CN110707170B - Back contact solar cell module production method and back contact solar cell module - Google Patents

Back contact solar cell module production method and back contact solar cell module Download PDF

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Publication number
CN110707170B
CN110707170B CN201910792400.3A CN201910792400A CN110707170B CN 110707170 B CN110707170 B CN 110707170B CN 201910792400 A CN201910792400 A CN 201910792400A CN 110707170 B CN110707170 B CN 110707170B
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conductive
piece
solar cell
back contact
contact solar
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CN110707170A (en
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李华
刘继宇
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Taizhou Longi Solar Technology Co Ltd
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Taizhou Longi Solar Technology Co Ltd
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Priority to CN201910792400.3A priority Critical patent/CN110707170B/en
Publication of CN110707170A publication Critical patent/CN110707170A/en
Priority to PCT/CN2020/074297 priority patent/WO2021036201A1/en
Priority to US17/638,946 priority patent/US20220302328A1/en
Priority to EP20858738.6A priority patent/EP4024478A4/en
Priority to AU2020340008A priority patent/AU2020340008B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02016—Circuit arrangements of general character for the devices
    • H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention provides a production method of a back contact solar cell module and the back contact solar cell module, and relates to the technical field of solar photovoltaics. The method comprises the following steps: providing a first stack; the first stacking member comprises a first piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site; providing a second stack; the second stacking member comprises a second piece; the surface of the second piece is provided with a plurality of second conductive sites; and stacking and laminating the first stacking piece and the second stacking piece so that the conductive bosses abut against the second conductive sites and the bonding insulating spacer ring bonds the first piece and the second piece together. This application has improved electric connection reliability and yields.

Description

Back contact solar cell module production method and back contact solar cell module
Technical Field
The invention relates to the technical field of solar photovoltaics, in particular to a back contact solar cell module and a production method thereof.
Background
The back contact solar cell module has the advantages that the front side of the back contact solar cell module is not provided with the main grid line, the positive electrode and the negative electrode are arranged on the back side of the cell, shading is reduced, a short circuit of the cell is effectively increased, energy conversion efficiency of the module is improved, and further the application prospect is wide.
At present, the production method of the back contact solar cell module mainly comprises the following steps: and conductive adhesive is arranged between the back contact solar cell and the metal circuit board, and the back contact solar cell is electrically connected and bonded with the metal circuit board through the conductive adhesive in the laminating process.
In the above method for producing a back contact solar cell module: in the laminating process, the back contact solar cell and the metal circuit board are electrically connected and bonded through the conductive adhesive, the electrical connection is unreliable, and the yield is low.
Disclosure of Invention
The invention provides a back contact solar cell module and a production method thereof, and aims to solve the problems of unreliable electrical connection and low yield of the back contact solar cell module.
According to a first aspect of the present invention, there is provided a back contact solar cell module production method comprising:
providing a first stack; the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site;
providing a second stack; the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece is provided with a plurality of second conductive sites;
stacking and laminating the first stacking piece and the second stacking piece to enable the conductive boss to abut against the second conductive site, and enabling the bonding insulating space ring to bond the first piece and the second piece together optionally, wherein the bonding insulating space ring is made of an insulating bonding material; the insulating bonding material comprises a liquid bonding agent and an inert filler; the inert filler comprises silica particles.
Optionally, the silica particles are fumed silica particles.
Optionally, the liquid adhesive comprises: a siloxane; the mass ratio of the inert filler to the liquid binder is as follows: 7:3 to 3: 7.
Optionally, the first stack is obtained by:
providing the first piece;
printing a conductive material on the first conductive sites of the first sheet to form the conductive bosses, and printing the adhesive insulating spacer on the periphery of the first conductive sites of the first sheet.
Optionally, the thickness of the adhesive insulating spacer ring is as follows: 1 to 100 microns.
Optionally, before the stacking and laminating the first stack and the second stack, the method further comprises:
and spraying soldering flux on the surface of the conductive boss.
Optionally, a gap is formed between adjacent bonding insulation space rings. Optionally, before printing the conductive material on the first conductive sites of the first sheet member to form the conductive bumps and printing the adhesive insulating spacer on the periphery of the first conductive sites of the first sheet member, the method further comprises:
stacking a packaging material and a cover plate material on the first side of the first piece in sequence; the first side is opposite the side of the first piece having the first conductive sites;
the printing of conductive material on the first conductive sites of the first sheet to form the conductive bosses and the printing of the adhesive insulating spacer on the periphery of the first conductive sites of the first sheet include:
and printing a conductive material on the first conductive sites of the first sheet to form conductive bosses by taking the packaging material and the cover plate material as printing support substrates, and printing the bonding insulating space ring on the periphery of the first conductive sites of the first sheet.
According to a second aspect of the present invention, there is provided a back contact solar cell module comprising: a first stacking member and a second stacking member;
the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site;
the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece is provided with a plurality of second conductive sites;
the first and second stacks are stacked and laminated together with the conductive land abutting against the second conductive site; the first piece and the second piece are bonded together through the bonding insulating space ring.
In an embodiment of the present invention, a first stacking member is provided; the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site; providing a second stack; the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece is provided with a plurality of second conductive sites; and stacking and laminating the first stacking piece and the second stacking piece so that the conductive bosses abut against the second conductive sites and the bonding insulating spacer ring bonds the first piece and the second piece together. Compared with the prior art, in the laminating process, the metal circuit board and the back contact solar cell piece are electrically connected and bonded through the conductive adhesive, the electrical connection is mainly realized by fusing the conductive adhesive with the metal circuit board and the conductive sites on the back contact solar cell piece in the laminating process, so that the electrical connection is low in reliability and yield. In this application, first pile up the piece including forming the electrically conductive boss on the first conducting site of first piece to and the insulating space ring of first conducting site outlying bonding, the electricity of metal circuit board and back contact solar wafer is connected, mainly stacks through first pile up piece and second, electrically conductive boss butt is realized on the second conducting site of second piece, basically need not to fuse and can realize stable electricity and connect, improved electric connection reliability and yields. The conductive boss and the second conductive site can be pressed more tightly by pressing the first stacking piece and the second stacking piece in the laminating process, so that the reliability and the yield of electric connection are further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 shows a flow chart of the steps of a method for producing a back contact solar cell module in an embodiment of the invention;
fig. 2 is a schematic structural diagram of a back contact solar cell in an embodiment of the invention;
FIG. 3 shows a schematic diagram of one electrode configuration in an embodiment of the invention;
FIG. 4 is a schematic diagram of a doped diffusion region in an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a bonded insulating spacer according to an embodiment of the present invention;
FIG. 6 is a schematic diagram showing another bonded insulating spacer in an embodiment of the present invention;
FIG. 7 is a schematic diagram of a back contact solar cell module according to an embodiment of the invention;
FIG. 8 is a flow chart illustrating steps in another method of manufacturing a back contact solar cell module in an embodiment of the invention;
FIG. 9 is a schematic diagram illustrating a stacking of encapsulating material on a first side of a first sheet in an embodiment of the invention;
fig. 10 shows a schematic structural diagram of printing and forming a conductive boss on a first conductive site of a back contact solar cell in an embodiment of the invention.
Description of the figure numbering:
1-silicon substrate, 2-doping diffusion region, 3-electrode, 11-surface of silicon substrate for receiving light, 8-gap between every two bonding insulation space rings, 12-back of silicon substrate 1, 21-P type doping diffusion region, 22-N type doping diffusion region, 31-negative electrode fine grid line, 32-positive electrode fine grid line, 33-negative electrode connecting electrode, 34-positive electrode connecting electrode, 10-front cover plate material, 20-front packaging material, 30-back contact solar cell piece, 40-bonding insulation space ring, 41-conductive boss, 42-inner ring of bonding insulation space ring, 50-metal circuit board, 60-back packaging material and 70-back cover plate material.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 shows a flow chart of steps of a method for manufacturing a back contact solar cell module according to an embodiment of the present invention.
Step 101, providing a first stacked piece; the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking member further comprises a conductive boss formed on the first conductive site of the first sheet member, and an adhesive insulating spacer ring around the first conductive site.
In an embodiment of the invention, the first stacking member comprises a first sheet member. The first piece is one of a metal circuit board or a back contact solar cell. For example, the first piece may be a metal circuit board. Alternatively, the first sheet may be a back contact solar cell sheet. The number of the back contact solar cells is not particularly limited, and each of the back contact solar cells may have substantially the same current characteristics or voltage characteristics. The back contact solar cell module is specifically arranged according to the requirements of the back contact solar cell module.
In the embodiment of the invention, the back contact solar cell sheet can be a solar cell sheet with a front surface without a main grid line and a positive electrode and a negative electrode both arranged on a back surface. In the embodiment of the invention, the back contact solar cell sheet can be an IBC cell, an MWT cell, an EWT cell, or the like.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a back contact solar cell in an embodiment of the invention. In fig. 2, 1 may be a silicon substrate, 2 may be a doped diffusion region, and 3 may be an electrode. 11 may be a light-receiving surface, i.e., 11 is the front surface of the silicon substrate 1. 12 may be a back surface of the silicon substrate 1. A doping diffusion region 2 and an electrode 3 are sequentially disposed on the back surface of the silicon substrate 1.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an electrode in an embodiment of the present invention. The electrodes 3 may include a negative fine gate line 31, a positive fine gate line 32, a negative connection electrode 33, and a positive connection electrode 34. The positive connection electrode 34 is electrically connected to the positive fine gate line 32, and the negative connection electrode 33 is electrically connected to the negative fine gate line 31. The positive thin gate lines 32 and the negative thin gate lines 31 may be segmented thin gate lines or continuous thin gate lines. The positive connection electrode 34 may be connected to all or part of the positive fine gate lines 32 in the same row or column, and the negative connection electrode 33 may be connected to all or part of the negative fine gate lines 31 in the same row or column. The positive fine gate line 32 may be in electrical contact with the P-type doped diffusion region, and the negative fine gate line 31 may be in electrical contact with the N-type doped diffusion region.
Referring to fig. 4, fig. 4 is a schematic structural diagram illustrating a doped diffusion region in an embodiment of the present invention. The impurity diffusion region 2 may include a P-type impurity diffusion region 21 and an N-type impurity diffusion region 22. The P-type impurity diffusion regions 21 and the N-type impurity diffusion regions 22 may be alternately arranged.
In the embodiment of the invention, the metal circuit board is used for collecting the current of the back contact solar cell piece and the like. The metal circuit board may be a metal circuit board with isolation formed through a patterning process. The patterning process may be to remove a portion of the metal circuit board by laser, chemical etching, mechanical cutting, or the like to form a void, and the width of the void may be greater than 50 microns, such as 200 microns or more. And one part of the metal circuit board is used for being connected with the P-type doped diffusion region of the back contact solar cell piece subsequently. And the other part of the metal circuit board is used for being connected with the N-type doped diffusion region of the back contact solar cell piece subsequently. Through setting up the isolation, can effectively avoid follow-up anodal and negative pole contact, effectively avoid the short circuit.
In the embodiment of the present invention, the material of the metal circuit board may be at least one of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten, and alloys thereof. For example, the material of the metal circuit board may be at least one simple substance of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, and tungsten. Alternatively, the material of the metal circuit board may be an alloy of at least two combinations of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, and tungsten. Alternatively, the material of the metal circuit board may be a combination of at least one simple substance and at least one alloy.
In an embodiment of the invention, the surface of the first piece has a plurality of first conductive sites. The first conductive sites are mainly used for collecting or leading out current. If the first piece is a back contact solar cell, the first conductive sites may be: an electrode back-contacted with the back light surface of the solar cell piece or a point to be connected with the electrode, etc. For example, the first conductive site may be: and the negative electrode thin grid line and the positive electrode thin grid line are in back contact with the backlight surface of the solar cell. Alternatively, the first conductive site may be: and the negative electrode and the positive electrode of the back surface of the back contact solar cell piece are connected with the electrode and the like. If the first piece is a metal circuit board, the first conductive sites may be: and the position on the surface of the metal circuit board, which is electrically connected with the electrode of the back contact solar cell. For example, the first conductive site may be: and points which are electrically connected with the negative electrode thin grid line and the positive electrode thin grid line of the back surface of the back contact solar cell piece are arranged on the surface of the metal circuit board. Alternatively, the first conductive site may be: and the surface of the metal circuit board is electrically connected with a negative electrode connecting electrode, a positive electrode connecting electrode and the like on the backlight surface of the back contact solar cell piece.
In an embodiment of the invention, the first stack further comprises conductive lands formed on the first conductive sites of the first sheet. The conductive boss mainly has the following functions: and electrically connecting the first conductive sites on the first chip and the second conductive sites on the second chip to collect or derive current. The height of the conductive boss is set to be able to electrically connect the first conductive site and the second conductive site well. In the embodiment of the present invention, the height of the conductive bump is not particularly limited.
In the embodiment of the present invention, the material of the conductive bump may be: at least one of solder paste, isotropic conductive paste, anisotropic conductive paste, conductive ink, and conductive paste.
Alternatively, the conductive bumps may be circular or rectangular in shape. The present invention is not particularly limited to these examples. The conductive bump may include: the conductive boss is in contact with the positive electrode of the back contact solar cell piece, and the conductive boss is in contact with the negative electrode of the back contact solar cell piece. Alternatively, the conductive bump may include: the conductive lug boss is in contact with the positive thin grid line of the back contact solar cell piece, and the conductive lug boss is in contact with the negative thin grid line of the back contact solar cell piece. Alternatively, the conductive bump may include: the conductive boss is in contact with the P-type doped diffusion region of the back contact solar cell piece, and the conductive boss is in contact with the N-type doped diffusion region of the back contact solar cell piece.
Alternatively, the number of conductive lands may be the same as or different from the number of first conductive sites. The number of the conductive bosses corresponding to a single back contact solar cell can be 20-5000. The number of the conductive bosses corresponding to the whole back contact solar cell module can be 1000-50000. The number of conductive lands facilitates current collection and conduction. In the embodiment of the present invention, this is not particularly limited.
For example, if the first sheet member is a single back contact solar cell sheet, 20 to 5000 conductive bumps may be included on the single back contact solar cell sheet.
In an embodiment of the invention, the first stacked member further comprises an adhesive insulating spacer on the first sheet member at the periphery of the first conductive sites. The bonding insulating space ring mainly has the following functions: isolating each conductive boss to avoid short circuit of each conductive boss; while bonding the first and second pieces during the lamination process. And in some cases, provide some thermal conductivity, hydrophobic properties, and the like. In the embodiment of the present invention, this is not particularly limited.
The number of the bonding insulating space rings can be equal to the number of the subsequent conductive bosses buckled with the bonding insulating space rings. The shape of the inner ring of the bonding insulating space ring can be matched with the shape of the subsequent conductive boss buckled with the bonding insulating space ring. In the embodiment of the present invention, this is not particularly limited.
In the embodiment of the invention, the thickness of the bonding insulation spacer can be 1 to 100 microns. Compared with the prior art, the thickness of the back contact solar cell module is more than 150 microns formed by using polyolefin and the like, the thickness of the back contact solar cell module is reduced, and meanwhile, the adhesive insulating spacer ring with the thickness is good in adhesive reliability in the subsequent laminating process and has good heat conduction performance, hydrophobic performance and the like.
In the embodiment of the present invention, optionally, the material for bonding the insulating space ring is an insulating bonding material. The insulating adhesive material may include a liquid binder and an inert filler. The inert filler includes silica particles. The adhesive insulating spacer ring made of the materials is low in cost, good in adhesive property, good in heat conduction performance and the like.
Specifically, the insulating adhesive material may include a liquid binder and an inert filler. The inert filler may in turn comprise silica particles. By adopting the silicon dioxide particles, the cost is low, the bonding performance of the insulating bonding material is good, and the insulating bonding material has good heat conduction performance and the like, so that the production cost of the back contact solar cell module is reduced, and the bonding reliability, the heat conduction performance and the like are improved. The adhesion reliability and the like can be further improved by providing the liquid adhesive in the insulating adhesive material.
In the embodiment of the present invention, optionally, the silica particles are fumed silica particles. Specifically, the fumed silica has smaller particles, good dispersibility, less possibility of precipitation, better adhesion property, lower cost and better heat conduction property. Meanwhile, the fumed silica particles have good hydrophobicity, so that the moisture can be reduced or prevented from remaining in the manufacturing process of the back contact solar cell module to a great extent, and the reliability of the back contact solar cell module is improved.
In an embodiment of the present invention, optionally, the inert filler may further include: at least one of alumina particles, talc powder and boron nitride particles. The material can further reduce the production cost of the back contact solar cell module, and improve the bonding reliability, heat conductivity and the like.
The liquid binder mainly plays a role of adhesion. In an embodiment of the present invention, optionally, the liquid adhesive includes: a siloxane. Specifically, the siloxane can enable the printed bonding insulating spacer ring to be more compact, the hydrophobicity of the bonding insulating spacer ring can be increased, moisture can be reduced or prevented from remaining in the manufacturing process of the back contact solar cell module to a greater extent, and the reliability of the back contact solar cell module is improved.
Preferably, the mass ratio of the inert filler to the liquid binder is: 7:3 to 3: 7. The bonded insulating spacer thus formed is lower in cost, and is better in bonding reliability, thermal conductivity, water repellency, and the like. For example, the mass ratio of the inert filler to the liquid binder in the insulating bonding material is as follows: 6:4.
In an embodiment of the present invention, optionally, the liquid adhesive further includes: at least one of organic solvent, resin, curing agent, colorant, wetting agent and dispersant. Specifically, the organic solvent may be: 1, 4-butanediol diglycidyl ether, dibutyl phthalate, and the like. The resin may be a thermosetting resin, a thermoplastic resin, or the like. The thermosetting resin may be: unsaturated polyesters, vinyl esters, epoxies, phenolics, Bismaleimides (BMIs), polyimide resins, and the like. The thermoplastic resin may be: polypropylene (PP), Polycarbonate (PC), NYLON (NYLON), Polyetheretherketone (PEEK), Polyethersulfone (PES), and the like. The dispersant can be used to improve the dispersibility of the insulating adhesive material, make the properties uniform, improve the fluidity, and the like. The curing agent can improve the anti-sagging performance and improve the shaping of the bonded insulating space ring after printing and the like. The coloring agent can make the insulating bonding material have a specific color, so that the subsequent identification, inspection and the like are facilitated. In the embodiment of the present invention, this is not particularly limited.
For example, according to the mass ratio, the material formula of the adhesive insulating spacer ring may be: 50% silica particles, 10% siloxane, 30% 1, 4-butanediol diglycidyl ether, 10% vinyl ester.
For another example, the material formula of the adhesive insulating spacer ring may be: 50% of silicon dioxide particles, 9% of siloxane, 20% of 1, 4-butanediol diglycidyl ether, 11% of dibutyl phthalate and 10% of polyether ether ketone.
In embodiments of the present invention, there may be no gap between adjacent bonded insulating spacers. That is, the bonding insulating space rings are also made of insulating bonding materials and the like, so that the bonding performance of the first sheet and the second sheet is better.
For example, referring to fig. 5, fig. 5 shows a schematic diagram of a bonded insulating spacer according to an embodiment of the present invention. In fig. 5, 42 may be an inner ring of an insulating spacer ring, and other positions than the inner ring 42 may be made of insulating bonding material or the like.
In the embodiment of the present invention, optionally, a gap is provided between adjacent bonded insulating spacers. Specifically, the space between the respective bonded insulating spacers is empty, and no insulating bonding material or the like is provided. And furthermore, the used insulating bonding materials are less, and the production cost is lower.
For example, referring to FIG. 6, FIG. 6 shows a schematic diagram of another bonded insulating spacer in an embodiment of the present invention. The dotted rectangular frame 40 may be an adhesive insulating spacer. 42 may be the inner race of a bonded insulating spacer. Gaps 8 are provided between adjacent bonded insulating spacers 40, that is, no insulating bonding material or the like is provided between adjacent bonded insulating spacers 40.
In the actual production process, whether a gap exists between the adjacent bonding insulation space rings or not can balance bonding reliability and the like and production cost and the like, and the two modes are selected or combined. In the embodiment of the present invention, this is not particularly limited. For example, there may be gaps between some adjacent bonded insulating spacers, and no gaps between some adjacent bonded insulating spacers.
102, providing a second stacked piece; the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece has a plurality of second conductive sites.
In the embodiment of the invention, the second sheet member may be another one of the metal circuit board or the back contact solar cell sheet than the first sheet member. For example, if the first piece is a metal circuit board. Then, the second sheet may be a back contact solar cell sheet. Or, if the first piece is a back contact solar cell. Then, the second piece may be a metal circuit board.
In the embodiment of the invention, the surface of the second piece is provided with a plurality of second conductive sites. The second conductive sites are primarily used to collect or conduct current. If the second piece is a back contact solar cell, the second conductive sites may be: an electrode back-contacted with the back light surface of the solar cell piece or a point to be connected with the electrode, etc. For example, the second conductive site may be: and the negative electrode thin grid line and the positive electrode thin grid line are in back contact with the backlight surface of the solar cell. Alternatively, the second conductive site may be: and the negative electrode and the positive electrode of the back surface of the back contact solar cell piece are connected with the electrode and the like. If the second piece is a metal circuit board, the second conductive sites may be: and the position on the surface of the metal circuit board, which is electrically connected with the electrode of the back contact solar cell. For example, the second conductive site may be: and points which are electrically connected with the negative electrode thin grid line and the positive electrode thin grid line of the back surface of the back contact solar cell piece are arranged on the surface of the metal circuit board. Alternatively, the second conductive site may be: and the surface of the metal circuit board is electrically connected with a negative electrode connecting electrode, a positive electrode connecting electrode and the like on the backlight surface of the back contact solar cell piece.
In the embodiment of the present invention, step 101 and step 102 may be performed simultaneously. Alternatively, step 101 is executed first and then step 102 is executed, or step 102 is executed first and then step 101 is executed. In the embodiment of the present invention, this is not particularly limited. In an embodiment of the present invention, each of the first stacking member and the second stacking member may further include: encapsulating material and cover material. The encapsulation material and the cover material may in turn be arranged on the side of the first or second piece remote from the conductive sites. The encapsulating material may include a sealing material such as EVA or polyolefin, and the cover material may be a tempered glass cover or a polymer cover such as TPT, TPE, KPE, KPK, KPC or KPF, and the like. The encapsulating material and the cover material may be thermally pressed or bonded, etc. It should be noted that, the packaging material and the cover material on the side of the first sheet or the second sheet receiving light can both have better light transmittance.
And 103, stacking and laminating the first stacked piece and the second stacked piece to enable the conductive bosses to abut against the second conductive sites, and enabling the bonding insulating spacer ring to bond the first piece and the second piece together.
In an embodiment of the invention, the second laminate is laminated to the first laminate with the conductive bumps abutting the second conductive sites to make electrical contact between the conductive bumps and the second piece. The adhesive insulating spacer ring adheres the first sheet member and the second sheet member together.
Specifically, one side of the first sheet, on which the conductive boss is arranged, is attached to one side of the second sheet, on which the second conductive site is arranged, so that the conductive boss is abutted to the second conductive site, and the first sheet is electrically contacted with the second sheet. The first conductive site is in electrical contact with the conductive boss, and the conductive boss is abutted against the second conductive site, so that the electrical contact between the first conductive site and the second conductive site is realized, and the current collection and conduction effects are further realized.
And stacking and laminating the first stacking piece and the second stacking piece, bonding the insulating space ring to bond the first piece and the second piece in a cross-linking manner in the laminating process, and bonding the first piece and the second piece together to obtain the back contact solar cell module. The bonded insulating spacer is used to bond the first and second sheets during lamination.
In the embodiments of the present invention, it should be noted that the conductive bump does not substantially undergo physical or chemical changes during the stacking and laminating processes. The metal circuit board is connected with the back contact solar cell piece in an electric mode. Compared with the prior art, in the laminating process, the conductive adhesive is fused with the metal circuit board and the conductive sites on the back contact solar cell piece to realize the electric connection between the metal circuit board and the back contact solar cell piece, and the electric connection reliability and the yield are low. This application, the electricity that mainly is electrically conductive boss butt and realizes metal circuit board and back contact solar wafer on the second conducting site of second piece is connected, need not to fuse and can realize stable electricity and connect, has improved electric connection reliability and yields. The conductive boss and the second conductive site can be pressed more tightly by pressing the first stacking piece and the second stacking piece in the laminating process, so that the reliability and the yield of electric connection are further improved.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a back contact solar cell module according to an embodiment of the present invention. In fig. 7, 10 may be a front cover plate material, 20 may be a front encapsulant material, for example, light-transmissive EVA or POE, 30 may be a back contact solar cell, 40 may be an adhesive insulating spacer ring, 41 may be a conductive boss, 42 may be an inner ring of the adhesive insulating spacer ring, 50 may be a metal circuit board, 60 may be a rear encapsulant material, and 70 may be a rear cover plate material. The front cover material 10 may be the side of the back contact solar cell module that receives light, and the back cover material 70 may be the side of the back contact solar cell module that is back-lit. The front cover material 10 and the front sealing material 20 may have good light transmittance.
In the embodiment of the invention, compared with the prior art, in the lamination process, the electric connection and bonding between the metal circuit board and the back contact solar cell piece are realized through the conductive adhesive, and the electric connection is mainly realized by fusing the conductive adhesive with the conductive sites on the metal circuit board and the back contact solar cell piece in the lamination process, so that the electric connection reliability is low and the yield is low. In this application, first piece of stacking stacks through first piece of stacking and second including the electrically conductive boss that forms on the first conductive site of first piece, metal circuit board and back of the body contact solar wafer's electricity, and electrically conductive boss butt is realized on the second conductive site of second piece, basically need not to fuse and can realize stable electricity and connect, has improved electric connection reliability and yields. The conductive boss and the second conductive site can be pressed more tightly by pressing the first stacking piece and the second stacking piece in the laminating process, so that the reliability and the yield of electric connection are further improved.
In an embodiment of the present invention, referring to fig. 8, fig. 8 is a flowchart illustrating steps of a method for manufacturing a back contact solar cell module according to another embodiment of the present invention.
Step 201, providing the first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking member further comprises a conductive boss formed on the first conductive site of the first sheet member, and an adhesive insulating spacer ring around the first conductive site.
In step 201, the first sheet, the first conductive sites, the conductive bumps, the adhesive insulating spacer rings, and the like may refer to the detailed description of step 101, and are not repeated herein to avoid repetition.
In this embodiment of the present invention, optionally, before the following step 202, the method may further include: stacking a packaging material and a cover plate material on the first side of the first piece in sequence; the first side is opposite the side of the first piece having the first conductive sites.
Specifically, the first side of the first piece is the side of the first piece opposite the side having the first conductive sites. For example, if the first sheet member is a back contact solar cell and the first conductive site is located on a backlight side of the back contact solar cell, the first side may be a side of the first sheet member opposite to the side receiving light. For example, if the first sheet member is a metal circuit board, the first conductive site is located on a side of the metal circuit board opposite to the side for receiving light, and the first side may be a side of the metal circuit board opposite to the backlight. The first side of the first piece may be first laminated with the encapsulating material and then with the cover material.
Referring to fig. 9, fig. 9 is a schematic diagram illustrating a structure of stacking packaging materials on a first side of a first sheet according to an embodiment of the present invention. The first sheet may be a back contact solar cell sheet 30. Since the encapsulant is located on the side of the back contact solar cell opposite to the side receiving light, the encapsulant can be a front encapsulant 20.
Step 202, printing a conductive material on the first conductive sites of the first sheet to form the conductive bosses, and printing the adhesive insulating spacer ring on the periphery of the first conductive sites of the first sheet to obtain the first stacked member.
In an embodiment of the present invention, a printing screen corresponding to the first conductive sites may be fabricated before the step 202. The first stacked member may be obtained by printing a conductive material on the first conductive sites of the first sheet member by screen printing or ink jet printing to form conductive lands. The printing can be carried out in full-page mode, so that the production efficiency is improved.
For example, if the first piece is a metal circuit board, the conductive material is printed on the first conductive sites of the metal circuit board to form conductive bumps. If the first piece is a back contact solar cell, a conductive boss is formed on the first conductive site of the back contact solar cell by printing and conduction. For example, the conductive bosses can be formed by printing in a full-page manner on the first conductive sites of 100 back-contact solar cells at one time, and the conductive bosses do not need to be formed by printing on the first conductive sites of the back-contact solar cells separately, so that the production efficiency is improved.
In an embodiment of the present invention, a spacer printing screen having corresponding first conductive sites may be fabricated before step 202. The adhesive insulating spacer can be formed by printing an insulating adhesive material or the like on the periphery of the first conductive sites on the first sheet by means of screen printing, ink jet printing or the like using the printing screen.
In an embodiment of the present invention, a conductive material may be printed on the first conductive sites of the first sheet to form the conductive bumps. And then printing to form an adhesive insulating spacer ring at the periphery of the first conductive sites of the first sheet member. Alternatively, the adhesive insulating spacer may be printed around the first conductive sites of the first sheet member. Conductive material is then printed on the first conductive sites of the first sheet to form conductive lands. In the embodiment of the present invention, this is not particularly limited.
In the embodiment of the present invention, before the second printing, the part printed first may be dried to have a certain surface dryness and hardness, so that the part does not stick to the screen and is collapsed, and the defect that the part printed first collapses and diffuses to the surrounding area to form short circuit and pollution during the second printing can be avoided.
For example, if the conductive bumps are printed first, the conductive bumps may be baked before printing the adhesive insulating spacer. If the insulating space ring is printed and bonded firstly, the conductive boss can be dried before the conductive boss is printed.
In the embodiment of the invention, the printing support substrate can be heated or the conductive boss or the bonding insulating spacer can be locally heated or irradiated for drying or pre-curing treatment. The heating temperature can be 50-100 ℃, and the heating time can be 10-300 seconds. In the embodiment of the present invention, this is not particularly limited.
In an embodiment of the present invention, a conductive material is printed on the first conductive sites of the first sheet member to form conductive lands, and an adhesive insulating spacer is printed on the periphery of the first conductive sites of the first sheet member. The conductive boss and the bonding insulating spacer ring are printed on the same piece, the bonding insulating spacer ring is arranged around the conductive boss in a surrounding mode during printing, and therefore subsequent buckling operation is not needed, and operation is simple and convenient. Meanwhile, the bonding insulating spacer ring is formed by printing the periphery of the first conductive site on the first piece, and can be obtained by one-time printing generally without laser drilling one by one, so that the production efficiency is high; in addition, the periphery of the conductive boss is printed to form a bonding insulating spacer ring in the printing process, and insulating bonding materials are removed without opening holes, so that the cost is reduced; meanwhile, laser ablation opening is not needed, damage to the insulating bonding material is reduced, and improvement of insulating reliability, bonding reliability and the like is facilitated.
In this embodiment of the present invention, optionally, step 202 may include: and printing a conductive material on the first conductive sites of the first sheet to form the conductive bosses by taking the packaging material and the cover plate material as printing support substrates, and printing the bonding insulating spacer ring on the periphery of the first conductive sites of the first sheet.
Specifically, the stacked package material and cover plate material may be used as a printing support substrate, a conductive material may be printed on the first conductive sites of the first sheet to form conductive bumps, and an adhesive insulating spacer may be printed on the periphery of the first conductive sites of the first sheet. Furthermore, after the printing of the conductive bosses and the bonding insulating spacer rings is finished, the stacked packaging materials and the stacked cover plate materials can be removed, so that the steps are reduced, and the production efficiency of the back contact solar cell module can be improved.
Referring to fig. 10, fig. 10 is a schematic structural diagram illustrating a structure of printing a conductive bump on a first conductive site of a back contact solar cell in an embodiment of the present invention. In fig. 10, conductive bump 41 includes a conductive bump in electrical contact with P-type doped diffusion region 21 and a conductive bump in electrical contact with N-type doped diffusion region 22.
Step 203, providing a second stacked piece; the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece has a plurality of second conductive sites.
Step 203 may refer to the description of step 102, and will not be described herein again to avoid repetition.
In the embodiment of the present invention, the steps 201 to 202 may be performed simultaneously with the step 203, or performed sequentially, and the execution sequence is not particularly limited.
And 204, spraying soldering flux on the surface of the conductive boss.
In the embodiment of the invention, the surface of the conductive boss is sprayed with the soldering flux, so that the conductive boss can be well pressed and contacted with the second conductive site of the second piece during subsequent lamination and solidification, the defects of poor contact and the like can not occur, and the conductive performance of the back contact solar cell module is improved.
And step 205, stacking and laminating the first stacked piece and the second stacked piece to enable the conductive bosses to abut against the second conductive sites, and enabling the bonding insulating spacer ring to bond the first piece and the second piece together.
In the embodiment of the present invention, the step 205 may refer to the description of the step 103, and is not described herein again to avoid repetition.
In the embodiment of the invention, compared with the prior art, in the lamination process, the electric connection and bonding between the metal circuit board and the back contact solar cell piece are realized through the conductive adhesive, and the electric connection is mainly realized by fusing the conductive adhesive with the conductive sites on the metal circuit board and the back contact solar cell piece in the lamination process, so that the electric connection reliability is low and the yield is low. In this application, first piece of stacking stacks through first piece of stacking and second including the electrically conductive boss that forms on the first conductive site of first piece, metal circuit board and back of the body contact solar wafer's electricity, and electrically conductive boss butt is realized on the second conductive site of second piece, basically need not to fuse and can realize stable electricity and connect, has improved electric connection reliability and yields. The conductive boss and the second conductive site can be pressed more tightly by pressing the first stacking piece and the second stacking piece in the laminating process, so that the reliability and the yield of electric connection are further improved. Meanwhile, the conductive boss and the bonding insulating spacer ring are both formed by printing, the process is simple, and the production efficiency is high. The conductive boss and the bonding insulating spacer ring are printed on the same piece, the bonding insulating spacer ring is arranged around the conductive boss in a surrounding mode during printing, and therefore subsequent buckling operation is not needed, and operation is simple and convenient. Meanwhile, the bonding insulating spacer ring is formed by printing the periphery of the first conductive site on the first piece, and can be obtained by one-time printing generally without laser drilling one by one, so that the production efficiency is high; in addition, the periphery of the conductive boss is printed to form a bonding insulating spacer ring in the printing process, and insulating bonding materials are removed without opening holes, so that the cost is reduced; meanwhile, laser ablation opening is not needed, damage to the insulating bonding material is reduced, and improvement of insulating reliability, bonding reliability and the like is facilitated.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the embodiments are not limited by the order of acts described, as some steps may occur in other orders or concurrently depending on the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the embodiments of the application.
In an embodiment of the present invention, there is further provided a back contact solar cell module, as shown in fig. 7, the back contact solar cell module may include: a first stacking member and a second stacking member.
The first stacking member includes a first piece. The first piece is: the metal circuit board 50 or one of the back contact solar cells 30. The surface of the first piece has a plurality of first conductive sites and the first stack further includes conductive lands 41 formed on the first conductive sites of the first piece. The first stack further includes an adhesive insulating spacer 40 formed around the first conductive sites of the first sheet member.
The second stacking member includes a second piece. The second piece is the other of the metal circuit board 50 and the back contact solar cell piece 30 except the first piece. The surface of the second piece has a plurality of second conductive sites.
The first and second stacks are stacked and laminated together with the conductive bumps 41 abutting on the second conductive sites. The first and second pieces are bonded together by a bonding insulating spacer 40.
The back contact solar cell module can refer to the related records of the production method of the back contact solar cell module, and can achieve the same technical effects, and the details are not repeated herein to avoid repetition.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A method for producing a back contact solar cell module, comprising:
providing a first stack; the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site;
providing a second stack; the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece is provided with a plurality of second conductive sites;
and stacking and laminating the first stacking piece and the second stacking piece so that the conductive bosses abut against the second conductive sites without fusing, and enabling the bonding insulating spacer ring to bond the first piece and the second piece together.
2. The method according to claim 1, wherein the material of the bonding insulating spacer ring is an insulating bonding material; the insulating bonding material comprises a liquid bonding agent and an inert filler; the inert filler comprises silica particles.
3. The method of claim 2, wherein the silica particles are fumed silica particles.
4. The method of claim 2, wherein the liquid adhesive comprises: a siloxane; the mass ratio of the inert filler to the liquid binder is as follows: 7:3 to 3: 7.
5. Method according to any one of claims 1 to 4, characterized in that said first superimposed element is obtained by:
providing the first piece;
printing a conductive material on the first conductive sites of the first sheet to form the conductive bosses, and printing the adhesive insulating spacer on the periphery of the first conductive sites of the first sheet.
6. The method of any of claims 1 to 4, wherein the bonded insulating spacer has a thickness of: 1 to 100 microns.
7. The method of any of claims 1-4, wherein prior to said stacking and laminating said first stack and said second stack, said method further comprises:
and spraying soldering flux on the surface of the conductive boss.
8. The method of any of claims 1 to 4, wherein adjacent bonded insulating spacers have a gap therebetween.
9. The method of claim 5, wherein said printing of conductive material on said first conductive sites of said first sheet member forms said conductive lands and wherein said printing forms said adhesive insulating spacer on the periphery of said first conductive sites of said first sheet member, said method further comprises: stacking a packaging material and a cover plate material on the first side of the first piece in sequence; the first side is opposite the side of the first piece having the first conductive sites; the step of printing conductive material on the first conductive sites of the first sheet to form the conductive lands, and printing the adhesive insulating spacer on the periphery of the first conductive sites of the first sheet, includes: and printing a conductive material on the first conductive sites of the first sheet to form the conductive bosses by taking the packaging material and the cover plate material as printing support substrates, and printing the bonding insulating spacer ring on the periphery of the first conductive sites of the first sheet.
10. A back contact solar cell module, comprising: a first stacking member and a second stacking member;
the first stacking member comprises a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece is provided with a plurality of first conductive sites; the first stacking piece further comprises a conductive boss formed on the first conductive site of the first piece, and an adhesive insulating spacer ring at the periphery of the first conductive site;
the second stacking member comprises a second piece; the second piece is the other one of the metal circuit board and the back contact solar cell piece; the surface of the second piece is provided with a plurality of second conductive sites;
the first and second stacks are stacked and laminated together without the conductive bosses fused against the second conductive sites; the first piece and the second piece are bonded together through the bonding insulating space ring.
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PCT/CN2020/074297 WO2021036201A1 (en) 2019-08-26 2020-02-04 Method for producing back-contact solar cell assembly and back-contact solar cell assembly
US17/638,946 US20220302328A1 (en) 2019-08-26 2020-02-04 Method for producing back-contact solar cell assembly and back-contact solar cell assembly
EP20858738.6A EP4024478A4 (en) 2019-08-26 2020-02-04 Method for producing back-contact solar cell assembly and back-contact solar cell assembly
AU2020340008A AU2020340008B2 (en) 2019-08-26 2020-02-04 Method for producing back-contact solar cell assembly and back-contact solar cell assembly

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