CN110716128A - PCB loss test method - Google Patents

PCB loss test method Download PDF

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Publication number
CN110716128A
CN110716128A CN201911040069.6A CN201911040069A CN110716128A CN 110716128 A CN110716128 A CN 110716128A CN 201911040069 A CN201911040069 A CN 201911040069A CN 110716128 A CN110716128 A CN 110716128A
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CN
China
Prior art keywords
transmission line
loss
pcb
loss value
sma
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Pending
Application number
CN201911040069.6A
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Chinese (zh)
Inventor
谢健鸿
陈钟俊
李艳国
王国
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Shenzhen Fastprint Circuit Tech Co Ltd
Guangzhou Fastprint Circuit Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
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Application filed by Shenzhen Fastprint Circuit Tech Co Ltd filed Critical Shenzhen Fastprint Circuit Tech Co Ltd
Priority to CN201911040069.6A priority Critical patent/CN110716128A/en
Publication of CN110716128A publication Critical patent/CN110716128A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2688Measuring quality factor or dielectric loss, e.g. loss angle, or power factor
    • G01R27/2694Measuring dielectric loss, e.g. loss angle, loss factor or power factor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

The invention discloses a PCB loss test method, and relates to the technical field of PCB test. The method comprises the following steps: selecting a first transmission line and a second transmission line with different lengths on the PCB; connecting the network analyzer and the electronic standard component by using a cable to calibrate the cable; the two ends of the first transmission line are connected with a first SMA clamp testing module, and the two ends of the second transmission line are connected with a second SMA clamp testing module; connecting the SMA connector to a first SMA clamp test module, connecting the cable to the SMA connector, and obtaining a loss value of the first transmission line by reading a reading of a network analyzer; connecting the SMA connector to a second SMA fixture test module, connecting the cable to the SMA connector, and obtaining a loss value of the second transmission line by reading a reading of the network analyzer; and calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line. According to the test method, the test efficiency is greatly improved, manpower and material resources are saved, the accuracy of the measured loss value result is high, and the error is within +/-5%.

Description

PCB loss test method
Technical Field
The invention relates to the technical field of PCB testing, in particular to a PCB loss testing method.
Background
The coming of the 5G era causes the printed circuit board industry to enter a high-speed and high-frequency process, when signal transmission reaches Gbps, the rising and falling speeds of signal high-low level switching are very high, and factors such as loss, reflection and crosstalk have great influence on signal quality. The quality of the signal is evaluated, and loss is the first factor. Currently, there are five methods recognized in the industry to measure loss: EBW (effective bandwidth method), RIE (root impulse energy method), SPP (short pulse propagation method), SET2DIL (single-ended TDR differential insertion loss method), FD (frequency domain method), the five measurement methods are the most accurate FD (frequency domain method), but the method is time-consuming, and the average loss of one test takes two hours or more, which seriously reduces the working efficiency of the practitioner. There is a continuing need for a method of increasing the measurement rate while maintaining accurate wear.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a PCB loss testing method which can effectively improve the efficiency of measuring loss and obtain the loss of a transmission line more conveniently.
One embodiment of the present invention provides a PCB loss test method, including:
selecting a first transmission line and a second transmission line with different lengths, wherein the first transmission line and the second transmission line are transmission lines on a PCB;
connecting a network analyzer and an electronic standard part by using a cable, calibrating the cable by using the network analyzer and the electronic calibration part, and separating the electronic calibration part after the calibration is finished;
connecting a first SMA clamp testing module at two ends of the first transmission line, and connecting a second SMA clamp testing module at two ends of the second transmission line;
connecting an SMA connector to the first SMA clamp test module, connecting the cable to the SMA connector, and obtaining a loss value of the first transmission line by reading a reading of the network analyzer;
connecting an SMA connector to the second SMA clamp test module, connecting the cable to the SMA connector, and obtaining a loss value of the second transmission line by reading a reading of the network analyzer;
and calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line.
The PCB loss test method of the embodiment of the invention at least has the following beneficial effects: the method has the advantages of simple steps, short testing time, great saving of manpower and material resources, and small error of the testing result due to the fact that the cable is calibrated.
According to other embodiments of the PCB loss test method of the present invention, the first transmission line and the second transmission line are single-ended transmission lines.
According to other embodiments of the PCB loss test method of the present invention, the first transmission line and the second transmission line are differential transmission lines.
According to another embodiment of the present invention, a specific formula for calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line is as follows:
SUB=(A2-A1)/ΔL (1)
Loss1=0.9713*SUB+0.0027 (2)
a1 is the Loss value of the first transmission line, A2 is the Loss value of the second transmission line, A2 is less than A1, delta L is the length difference of the first transmission line and the second transmission line, delta L is greater than 0, and Loss1 is the PCB Loss.
According to another embodiment of the present invention, a specific formula for calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line is as follows:
SUB=(A2-A1)/ΔL (1)
Loss2=SUB-0.0025f (3)
wherein a1 is a Loss value of the first transmission line, a2 is a Loss value of the second transmission line, a2< a1, Δ L is a length difference between the first transmission line and the second transmission line, Δ L >0, Loss2 is a PCB Loss, and f is a frequency corresponding to SUB.
Drawings
FIG. 1 is a schematic flow chart diagram illustrating an embodiment of a PCB loss testing method in accordance with the present invention;
FIG. 2 is a schematic diagram of a test of a single-ended transmission line according to an embodiment of the present invention;
fig. 3 is a schematic diagram of testing a differential transmission line according to an embodiment of the present invention.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. If a feature is referred to as being "disposed," "secured," "connected," or "mounted" to another feature, it can be directly disposed, secured, or connected to the other feature or indirectly disposed, secured, connected, or mounted to the other feature.
In the description of the embodiments of the present invention, if "a number" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "greater than", "lower" or "inner" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
Example one
Referring to fig. 1, a flow diagram of the PCB loss testing method in this embodiment is shown. The method comprises the following steps:
s100, selecting a first transmission line and a second transmission line which are different in length, wherein the first transmission line and the second transmission line are transmission lines on a PCB;
s200, connecting the network analyzer and the electronic standard component by using a cable, calibrating the cable by using the network analyzer and the electronic calibration component, and separating the electronic calibration component after the calibration is finished;
s300, connecting a first SMA clamp testing module at two ends of a first transmission line, and connecting a second SMA clamp testing module at two ends of a second transmission line;
s400, connecting the SMA connector to a first SMA clamp test module, connecting a cable to the SMA connector, and obtaining a loss value of the first transmission line by reading a reading of a network analyzer;
s500, connecting the SMA connector to a second SMA fixture test module, connecting a cable to the SMA connector, and obtaining a loss value of a second transmission line by reading a reading of a network analyzer;
and S600, calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line.
Referring to fig. 2, in the present embodiment, the first transmission line and the second transmission line are single-ended transmission lines as an example. 100 is a first transmission line, 200 is a second transmission line, 110 is a first SMA clamp test module, and 210 is a second SMA clamp test module.
During testing, two transmission lines on the PCB are selected, and the first transmission line 100 is 5 inches shorter than the second transmission line 200 (the length difference can be selected to be other values).
Connecting the network analyzer and the electronic standard component (a measuring instrument) by a cable, calibrating the cable by using the network analyzer and the electronic calibration component, and separating the electronic calibration component after the calibration is finished. The method specifically comprises the following steps: and selecting a corresponding calibration mode on the network analyzer, and waiting for several seconds. The purpose of the calibration is to: since the cable also has a certain transmission loss, the loss of the cable needs to be zeroed during calculation, and therefore the cable is calibrated.
A first SMA clamp test module 110 is connected at both ends of the first transmission line 100 and a second SMA clamp test module 210 is connected at both ends of the second transmission line 200. The SMA connector is connected to the first SMA clamp test module 110, the cable is connected to the SMA connector, and the loss value a1 of the first transmission line 100 is obtained by reading the network analyzer. The SMA connector is then connected to the second SMA clamp test module 210, the cable is connected to the SMA connector, and the loss value a2 of the second transmission line 200 is obtained by reading the readings of the network analyzer. It is worth noting here that the first transmission line a1 and the second transmission line a2 may also be tested simultaneously using two SMA connectors.
Calculating the PCB loss according to the loss value A1 of the first transmission line 100 and the loss value A2 of the second transmission line 200, wherein the specific formula is as follows:
SUB=(A2-A1)/ΔL (1)
Loss1=0.9713*SUB+0.0027 (2)
in this embodiment, the Loss values a1 and a2 are both negative values, and since the second transmission line 200 is longer than the first transmission line 100, a2< a1, Δ L is 5inch, SUB is negative, and Loss1 is PCB Loss (also negative).
Example two
The difference from the first embodiment is that, in the present embodiment, referring to fig. 3, the first transmission line 100 and the second transmission line 200 are differential transmission lines.
The testing method is the same as the steps in the first embodiment, and is not described herein again.
The specific formula for calculating the PCB loss is as follows:
SUB=(A2-A1)/ΔL (1)
Loss2=SUB-0.0025f (3)
wherein, a1 is the Loss value of the first transmission line 100, a2 is the Loss value of the second transmission line 200, a2< a1, Δ L is the length difference between the first transmission line 100 and the second transmission line 200, Δ L >0, Loss2 is the PCB Loss, and f is the frequency corresponding to SUB.
It should be noted here that, since the differential transmission line is sensitive to the transmission frequency compared to the single-ended transmission line, the frequency f needs to be added to the calculation formula, and the calculation of the single-ended transmission line can be ignored.
According to the test method, the time for measuring the loss of the PCB at one time can be shortened to be within 5 minutes, the test efficiency is greatly improved, manpower and material resources are saved, the accuracy of the measured loss value result is high, and the error is within +/-5%.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.

Claims (5)

1. A PCB loss test method, the method comprising:
selecting a first transmission line and a second transmission line with different lengths, wherein the first transmission line and the second transmission line are transmission lines on a PCB;
connecting a network analyzer and an electronic standard part by using a cable, calibrating the cable by using the network analyzer and the electronic calibration part, and separating the electronic calibration part after the calibration is finished;
connecting a first SMA clamp testing module at two ends of the first transmission line, and connecting a second SMA clamp testing module at two ends of the second transmission line;
connecting an SMA connector to the first SMA clamp test module, connecting the cable to the SMA connector, and obtaining a loss value of the first transmission line by reading a reading of the network analyzer;
connecting an SMA connector to the second SMA clamp test module, connecting the cable to the SMA connector, and obtaining a loss value of the second transmission line by reading a reading of the network analyzer;
and calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line.
2. The PCB loss testing method of claim 1, wherein the first transmission line and the second transmission line are single-ended transmission lines.
3. The PCB loss testing method of claim 1, wherein the first transmission line and the second transmission line are differential transmission lines.
4. The PCB loss test method of claim 2, wherein a specific formula for calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line is as follows:
SUB=(A2-A1)/ΔL (1)
Loss1=0.9713*SUB+0.0027 (2)
a1 is the Loss value of the first transmission line, A2 is the Loss value of the second transmission line, A2 is less than A1, delta L is the length difference of the first transmission line and the second transmission line, delta L is greater than 0, and Loss1 is the PCB Loss.
5. The PCB loss test method of claim 3, wherein a specific formula for calculating the PCB loss according to the loss value of the first transmission line and the loss value of the second transmission line is as follows:
SUB=(A2-A1)/ΔL (1)
Loss2=SUB-0.0025f (3)
wherein a1 is a Loss value of the first transmission line, a2 is a Loss value of the second transmission line, a2< a1, Δ L is a length difference between the first transmission line and the second transmission line, Δ L >0, Loss2 is a PCB Loss, and f is a frequency corresponding to SUB.
CN201911040069.6A 2019-10-29 2019-10-29 PCB loss test method Pending CN110716128A (en)

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CN111458588A (en) * 2020-04-17 2020-07-28 恒为科技(上海)股份有限公司 Differential coupling line, preparation method thereof and loss test method

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Publication number Priority date Publication date Assignee Title
CN111458588A (en) * 2020-04-17 2020-07-28 恒为科技(上海)股份有限公司 Differential coupling line, preparation method thereof and loss test method
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