CN110701161A - Method for assembling parts - Google Patents
Method for assembling parts Download PDFInfo
- Publication number
- CN110701161A CN110701161A CN201810749374.1A CN201810749374A CN110701161A CN 110701161 A CN110701161 A CN 110701161A CN 201810749374 A CN201810749374 A CN 201810749374A CN 110701161 A CN110701161 A CN 110701161A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- glue
- mounting groove
- shadowless
- assembling method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a part assembling method, which is used for assembling parts in a mounting groove of a workpiece and comprises the following steps: coating glue into the mounting groove; loading the part into the mounting groove and making the top surface of the part lower than the surface of the workpiece; curing the glue; detecting the distance between the top surface of the part and the surface of the workpiece; smearing the shadowless glue in the mounting groove to enable the shadowless glue to be flush with the surface of the workpiece; and curing the shadowless adhesive. The workpiece assembled by the part assembling method has higher flatness.
Description
Technical Field
The invention relates to an assembling method, in particular to an assembling method through dispensing and fixing.
Background
When the parts are assembled on the workpiece, glue is dispensed into the mounting groove of the workpiece, and then the parts are mounted in the mounting groove for fixing, which is a simple, convenient and efficient method. This approach may result in the part sinking into the mounting pocket, i.e., the top surface of the part is below the surface of the workpiece. If the flatness requirements of the workpiece are high, when the sagging phenomenon occurs, the parts can be removed for reassembly, usually only by rework, which affects production efficiency and increases production cost.
Disclosure of Invention
In view of the above, it is desirable to provide a method for assembling parts to solve the above problems.
A part assembling method is used for assembling parts in a mounting groove of a workpiece and comprises the following steps: coating glue into the mounting groove; loading the part into the mounting groove and making the top surface of the part lower than the surface of the workpiece; curing the glue; detecting the distance between the top surface of the part and the surface of the workpiece; smearing the shadowless glue in the mounting groove to enable the shadowless glue to be flush with the surface of the workpiece; and curing the shadowless adhesive.
According to the invention, the part is pressed down in the mounting groove of the workpiece, and then the mounting groove is filled with the sprayed shadowless glue to smooth the section difference between the part and the workpiece, so that the flatness of the workpiece is ensured.
Drawings
FIG. 1 is a flow chart of a part assembly method according to an embodiment of the invention.
FIG. 2 is a schematic cross-sectional view of a part installed in a mounting slot according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view of an assembled component according to an embodiment of the present invention.
Description of the main elements
| Details of | 10 |
| |
20 |
| |
21 |
| |
30 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, an embodiment of the invention provides a component assembling method for assembling a component 10 in a mounting groove 21 of a workpiece 20, in which in the embodiment, the workpiece 20 may be an electronic device housing, and the component 10 may be a decorative strip, but is not limited thereto, the workpiece 20 may be another workpiece having a mounting groove 21, and the component 10 may be another component. The part assembling method comprises the following steps:
s101: dispensing into the mounting groove 21.
Specifically, glue is uniformly applied to the bottom wall and the side wall of the mounting groove 21 by the glue dispensing device. The glue can be glue which is commonly used in the industry for pasting electronic parts.
S102: the part 10 is loaded into the mounting groove 21 with the top surface of the part 10 lower than the mounting groove 21.
In the embodiment, the pressing device presses the part 10, so that the top surface of the part 10 is 0.12 mm to 0.15 mm lower than the surface of the workpiece.
S103: and (5) removing the overflowing glue.
The glue overflowing due to extrusion of the part 10 is removed, and the pressing device still keeps the state of pressing the part 10 when the overflowing glue is removed. It is understood that in other embodiments, S103 may be omitted.
S104: and curing the glue.
In this embodiment, the workpiece 20 and the part 10 in a pressed state are heated to 60-80 ℃ by an oven and kept for 60-120 seconds. Preferably, heat to 70 degrees celsius and hold for 80 seconds. It is understood that in other embodiments, the temperature and time of heating may be set as desired.
S105: and (5) removing residual glue.
And taking the workpiece 20 and the part 10 out of the pressing device, and removing residual glue on the surface of the workpiece. It is understood that in other embodiments, S105 may be omitted.
S106: the distance between the top surface of the part 10 and the surface of the workpiece 20 is detected and the compensation amount of the shadowless glue is calculated.
In the present embodiment, the visual inspection device identifies the contour of the mounting groove 21 to determine the dispensing position and the dispensing path, and then the laser distance meter detects the distance between the part 10 and the surface of the workpiece 20 to automatically calculate the compensation amount of the shadowless glue. It will be appreciated that in other embodiments, other distance sensors may be used for detection, such as infrared rangefinders and the like.
S107: the shadow-less glue 30 is sprayed in the mounting groove 21 to fill the gap from the top surface of the part to the surface of the workpiece.
The positions and paths of the dispensing and the compensation amount of the shadow-less pins are determined according to step S106. In this embodiment, the shadow-less glue 30 comprises 60% to 70% of resin, 25% to 35% of acrylate monomer, 4% to 6% of initiator, 0.2% to 0.4% of defoamer, 0.2% to 0.4% of leveling agent, and 1% to 1.5% of color paste. Wherein the color of the color paste is the same as the color of the part 10.
S108: and (5) standing the workpiece to level the shadowless glue 30.
The time for the workpiece to stand is 10 to 25 minutes. In this embodiment, the standing time is preferably 15 minutes. It is understood that in other embodiments, S108 may be omitted.
S109: the shadowless glue 30 is cured.
In the present embodiment, the shadowless glue 30 is irradiated by using a 395 nm long light source for 10 to 30 seconds, preferably 15 seconds.
According to the invention, the part 10 is pressed down in the mounting groove 21 of the workpiece 20, and then the mounting groove 21 is filled with the sprayed shadowless glue 30 to smooth the section difference between the part 10 and the workpiece 20, so that the flatness of the workpiece is ensured.
In addition, other modifications within the spirit of the invention may occur to those skilled in the art, and such modifications are, of course, included within the scope of the invention as claimed.
Claims (9)
1. A part assembling method is used for assembling parts in a mounting groove of a workpiece and comprises the following steps:
coating glue into the mounting groove;
loading the part into the mounting groove and making the top surface of the part lower than the surface of the workpiece;
curing the glue;
detecting the distance between the top surface of the part and the surface of the workpiece;
smearing the shadowless glue in the mounting groove to enable the shadowless glue to be flush with the surface of the workpiece; and
and curing the shadowless adhesive.
2. The parts assembling method as set forth in claim 1, wherein: the step of curing the glue comprises: and placing the workpiece and the part in an oven, heating to 60-80 ℃, and keeping for 60-120 seconds.
3. The parts assembling method as set forth in claim 1, wherein: the step of detecting the distance between the top surface of the part and the surface of the workpiece comprises: identifying the contour of the mounting groove by a visual detection device to determine a dispensing position and a dispensing path; and detecting the distance between the part and the surface of the workpiece through a laser range finder to automatically calculate the compensation amount of the shadowless glue.
4. The parts assembling method as set forth in claim 1, wherein: the shadowless glue 30 comprises 60 to 70 percent of resin, 25 to 35 percent of acrylate monomer, 4 to 6 percent of initiator, 0.2 to 0.4 percent of defoaming agent, 0.2 to 0.4 percent of flatting agent and 1 to 1.5 percent of color paste, and the color of the color paste is the same as that of the part.
5. The parts assembling method as set forth in claim 1, wherein: after the step of placing the part in the mounting pocket with the top surface of the part below the surface of the workpiece and before the step of curing the glue, the method further comprises: and removing the glue overflowing from the surface of the workpiece.
6. The parts assembling method as set forth in claim 1, wherein: after the step of curing the glue and before the step of detecting the distance between the top surface of the part and the surface of the workpiece, the method further comprises: and removing residual glue on the surface of the workpiece.
7. The parts assembling method as set forth in claim 1, wherein: after the step of coating the shadowless glue in the mounting groove to enable the shadowless glue to be flush with the surface of the workpiece and before the step of curing the shadowless glue, the method further comprises the following steps: the workpiece was left to stand for 10 to 25 minutes to level the shadowless glue.
8. The parts assembling method as set forth in claim 1, wherein: the step of installing the part in the mounting groove with the top surface of the part lower than the surface of the workpiece includes: the workpiece and the part are placed in a pressing device, and the pressing device is used for pressing the part, so that the top surface of the part is 0.12 mm to 0.15 mm lower than the surface of the workpiece.
9. The parts assembling method as set forth in claim 1, wherein: the step of curing the shadowless adhesive comprises the following steps: and irradiating the shadowless adhesive by using a 395-nanometer long light source for 10-30 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749374.1A CN110701161A (en) | 2018-07-10 | 2018-07-10 | Method for assembling parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749374.1A CN110701161A (en) | 2018-07-10 | 2018-07-10 | Method for assembling parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110701161A true CN110701161A (en) | 2020-01-17 |
Family
ID=69192304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810749374.1A Pending CN110701161A (en) | 2018-07-10 | 2018-07-10 | Method for assembling parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110701161A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10121086A1 (en) * | 2001-04-28 | 2002-12-05 | Man Nutzfahrzeuge Ag | Method for glueing two building elements or filling a gap between them involves mixing of an adhesive or a sealant with compression resistant particles of appropriate size |
| CN204119297U (en) * | 2014-10-27 | 2015-01-21 | 广东欧珀移动通信有限公司 | A kind of cell cover structure for mobile phone and mobile phone |
| CN105443526A (en) * | 2015-11-03 | 2016-03-30 | 广东欧珀移动通信有限公司 | Offset eliminating method and movable terminal battery cover |
| CN106772773A (en) * | 2017-01-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of light guide plate and preparation method thereof and backlight module, display device |
| CN106827844A (en) * | 2016-12-15 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | The stereo identification preparation method and terminal of a kind of metal surface |
| CN107219692A (en) * | 2017-07-28 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of liquid crystal panel and liquid crystal display device |
-
2018
- 2018-07-10 CN CN201810749374.1A patent/CN110701161A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10121086A1 (en) * | 2001-04-28 | 2002-12-05 | Man Nutzfahrzeuge Ag | Method for glueing two building elements or filling a gap between them involves mixing of an adhesive or a sealant with compression resistant particles of appropriate size |
| CN204119297U (en) * | 2014-10-27 | 2015-01-21 | 广东欧珀移动通信有限公司 | A kind of cell cover structure for mobile phone and mobile phone |
| CN105443526A (en) * | 2015-11-03 | 2016-03-30 | 广东欧珀移动通信有限公司 | Offset eliminating method and movable terminal battery cover |
| CN106827844A (en) * | 2016-12-15 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | The stereo identification preparation method and terminal of a kind of metal surface |
| CN106772773A (en) * | 2017-01-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of light guide plate and preparation method thereof and backlight module, display device |
| CN107219692A (en) * | 2017-07-28 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of liquid crystal panel and liquid crystal display device |
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| PB01 | Publication | ||
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Application publication date: 20200117 |