CN109291446B - Colloid bonding method and colloid bonding device - Google Patents
Colloid bonding method and colloid bonding device Download PDFInfo
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- CN109291446B CN109291446B CN201811140819.2A CN201811140819A CN109291446B CN 109291446 B CN109291446 B CN 109291446B CN 201811140819 A CN201811140819 A CN 201811140819A CN 109291446 B CN109291446 B CN 109291446B
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- 239000000084 colloidal system Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000011049 filling Methods 0.000 claims abstract description 86
- 239000003292 glue Substances 0.000 claims abstract description 72
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 83
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 238000004026 adhesive bonding Methods 0.000 claims description 31
- 238000007664 blowing Methods 0.000 claims description 14
- 238000005303 weighing Methods 0.000 claims description 14
- 238000004381 surface treatment Methods 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims 2
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 16
- 239000000843 powder Substances 0.000 description 12
- 239000011259 mixed solution Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007850 fluorescent dye Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/03—After-treatments in the joint area
- B29C66/034—Thermal after-treatments
- B29C66/0342—Cooling, e.g. transporting through welding and cooling zone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3475—Displays, monitors, TV-sets, computer screens
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The application provides a colloid bonding method and colloid bonding device, colloid bonding method is used for connecting center and display screen veneer, includes: mixing a fluorescent agent in the colloid to obtain a bonding medium; carrying out laser scanning on the middle frame to extract a groove track of a part to be subjected to glue dispensing on the middle frame; filling the bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first shell; and attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so that the first shell and the display screen are fixedly connected. The technical scheme of this application helps formulating accurate some glue route, improves the accuracy of center and display screen assembly.
Description
Technical Field
The application relates to the technical field of assembly, in particular to a colloid bonding method and a colloid bonding device.
Background
Glue dispensing is a process, also called glue applying, glue spreading, glue pouring, glue dripping and the like, and is to apply, fill and drip glue, oil or other liquid on a product to ensure that the product has the effects of pasting, filling and sealing, insulation, fixation, smooth surface and the like. The traditional center and display screen are glued before the assembly, use the screen decoration circle outside the center as the reference to formulate the route of gluing, decorate the circle glue through the screen and connect center and display screen. With the development of electronic equipment towards the comprehensive screen, the middle frame is directly bonded with the display screen by adopting colloid to form a trend, and a screen decorative ring is omitted. Because no screen decoration ring is used as a reference, a dispensing path cannot be accurately formulated, and the accuracy of assembling the middle frame and the display screen is influenced.
Disclosure of Invention
The application provides a colloid bonding method for with center and display screen veneer connection, the colloid bonding method includes:
mixing a fluorescent agent in the colloid to obtain a bonding medium;
carrying out laser scanning on the middle frame to extract a groove track of a part to be subjected to glue dispensing on the middle frame;
filling the bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first shell;
and attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so that the first shell and the display screen are fixedly connected.
The colloid bonding method is used for bonding and connecting the middle frame and the display screen, firstly, a fluorescent agent is mixed in colloid to obtain a bonding medium, then, the middle frame is scanned by laser, and the groove track of the part to be glued on the middle frame is extracted; filling the bonding medium into the groove of the position to be subjected to glue dispensing of the extracted middle frame, and curing to obtain a first shell; and attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so that the first shell and the display screen are fixedly connected. The dispensing path of the part to be dispensed can be accurately made through laser scanning, so that the accuracy in assembling the middle frame and the display screen is improved.
The application still provides a colloid bonding device for connect center and display screen veneer, colloid bonding device includes:
the acquisition module is used for mixing a fluorescent agent in the colloid to acquire a bonding medium;
the scanning and extracting module is used for carrying out laser scanning on the middle frame so as to extract the groove track of the part to be subjected to glue dispensing on the middle frame;
the first filling and curing module is used for filling the bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first shell;
and the attaching module is used for attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so as to fixedly connect the first shell and the display screen.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a laminated structure of a middle frame and a display screen according to an embodiment of the present application.
Fig. 2 is a flowchart of a colloid bonding method according to an embodiment of the present application.
Fig. 3 is a partial flowchart of a method for adhesive bonding according to an embodiment of the present disclosure.
Fig. 4 is a flowchart of a colloid bonding method according to a second embodiment of the present application.
Fig. 5 is a flowchart of a colloid bonding method according to a third embodiment of the present application.
Fig. 6 is a flowchart of a colloid bonding method according to a fourth embodiment of the present application.
Fig. 7 is a flowchart of a glue bonding method according to a fifth embodiment of the present application.
Fig. 8 is a flowchart of another colloid bonding method provided in the fifth embodiment of the present application.
Fig. 9 is a flowchart of a colloid bonding method according to a sixth embodiment of the present application.
Fig. 10 is a schematic structural diagram of a first glue-binding apparatus according to an embodiment of the present application.
Fig. 11 is a schematic structural diagram of a second glue-binding apparatus according to an embodiment of the present application.
Fig. 12 is a schematic structural diagram of a third adhesive bonding apparatus according to an embodiment of the present disclosure.
Fig. 13 is a schematic structural diagram of a fourth colloid binding apparatus according to an embodiment of the present application.
Fig. 14 is another schematic structural diagram of a fifth glue-binding apparatus according to an embodiment of the present disclosure.
Fig. 15 is a schematic structural diagram of a fifth glue-binding apparatus according to an embodiment of the present disclosure.
Fig. 16 is a schematic structural diagram of a sixth colloid binding apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive effort based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic diagram of a laminated structure of a middle frame and a display screen according to an embodiment of the present application. Fig. 2 is a flowchart of a colloid bonding method according to an embodiment of the present application. In the present embodiment, the adhesive bonding method is used for gluing and connecting the display panel assembly 1020 formed by the middle frame 10 and the display panel 20, and the adhesive bonding method includes, but is not limited to, steps S100, S200, S300, and S400, and the steps S100, S200, S300, and S400 are described in detail as follows.
S100: a fluorescent agent is mixed in the colloid to obtain the adhesive medium 30.
Specifically, the "S100: mixing a fluorescent agent in the gel to obtain the bonding medium 30 "includes, but is not limited to, the following steps I and II, which are described in detail below.
I. And carrying out powdering treatment on the fluorescent agent to obtain the fluorescent powder.
Fluorescent agents, also known as optical brighteners, are fluorescent dyes, also known as white dyes, and are complex organic compounds. It can absorb incident light to produce fluorescence, so that the dyed material can obtain the flash light effect similar to fluorite, and the material can be seen by naked eyes to obtain the whitening effect.
Specifically, the fluorescer is ground firstly, and grinding equipment can be adopted to grind the fluorescer along the same direction. And then screening the ground fluorescent agent, and particularly screening the ground fluorescent agent by adopting a nanoscale screening device. And then drying the screened fluorescent agent to further refine the screened fluorescent agent so as to obtain the fluorescent powder. Optionally, an air dryer may be used to air dry the screened fluorescer.
And II, adding the fluorescent powder into a liquid colloid with a first temperature, and stirring the liquid colloid to obtain a bonding medium 30, wherein the first temperature is higher than a preset temperature.
Specifically, the fluorescent powder is uniformly mixed into the liquid colloid with the first temperature, and in the process of mixing the fluorescent powder, the fluorescent powder is added while the liquid colloid is stirred, so that the obtained bonding medium 30 can be more uniform.
Optionally, in an embodiment, in the process of uniformly mixing the phosphor to the liquid colloid having the first temperature, the mixed solution having the phosphor and the liquid colloid is uniformly blown, and the mixed solution is caused to directionally flow in one direction by blowing, so that the obtained bonding medium 30 can be more uniform. And the blowing promotes the directional flow of the mixed solution, which is helpful for removing the air bubbles in the mixed solution, so that the density of the bonding medium 30 is increased, and the bonding characteristic is better.
Optionally, in another embodiment, in the process of uniformly mixing the phosphor powder with the liquid colloid having the first temperature, the pressure of the mixed solution having the phosphor powder and the liquid colloid is uniformly increased, the obtained bonding medium 30 can be made more uniform by increasing the pressure, and the bubble in the mixed solution can be removed, so that the density of the bonding medium 30 is increased, and the bonding medium has a better bonding characteristic.
The first temperature can be 40-80 ℃, the liquid colloid is a hot melt adhesive, after the fluorescent powder is added into the liquid colloid at the first temperature, the fluorescent powder molecules move in the liquid colloid at a high speed due to the thermal movement of the fluorescent powder molecules, so that the fluorescent agent molecules in the obtained bonding medium 30 can be mixed more uniformly, the bonding medium 30 can present a uniform highlight effect, and the amount of the bonding medium 30 filled in the middle frame 10 can be judged by taking the boundary of the bonding medium 30 as a reference.
S200: and carrying out laser scanning on the middle frame 10 to extract the track of the groove 10a of the part to be subjected to glue dispensing on the middle frame 10.
Optionally, a three-dimensional laser scanner is used to scan the outer contour of the middle frame 10 to obtain the track of the groove 10a of the dispensing position on the middle frame 10. The three-dimensional laser scanning technology is also called as a live-action replication technology, has the unique advantages of high efficiency and high precision, can provide three-dimensional point cloud data of the surface of a scanned object, and can be used for acquiring a digital terrain model with high precision and high resolution.
Further, in a preferred embodiment, the accuracy of the laser scanning is controlled by controlling the speed of the laser scanning. Specifically, the arc line position at the corner position of center 10 adopts first speed of predetermineeing to scan, adopts the second speed of predetermineeing to scan at the sideline position of center 10, first speed of predetermineeing is less than the second speed of predetermineeing, and two adjacent sidelines enclose establish and form the corner. Scanning is carried out at a slow speed through the arc line of the corner position of the middle frame 10, scanning is carried out at a fast speed through the side line position of the middle frame 10, the efficiency of laser scanning can be improved, meanwhile, the scanning precision of the middle frame 10 can be improved, and the acquisition of the track of the groove 10a of the accurate middle frame 10 where the glue is to be dispensed is facilitated.
Optionally, in another preferred embodiment, the middle frame 10 is scanned with multiple laser scans, and the scanning speed is increased in sequence. Specifically, when the laser scanning is performed on the center frame 10 for the first time, a first scanning speed is adopted; then, when the middle frame 10 is scanned by the laser for the second time, the second scanning speed is adopted, wherein the first scanning speed is less than the second scanning speed. Through carrying out laser scanning many times to center 10, help obtaining center 10 is accurate external profile, and then accurate extraction center 10 is waited to glue the recess 10a orbit of position, helps improving the accuracy of center 10 and the laminating of display screen 20.
S300: and filling the bonding medium 30 into the groove 10a of the position to be subjected to glue dispensing of the middle frame 10, and curing to obtain the first shell 1030.
Specifically, the adhesive medium 30 can be simultaneously filled into the plurality of dispensing positions of the groove 10a on the middle frame 10, and the plurality of dispensing positions are uniformly distributed on the groove 10a, so that when the filling speed of the adhesive medium 30 into each dispensing position is kept consistent, the adhesive medium 30 can be uniformly filled into the groove 10a of the middle frame 10, and the connection between the middle frame 10 and the display screen 20 can be tighter.
Further, the middle frame 10 filled with the adhesive medium 30 is uv-cured, and the first housing 1030 is obtained. The ultraviolet curing is a process of curing the liquid adhesive medium 30 by irradiating it with Ultraviolet (UV) rays. Specifically, in an embodiment, the ultraviolet curing device is fixed at a position away from the middle frame 10 by a preset distance to irradiate the middle frame 10 filled with the bonding medium 30, so that the bonding medium 30 is uniformly irradiated by ultraviolet rays, and thus can be cured together, which helps to make the curing speed of the bonding medium 30 more uniform, and further obtain the first shell 1030 with good bonding properties. Optionally, in another embodiment, the ultraviolet curing device is moved at a constant speed to scan and cure the middle frame 10 filled with the bonding medium 30, so as to help eliminate internal stress of the bonding medium 30 during curing, and help to enhance bonding strength of the bonding medium 30, so that the middle frame 10 and the display screen 20 can be connected more firmly.
S400: the surface of the first housing 1030 filled with the adhesive medium 30 is attached to the display panel 20, so that the first housing 1030 and the display panel 20 are fixedly connected.
Specifically, the first housing 1030 and the surface filled with the adhesive medium 30 are aligned with the display screen 20 and then attached together, and a certain pretightening force is applied, so that the stress between the first housing 1030 and the display screen 20 is more uniform, and the connection between the first housing 1030 and the display screen 20 is more reliable.
Further, after the first housing 1030 and the display screen 20 are attached together, whether the excessive bonding medium 30 overflows from the attachment portion of the first housing 1030 and the display screen 20 is detected, and when the excessive bonding medium 30 overflows from the attachment portion of the first housing 1030 and the display screen 20 is detected, the cleaning liquid is used for cleaning the portion, where the excessive bonding medium 30 overflows, of the attachment portion of the first housing 1030 and the display screen 20, so as to remove the excessive bonding medium 30 from the attachment portion of the first housing 1030 and the display screen 20, and therefore the appearance consistency of the first housing 1030 and the display screen 20 is maintained. When cleaning the joint of the first housing 1030 and the display 20 where the excess bonding medium 30 overflows, a protective film is required to cover the groove 10a between the first housing 1030 and the display 20 to prevent the bonding medium 30 filled in the groove 10a from being damaged.
The colloid bonding method provided by the technical scheme is used for bonding and connecting the middle frame 10 and the display screen 20, firstly, a fluorescent agent is mixed in colloid to obtain a bonding medium 30, then, the middle frame 10 is scanned by laser, and the track of the groove 10a of the part to be subjected to glue dispensing on the middle frame 10 is extracted; filling the bonding medium 30 into the groove 10a of the extracted middle frame 10 at the position to be subjected to glue dispensing, and curing to obtain a first shell 1030; the surface of the first housing 1030 filled with the adhesive medium 30 is attached to the display panel 20, so that the first housing 1030 and the display panel 20 are fixedly connected. The dispensing path of the part to be dispensed can be accurately made through laser scanning, thereby being beneficial to improving the accuracy of the assembly of the middle frame 10 and the display screen 20.
Referring to fig. 1 and fig. 3 together, fig. 3 is a partial flowchart of a method for adhesive bonding according to an embodiment of the present disclosure. Optionally, in the step S100: after mixing the fluorescent agent in the colloid to obtain the bonding medium 30 ″, the method for bonding the colloid further includes, but is not limited to, steps S110 and S120, and the following detailed description is provided with respect to steps S110 and S120.
S110: the shelf life of the bonding medium 30 is monitored.
Specifically, the preheating barrel of the bonding medium 30 is connected with the dispenser through a sensing device, the use period of the bonding medium 30 is calculated from the time the bonding medium 30 is placed in the preheating barrel, and the shelf life of the bonding medium 30 is monitored in real time.
S120: and when the quality guarantee period of the bonding medium 30 is monitored to be greater than or equal to the preset period, replacing the bonding medium 30.
Specifically, when the sensing device detects that the usage period of the adhesive medium 30 placed in the preheating tub is greater than or equal to the preset period, it indicates that the adhesive medium 30 has failed, i.e., the shelf life of the adhesive medium 30 has passed. At this time, the viscosity of the adhesive medium 30 is greatly reduced, and if the shelf life of the adhesive medium 30 is over to adhere the middle frame 10 and the display screen 20, the connection is not firm. Therefore, it is necessary to replace the adhesive agent 30 with a new one to ensure a more firm connection between the middle frame 10 and the display panel 20. Wherein the preset period may be 4 hours.
Referring to fig. 1 and 4 together, fig. 4 is a flowchart of a colloid bonding method according to a second embodiment of the present application. The adhesive bonding method provided in the second embodiment is substantially the same as the adhesive bonding method provided in the first embodiment, except that, in this embodiment, the step "S200: the laser scanning of the middle frame 10 to extract the track of the groove 10a of the dispensing location on the middle frame 10 includes, but is not limited to, steps S210 and S220, and the details about steps S210 and S220 are described below.
S210: and scanning the groove 10a of the part of the middle frame 10 to be subjected to glue dispensing by adopting laser.
Specifically, scanning is performed along the extending direction of the groove 10a of the portion to be subjected to glue dispensing of the middle frame 10 by using a scanning device, and the speed of laser scanning is controlled, so as to improve the scanning accuracy of the groove 10a of the portion to be subjected to glue dispensing of the middle frame 10. Specifically, the straight extension part of the track of the groove 10a is scanned at a third scanning speed, and the bent extension part of the track of the groove 10a is scanned at a fourth scanning speed, wherein the third scanning speed is greater than the fourth scanning speed, so that the accuracy of scanning the bent part of the groove 10a is improved, the accuracy of filling the bonding medium 30 can be improved, and the connection between the middle frame 10 and the display screen 20 is firmer.
Optionally, in a preferred embodiment, when the groove 10a of the portion to be subjected to dispensing of the middle frame 10 is scanned by using laser, light is supplemented to the groove 10a of the middle frame 10, so that the brightness of the groove 10a is improved, and the precision of laser scanning is improved. Specifically, adopt the line source just to shine the recess 10a of center 10 to improve the luminance of recess 10a diapire, thereby help the more accurate scanning of laser, help obtaining the accurate structure of recess 10a on center 10, thereby make bonding medium 30's packing more accurate, make the laminating between center 10 and display screen 20 more accurate.
S220: extracting a bottom wall, a first side line and a second side line which are opposite to the bottom wall, the first side line and the second side line of the groove 10a of the middle frame 10 at the position to be glued, determining a central line of the position to be glued of the middle frame 10 according to the bottom wall, the first side line and the second side line, and taking the central line as a track of the position to be glued of the middle frame 10.
Specifically, line scanning is performed using laser light to extract the first side line and the second side line opposite to the groove 10a, and then surface scanning is performed using laser light to extract the bottom wall of the groove 10 a. A first central line of the groove 10a is determined through the first side line and the second side line, and then a central line of the position of the middle frame 10 to be subjected to glue dispensing can be determined according to the first central line and the bottom wall of the groove 10a, so that the central line can be used as a track of the position of the middle frame 10 to be subjected to glue dispensing.
Referring to fig. 1 and 5, fig. 5 is a flowchart illustrating a colloid bonding method according to a third embodiment of the present application. The adhesive bonding method provided in the third embodiment is substantially the same as the adhesive bonding method provided in the first embodiment, except that, in this embodiment, the step "S300: the adhesive medium 30 is filled into the groove 10a of the portion to be dispensed of the middle frame 10, and the first housing 1030 ″ obtained after curing includes, but is not limited to, steps S310, S320, S330, and S340, and the steps S310, S320, S330, and S340 are described in detail below.
S310: and filling a first sub-bonding medium into the groove 10a of the part to be subjected to glue dispensing of the middle frame 10.
Specifically, when the first sub-bonding medium is filled in the groove 10a with the dispensing position of the middle frame 10, the first sub-bonding medium is uniformly attached to the side wall of the groove 10a, so that the first sub-bonding medium can be used as a substrate, then the second sub-bonding medium is filled, the connection strength between the first sub-bonding medium and the second sub-bonding medium can be enhanced, and the connection strength between the middle frame 10 and the display screen 20 is further enhanced.
S320: the first sub-bonding medium is blown along the extending direction of the groove 10a so that the first sub-bonding medium fills the groove 10a, and is cured to obtain a first filling layer.
Specifically, the first sub-bonding medium filled in the groove 10a is blown by using a blowing device moving along the extending direction of the groove 10a, so that the first sub-bonding medium is caused to flow directionally, and thus the first sub-bonding medium can be uniformly filled in the groove 10 a.
Further, the middle frame 10 filled with the first sub-adhesive medium is subjected to ultraviolet curing, so that the first sub-adhesive medium forms a first filling layer after being cured. The ultraviolet curing is a process of curing the liquid adhesive medium 30 by irradiating it with Ultraviolet (UV) rays. Specifically, in an embodiment, the ultraviolet curing device is fixed at a position away from the middle frame 10 by a preset distance to irradiate the middle frame 10 filled with the first sub-adhesive medium, so that the first sub-adhesive medium is uniformly irradiated by ultraviolet rays, and can be cured together, which is helpful for making the curing speed of the first sub-adhesive medium more uniform, and further obtaining the first filling layer with good adhesive properties. Optionally, in another embodiment, the ultraviolet curing device moves at a constant speed to scan and cure the middle frame 10 filled with the first sub-adhesive medium, so as to help eliminate internal stress of the first sub-adhesive medium during curing, and help to enhance adhesive strength of the first sub-adhesive medium, so that the middle frame 10 and the display screen 20 can be connected more firmly.
S330: and filling a second sub-bonding medium into the surface of the cured first filling layer.
Optionally, the filling amount of the second sub-adhesive medium is smaller than that of the first sub-adhesive medium, so that the second sub-adhesive medium is attached to the surface of the first sub-adhesive medium, and the second sub-adhesive medium uses the first sub-adhesive medium as a substrate, so as to enhance the connection strength between the first sub-adhesive medium and the second sub-adhesive medium, and further enhance the connection strength between the middle frame 10 and the display screen 20.
S340: and blowing the second sub-bonding medium along the surface of the first filling layer so that the second sub-bonding medium covers the surface of the first filling layer, and curing the second sub-bonding medium to obtain a second filling layer.
Specifically, air is blown to the second sub-adhesive medium by air blowing equipment moving along the surface of the first filling layer, so that the second sub-adhesive medium flows directionally on the surface of the first sub-adhesive medium, the second sub-adhesive medium uniformly covers the surface of the first sub-adhesive medium, the connection strength between the first sub-adhesive medium and the second sub-adhesive medium is enhanced, and the connection strength between the middle frame 10 and the display screen 20 is further enhanced.
Further, the first sub-bonding medium is blown at a first speed, and the second sub-bonding medium is blown at a second speed, wherein the first speed is higher than the second speed. When the first speed is higher, the first sub-bonding medium can be quickly filled in the groove 10a, and the first sub-bonding medium is prevented from being solidified due to too low speed. When the second speed is slower, the first sub-adhesive medium can be uniformly covered on the surface of the second sub-adhesive medium, so that the connection strength between the first sub-adhesive medium and the second sub-adhesive medium is enhanced, and further, the connection strength between the middle frame 10 and the display screen 20 is enhanced. And the second sub-bonding medium can be prevented from overflowing the groove 10a due to the excessively high blowing speed, so that the appearance surface of the middle frame 10 is prevented from being damaged.
Further, the middle frame 10 filled with the second sub-adhesive medium is uv-cured, so that the second sub-adhesive medium forms a second filling layer after being cured. The ultraviolet curing is a process of curing the liquid adhesive medium 30 by irradiating it with Ultraviolet (UV) rays. Specifically, in an embodiment, the ultraviolet curing device is fixed at a position away from the middle frame 10 by a preset distance to irradiate the middle frame 10 filled with the second sub-adhesive medium, so that the second sub-adhesive medium is uniformly irradiated by ultraviolet rays, and can be cured together, which is helpful for making the curing speed of the second sub-adhesive medium more uniform, and further obtaining a second filling layer with good adhesive properties. Optionally, in another embodiment, the ultraviolet curing device moves at a constant speed to scan and cure the middle frame 10 filled with the second sub-adhesive medium, so as to help eliminate internal stress of the second sub-adhesive medium during curing, and help enhance adhesive strength of the second sub-adhesive medium, so that the middle frame 10 and the display screen 20 can be connected more firmly.
Referring to fig. 1 and fig. 6 together, fig. 6 is a flowchart of a colloid bonding method according to a fourth embodiment of the present application. The adhesive bonding method provided in the fourth embodiment is substantially the same as the adhesive bonding method provided in the first embodiment, except that, in this embodiment, the step "S300: the step of filling the adhesive medium 30 into the groove 10a of the to-be-dispensed portion of the middle frame 10, and obtaining the first housing 1030 ″ after curing further includes, but is not limited to, steps S301, S302, S303, and S304, and the steps S301, S302, S303, and S304 are described in detail as follows.
S301: and filling a third sub-bonding medium into the groove 10a of the part to be subjected to glue dispensing of the middle frame 10, and curing to obtain a first sub-shell.
S302: the first sub-housing is weighed.
Specifically, the mass of the first sub-shell is weighed using a specially made microbalance. Alternatively, the precision of the microbalance can reach 0.01 g.
S303: and when the weight of the first sub-shell is smaller than the preset weight, filling a fourth sub-bonding medium on the surface of the cured third sub-bonding medium, and curing to obtain a second sub-shell.
Specifically, when the weight of the first sub-housing is less than the preset weight, the filling amount of the adhesive medium 30 is considered to be insufficient, and at this time, in order to make the connection between the middle frame 10 and the display screen 20 more firm, the adhesive medium 30 needs to be continuously filled.
Optionally, in a preferred embodiment, the filling amount of the fourth sub bonding medium is smaller than the filling amount of the third sub bonding medium. That is, the third sub-adhesive medium with a large filling amount is filled first, then the filling amount of the adhesive medium 30 is gradually reduced, and finally the fourth sub-adhesive medium with a small filling amount is filled. The filling efficiency of the bonding medium 30 can be improved, the filling accuracy of the bonding medium 30 can be improved, the situations of glue leakage, glue shortage and even glue shortage can be avoided, the connection strength between the middle frame 10 and the display screen 20 can be enhanced, and the appearance consistency of the middle frame 10 and the display screen 20 can be ensured.
S304: and weighing the second sub-shell, and when the weight of the second sub-shell is within a preset weight range, taking the second sub-shell as the first shell 1030.
Specifically, when the weight of the second sub-housing is within the preset weight range, the filling amount of the fourth sub-adhesive medium in the second sub-housing is considered to be sufficient, and at this time, if the adhesive medium 30 is continuously filled, the problem of excessive adhesive may occur, and finally, the adhesive overflow condition may occur, which affects the appearance consistency of the middle frame 10 and the display screen 20. Therefore, at this time, it is necessary to stop filling the adhesive medium 30, and attach the second sub-housing as the first housing 1030 to the display panel 20, so that the second sub-housing is fixedly connected to the display panel 20.
Referring to fig. 1, fig. 7 and fig. 8, fig. 7 is a flowchart of a glue bonding method according to a fifth embodiment of the present application. Fig. 8 is a flowchart of another colloid bonding method provided in the fifth embodiment of the present application. The adhesive bonding method provided in the fifth embodiment is substantially the same as the adhesive bonding method provided in the first embodiment, except that in this embodiment, the step "S400: the surface of the first housing 1030 filled with the adhesive medium 30 is attached to the display panel 20, so that the first housing 1030 and the display panel 20 are fixedly connected "including, but not limited to, steps S410 and S420 or steps S410 and S430, and the detailed description of steps S410, S420 and S430 is as follows.
S410: the first surface 20a of the display screen 20 is surface-treated to improve the adhesive force of the adhesive medium 30 of the first surface 20 a.
Optionally, the first surface 20a of the display screen 20 is subjected to plasma surface treatment to improve the surface roughness of the first surface 20a, so as to improve the adhesion of the adhesive medium 30 of the first surface 20 a.
The plasma surface treatment is performed by applying sufficient energy to the first surface 20a of the display panel 20 to ionize the first surface into a plasma state. The surface roughness refers to the small pitch and the unevenness of minute peaks and valleys of the processed surface. The distance between two wave crests or two wave troughs (wave distance) is very small (below 1 mm), and the micro geometrical shape error belongs to. The smaller the surface roughness, the smoother the surface.
S420: a first center of the display screen 20 and a second center of the first housing 1030 are determined, and the first center and the second center are aligned to fixedly connect the first surface 20a and the surface of the first housing 1030 filled with the adhesive medium 30.
Optionally, the first center of the display screen 20 and the second center of the first housing 1030 may be obtained by a "hanging method", the first center and the second center are aligned, and the display screen 20 and the first housing 1030 may be fixedly connected by adjusting a rotation angle between the display screen 20 and the first housing 1030.
Or, S430: determining a first corner and a second corner of the display screen 20, determining a third corner and a fourth corner of the first housing 1030, aligning the first corner and the third corner, and aligning the second corner and the fourth corner to fixedly connect the display screen 20 and the first housing 1030.
Referring to fig. 1 and 9 together, fig. 9 is a flowchart of a glue bonding method according to a sixth embodiment of the present application. The colloid bonding method provided in the sixth embodiment is substantially the same as the colloid bonding method provided in the first embodiment, except that in this embodiment, in the step "S400: after the surface of the first housing 1030 filled with the adhesive medium 30 is attached to the display panel 20, so that the first housing 1030 and the display panel 20 are fixedly connected, "the adhesive bonding method further includes, but is not limited to, steps S500 and S600, and the details about steps S500 and S600 are described below.
S500: placing the first shell 1030 and the display screen 20 which are attached together in a pressure maintaining jig and standing for a preset time so that the bonding medium 30 is cured.
Specifically, the first shell 1030 and the display screen 20 after alignment and attachment are placed into a pressure maintaining jig together, the pretightening force and the pressure maintaining temperature of the pressure maintaining jig are adjusted, and the static placement is performed for a preset time, so that the bonding medium 30 is fully cured, and the first shell 1030 and the display screen 20 are fixedly connected.
S600: and taking out the display screen assembly 1020 formed by the first shell 1030 and the display screen 20, and testing the appearance and the display function of the display screen assembly 1020.
Specifically, after the display screen assembly 1020 is maintained for a preset time, the display screen assembly 1020 is taken out, the appearance of the display screen assembly 1020 is firstly detected, and whether glue overflow occurs on the display screen assembly 1020 is judged. If the display panel assembly 1020 has an adhesive overflow condition, the excess adhesive medium 30 needs to be cleaned by a cleaning solution. Second, the display function of the display panel assembly 1020 needs to be tested to ensure that the display panel assembly 1020 has a normal display function.
Further, need carry out tensile test to display screen subassembly 1020's joint strength, adopt pulling force equipment to exert pulling force to the first casing 1030 and the display screen 20 of the display screen subassembly 1020 of accomplishing the installation promptly, and set up the pulling force to predetermineeing the pulling force, and drag the predetermined number of times to first casing 1030 and display screen 20, bear predetermined pulling force when first casing 1030 and display screen 20, and drag and still keep fixed connection after predetermineeing the number of times, then think that display screen subassembly 1020 can pass through tensile test. The preset tension can be 50N, and the preset times can be 30 ten thousand.
Referring to fig. 1 and 10 together, fig. 10 is a schematic structural diagram of a first glue-bonding apparatus according to an embodiment of the present disclosure. In the present embodiment, the colloid bonding apparatus 50 includes, but is not limited to, the obtaining module 100, the scanning and extracting module 200, the first filling and curing module 310, and the attaching module 400, and the obtaining module 100, the scanning and extracting module 200, the first filling and curing module 310, and the attaching module 400 are described as follows.
An obtaining module 100 is configured to mix a fluorescent agent in the colloid to obtain the adhesive medium 30.
Specifically, the obtaining module 100 includes, but is not limited to, a processing sub-module 110 and a stirring module 120, and the following description is provided for the processing sub-module 110 and the stirring module 120.
And the processing submodule 110 is used for performing powdering processing on the fluorescent agent to obtain the fluorescent powder.
The stirring module 120 is configured to add the phosphor into a liquid colloid having a first temperature, and stir the liquid colloid to obtain the bonding medium 30, where the first temperature is greater than a preset temperature.
In one possible embodiment, the adhesive bonding apparatus 50 further includes, but is not limited to, a monitoring module 130 and a replacement module 140, and the monitoring module 130 and the replacement module 140 are described below.
A monitoring module 130 for monitoring the shelf life of the adhesive medium 30.
And the replacing module 140 is used for replacing the bonding medium 30 when the quality guarantee period of the bonding medium 30 is monitored to be greater than or equal to a preset period.
The scanning and extracting module 200 is configured to perform laser scanning on the middle frame 10 to extract a track of the groove 10a of the position to be subjected to glue dispensing on the middle frame 10.
The first filling and curing module 310 is configured to fill the bonding medium 30 into the groove 10a of the portion of the middle frame 10 to be subjected to dispensing, and obtain the first housing 1030 after curing.
A fitting module 400, configured to fit a surface of the first housing 1030, which is filled with the adhesive medium 30, to the display screen 20, so that the first housing 1030 and the display screen 20 are fixedly connected.
The colloid bonding device 50 is used for bonding and connecting the middle frame 10 and the display screen 20, firstly, a fluorescent agent is mixed in colloid to obtain a bonding medium 30, then, the middle frame 10 is scanned by laser, and the track of the groove 10a of the position to be subjected to glue dispensing on the middle frame 10 is extracted; filling the bonding medium 30 into the groove 10a of the extracted middle frame 10 at the position to be subjected to glue dispensing, and curing to obtain a first shell 1030; the surface of the first housing 1030 filled with the adhesive medium 30 is attached to the display panel 20, so that the first housing 1030 and the display panel 20 are fixedly connected. The dispensing path of the part to be dispensed can be accurately made through laser scanning, thereby being beneficial to improving the accuracy of the assembly of the middle frame 10 and the display screen 20.
Referring to fig. 1 and 11 together, fig. 11 is a schematic structural diagram of a second glue-bonding apparatus according to an embodiment of the present application. The structure of the second glue-binding apparatus is substantially the same as that of the first glue-binding apparatus, except that in the present embodiment, the scanning and extracting module 200 includes, but is not limited to, a scanning module 510 and an extracting module 530, which are described below with respect to the scanning module 510 and the extracting module 530.
The scanning module 510 is configured to scan the groove 10a of the middle frame 10 at the position to be subjected to dispensing with laser.
An extracting module 530, configured to extract a bottom wall of the groove 10a of the middle frame 10 where the glue is to be dispensed and a first side line and a second side line opposite to the bottom wall, determine a center line of the part of the middle frame 10 where the glue is to be dispensed according to the bottom wall, the first side line, and the second side line, and use the center line as a track of the part of the middle frame 10 where the glue is to be dispensed.
Referring to fig. 1 and 12 together, fig. 12 is a schematic structural diagram of a third adhesive bonding apparatus according to an embodiment of the present disclosure. The third glue bonding apparatus has substantially the same structure as the first glue bonding apparatus, except that the first filling and curing module 310 includes, but is not limited to, a first filling submodule 311, a first blow curing module 312, a second filling submodule 313 and a second blow curing module 314, and the first filling submodule 311, the first blow curing module 312, the second filling submodule 313 and the second blow curing module 314 are described as follows.
The first filling submodule 311 is configured to fill the groove 10a of the position to be subjected to glue dispensing of the middle frame 10 with a first sub-bonding medium.
The first blowing and solidifying module 312 is configured to blow the first sub-bonding medium along the extending direction of the groove 10a, so that the groove 10a is filled with the first sub-bonding medium, and the first sub-bonding medium is solidified to obtain a first filling layer.
And a second filling submodule 313 for filling the surface of the cured first filling layer with a second sub-bonding medium.
And a second air blowing and curing module 314, configured to blow air to the second sub-bonding medium along the surface of the first filling layer, so that the second sub-bonding medium covers the surface of the first filling layer, and cure the second sub-bonding medium, so as to obtain a second filling layer.
Referring to fig. 1 and 13 together, fig. 13 is a schematic structural diagram of a fourth colloid binding apparatus according to an embodiment of the present application. The fourth glue-binding apparatus has substantially the same structure as the first glue-binding apparatus, except that the glue-binding apparatus 50 further includes, but is not limited to, a second filling and curing module 320, a first weighing module 330, a third filling and curing module 340, and a second weighing module 350, which are described below with respect to the second filling and curing module 320, the first weighing module 330, the third filling and curing module 340, and the second weighing module 350.
The second filling and curing module 320 is configured to fill a third sub-bonding medium into the groove 10a of the portion of the middle frame 10 to be subjected to glue dispensing, and cure the third sub-bonding medium to obtain a first sub-housing.
A first weighing module 330 for weighing the first sub-housing.
And a third filling and curing module 340, configured to fill a fourth sub-bonding medium on the surface of the cured third sub-bonding medium when the weight of the first sub-housing is smaller than the preset weight, and cure the third sub-bonding medium to obtain a second sub-housing.
And a second weighing module 350, configured to weigh the second sub-housing, and when the weight of the second sub-housing is within a preset weight range, use the second sub-housing as the first housing 1030.
Referring to fig. 1, 14 and 15, fig. 14 is another schematic structural diagram of a fifth glue-binding apparatus according to an embodiment of the present disclosure. Fig. 15 is a schematic structural diagram of a fifth glue-binding apparatus according to an embodiment of the present disclosure. The fifth glue-applying device has substantially the same structure as the first glue-applying device, except that the pasting module 400 includes, but is not limited to, a surface treatment module 600 and a first determination module 610, or a surface treatment module 600 and a second determination module 620, which are described below with respect to the surface treatment module 600, the first determination module 610, and the second determination module 620.
The surface treatment module 600 is configured to perform surface treatment on the first surface 20a of the display screen 20 to improve the adhesion of the adhesive medium 30 on the first surface 20 a.
A first determining module 610, configured to determine a first center of the display screen 20 and a second center of the first housing 1030, and align the first center and the second center to fixedly connect the first surface 20a and the surface of the first housing 1030 filled with the adhesive medium 30.
Or, the second determining module 620 is configured to determine a first corner and a second corner of the display screen 20, determine a third corner and a fourth corner of the first casing 1030, align the first corner and the third corner, and align the second corner and the fourth corner to fixedly connect the display screen 20 and the first casing 1030.
Referring to fig. 1 and 16 together, fig. 16 is a schematic structural diagram of a sixth glue-binding apparatus according to an embodiment of the present disclosure. The structure of the sixth glue-binding apparatus is substantially the same as that of the first glue-binding apparatus, except that the glue-binding apparatus 50 further includes, but is not limited to, a static curing module 700 and a testing module 800, which are described below with respect to the static curing module 700 and the testing module 800.
The standing and curing module 700 is configured to place the first housing 1030 and the display screen 20, which are attached together, in a pressure holding fixture for a preset time period to cure the bonding medium 30;
the testing module 800 is configured to take out the display screen assembly 1020 formed by the first housing 1030 and the display screen 20, and test an appearance and a display function of the display screen assembly 1020.
The modules or sub-modules described as separate parts may or may not be physically separate, and parts displayed as modules or sub-modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules or sub-modules can be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, each functional module or sub-module in each embodiment of the present invention may be integrated into one processing module, or each module or sub-module may exist alone physically, or two or more modules or sub-modules may be integrated into one module. The integrated modules or sub-modules can be realized in the form of hardware or in the form of software functional modules.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (12)
1. A colloid bonding method is used for bonding and connecting a middle frame and a display screen, and is characterized by comprising the following steps:
mixing a fluorescent agent in the colloid to obtain a bonding medium;
monitoring the shelf life of the bonding medium, comprising: connecting a preheating barrel containing a bonding medium with a dispenser through a sensing device, starting to calculate the service cycle of the bonding medium from the time the bonding medium is placed in the preheating barrel, and monitoring the shelf life of the bonding medium in real time;
when the quality guarantee period of the bonding medium is monitored to be greater than or equal to the preset period, replacing the bonding medium;
performing laser scanning on the middle frame to extract a groove track of a position to be subjected to glue dispensing on the middle frame, wherein when the middle frame is subjected to laser scanning, scanning is performed at an arc line of a corner position of the middle frame at a first preset speed, scanning is performed at a sideline position of the middle frame at a second preset speed, and the first preset speed is smaller than the second preset speed;
filling the bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first shell;
and attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so that the first shell and the display screen are fixedly connected.
2. A method for bonding glue according to claim 1, wherein said step of performing laser scanning on the middle frame to extract the groove track of the portion to be glued on the middle frame comprises:
scanning the groove of the part of the middle frame to be subjected to glue dispensing by adopting laser;
extracting a bottom wall of a groove of a position to be subjected to glue dispensing of the middle frame, and a first side line and a second side line which are opposite to each other, determining a central line of the position to be subjected to glue dispensing of the middle frame according to the bottom wall, the first side line and the second side line, and taking the central line as a track of the position to be subjected to glue dispensing of the middle frame.
3. A colloid bonding method according to claim 1, wherein said filling the bonding medium into the groove of the portion of the middle frame to be dispensed and obtaining the first housing after curing comprises:
filling a first sub-bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing;
blowing the first sub-bonding medium along the extending direction of the groove so that the first sub-bonding medium fills the groove, and curing the first sub-bonding medium to obtain a first filling layer;
filling a second sub-bonding medium on the surface of the solidified first filling layer;
and blowing the second sub-bonding medium along the surface of the first filling layer so that the second sub-bonding medium covers the surface of the first filling layer, and curing the second sub-bonding medium to obtain a second filling layer.
4. A colloid bonding method according to claim 1, wherein said step of filling the bonding medium into the groove of the portion of the middle frame to be dispensed and obtaining the first housing after curing further comprises the steps of:
filling a third sub-bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first sub-shell;
weighing the first sub-housing;
when the weight of the first sub-shell is smaller than the preset weight, filling a fourth sub-bonding medium on the surface of the cured third sub-bonding medium, and curing to obtain a second sub-shell;
and weighing the second sub-shell, and when the weight of the second sub-shell is within a preset weight range, taking the second sub-shell as the first sub-shell.
5. The adhesive bonding method of claim 1, wherein the adhering the surface of the first housing filled with the adhesive medium to the display screen so that the first housing and the display screen are fixedly connected comprises:
carrying out surface treatment on the first surface of the display screen so as to improve the bonding force of a bonding medium on the first surface;
determining a first center of the display screen and a second center of the first housing, aligning the first center and the second center to fixedly connect the first surface and the surface of the first housing filled with the bonding medium;
or, determining a first corner and a second corner which are arranged oppositely to the display screen, determining a third corner and a fourth corner which are arranged oppositely to the first shell, aligning the first corner and the third corner, and aligning the second corner and the fourth corner to fixedly connect the display screen and the first shell.
6. The adhesive bonding method according to claim 1, wherein after the "attaching the surface of the first housing filled with the bonding medium to the display screen so that the first housing and the display screen are fixedly connected", the adhesive bonding method further comprises:
placing the first shell and the display screen which are attached together in a pressure maintaining jig for standing for a preset time so as to cure the bonding medium;
and taking out the first shell and a display screen assembly formed by the display screen, and testing the appearance and the display function of the display screen assembly.
7. The utility model provides a colloid bonding device for be connected center and display screen veneer, its characterized in that, colloid bonding device includes:
the acquisition module is used for mixing a fluorescent agent in the colloid to acquire a bonding medium;
the monitoring module is used for monitoring the quality guarantee period of the bonding medium and comprises: connecting a preheating barrel containing a bonding medium with a dispenser through a sensing device, starting to calculate the service cycle of the bonding medium from the time the bonding medium is placed in the preheating barrel, and monitoring the shelf life of the bonding medium in real time;
the replacing module is used for replacing the bonding medium when the quality guarantee period of the bonding medium is monitored to be larger than or equal to a preset period; wherein the shelf life of the bonding medium is monitored;
the scanning and extracting module is used for carrying out laser scanning on the middle frame so as to extract the groove track of the position to be subjected to glue dispensing on the middle frame, wherein when the middle frame is subjected to laser scanning, the arc line of the corner position of the middle frame is scanned at a first preset speed, the side line position of the middle frame is scanned at a second preset speed, and the first preset speed is smaller than the second preset speed;
the first filling and curing module is used for filling the bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing, and curing to obtain a first shell;
and the attaching module is used for attaching the surface of the first shell, which is filled with the bonding medium, to the display screen so as to fixedly connect the first shell and the display screen.
8. The adhesive bonding apparatus of claim 7, wherein the scan extraction module comprises:
the scanning module is used for scanning the groove of the part, to be subjected to glue dispensing, of the middle frame by adopting laser;
the extraction module is used for extracting a bottom wall of the groove of the position to be subjected to glue dispensing of the middle frame and a first side line and a second side line which are opposite to each other, determining a central line of the position to be subjected to glue dispensing of the middle frame according to the bottom wall, the first side line and the second side line, and taking the central line as a track of the position to be subjected to glue dispensing of the middle frame.
9. The adhesive bonding apparatus of claim 7, wherein the first fill-cure module comprises:
the first filling submodule is used for filling a first sub-bonding medium into the groove of the part of the middle frame to be subjected to glue dispensing;
the first blowing solidification module is used for blowing the first sub-bonding medium along the extending direction of the groove so as to enable the first sub-bonding medium to fill the groove, and curing the first sub-bonding medium to obtain a first filling layer;
the second filling submodule is used for filling a second sub-bonding medium into the surface of the cured first filling layer;
and the second air blowing curing module is used for blowing air to the second sub-bonding medium along the surface of the first filling layer so as to enable the second sub-bonding medium to cover the surface of the first filling layer, and curing the second sub-bonding medium to obtain a second filling layer.
10. A colloidal bonding apparatus as defined in claim 7, further comprising:
the second filling and curing module is used for filling a third sub-bonding medium into the groove of the part, to be subjected to glue dispensing, of the middle frame and curing the third sub-bonding medium to obtain a first sub-shell;
the first weighing module is used for weighing the first sub-shell;
the third filling and curing module is used for filling a fourth sub-bonding medium on the surface of the cured third sub-bonding medium when the weight of the first sub-shell is smaller than the preset weight, and curing to obtain a second sub-shell;
and the second weighing module is used for weighing the second sub-shell, and when the weight of the second sub-shell is within a preset weight range, the second sub-shell is used as the first shell.
11. The adhesive bonding apparatus of claim 7, wherein the attachment module comprises:
the surface treatment module is used for carrying out surface treatment on the first surface of the display screen so as to improve the adhesive force of an adhesive medium of the first surface;
a first determining module for determining a first center of the display screen and a second center of the first housing, the first center and the second center being aligned to fixedly connect the display screen and the first housing;
or the second determining module is used for determining a first corner and a second corner which are arranged oppositely to the display screen, determining a third corner and a fourth corner which are arranged oppositely to the first shell, aligning the first corner and the third corner, and aligning the second corner and the fourth corner to fixedly connect the display screen and the first shell.
12. A colloidal bonding apparatus as defined in claim 7, further comprising:
the standing and curing module is used for placing the first shell and the display screen which are attached together in a pressure maintaining jig for standing for a preset time so as to cure the bonding medium;
and the test module is used for taking out the first shell and a display screen assembly formed by the display screen and testing the appearance and the display function of the display screen assembly.
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| CN110012138B (en) * | 2019-04-11 | 2021-03-12 | Oppo（重庆）智能科技有限公司 | Middle frame and manufacturing method thereof, curved screen mobile terminal and display screen bonding process thereof |
| CN112388306B (en) * | 2020-11-11 | 2022-06-28 | 山西新华防化装备研究院有限公司 | Flexible lens gas mask lens and mask body assembly production line |
| CN114648914A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Display screen processing method and device, laminating system and storage medium |
| CN114645890A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Middle frame and display screen attaching method and device, attaching system and storage medium |
| CN114871974B (en) * | 2021-02-05 | 2024-05-28 | 深圳富泰宏精密工业有限公司 | Fixing device and display panel assembling method |
| CN113242649B (en) * | 2021-05-20 | 2022-05-13 | 上海望友信息科技有限公司 | Jet printing data generation method and system, electronic equipment and storage medium |
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| CN109291446A (en) | 2019-02-01 |
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