CN110714221A - Electroplating solution air stirring pipeline - Google Patents

Electroplating solution air stirring pipeline Download PDF

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Publication number
CN110714221A
CN110714221A CN201911204472.8A CN201911204472A CN110714221A CN 110714221 A CN110714221 A CN 110714221A CN 201911204472 A CN201911204472 A CN 201911204472A CN 110714221 A CN110714221 A CN 110714221A
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CN
China
Prior art keywords
pipe
stirring
air
compressed air
electroplating solution
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911204472.8A
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Chinese (zh)
Inventor
匡优新
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Wuxi Xingyi Intelligent Environment Equipment Co Ltd
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Wuxi Xingyi Intelligent Environment Equipment Co Ltd
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Priority to CN201911204472.8A priority Critical patent/CN110714221A/en
Publication of CN110714221A publication Critical patent/CN110714221A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses an electroplating solution air stirring pipeline which comprises a compressed air main pipe and a plurality of tank bodies, wherein an H-shaped stirring pipe is uniformly distributed at the bottom of each tank body, the H-shaped stirring pipe is connected into the compressed air main pipe through a connecting pipe, the compressed air main pipe is connected with a compressed air source, the H-shaped stirring pipe comprises two stirring branch pipes which are arranged in parallel at intervals along the length direction of the tank body, the middle parts of the two stirring branch pipes are connected through a communicating pipe, a header pipe is connected onto the communicating pipe, the header pipe is connected into the connecting pipe, and a plurality of airflow jet orifices are formed in each stirring branch pipe. Above-mentioned electroplating solution air stirring pipeline arranges H type stirred tubular at the bottom in the tank, and the piece is plated to the bottom even spout of air current direction from the tank, has improved stirring efficiency, better guarantee stirring effect.

Description

Electroplating solution air stirring pipeline
Technical Field
The invention belongs to the technology of stirring of electroplating solution, and particularly relates to an air stirring pipeline for the electroplating solution.
Background
The heating and cooling of the plating solution generally requires uniform agitation, and the cleaning of the plated workpiece in the rinsing bath also requires agitation to promote the cleaning effect. Some solutions do not plate well without agitation or cannot be energized with large current without agitation. Therefore, agitation is important for electroplating. There are many ways of stirring: compressed air agitation, cathode movement, vibration, pump agitation, solution spraying, and the like. The compressed air stirring is the most common solution stirring method, is widely applied to the stirring of the cleaning tank, and can greatly improve the cleaning efficiency.
At present, an air stirring pipe in a cleaning tank is centrally arranged by using one air stirring pipe and is controlled by a manual valve. However, the plating part hanging positions in the cleaning tank have different hanging thicknesses, and the arrangement mode of one stirring pipe is not easy to ensure that the plating parts are uniformly stirred.
Disclosure of Invention
The invention aims to provide an electroplating solution air stirring pipeline to solve the problem of uneven stirring in the prior art when solution is stirred by compressed air.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an electroplating solution air stirring pipeline, its includes compressed air house steward and a plurality of cell body, wherein, H type stirring pipe has been put to the bottom equipartition of every cell body, H type stirring pipe passes through the connecting pipe and inserts compressed air house steward, compressed air house steward connects compressed air source, just H type stirring pipe includes two stirring branch pipes along the parallel interval arrangement of cell body length direction, and the middle part of two stirring branch pipes is passed through communicating pipe and is connected, be connected with the manifold on communicating pipe, the manifold inserts the connecting pipe, a plurality of air jet has all been seted up on two stirring branch pipes.
Particularly, the plurality of air flow jet openings are arranged in a staggered mode at equal intervals, and the included angle between every two adjacent air flow jet openings is 90 degrees.
Particularly, an elbow is installed at the position, located at the opening at the top of the groove body, of the connecting pipe, and an anti-siphon small hole is formed in the elbow.
Particularly, the anti-siphon small holes are obliquely formed upwards at an angle of 45 degrees.
Particularly, a shielding cover plate is arranged on the elbow outside the anti-siphon small hole.
Particularly, a bracket is fixed above one side of the groove body in an inclined mode, the compressed air main pipe is arranged on the bracket, and a control valve is installed on the connecting pipe.
Particularly, the top opening part of cell body is provided with the conduit saddle, the connecting pipe set up in on the conduit saddle, the bottom of cell body is provided with a plurality of pipe strap, is fixed in the bottom of cell body through the pipe strap with H type stirred tube.
Compared with the prior art, the electroplating solution air stirring pipeline has the advantages that the H-shaped stirring pipe is arranged at the bottom in the tank, the airflow direction is uniformly sprayed to the plating part from the bottom of the tank, the stirring efficiency is improved, the stirring effect is better ensured, and meanwhile, the anti-siphon small holes are formed, so that the siphon phenomenon caused by inconsistent pressure of each tank body is avoided.
Drawings
FIG. 1 is a schematic structural view of an air agitation piping for an electroplating solution according to an embodiment of the present invention;
FIG. 2 is a top view of an H-shaped stirring pipe of an air stirring pipeline for electroplating solution according to an embodiment of the present invention;
FIG. 3 is a schematic view of an anti-siphon orifice of an air agitation piping for electroplating solution according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the arrangement of the air flow injection ports of the air stirring pipeline for electroplating solution according to the embodiment of the present invention;
FIG. 5 is a cross-sectional view of an air flow injection port of an air agitation piping for plating solution according to an embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 5, in the present embodiment, an air stirring pipeline for electroplating solution includes a compressed air main pipe 1 and a plurality of tank bodies 2, a bracket 3 is fixed on one side of each tank body 2, the compressed air main pipe 1 is disposed on the bracket 3, the compressed air main pipe 1 is connected to a compressed air source, H-shaped stirring pipes 4 are disposed at the bottom of each tank body 2, the H-shaped stirring pipes 4 are connected to the compressed air main pipe 1 through connecting pipes 5, control valves 6 are installed on the connecting pipes 5, the sizes of air flows in the pipes can be controlled through the control valves 6, and further the intensity of air stirring in the tank can be controlled. Be provided with conduit saddle 7 on the groove panel of the open-top department of cell body 2, connecting pipe 5 sets up on conduit saddle 7, and the bottom of cell body 2 is provided with a plurality of pipe strap 8, is fixed in the bottom of cell body 2 through pipe strap 8 with H type stirred tube 4.
H type stirred tube 4 includes two along 2 length direction parallel interval arrangements of cell body two stirring branch pipes 40, the both ends of two stirring branch pipes 40 are sealed, and the middle part of two stirring branch pipes 40 is passed through communicating pipe 41 and is connected, be connected with collection pipe 42 on communicating pipe 41, collection pipe 42 inserts connecting pipe 5, a plurality of air jet 43 has all been seted up on two stirring branch pipes 40, a plurality of air jet 43 equidistance interval staggered arrangement, and the contained angle of two adjacent air jet 43 is 90, air jet 43's opening direction can make progress as required, also can be downward.
Install elbow 9 on the position that lies in the top opening part of cell body 2 and expose the liquid level on the connecting pipe 5, the elbow 9 is last to begin to have anti-siphon aperture 10, and anti-siphon aperture 10 is 45 jiaos and upwards offers to one side, and its effect is: there are a plurality of cell bodies 2 on the production line, and each H type stirred tube 4 in the cell body 2 all connects in same compressed air house steward 1 through connecting pipe 5, when compressed air house steward 1 stops the gas, or when there is pressure differential in each groove, takes place siphon phenomenon very easily, makes certain inslot liquid flow to another groove through air stirred tube, causes cross contamination. The anti-siphon holes 10 help to keep the pressure of each groove consistent, thereby avoiding the siphon phenomenon. A shielding cover plate 11 is arranged above the anti-siphon small hole 10 to prevent fine particles in the air from falling into the anti-siphon small hole 10 to block the anti-siphon small hole.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (7)

1. The utility model provides an electroplating solution air stirring pipeline, its includes compressed air house steward and a plurality of cell body, its characterized in that, H type stirring pipe has been put to the bottom equipartition of every cell body, H type stirring pipe passes through the connecting pipe and inserts compressed air house steward, compressed air house steward connects compressed air source, just H type stirring pipe includes two stirring branch pipes along the parallel interval arrangement of cell body length direction, and the middle part of two stirring branch pipes is passed through communicating pipe and is connected, be connected with the manifold on communicating pipe, the manifold inserts the connecting pipe, a plurality of air jet has all been seted up on two stirring branch pipes.
2. The air agitation pipeline for electroplating solution according to claim 1, wherein said plurality of air jet orifices are equidistantly and alternately arranged, and the angle between two adjacent air jet orifices is 90 °.
3. The air stirring pipeline for electroplating solution according to claim 1, wherein a bend is arranged at the position of the top opening of the tank body on the connecting pipe, and an anti-siphon small hole is arranged on the bend.
4. The air agitation piping for plating solution of claim 3, wherein said anti-siphon small hole is opened obliquely upward at an angle of 45 °.
5. The air agitation piping for plating solution according to claim 3 or 4, wherein said elbow is provided with a shielding cover plate outside said anti-siphon holes.
6. The air stirring pipeline for electroplating solution according to claim 1, wherein a bracket is fixed on one side of the tank body obliquely above, the compressed air main pipe is arranged on the bracket, and the connecting pipe is provided with a control valve.
7. The air stirring pipeline for the electroplating solution as claimed in claim 1, wherein a pipe bracket is arranged at the opening at the top of the tank body, the connecting pipe is arranged on the pipe bracket, a plurality of pipe clamps are arranged at the bottom of the tank body, and the H-shaped stirring pipe is fixed at the bottom of the tank body through the pipe clamps.
CN201911204472.8A 2019-11-29 2019-11-29 Electroplating solution air stirring pipeline Pending CN110714221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911204472.8A CN110714221A (en) 2019-11-29 2019-11-29 Electroplating solution air stirring pipeline

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911204472.8A CN110714221A (en) 2019-11-29 2019-11-29 Electroplating solution air stirring pipeline

Publications (1)

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CN110714221A true CN110714221A (en) 2020-01-21

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CN201911204472.8A Pending CN110714221A (en) 2019-11-29 2019-11-29 Electroplating solution air stirring pipeline

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113388835A (en) * 2021-06-30 2021-09-14 中国航发贵州黎阳航空动力有限公司 Chemical milling device and using method thereof
CN115043495A (en) * 2022-07-06 2022-09-13 武汉辰雨环保科技有限公司 Rural sewage container type A 2 O integrated processing device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09195095A (en) * 1996-01-16 1997-07-29 Chuo Seisakusho Ltd Siphon preventive pipeline and surface-treating device
CN101403133A (en) * 2007-11-08 2009-04-08 匡优新 Air stirring pipe for electroplating production equipment
CN104152977A (en) * 2014-07-31 2014-11-19 河北昊昱机电设备研究所有限公司 Full automatic electroplating production line
CN204265879U (en) * 2014-12-02 2015-04-15 北京欧地安科技有限公司 A kind of plating tank air stirrer
CN209082026U (en) * 2018-11-26 2019-07-09 惠州市鑫华美机械有限公司 A kind of electroplating bath agitating device
CN209669389U (en) * 2018-12-25 2019-11-22 清远敏惠汽车零部件有限公司 Microporous nickel air stirrer
CN211471628U (en) * 2019-11-29 2020-09-11 无锡星亿智能环保装备股份有限公司 Electroplating solution air stirring pipeline

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09195095A (en) * 1996-01-16 1997-07-29 Chuo Seisakusho Ltd Siphon preventive pipeline and surface-treating device
CN101403133A (en) * 2007-11-08 2009-04-08 匡优新 Air stirring pipe for electroplating production equipment
CN104152977A (en) * 2014-07-31 2014-11-19 河北昊昱机电设备研究所有限公司 Full automatic electroplating production line
CN204265879U (en) * 2014-12-02 2015-04-15 北京欧地安科技有限公司 A kind of plating tank air stirrer
CN209082026U (en) * 2018-11-26 2019-07-09 惠州市鑫华美机械有限公司 A kind of electroplating bath agitating device
CN209669389U (en) * 2018-12-25 2019-11-22 清远敏惠汽车零部件有限公司 Microporous nickel air stirrer
CN211471628U (en) * 2019-11-29 2020-09-11 无锡星亿智能环保装备股份有限公司 Electroplating solution air stirring pipeline

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113388835A (en) * 2021-06-30 2021-09-14 中国航发贵州黎阳航空动力有限公司 Chemical milling device and using method thereof
CN115043495A (en) * 2022-07-06 2022-09-13 武汉辰雨环保科技有限公司 Rural sewage container type A 2 O integrated processing device

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