CN110707018A - Substrate transfer apparatus and substrate processing apparatus - Google Patents

Substrate transfer apparatus and substrate processing apparatus Download PDF

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Publication number
CN110707018A
CN110707018A CN201910610848.9A CN201910610848A CN110707018A CN 110707018 A CN110707018 A CN 110707018A CN 201910610848 A CN201910610848 A CN 201910610848A CN 110707018 A CN110707018 A CN 110707018A
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CN
China
Prior art keywords
rollers
substrate
adjacent
connecting members
shafts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910610848.9A
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Chinese (zh)
Inventor
任世珍
朴奇洪
姜声根
金基雄
孙硕皓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
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Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN110707018A publication Critical patent/CN110707018A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Abstract

The present invention relates to a substrate transfer apparatus and a substrate processing apparatus. The substrate transfer device may include a plurality of first shafts having a plurality of first rollers, a plurality of second shafts having a plurality of second rollers, a plurality of first connection parts connecting the adjacent first rollers, and a plurality of second connection parts connecting the adjacent second rollers. The adjacent first rollers may be disposed to be substantially opposite to each other, the adjacent second rollers may be disposed to be substantially opposite to each other, and the first shafts and the second shafts may be alternately disposed along a transfer direction of the substrate.

Description

Substrate transfer apparatus and substrate processing apparatus
The present application has priority to korean invention application No. 10-2018-0079235, which was applied to korean patent office on 7/9/2018.
Technical Field
Exemplary embodiments of the present invention relate to a substrate transfer apparatus and a substrate processing apparatus. More particularly, exemplary embodiments of the present invention relate to a substrate transfer device including a first shaft having a plurality of first rollers and a second shaft having a plurality of second rollers, and a substrate processing device including the same.
Background
In a manufacturing process of a display device such as a flat panel display device, in order to form a photoresist film on a substrate, a photoresist solution may be coated on the substrate, the photoresist film is selectively removed after exposing and developing the photoresist film to form a photoresist pattern on the substrate.
In the step of developing the photoresist film, a developing solution may be supplied onto the substrate while transferring the substrate by a transfer device having a structure in which a shaft including a roller is repeatedly disposed. Here, in the case where the developing solution on the substrate flows during the transfer of the substrate, and thus the developing solution is not uniformly supplied onto the substrate as a whole, it may be impossible to make the photoresist pattern have an appropriate critical dimension (critical dimension).
However, in the conventional transfer device, the front end and the rear end of the substrate may be bent downward or sunk due to the distance between the adjacent shafts, and thus the developing solution supplied onto the substrate may flow. Also, there may occur a case where the front end portion of the substrate comes into contact with or collides with the roller of the shaft to cause the substrate to vibrate, thereby causing the developing solution on the substrate to flow. Therefore, the developing solution may not be uniformly supplied to the entire surface of the substrate, failing to make the photoresist pattern have an appropriate critical dimension.
Disclosure of Invention
Technical problem
An object of the present invention is to provide a substrate transfer apparatus capable of preventing a solution from flowing on a substrate.
Another object of the present invention is to provide a substrate processing apparatus capable of forming a desired micro pattern by preventing a solution from flowing on a substrate.
Technical scheme
According to an exemplary embodiment of the present invention for achieving one object of the present invention described above, there is provided a substrate transfer apparatus including: a plurality of first shafts having a plurality of first rollers; a plurality of second shafts having a plurality of second rollers; a plurality of first connecting members connecting the adjoining plurality of first rollers; and a plurality of second connecting members connecting the plurality of second rollers adjacent to each other. Wherein the adjacent first rollers may be disposed to face each other and the adjacent second rollers may be disposed to face each other along the transfer direction of the substrate. The first shafts and the second shafts are alternately arranged.
In an exemplary embodiment, each of the first connection parts may selectively connect at least two first rollers opposite to each other, and each of the second connection parts may selectively connect at least two second rollers opposite to each other.
In another exemplary embodiment, each of the first connecting parts may connect a pair of first rollers to an adjacent pair of first rollers, and each of the second connecting parts may connect a pair of second rollers to an adjacent pair of second rollers.
In an exemplary embodiment, the plurality of first connecting members and the plurality of second connecting members may be configured to form a zigzag pattern.
In an exemplary embodiment, each of the first and second connecting members may include one of an O-ring, a timing belt, and a chain.
According to an exemplary embodiment of the present invention for achieving one object of the present invention described above, there is provided a substrate processing apparatus for selectively removing a photoresist film formed on a substrate to form a photoresist pattern on the substrate. The substrate processing apparatus may include: a transfer member for transferring the substrate; and a solution supply member for supplying a developing solution onto the substrate transferred by the transfer member. The transfer member may include: a plurality of first shafts having a plurality of first rollers; a plurality of second shafts having a plurality of second rollers; a plurality of first connecting members connecting the adjoining plurality of first rollers; and a plurality of second connecting members connecting the plurality of second rollers adjacent to each other. Wherein the adjacent first rollers may be disposed to face each other, the adjacent second rollers may be disposed to face each other, and the first shafts and the second shafts may be alternately disposed along the transfer direction of the substrate.
In an exemplary embodiment, each of the first connection parts may selectively connect at least two first rollers opposite to each other, and each of the second connection parts may selectively connect at least two second rollers opposite to each other.
In another exemplary embodiment, each of the first connecting parts may connect a pair of first rollers to an adjacent pair of first rollers, and each of the second connecting parts may connect a pair of second rollers to an adjacent pair of second rollers.
In an exemplary embodiment, the plurality of first connecting members and the plurality of second connecting members may be configured to form a zigzag pattern.
In an exemplary embodiment, each of the first and second connecting members may include one of an O-ring, a timing belt, and a chain.
Technical effects
According to an exemplary embodiment of the present invention, the substrate transfer device and the substrate processing device may include the first roller, the second roller, the first connection part, and the second connection part, and thus a front end portion and/or a rear end portion of the substrate may be prevented from sinking or bending downward during transfer of the substrate, and the front end portion of the substrate may be prevented from contacting or colliding with the first roller of the first shaft and/or the second roller of the second shaft. Therefore, the flow of the solution such as the developing solution supplied from the solution supply device onto the substrate can be effectively prevented. As a result, the photoresist film can be selectively removed by the developing solution so that the photoresist pattern formed on the substrate has a desired critical dimension, and thus can be effectively used in a process of manufacturing a current display device requiring a pattern having a micro-size.
However, the effects of the present invention are not limited to the above-described effects, and various expansions can be made without departing from the spirit and scope of the present invention.
Drawings
Fig. 1 is a schematic plan view of a substrate transfer apparatus for explaining an exemplary embodiment of the present invention;
fig. 2 is a schematic side view of a substrate processing apparatus for explaining an exemplary embodiment of the present invention.
Detailed Description
The present invention may be variously modified and variously modified, and the exemplary embodiments will be described in detail in the specification. However, the present invention is not intended to be limited to the specific forms disclosed, and all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention are to be understood. Like reference numerals are used for like components in describing the respective drawings. The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are only used to distinguish one constituent element from other constituent elements. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular references also include plural references without explicit recitation herein. It should be understood that the terms "comprises" or "comprising," or any combination thereof, when used in this application, are intended to specify the presence of stated features, integers, steps, acts, elements, components, or groups thereof, but should not be construed to preclude the presence or addition of one or more other features, integers, steps, acts, elements, components, or groups thereof.
Unless otherwise defined, all terms used herein including technical and scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with the meaning of context in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, a substrate transfer apparatus and a substrate processing apparatus according to exemplary embodiments of the present invention will be described with reference to the drawings. The same or similar constituent elements in the drawings are denoted by the same or similar reference numerals.
Fig. 1 is a schematic plan view of a substrate transfer apparatus for explaining an exemplary embodiment of the present invention.
Referring to fig. 1, a substrate transfer device 100 of an exemplary embodiment may include a plurality of first shafts 11 and a plurality of second shafts 15. Here, each first shaft 11 may have a plurality of first rollers 13, and each second shaft 15 may have a plurality of second rollers 17. The substrate transfer apparatus 100 may be used in a process of forming a predetermined pattern on an object such as a substrate.
In the substrate transfer device 100, the first shafts 11 and the second shafts 15 may be alternately arranged along the transfer direction of the substrate. In this case, the first rollers 13 of the first shaft 11 and the second rollers 17 of the second shaft 15 may be arranged alternately in a direction substantially perpendicular to the substrate transfer direction.
In the exemplary embodiment, the first roller 13 of one first shaft 11 may be configured to be substantially opposite the first roller 13 of an adjacent first shaft 11, and the second roller 17 of one second shaft 15 may be configured to be substantially opposite the second roller 17 of an adjacent second shaft 15. For example, the first roller 13 of one first shaft 11 may correspond to the first roller 13 of the adjacent first shaft 11 with one second shaft 15 therebetween along the transfer direction of the substrate. The second roller 17 of one second shaft 15 may correspond to the second roller 17 of the adjacent second shaft 15 with one first shaft 11 therebetween along the transfer direction of the substrate. In other words, the first rollers 13 of the shaft 11 and the second rollers 17 of the second shaft 15 may be substantially arranged in a zigzag pattern.
In an exemplary embodiment, the substrate transfer device 100 may further include a plurality of first connection parts 19 and a plurality of second connection parts 21. The first connecting means 19 may connect the first rollers 13 of the adjacent first shafts 11 to each other along the transfer direction of the substrate, and the second connecting means 21 may connect the second rollers 17 of the adjacent second shafts 15 to each other along the transfer direction of the substrate. In this case, the first connecting member 19 may not contact the second shaft 15, and the second connecting member 21 may not contact the first shaft 11.
In the substrate transfer device 100, the first rollers 13 adjacent to each other may be connected to each other by the first connection means 19, and the second rollers 17 adjacent to each other may be connected to each other by the second connection means 21, so that the first rollers 13 of the first shaft 11 and the second rollers 17 of the second shaft 15 may be simultaneously rotated in the substrate transfer direction. In other words, the first rollers 13 connected by the first connection means 19 are substantially simultaneously rotatable in the substrate transfer direction, and the second rollers 17 connected by the second connection means 21 are substantially simultaneously rotatable in the substrate transfer direction.
According to an exemplary embodiment, the first and second connection parts 19 and 21 may support the substrate while the substrate transfer device 100 transfers the substrate. Here, since the plurality of first connection members 19 and the plurality of second connection members 21 may be alternately arranged, the first connection members 19 and the second connection members 21 may stably support the substrate during the transfer of the substrate. Therefore, it is possible to prevent the front end and/or the rear end of the substrate from sinking or bending downward due to the space between the first shaft 11 and the second shaft 15 during the substrate transfer by the substrate transfer device 100. Further, the front end of the substrate can be prevented from contacting or colliding with the first roller 13 of the first shaft 11 and/or the second roller 17 of the second shaft 15 during the transfer of the substrate.
In the exemplary embodiment, the first connecting part 19 may selectively connect the adjoining two first rollers 13 substantially opposite to each other. Also, the second connecting member 21 may selectively connect two adjacent second rollers 17 substantially opposite to each other. In other words, the first connection part 19 may not connect all the adjoining first rollers 13, but selectively connect the number of first rollers 13 required for stably supporting the substrate at predetermined intervals according to the size of the substrate. Also, the second connection part 21 may not connect all adjacent second rollers 17, but connect the number of second rollers 17 required for stably supporting the substrate according to the size of the substrate at a predetermined interval. For example, in the case where the number of first connection parts 19 required to connect all the adjacent first rollers 13 is N, the substrate transfer device 100 of the exemplary embodiment may include N/2, N/3, N/4, etc. first connection parts 19 within a range capable of stably supporting the substrate. Similarly, in the case where the number of the second connection parts 21 required to connect all the adjacent second rollers 17 is M, the substrate transfer device 100 of the exemplary embodiment may include M/2, M/3, M/4, etc. second connection parts 21 within a range capable of stably supporting the substrate. In this case, the substrate transfer device 100 may include at least two first connection parts 19 and at least two second connection parts 21.
In another exemplary embodiment, each of the first connecting parts 19 may connect one pair of first rollers 13 with another adjacent pair of first rollers 13. Each of the second connecting members 21 may connect one pair of the second rollers 17 to another adjacent pair of the second rollers 17. In other words, each of the first shafts 11 may include a pair of first rollers 13, and each of the second shafts 15 may include a pair of second rollers 17. That is, the first rollers 13 may be provided on each first shaft 11 in pairs, and the second rollers 17 may be provided on each second shaft 15 in pairs. In this case, the first connecting means 19 may connect a pair of the first rollers 13 to a pair of the adjacent first rollers 13, and the second connecting means 21 may connect a pair of the second rollers 17 to a pair of the adjacent second rollers 17.
In an exemplary embodiment, the first connection parts 19 may be arranged in a substantially line-shaped manner along the substrate transfer direction, and the second connection parts 21 may also be arranged in a substantially line-shaped manner along the substrate transfer direction. Therefore, the first and second connection members 19 and 21 may be integrally arranged to substantially form a zigzag shape. In this case, the end portion of the first connection member 19 may be aligned to be adjacent to the central portion of the second connection member 21, and the end portion of the second connection member 21 may be aligned to be adjacent to the central portion of the first connection member 19.
In an exemplary embodiment, the first and second connection parts 19 and 21 may each include one of an O-ring (O-ring), a timing belt, and a chain. In other words, the adjacent first roller 13 and the adjacent second roller 17 may be connected by an O-ring, a timing belt, or a chain. In other exemplary embodiments, each of the first and second connecting parts 19 and 21 may include an O-ring (O-ring), a timing belt, and different components in a chain.
As described above, the substrate transfer device 100 may include the first and second connection parts 19 and 21 disposed along the transfer direction of the substrate and capable of supporting the substrate. Therefore, it is possible to more effectively prevent the front end portion and/or the rear end portion of the substrate from sinking or bending downward during the transfer of the substrate by the substrate transfer device 100. Further, the front end of the substrate can be more effectively prevented from contacting or colliding with the first roller 13 and/or the second roller 17 during transfer of the substrate.
Hereinafter, a substrate processing apparatus according to an exemplary embodiment of the present invention will be described with reference to the drawings.
Fig. 2 is a side view of a substrate processing apparatus for illustrating an exemplary embodiment of the present invention.
Referring to fig. 2, the substrate processing apparatus 200 of the exemplary embodiment may be applied to a process of forming a photoresist pattern on a substrate 23 by selectively removing a photoresist film formed on the substrate 23. The substrate processing apparatus 200 may include a substrate transfer apparatus 100 and a solution supply part 25.
The substrate transfer device 100 may transfer the substrate 23 in a predetermined direction, and the solution supply unit 25 may supply a solution such as a developing solution onto the substrate 23 transferred by the substrate transfer device 100. In an exemplary embodiment, the solution supply part 25 may supply the developing solution onto the substrate 23 on which the exposed photoresist film is formed. In this case, an end of the solution supply member 25 may be provided with a nozzle for supplying the developing solution onto the substrate 23. The solution supply member 25 may be disposed above the substrate 23 with a predetermined interval from the upper surface of the substrate 23. The solution supply part 25 may supply the developing solution onto the exposed photoresist film formed on the substrate 23 during the transfer of the substrate 23 by the substrate transfer device 100.
In the substrate processing apparatus 200, the substrate transfer apparatus 100 may include a first shaft 11 having a plurality of first rollers 13, a second shaft 15 having a plurality of second rollers 17, a first connection member 19 capable of connecting the adjacent first rollers 13, and a second connection member 21 capable of connecting the adjacent second rollers 17. Here, the first shafts 11 and the second shafts 15 may be alternately arranged along a transfer direction of the substrate 23. The adjacent first rollers 13 may be disposed substantially opposite to each other along the transfer direction of the substrate 23, and the adjacent second rollers 17 may be disposed substantially opposite to each other along the transfer direction of the substrate 23. In an exemplary embodiment, each of the first connecting parts 19 may selectively connect at least two first rollers 13 substantially opposite to each other, and each of the second connecting parts 21 may selectively connect at least two second rollers 17 substantially opposite to each other. According to another exemplary embodiment, each of the first connection parts 19 may connect a pair of first rollers 13 to an adjacent pair of first rollers 13, and each of the second connection parts 21 may connect a pair of second rollers 17 to an adjacent pair of second rollers 17. The first and second connection members 19 and 21 may be configured to substantially form a zigzag shape, and each of the first and second connection members 19 and 21 may selectively include one of an O-ring, a timing belt, and a chain.
As described above, since the substrate processing apparatus 200 may include the first roller 13, the second roller 17, the first connection part 19, and the second connection part 21, the front end and/or the rear end of the substrate 23 may be prevented from sinking or bending downward during the transfer of the substrate 23 by the substrate transfer apparatus 100, and the front end of the substrate 23 may be prevented from contacting or colliding with the first roller 13 of the first shaft 11 and/or the second roller 17 of the second shaft 15. Therefore, the developing solution supplied from the solution supply device 25 onto the substrate 23 can be effectively prevented from flowing. As a result, the photoresist film can be selectively removed by the developing solution so that the photoresist pattern formed on the substrate 23 has a desired critical dimension.
According to exemplary embodiments of the present invention, the substrate transfer apparatus and the substrate processing apparatus can be more effectively used in a manufacturing process of manufacturing a display device using a substrate having a relatively large area. The substrate transfer apparatus and the substrate processing apparatus can be effectively used in a process of manufacturing various electronic devices such as a smart phone, various computers, a tablet computer, and a home appliance.
While the present invention has been described with reference to the exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the claims.

Claims (10)

1. A substrate transfer apparatus, comprising:
a plurality of first shafts having a plurality of first rollers;
a plurality of second shafts having a plurality of second rollers;
a plurality of first connecting members connecting the adjoining plurality of first rollers; and
a plurality of second connecting members connecting the plurality of second rollers adjacent to each other,
the adjacent first rollers are disposed to face each other, the adjacent second rollers are disposed to face each other, and the first shafts and the second shafts are alternately disposed along the transfer direction of the substrate.
2. The substrate transfer apparatus according to claim 1, wherein:
each of the first connection parts selectively connects at least two first rollers opposite to each other, and each of the second connection parts selectively connects at least two second rollers opposite to each other.
3. The substrate transfer apparatus according to claim 1, wherein:
each of the first connecting members connects a pair of the first rollers to an adjacent pair of the first rollers, and each of the second connecting members connects a pair of the second rollers to an adjacent pair of the second rollers.
4. The substrate transfer apparatus according to claim 1, wherein:
the plurality of first connecting members and the plurality of second connecting members are arranged to form a zigzag shape.
5. The substrate transfer apparatus according to claim 1, wherein:
each of the first and second connecting members includes one of an O-ring, a timing belt, and a chain.
6. A substrate processing apparatus for selectively removing a photoresist film formed on a substrate to form a photoresist pattern on the substrate, comprising:
a transfer member for transferring the substrate; and
a solution supply part for supplying a developing solution onto the substrate transferred by the transfer part,
the transfer member includes:
a plurality of first shafts having a plurality of first rollers;
a plurality of second shafts having a plurality of second rollers;
a plurality of first connecting members connecting the adjoining plurality of first rollers; and
a plurality of second connecting members connecting the plurality of second rollers adjacent to each other,
wherein the plurality of first rollers are disposed to face each other, the plurality of second rollers are disposed to face each other, and the plurality of first shafts and the plurality of second shafts are alternately disposed along the transfer direction of the substrate.
7. The substrate processing apparatus according to claim 6, wherein:
each of the first connection parts selectively connects at least two first rollers opposite to each other, and each of the second connection parts selectively connects at least two second rollers opposite to each other.
8. The substrate processing apparatus according to claim 6, wherein:
each of the first connecting members connects a pair of the first rollers to an adjacent pair of the first rollers, and each of the second connecting members connects a pair of the second rollers to an adjacent pair of the second rollers.
9. The substrate processing apparatus according to claim 6, wherein:
the plurality of first connecting members and the plurality of second connecting members are arranged to form a zigzag shape.
10. The substrate processing apparatus according to claim 6, wherein:
each of the first and second connecting members includes one of an O-ring, a timing belt, and a chain.
CN201910610848.9A 2018-07-09 2019-07-08 Substrate transfer apparatus and substrate processing apparatus Pending CN110707018A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20180079235 2018-07-09
KR10-2018-0079235 2018-07-09

Publications (1)

Publication Number Publication Date
CN110707018A true CN110707018A (en) 2020-01-17

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299403A (en) * 2001-03-29 2002-10-11 Hitachi Electronics Eng Co Ltd Apparatus and method of transporting thin board
JP2003124285A (en) * 2001-10-17 2003-04-25 Dainippon Printing Co Ltd Wet processing equipment and transport method
CN1532126A (en) * 2003-03-19 2004-09-29 大日本网目版制造株式会社 Base board transport device
CN104619620A (en) * 2012-10-12 2015-05-13 旭硝子株式会社 Glass plate conveyance device and glass plate conveyance method
CN205264681U (en) * 2015-03-09 2016-05-25 株式会社思可林集团 Substrate processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299403A (en) * 2001-03-29 2002-10-11 Hitachi Electronics Eng Co Ltd Apparatus and method of transporting thin board
JP2003124285A (en) * 2001-10-17 2003-04-25 Dainippon Printing Co Ltd Wet processing equipment and transport method
CN1532126A (en) * 2003-03-19 2004-09-29 大日本网目版制造株式会社 Base board transport device
CN104619620A (en) * 2012-10-12 2015-05-13 旭硝子株式会社 Glass plate conveyance device and glass plate conveyance method
CN205264681U (en) * 2015-03-09 2016-05-25 株式会社思可林集团 Substrate processing apparatus

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