparent substrate, the method comprising:
depositing a supporting layer on the upper surface of the chip or the lower surface of the transparent substrate;
etching a supporting pattern at the position of the sealant corresponding to the upper surface of the chip or the lower surface of the transparent substrate by adopting a photoetching process;
and dry-etching the support layer according to the support pattern to obtain a support member for supporting the liquid crystal layer.
Optionally, the step of depositing the support layer on the upper surface of the chip or the lower surface of the transparent substrate includes:
and pretreating the upper surface of the chip or the lower surface of the transparent substrate to increase the deposition adhesion of the supporting layer.
In addition, in order to achieve the above object, the present invention further provides a projection display, which includes the liquid crystal chip package structure as described above and a light source, wherein the light source irradiates the liquid crystal chip package structure to perform projection display.
In addition, in order to achieve the above object, the present invention further provides a projection display system, which includes the liquid crystal chip package structure and a housing as described above, wherein the liquid crystal chip package structure is disposed in the housing.
According to the technical scheme provided by the invention, the liquid crystal layer is arranged between the chip and the transparent substrate in a sealing manner, the chip enables liquid crystal molecules in the liquid crystal layer to be in different arrangement modes by controlling the voltage of the liquid crystal layer, so that the projection display of a picture is completed, the supporting piece is arranged in the sealant, a certain storage space is formed between the chip and the transparent substrate through the supporting action of the supporting piece, the liquid crystal layer is arranged in the storage space supported by the supporting piece, and the supporting piece bears the abutting pressure from the chip and the transparent substrate, so that the thickness of the liquid crystal layer is controlled, and the display effect of the chip is.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a first embodiment of a liquid crystal chip package structure according to the present invention;
FIG. 2 is a schematic structural diagram of a top view angle of a liquid crystal chip package structure according to the present invention;
FIG. 3 is a schematic structural diagram of a second embodiment of a liquid crystal chip package structure according to the present invention;
FIG. 4 is a schematic structural diagram of a third embodiment of a liquid crystal chip package structure according to the present invention;
FIG. 5 is a schematic flow chart illustrating a first embodiment of a liquid crystal chip packaging method according to the present invention;
FIG. 6 is a flow chart illustrating a second embodiment of a liquid crystal chip packaging method according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Chip and method for manufacturing the same | 400 | |
| 200 | |
500 | |
| 300 | Liquid crystal layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, a first embodiment of the present invention provides a liquid crystal chip package structure, including: the liquid crystal display device includes a chip 100, a transparent substrate 200, a liquid crystal layer 300, a sealant 400, and a supporter 500.
The transparent substrate 200 is disposed above the chip 100; the chip 100 includes a wafer, which is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, various circuit element structures, which are called integrated circuit products having specific electrical functions, can be manufactured on the wafer, and a certain storage space is provided between the chip 100 and the transparent substrate 200.
The liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200; the liquid crystal layer 300 includes liquid crystal molecules, and after the substance is in a molten state or dissolved by a solvent, although the substance loses the rigidity of a solid substance, the substance has liquid fluidity, and retains the anisotropic ordered arrangement of partial crystalline substance molecules to form an intermediate state with partial properties of both crystals and liquid, such an oriented ordered fluid existing in the process of converting from a solid state to a liquid state is called liquid crystal, generally light is transmitted through the transparent substrate 200 and emitted to the chip 100, the chip 100 controls the voltage between the liquid crystal layers 300 according to the projection display requirements to enable the liquid crystal molecules in the liquid crystal layer 300 to present different arrangement modes, and the incident light is reflected according to the picture display requirements, thereby forming a picture to be displayed.
The sealant 400 is disposed around the liquid crystal layer 300;
specifically, in order to prevent the liquid crystal in the liquid crystal layer 300 from flowing freely, the liquid crystal layer 300 is confined in a storage space formed between the chip 100 and the transparent substrate 200 by the sealant 400. Generally, the liquid crystal layer 300 is sealed by the sealant 400 and then cured, so that the sealant 400 can be effectively supported between the chip 100 and the transparent substrate 200. The sealant 400 can be cured by natural air drying or heating.
The support 500 is disposed between the chip 100 and the transparent substrate 200, and the support 500 surrounds the liquid crystal layer 300 to support the liquid crystal layer 300.
In the case that the supporting force of the sealant 400 is not sufficient, the sealant 400 itself is easily deformed by a force, so that the chip 100 and the transparent substrate 200 are pressed against the liquid crystal layer 300, and the supporting member 500 is provided to effectively support the chip 100 and the transparent substrate 200.
In the present embodiment, the liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200 in a sealing manner, the chip 100 controls the voltage of the liquid crystal layer 300 to make liquid crystal molecules inside the liquid crystal layer 300 present different arrangement modes, thereby completing the projection display of the picture, the sealant 400 is disposed with the supporting member 500, a certain storage space is formed between the chip 100 and the transparent substrate 200 by the supporting function of the supporting member 500, the liquid crystal layer 300 is disposed in the storage space supported by the supporting member 500, and the supporting member 500 bears the abutting pressure from the chip 100 and the transparent substrate 200, thereby controlling the thickness of the liquid crystal layer 300 and ensuring the display effect of the chip 100.
Further, the height of the supporting member 500 is greater than or equal to the distance between the chip 100 and the transparent substrate 200, the chip 100 and the transparent substrate 200 are sealed and covered, one end of the supporting member 500 abuts against the upper surface of the chip 100, and the other end of the supporting member 500 abuts against the lower surface of the transparent substrate 200, wherein, in the curing process of the sealant 400, shrinkage deformation may occur, gaps may occur between the upper surface of the chip 100 and the lower surface of the transparent substrate 200 and water vapor may enter the liquid crystal layer 300 along the gaps, which affects the arrangement of liquid crystal molecules of the liquid crystal layer 300, and even causes the liquid crystal chip to fail to work normally, the two ends of the supporting member 500 abut against the upper surface of the chip 100 and the lower surface of the transparent substrate 200 respectively, so as to further seal the liquid crystal layer 300, and prevent water vapor from entering the liquid crystal layer 300 in.
Further, the supporting member 500 includes a conductive portion, a conductive layer (not shown) is disposed on the lower surface of the transparent substrate 200, a conductive region (not shown) is disposed on the transparent substrate 200 corresponding to the sealant 400, and the conductive portion is connected to the conductive layer and the conductive region.
Specifically, it can be understood that the supporting member 500 is conductive as a whole, in the related art, the sealant 400 is added with silicon balls with a diameter greater than or equal to the height of the liquid crystal layer 300, the height of the liquid crystal layer cannot be flexibly adjusted through the silicon balls, and meanwhile, the chip 100 and the transparent substrate 200 cannot be electrically conducted, the supporting member 500 is made of aluminum metal, the conductive region of the chip 100 is further connected with a power supply, for example, a circuit board, the power is supplied through the circuit board, the power passes through the conductive region of the chip 100, the power is supplied to the conductive layer of the transparent substrate 200 through the conductive supporting member 500, a power source is provided for the chip 100 to control the arrangement of liquid crystal molecules in the liquid crystal layer 300, the electrical conduction of the chip 100 and the transparent substrate 200 is effectively achieved, the.
In another embodiment, the supporting member 500 is disposed on a side of the sealant 400 away from the liquid crystal layer 300, that is, the sealant 400 surrounds the supporting member 500, so as to further effectively support the liquid crystal layer 300.
Referring to fig. 2, the supporting member 500 surrounds the liquid crystal layer 300, the surface of the supporting member 500 is provided with a liquid crystal filling hole 510, and after the supporting member 500 is completely installed, a liquid crystal is filled through the liquid crystal filling hole 510.
Referring to fig. 3, in addition, according to another embodiment of the present invention, at least one end of the supporting member 500 abuts against the upper surface of the chip 100 or the lower surface of the transparent substrate 200, so that the supporting member 500 can be supported between the upper surface of the chip 100 and the lower surface of the transparent substrate 200 more stably by using the upper surface of the chip 100 or the lower surface of the transparent substrate 200 as a supporting point.
Referring to fig. 4, in addition, the supporting member 500 is embedded in the sealant 400, and the width of the supporting member 500 is smaller than the width of the sealant 400.
Wherein, the columnar support piece 500 is convenient for processing, the columnar support piece 500 can be effectively supported between the chip 100 and the transparent substrate 200, the support piece 500 is embedded inside the sealant 400, that is, the sealant 400 wraps the support piece 500, thus, the sealant 400 can also effectively protect the support piece 500, for example, when the material of the support piece 500 is silicon dioxide or silicon nitride, the sealant 400 can protect the support piece 500 from being corroded, furthermore, when the support piece 500 is conductive metal, for example, aluminum or chromium, when the sealant 400 wraps the conductive support piece 500, the electric leakage can be avoided, meanwhile, aluminum or chromium has certain hardness in the related technical field, under the condition of being conductive, the aluminum or chromium can also be supported between the chip 100 and the transparent substrate 200 by means of the hardness property of the aluminum or chromium.
Further, the sealant 400 is an epoxy resin sealant, and the transparent substrate 200 is a transparent glass plate.
Specifically, in the related art, two materials, namely Epoxy Resin Adhesive and transparent glass, exist, the Epoxy Resin Adhesive (Epoxy Resin Adhesive) is an Adhesive prepared by taking Epoxy Resin as a main body, is colorless and transparent, and can be cured at normal temperature after the liquid crystal layer 400 is sealed, so that the sealing tightness is ensured, the transparent substrate 200 made of the transparent glass material also plays a role in supporting and protecting the liquid crystal layer 300 and the chip 100, the liquid crystal layer 300 and the chip 100 are prevented from being damaged due to external force, and meanwhile, the transparent glass also has good light transmittance.
Referring to fig. 5, the present invention further provides a method for packaging a liquid crystal chip, in which a liquid crystal layer is disposed between the chip and a transparent substrate, the method comprising:
step S10, depositing a support layer on the upper surface of the chip or the lower surface of the transparent substrate;
specifically, the deposition manner includes chemical deposition or physical deposition, the material of the support layer is silicon dioxide or silicon nitride, and multiple depositions are generally performed according to the thickness requirement.
Step S20, etching a support pattern at the position of the sealant corresponding to the upper surface of the chip or the lower surface of the transparent substrate by adopting a photoetching process;
specifically, a desired support pattern, for example, a cylindrical support pattern, which is easily formed and easily processed, can be accurately etched on the sealant by using a photolithography process, and in addition, the processed pattern is not limited to a cylindrical shape.
Step S30, dry-etching the supporting layer according to the supporting pattern to obtain a supporting member for supporting the liquid crystal layer.
The dry etching process can ensure that the structural appearance of the supporting piece is obtained, the supporting pattern is effectively transferred onto the supporting layer, the corresponding position of the supporting layer is shielded by the sealant, the plasma and the sealant react with the supporting layer except the shielding position during dry etching, and the rest shape structure comprises the supporting piece which accords with the supporting pattern.
Referring to fig. 6, further, step S10 of depositing a support layer on the upper surface of the chip or the lower surface of the transparent substrate includes:
step S01, pre-treating the upper surface of the chip or the lower surface of the transparent substrate to increase the adhesion of the support layer, specifically, the pre-treatment may be plasma bombardment to increase the roughness of the upper surface of the chip or the lower surface of the transparent substrate, so as to improve the adhesion of the support layer deposited thereon, and the impurity oil stain on the upper surface of the chip or the lower surface of the transparent substrate may be cleaned by a chemical cleaning method to increase the adhesion of the support layer, or the combination of the two methods of plasma bombardment and chemical cleaning.
In this embodiment, it is provided with the liquid crystal layer to seal between chip and transparent substrate, the chip passes through the voltage of control liquid crystal layer, make the inside liquid crystal molecule of liquid crystal layer present different arrangement, accomplish the projection display of picture from this, set up support piece in sealed glue, supporting role through support piece, form certain storage space between chip and transparent substrate, the liquid crystal layer sets up in the storage space that support piece supported, support piece bears the butt pressure that comes from chip and transparent substrate, reduce the pressure that the liquid crystal layer received from this, further avoid the liquid crystal to leak outward, guarantee that the liquid crystal chip accomplishes the encapsulation.
The invention also provides a projection display, which comprises a liquid crystal chip packaging structure and a light source, wherein the light source irradiates the liquid crystal chip packaging structure to perform projection display, and the liquid crystal chip packaging structure comprises: the liquid crystal display device includes a chip 100, a transparent substrate 200, a liquid crystal layer 300, a sealant 400, and a supporter 500.
The transparent substrate 200 is disposed above the chip 100; the chip 100 includes a wafer, which is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, various circuit element structures, which are called integrated circuit products having specific electrical functions, can be manufactured on the wafer, and a certain storage space is provided between the chip 100 and the transparent substrate 200.
The liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200; the liquid crystal layer 300 includes liquid crystal molecules, and after the substance is in a molten state or dissolved by a solvent, although the substance loses the rigidity of a solid substance, the substance has liquid fluidity, and retains the anisotropic ordered arrangement of partial crystalline substance molecules to form an intermediate state with partial properties of both crystals and liquid, such an oriented ordered fluid existing in the process of converting from a solid state to a liquid state is called liquid crystal, generally light is transmitted through the transparent substrate 200 and emitted to the chip 100, the chip 100 controls the voltage between the liquid crystal layers 300 according to the projection display requirements to enable the liquid crystal molecules in the liquid crystal layer 300 to present different arrangement modes, and the incident light is reflected according to the picture display requirements, thereby forming a picture to be displayed.
The sealant 400 is disposed around the liquid crystal layer 300;
specifically, in order to prevent the liquid crystal in the liquid crystal layer 300 from flowing freely, the liquid crystal layer 300 is confined in a storage space formed between the chip 100 and the transparent substrate 200 by the sealant 400. Generally, the liquid crystal layer 300 is sealed by the sealant 400 and then cured, so that the sealant 400 can be effectively supported between the chip 100 and the transparent substrate 200. The sealant 400 can be cured by natural air drying or heating.
The support 500 is disposed between the chip 100 and the transparent substrate 200, and the support 500 surrounds the liquid crystal layer 300 to support the liquid crystal layer 300.
Before the sealant 400 is cured, the supporting force of the sealant 400 is insufficient, and the sealant 400 itself is easily deformed by a force, so that the chip 100 and the transparent substrate 200 extrude the liquid crystal layer 300, and the supporting member 500 is arranged in the sealant 400, so that the chip 100 and the transparent substrate 200 can be effectively supported by the supporting member 500.
In the present embodiment, the liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200 in a sealing manner, the chip 100 controls the voltage of the liquid crystal layer 300 to make liquid crystal molecules inside the liquid crystal layer 300 present different arrangement modes, thereby completing the projection display of the picture, the sealant 400 is disposed with the supporting member 500, a certain storage space is formed between the chip 100 and the transparent substrate 200 by the supporting function of the supporting member 500, the liquid crystal layer 300 is disposed in the storage space supported by the supporting member 500, and the supporting member 500 bears the abutting pressure from the chip 100 and the transparent substrate 200, thereby controlling the thickness of the liquid crystal layer 300 and ensuring the display effect of the chip 100.
Other embodiments of a projection display according to the present invention can refer to the above embodiments of the liquid crystal chip package structure, and are not described herein again.
The invention also provides a projection display system, which comprises a liquid crystal chip packaging structure and a shell, wherein the liquid crystal chip packaging structure is arranged in the shell, namely the chip 100, the transparent substrate 200, the liquid crystal layer 300, the sealant 400 and the supporting piece 500. Such as an LCOS (Liquid Crystal on Silicon) projection display system.
The transparent substrate 200 is disposed above the chip 100; the chip 100 includes a wafer, which is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, various circuit element structures, which are called integrated circuit products having specific electrical functions, can be manufactured on the wafer, and a certain storage space is provided between the chip 100 and the transparent substrate 200.
The liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200; the liquid crystal layer 300 includes liquid crystal molecules, and after the substance is in a molten state or dissolved by a solvent, although the substance loses the rigidity of a solid substance, the substance has liquid fluidity, and retains the anisotropic ordered arrangement of partial crystalline substance molecules to form an intermediate state with partial properties of both crystals and liquid, such an oriented ordered fluid existing in the process of converting from a solid state to a liquid state is called liquid crystal, generally light is transmitted through the transparent substrate 200 and emitted to the chip 100, the chip 100 controls the voltage between the liquid crystal layers 300 according to the projection display requirements to enable the liquid crystal molecules in the liquid crystal layer 300 to present different arrangement modes, and the incident light is reflected according to the picture display requirements, thereby forming a picture to be displayed.
The sealant 400 is disposed around the liquid crystal layer 300;
specifically, in order to prevent the liquid crystal in the liquid crystal layer 300 from flowing freely, the liquid crystal layer 300 is confined in a storage space formed between the chip 100 and the transparent substrate 200 by the sealant 400. Generally, the liquid crystal layer 300 is sealed by the sealant 400 and then cured, so that the sealant 400 can be effectively supported between the chip 100 and the transparent substrate 200. The sealant 400 can be cured by natural air drying or heating.
The support 500 is disposed between the chip 100 and the transparent substrate 200, and the support 500 surrounds the liquid crystal layer 300 to support the liquid crystal layer 300.
Before the sealant 400 is cured, the supporting force of the sealant 400 is insufficient, and the sealant 400 itself is easily deformed by a force, so that the chip 100 and the transparent substrate 200 extrude the liquid crystal layer 300, and the supporting member 500 is arranged in the sealant 400, so that the chip 100 and the transparent substrate 200 can be effectively supported by the supporting member 500.
In the present embodiment, the liquid crystal layer 300 is disposed between the chip 100 and the transparent substrate 200 in a sealing manner, the chip 100 controls the voltage of the liquid crystal layer 300 to make liquid crystal molecules inside the liquid crystal layer 300 present different arrangement modes, thereby completing the projection display of the picture, the sealant 400 is disposed with the supporting member 500, a certain storage space is formed between the chip 100 and the transparent substrate 200 by the supporting function of the supporting member 500, the liquid crystal layer 300 is disposed in the storage space supported by the supporting member 500, and the supporting member 500 bears the abutting pressure from the chip 100 and the transparent substrate 200, thereby controlling the thickness of the liquid crystal layer 300 and ensuring the display effect of the chip 100.
Other embodiments of a projection display system according to the present invention can refer to the above embodiments of the liquid crystal chip package structure, and are not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A liquid crystal chip package structure, comprising:
a chip;
a transparent substrate disposed over the chip;
the liquid crystal layer is arranged between the chip and the transparent substrate;
the sealant is arranged at the periphery of the liquid crystal layer; and
the support piece is arranged between the chip and the transparent substrate, and the support piece is arranged around the liquid crystal layer to support the liquid crystal layer.
2. The liquid crystal chip package structure of claim 1, wherein the height of the supporting member is greater than or equal to the distance between the chip and the transparent substrate, the chip and the transparent substrate are covered, one end of the supporting member abuts against the upper surface of the chip, and the other end of the supporting member abuts against the lower surface of the transparent substrate.
3. The liquid crystal chip package structure of claim 2, wherein the supporting member comprises a conductive portion, a conductive layer is disposed on the lower surface of the transparent substrate, a conductive region is disposed on the transparent substrate corresponding to the sealant region, and the conductive portion is connected to the conductive layer and the conductive region.
4. The liquid crystal chip package structure of claim 1, wherein the supporting member is disposed on a side of the sealant away from the liquid crystal layer.
5. The liquid crystal chip package structure of claim 4, wherein the supporting member surrounds the liquid crystal layer, and a chip filling hole is formed on a surface of the supporting member.
6. The liquid crystal chip package structure of any one of claims 1 to 5, wherein the sealant is an epoxy resin adhesive, and the transparent substrate is a transparent glass plate.
7. A method of packaging a liquid crystal chip, wherein a liquid crystal layer is disposed between the chip and a transparent substrate, the method comprising:
depositing a supporting layer on the upper surface of the chip or the lower surface of the transparent substrate;
etching a supporting pattern at the position of the sealant corresponding to the upper surface of the chip or the lower surface of the transparent substrate by adopting a photoetching process;
and dry-etching the support layer according to the support pattern to obtain a support member for supporting the liquid crystal layer.
8. The method for packaging a liquid crystal chip as claimed in claim 7, wherein the step of depositing the support layer on the upper surface of the chip or the lower surface of the transparent substrate comprises:
and pretreating the upper surface of the chip or the lower surface of the transparent substrate to increase the deposition adhesion of the supporting layer.
9. A projection display, comprising the liquid crystal chip package structure of any one of claims 1 to 6 and a light source, wherein the light source illuminates the liquid crystal chip package structure for projection display.
10. A projection display system, comprising the liquid crystal chip package structure of any one of claims 1 to 6 and a housing, wherein the liquid crystal chip package structure is disposed in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911029419.9A CN110727148A (en) | 2019-10-24 | 2019-10-24 | Liquid crystal chip packaging structure, method, projection display and projection display system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911029419.9A CN110727148A (en) | 2019-10-24 | 2019-10-24 | Liquid crystal chip packaging structure, method, projection display and projection display system |
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| CN110727148A true CN110727148A (en) | 2020-01-24 |
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| CN201911029419.9A Pending CN110727148A (en) | 2019-10-24 | 2019-10-24 | Liquid crystal chip packaging structure, method, projection display and projection display system |
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