CN110699023A - High-temperature conductive adhesive and application thereof - Google Patents
High-temperature conductive adhesive and application thereof Download PDFInfo
- Publication number
- CN110699023A CN110699023A CN201911031917.7A CN201911031917A CN110699023A CN 110699023 A CN110699023 A CN 110699023A CN 201911031917 A CN201911031917 A CN 201911031917A CN 110699023 A CN110699023 A CN 110699023A
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- CN
- China
- Prior art keywords
- conductive adhesive
- temperature
- conductive
- silicon carbide
- phenolic resin
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
The invention provides a high-temperature conductive adhesive and application thereof, wherein silicon carbide, phenolic resin and graphite conductive adhesive are used as raw materials, and the weight ratio of the raw materials is (0.5-1): (0.5-0.7): (0.3-1), uniformly mixing and grinding into paste to obtain the conductive adhesive. The invention provides a conductive adhesive with the use temperature of 1000 ℃ or above, and the conductive adhesive is prepared by using a high-temperature ceramic phase, so that the method is simple, the process has no environmental pollution, and the conductive adhesive is suitable for industrial scale. The conductive adhesive obtained by the method can be applied to a higher temperature environment, and the defects of the existing conductive adhesive varieties are overcome.
Description
Technical Field
The invention relates to the technical field of preparation of novel conductive adhesives, in particular to a high-temperature conductive adhesive and application thereof.
Background
The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain special requirements on the conductivity and the adhesive bonding strength. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like. The existing conductive adhesive can be divided into silver conductive adhesive, gold conductive adhesive, copper conductive adhesive, carbon conductive adhesive and the like according to the types of conductive particles in the conductive adhesive, and the silver conductive adhesive is most widely applied.
The conductive adhesive can be classified into room temperature cured conductive adhesive, medium temperature cured conductive adhesive, high temperature cured conductive adhesive, ultraviolet cured conductive adhesive, etc. according to the curing system. The metal particles are easy to oxidize when the high-temperature conductive adhesive is cured at high temperature, and the requirement on curing time needs to be short so as to meet the requirement on the conductive adhesive. At present, the middle-temperature curing conductive adhesive (lower than 150 ℃) is mostly applied at home and abroad.
However, in the preparation of new materials such as conductive ceramics, the method of flash and the like is usually adopted to rapidly obtain solid blocks, and conductive adhesive with the use temperature of 1000 ℃ or above is required.
Disclosure of Invention
The invention provides a high-temperature conductive adhesive and application thereof, overcomes the defects that the existing conductive adhesive has low use temperature and cannot meet the preparation of the existing material, and the obtained conductive adhesive can reach more than 1000 ℃ in experimental research by configuring a high-temperature ceramic phase.
The technical scheme for realizing the invention is as follows:
a high-temperature conductive adhesive is prepared by taking silicon carbide, phenolic resin and graphite conductive adhesive as raw materials, uniformly mixing and grinding into paste to obtain the conductive adhesive.
The weight ratio of the silicon carbide to the phenolic resin to the graphite conductive adhesive is (0.5-1): (0.5-0.7): (0.3-1).
The conductive adhesive is used at a temperature of more than 1000 ℃.
The conductive paste directly coats and adheres to the conductive features.
The conductive adhesive is used in an air atmosphere.
The conductive adhesive is diluted by using an ethanol, methanol or acetone solvent.
The invention has the beneficial effects that: the invention provides a conductive adhesive with the use temperature of 1000 ℃ or above, and the conductive adhesive is prepared by using a high-temperature ceramic phase, so that the method is simple, the process has no environmental pollution, and the conductive adhesive is suitable for industrial scale. The conductive adhesive obtained by the method can be applied to a higher temperature environment, and the defects of the existing conductive adhesive varieties are overcome.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Example 1
The specific method for preparing the high-temperature conductive adhesive by using the high-temperature ceramic phase comprises the following steps:
(1) silicon carbide, phenolic resin and graphite conductive adhesive are mixed according to the proportion of 0.5: 0.5: 0.3, mixing evenly, and grinding into paste in a mortar;
(2) the conductive adhesive can be used at the temperature of over 1000 ℃ and can also be used in the air atmosphere;
(3) when in use, the conductive adhesive is coated and adhered with the conductive part;
(4) the dilution may be performed using ethanol, methanol, acetone, or the like.
Example 2
The specific method for preparing the high-temperature conductive adhesive by using the high-temperature ceramic phase comprises the following steps:
silicon carbide, phenolic resin and graphite conductive adhesive are mixed according to the proportion of 0.8: 0.6: 0.6, mixing evenly, and grinding into paste in a mortar.
Example 3
The specific method for preparing the high-temperature conductive adhesive by using the high-temperature ceramic phase comprises the following steps:
silicon carbide, phenolic resin and graphite conductive adhesive are mixed according to the proportion of 1: 0.7: 1, mixing uniformly, and grinding into paste in a mortar.
Application example 1
After LiLaZrO powder is molded, preparing high-temperature conductive adhesive according to 3g of silicon carbide, 2g of phenolic resin and 3g of graphite conductive adhesive, coating the conductive adhesive on a sample, and performing flash sintering at the sintering temperature of 500 ℃.
Application example 2
Mixing MoSi2C, Si, preparing high-temperature conductive adhesive according to 2.8g of silicon carbide, 2g of phenolic resin and 2.8g of graphite conductive adhesive after powder molding, and then coating the conductive adhesive on a sample for carrying outAnd (3) flash sintering, wherein the sintering temperature is 890 ℃.
Application example 3
Mixing MoSi2、B4C. Si is uniformly mixed, after powder is formed, high-temperature conductive adhesive is prepared according to 2.9g of silicon carbide, 2g of phenolic resin and 2.9g of graphite conductive adhesive, then the conductive adhesive is coated on a sample, and flash sintering is carried out, wherein the sintering temperature is 1050 ℃.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A high-temperature conductive adhesive is characterized in that: silicon carbide, phenolic resin and graphite conductive adhesive are used as raw materials, and the raw materials are uniformly mixed and ground into paste, so that the conductive adhesive is obtained.
2. The high-temperature conductive adhesive according to claim 1, wherein: the weight ratio of the silicon carbide to the phenolic resin to the graphite conductive adhesive is (0.5-1): (0.5-0.7): (0.3-1).
3. The use of a high temperature conductive paste as claimed in claim 1 or 2, wherein: the conductive adhesive is used at a temperature of more than 1000 ℃.
4. The use of a high temperature conductive adhesive as claimed in claim 3, wherein: the conductive paste directly coats and adheres to the conductive features.
5. The use of a high temperature conductive adhesive as claimed in claim 3, wherein: the conductive adhesive is used in an air atmosphere.
6. The use of a high temperature conductive adhesive as claimed in claim 3, wherein: the conductive adhesive is diluted by using an ethanol, methanol or acetone solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911031917.7A CN110699023A (en) | 2019-10-28 | 2019-10-28 | High-temperature conductive adhesive and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911031917.7A CN110699023A (en) | 2019-10-28 | 2019-10-28 | High-temperature conductive adhesive and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110699023A true CN110699023A (en) | 2020-01-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911031917.7A Pending CN110699023A (en) | 2019-10-28 | 2019-10-28 | High-temperature conductive adhesive and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110699023A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002022740A1 (en) * | 2000-09-13 | 2002-03-21 | Kaneka Corporation | Polyimide resin composition and, polyimide product formed into film and intermediate transfer belt comprising the same |
| CN104342079A (en) * | 2013-08-01 | 2015-02-11 | 甘肃郝氏炭纤维有限公司 | Preparation method and application method of high-temperature bonding agent used for bonding carbon felts |
-
2019
- 2019-10-28 CN CN201911031917.7A patent/CN110699023A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002022740A1 (en) * | 2000-09-13 | 2002-03-21 | Kaneka Corporation | Polyimide resin composition and, polyimide product formed into film and intermediate transfer belt comprising the same |
| CN104342079A (en) * | 2013-08-01 | 2015-02-11 | 甘肃郝氏炭纤维有限公司 | Preparation method and application method of high-temperature bonding agent used for bonding carbon felts |
Non-Patent Citations (2)
| Title |
|---|
| 雷阎盈: "SC型特种高温导电胶粘剂研制", 《陕西化工》 * |
| 雷阎盈: "SC-型特种高温导电胶粘剂研究", 《西北大学学报(自然科学版)》 * |
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