CN110699742A - Air stirring system for electroplating solution - Google Patents
Air stirring system for electroplating solution Download PDFInfo
- Publication number
- CN110699742A CN110699742A CN201911204405.6A CN201911204405A CN110699742A CN 110699742 A CN110699742 A CN 110699742A CN 201911204405 A CN201911204405 A CN 201911204405A CN 110699742 A CN110699742 A CN 110699742A
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- China
- Prior art keywords
- pipe
- air
- electroplating solution
- tank body
- stirring
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- 238000003756 stirring Methods 0.000 title claims abstract description 45
- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000013019 agitation Methods 0.000 claims description 14
- 210000005056 cell body Anatomy 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 16
- 238000007747 plating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000004401 flow injection analysis Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an air stirring system of an electroplating solution, which comprises a plurality of tank bodies, wherein the bottom of each tank body is uniformly provided with a ring-shaped stirring pipe, the ring-shaped stirring pipe is connected into a compressed air main pipe through a connecting pipe, the ring-shaped stirring pipe is formed by connecting two long pipes with the same length and two short pipes with the same length through a three-way joint and three bent pipes, the two long pipes are arranged along the length direction of the tank body, the two short pipes are arranged along the width direction of the tank body, the connecting pipe is connected with the ring-shaped stirring pipe through a movable joint, and a plurality of airflow jet orifices are respectively arranged on the long pipes and the short pipes. The annular stirring pipe is arranged at the bottom in the electroplating solution air stirring system, and the air flow direction is uniformly sprayed to the plated part from the periphery of the bottom of the electroplating solution air stirring system, so that the stirring efficiency is improved, and the cleaning effect is better guaranteed.
Description
Technical Field
The invention belongs to the technology of electroplating solution stirring, and particularly relates to an air stirring system for an electroplating solution.
Background
The heating and cooling of the plating solution generally requires uniform agitation, and the cleaning of the plated workpiece in the rinsing bath also requires agitation to promote the cleaning effect. Some solutions do not plate well without agitation or cannot be energized with large current without agitation. Therefore, agitation is important for electroplating. There are many ways of stirring: compressed air agitation, cathode movement, vibration, pump agitation, solution spraying, and the like. The compressed air stirring is the most common solution stirring method, is widely applied to the stirring of the cleaning tank, and can greatly improve the cleaning efficiency.
At present, an air stirring pipe in a cleaning tank is centrally arranged by using one air stirring pipe and is controlled by a manual valve. However, the plating part hanging positions in the cleaning tank have different hanging thicknesses, and the arrangement mode of one stirring pipe is not easy to ensure that the plating parts are uniformly stirred.
Disclosure of Invention
The invention aims to provide an air stirring system for an electroplating solution, which aims to solve the problem of uneven stirring in the prior art when solution is stirred by compressed air.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an air stirring system of electroplating solution, its includes a plurality of cell body, wherein, the loop type stirred tube has been put to the bottom equipartition of every cell body, the loop type stirred tube passes through the connecting pipe and inserts compressed air house steward, just the loop type stirred tube is formed by two long tubes that length is the same and two nozzle stub that length is the same through a three way connection and three return bend connection, two long tubes are arranged along the length direction of cell body, two nozzle stub are arranged along the width direction of cell body, the connecting pipe passes through the swing joint and is connected with the loop type stirred tube, a plurality of air jet has all been seted up on long tube and the nozzle stub.
Particularly, the plurality of air flow jet openings are arranged in a staggered mode at equal intervals, and the included angle between every two adjacent air flow jet openings is 90 degrees.
Particularly, an elbow is installed at a position, outside the groove body, of the connecting pipe, and an anti-siphon small hole is formed in the elbow.
Particularly, the anti-siphon small holes are obliquely formed upwards at an angle of 45 degrees.
Particularly, a shielding cover plate is arranged on the elbow outside the anti-siphon small hole.
Particularly, the tank panel at the opening part of the top of the tank body, the inner wall of the tank body and the bottom of the tank body are respectively provided with a pipe bracket, and the connecting pipe and the annular stirring pipe are fixed on the tank body through the pipe brackets.
Compared with the prior art, the air stirring system for the electroplating solution has the advantages that the annular stirring pipe is arranged at the bottom in the tank, the airflow direction is uniformly sprayed to the plating part from the periphery of the tank bottom, the stirring efficiency is improved, the cleaning effect is better ensured, and meanwhile, the anti-siphon small holes are formed, so that the siphon phenomenon caused by inconsistent pressure of each tank body is avoided.
Drawings
FIG. 1 is a schematic structural view of an air agitation system for electroplating solution according to an embodiment of the present invention;
FIG. 2 is a top view of a ring-shaped stirring pipe of an air stirring system for an electroplating solution according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 1 at A;
FIG. 4 is a schematic view of the arrangement of the air jet ports of the air agitation system for electroplating solution according to the embodiment of the present invention;
FIG. 5 is a cross-sectional view of an air flow injection port of an air agitation system for electroplating solution according to an embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 5, in the present embodiment, an air stirring system for an electroplating solution includes a plurality of parallel tanks 1, a ring-shaped stirring pipe 2 is disposed at the bottom of each tank 1, the ring-shaped stirring pipe 2 is connected to a compressed air main pipe through a connecting pipe 3, the compressed air main pipe is connected to a compressed air source, and a control valve is installed on the connecting pipe 3, so as to control the size of air flow in the pipe through the control valve, and further control the intensity of air stirring in the tank. The tank panel, the inner wall of the tank body and the bottom of the tank body at the top opening of the tank body 1 are respectively provided with a pipe bracket 4, and the connecting pipe 3 and the annular stirring pipe 2 are fixed on the tank body 1 through the pipe brackets 4.
The annular stirring pipe 2 is formed by connecting two long pipes 20 with the same length and two short pipes 21 with the same length through a three-way joint 22 and three bent pipes 23, the two long pipes 20 are arranged along the length direction of the tank body 1, the two short pipes 21 are arranged along the width direction of the tank body 1, and the connecting pipe 3 is connected with the annular stirring pipe 2 through the movable joint 5, so that the annular stirring pipe is convenient to install and disassemble. The long pipe 20 and the short pipe 21 are both provided with a plurality of airflow jet openings 24, the airflow jet openings 24 are arranged in a staggered mode at equal intervals, the included angle between every two adjacent airflow jet openings 24 is 90 degrees, and the opening direction of the airflow jet openings 24 can be upward or downward as required.
Install elbow 6 on the position that lies in the top opening part of cell body 1 and expose the liquid level on the connecting pipe 3, the elbow 6 is last to begin to have anti-siphon aperture 7, and anti-siphon aperture 7 is 45 jiaos and upwards offers to one side, and its effect is: the production line is provided with a plurality of grooves 1, each annular stirring pipe 2 in the grooves 1 is connected to the same compressed air main pipe through a connecting pipe 3, when the compressed air main pipe stops air or pressure difference exists in each groove, siphonage is easy to occur, liquid in a certain groove is enabled to flow to another groove through the air stirring pipe, and cross contamination is caused. After the anti-siphon small hole 7 is formed, the pressure of each groove is kept consistent, and therefore the siphon phenomenon is avoided. A shielding cover plate 8 is arranged above the anti-siphon small hole 7 to prevent fine particles in the air from falling into the anti-siphon small hole 7 to block the anti-siphon small hole.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (6)
1. The utility model provides an air mixing system of electroplating solution, its includes a plurality of cell body, its characterized in that, the bottom equipartition of every cell body has put the loop type stirring pipe, the loop type stirring pipe passes through the connecting pipe and inserts compressed air house steward, just the loop type stirring pipe is formed by two long tubes that length is the same and two nozzle stub that length is the same through a three way connection and three return bend connection, two long tubes are arranged along the length direction of cell body, two nozzle stub are arranged along the width direction of cell body, the connecting pipe passes through the swing joint and is connected with the loop type stirring pipe, a plurality of air current jet has all been seted up on long tube and the nozzle stub.
2. The air agitation system for electroplating solution of claim 1, wherein said plurality of air jet orifices are equidistantly and alternately arranged, and the angle between two adjacent air jet orifices is 90 °.
3. The air agitation system for electroplating solution of claim 1, wherein a bend is installed at a position outside the tank body on the connection pipe, and an anti-siphon small hole is started on the bend.
4. An air agitation system for electroplating solutions according to claim 3 wherein said anti-siphon apertures are angled at 45 ° upward.
5. An air agitation system for electroplating solution according to claim 3 or 4, wherein said elbow is provided with a cover plate outside said anti-siphon holes.
6. The air stirring system for the electroplating solution as claimed in claim 1, wherein the tank panel at the opening of the top of the tank body, the inner wall of the tank body and the bottom of the tank body are respectively provided with a pipe bracket, and the connecting pipe and the annular stirring pipe are fixed on the tank body through the pipe brackets.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911204405.6A CN110699742A (en) | 2019-11-29 | 2019-11-29 | Air stirring system for electroplating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911204405.6A CN110699742A (en) | 2019-11-29 | 2019-11-29 | Air stirring system for electroplating solution |
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CN110699742A true CN110699742A (en) | 2020-01-17 |
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CN201911204405.6A Pending CN110699742A (en) | 2019-11-29 | 2019-11-29 | Air stirring system for electroplating solution |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09195095A (en) * | 1996-01-16 | 1997-07-29 | Chuo Seisakusho Ltd | Siphon preventive pipeline and surface-treating device |
CN101403133A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Air stirring pipe for electroplating production equipment |
CN102650071A (en) * | 2011-02-25 | 2012-08-29 | 苏州柳溪机电工程有限公司 | Electrophoresis transfer tank |
CN207891454U (en) * | 2017-12-22 | 2018-09-21 | 沈阳昂达金属表面处理有限公司 | A kind of agitating device for electroplating bath |
CN209082026U (en) * | 2018-11-26 | 2019-07-09 | 惠州市鑫华美机械有限公司 | A kind of electroplating bath agitating device |
CN209669389U (en) * | 2018-12-25 | 2019-11-22 | 清远敏惠汽车零部件有限公司 | Microporous nickel air stirrer |
CN211471627U (en) * | 2019-11-29 | 2020-09-11 | 无锡星亿智能环保装备股份有限公司 | Air stirring system for electroplating solution |
-
2019
- 2019-11-29 CN CN201911204405.6A patent/CN110699742A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09195095A (en) * | 1996-01-16 | 1997-07-29 | Chuo Seisakusho Ltd | Siphon preventive pipeline and surface-treating device |
CN101403133A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Air stirring pipe for electroplating production equipment |
CN102650071A (en) * | 2011-02-25 | 2012-08-29 | 苏州柳溪机电工程有限公司 | Electrophoresis transfer tank |
CN207891454U (en) * | 2017-12-22 | 2018-09-21 | 沈阳昂达金属表面处理有限公司 | A kind of agitating device for electroplating bath |
CN209082026U (en) * | 2018-11-26 | 2019-07-09 | 惠州市鑫华美机械有限公司 | A kind of electroplating bath agitating device |
CN209669389U (en) * | 2018-12-25 | 2019-11-22 | 清远敏惠汽车零部件有限公司 | Microporous nickel air stirrer |
CN211471627U (en) * | 2019-11-29 | 2020-09-11 | 无锡星亿智能环保装备股份有限公司 | Air stirring system for electroplating solution |
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