CN110696241A

CN110696241A - Mold cleaning device and method, resin molding device, and method for manufacturing resin molded product

Info

Publication number: CN110696241A
Application number: CN201910530574.2A
Authority: CN
Inventors: 冈本纯
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2018-07-10
Filing date: 2019-06-19
Publication date: 2020-01-17
Anticipated expiration: 2039-06-19
Also published as: KR102167896B1; TWI704045B; JP2020006600A; KR20200006480A; TW202005775A; CN110696241B

Abstract

The invention provides a cleaning device and a method for a forming die, a resin forming device and a manufacturing method for a resin forming product, which can inhibit the influence caused by heat even when the forming die is heated to a temperature capable of performing resin forming. The mold cleaning device is a device for removing an attached matter attached to a surface of at least one of an upper mold and a lower mold facing the upper mold, the upper mold forming a mold, and the device includes: a laser light source arranged outside the space between the upper die and the lower die and emitting a laser beam; a laser beam reflection mechanism having a mirror and an XY stage for moving the mirror between a first position in the space and a second position outside the space, the direction of the mirror being set so that the laser beam reflected by the mirror is irradiated onto the surface of the upper mold or the lower mold when the mirror is at the first position; and a laser beam moving section provided outside the space and moving the laser beam relative to the mirror when the laser beam is located at the first position.

Description

Mold cleaning device and method, resin molding device, and method for manufacturing resin molded product

Technical Field

The present invention relates to a mold cleaning device and method, a resin molding device, and a method for manufacturing a resin molded product.

Background

When resin molding is performed using a mold in a resin molding apparatus, the resin slightly adheres to the surface of the mold and remains even after the molded product is removed, and the amount of adhering matter gradually increases while resin molding is repeatedly performed using the same mold. When resin molding is performed in a state where such deposits have adhered to the surface of the molding die, there is a possibility that the shape of the deposits is transferred to the resin molded product.

Therefore, the production of the resin molded product is periodically temporarily stopped, and the mold is cleaned to remove the deposit on the mold. Patent document 1 describes an apparatus including: a laser light source is disposed in a space between an upper mold and a lower mold constituting a molding die, and a laser beam is irradiated to the lower mold (upper mold) while moving the laser light source along an upper surface of the lower mold (or a lower surface of the upper mold), thereby peeling off an adhering substance from the lower mold (upper mold).

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2008-149705

Disclosure of Invention

[ problems to be solved by the invention ]

In resin molding, the molding die must be heated to, for example, about 180 ℃ to melt the resin. In the apparatus described in patent document 1, when the cleaning is performed in a state where the temperature of the molding die is raised, the laser light source or the moving device for moving the laser light source is disposed in the vicinity of the molding die (for example, in the middle between the upper die and the lower die) and used, and therefore, there is a possibility that a problem such as deterioration in accuracy of the irradiation position of the laser light or the like occurs due to heat of a space in which the laser light source or the moving device is disposed, or heat such as radiation heat from the molding die. In order to avoid such a problem, when the molding die is cooled once and then cleaned, there is a possibility that: a waiting time including a time until the mold is again raised to a stable temperature for resin molding after cleaning occurs, and a takt time (takt time) in the resin molding step is prolonged, thereby reducing the production efficiency of the resin molded product.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a mold cleaning device and method, a resin molding device, and a method for manufacturing a resin molded product, which can suppress the influence of heat even when a mold is heated to a temperature at which resin molding can be performed.

[ means for solving problems ]

The forming die cleaning device of the present invention is a device for removing an attached matter attached to a surface of at least one of a first die and a second die facing the first die, the first die forming a forming die, the device including:

a) a laser light source disposed outside a space between the first and second modes and emitting the laser beam;

b) a laser beam reflection mechanism having a mirror and a mirror moving mechanism, the mirror moving mechanism moving the mirror between a first position in the space and a second position outside the space, the laser beam reflection mechanism setting a direction of the mirror in such a manner that the laser beam reflected by the mirror is irradiated onto a surface of the first mold or the second mold when the mirror is located at the first position; and

c) and a laser beam moving mechanism which is arranged outside the space and moves the laser beam relative to the reflecting mirror when the laser beam is positioned at the first position.

The cleaning method of the forming die of the present invention is a method for removing an attached matter attached to a surface of at least one of a first die and a second die facing the first die, the first die constituting the forming die, the method comprising:

disposing a mirror in a space between the first mode and the second mode,

a laser beam is emitted from a laser light source disposed outside the space, and the laser beam is irradiated onto the reflecting mirror while being moved relative to the reflecting mirror by a laser beam moving mechanism disposed outside the space, and

irradiating the laser beam reflected by the mirror onto the first mode or the second mode.

The resin molding apparatus of the present invention includes: the forming die and the forming die cleaning device.

The method for producing a resin molded article of the present invention comprises: after the molding die cleaning method is performed, a resin molded article is produced using the molding die.

[ Effect of the invention ]

According to the present invention, even when the molding die is heated to a temperature at which resin molding can be performed, the molding die can be used while suppressing the influence of heat.

Drawings

Fig. 1(a), 1(b), 1(c), 1(d) and 1(e) are electron micrographs of the surface of a mold that has not been resin-molded after cleaning and a mold that has been resin-molded 200 times, 400 times, 600 times and 800 times after cleaning, respectively.

Fig. 2 is a schematic configuration diagram showing an embodiment of a mold cleaning device and a resin molding device having the same according to the present invention.

Fig. 3 is an enlarged view of the forming die and its vicinity in the resin molding apparatus of the present embodiment.

Fig. 4(a) and 4(b) are a plan view and a side view, respectively, showing a case where the laser beam is moved by the laser beam moving unit.

Fig. 5 is a perspective and partial sectional view of a reflector and its attachment in the molding die cleaning apparatus according to the present embodiment.

Fig. 6(a) is a partially enlarged cross-sectional view of the attachment of the mirror, showing the vicinity of the one rotational shaft body, fig. 6(b) is a view showing the vicinity of the other rotational shaft body, and fig. 6(c) is a view showing a state in which the other rotational shaft body has moved to the opposite side of the mirror as compared with the case of fig. 6 (b).

Fig. 7(a) is a view showing a state in which a pair of holding tools for holding the mirror are connected by a shaft, and fig. 7(b) is a view showing a state in which one of the holding tools has moved to the opposite side of the mirror as compared with the case of fig. 7 (a).

Fig. 8(a) and 8(b) are schematic views showing a state in which the molding die cleaning device of the present embodiment is located at a use position and a standby position, respectively.

Fig. 9 is a view showing a structure in which a laser light source and a laser beam moving section are connected to a mirror by a connecting rod extending in the Y direction.

Fig. 10 is a diagram showing an example in which a mirror having a width in the X direction larger than the irradiation range of the laser beam in the X direction is used.

Fig. 11(a) is an operation at the time of resin molding in the resin molding apparatus of the present embodiment, and is a diagram showing a state in which the lead frame is placed on the lower mold and the resin material is supplied into the barrel of the lower mold, and fig. 11(b) is a diagram showing a state in which the molding dies are closed and the resin material is supplied into the cavity.

Fig. 12 is a diagram showing a case where the spot of the pulse laser beam moves in a zigzag manner.

Fig. 13 is a diagram showing a trajectory (thin solid line) of the laser beam on the surface of the lower die or the upper die and a boundary (thick broken line) of a region to which the laser beam is irradiated by the primary zigzag movement of the laser beam.

Fig. 14(a) is a schematic view showing a state in which a pulsed laser beam is irradiated to the molding die to generate plasma in the vicinity of the surface of the molding die, and fig. 14(b) is a schematic view showing a state in which the pulsed laser beam is repeatedly irradiated to the plasma to heat the plasma and vaporize the deposits.

Fig. 15(a) and 15(b) are a plan view and a vertical cross-sectional view, respectively, showing an example of using a shielding portion.

Fig. 16(a) is a diagram showing an example in which one-way movement is repeated in an irradiation region as another example of trajectory of a laser beam on the surface of a lower die or an upper die, and fig. 16(b) is a diagram showing an example in which the trajectory moves in a zigzag manner over the entire surface of the lower die or the upper die.

Fig. 17 is a schematic diagram showing an example of an X-direction moving mechanism for moving the mirror in the X direction.

FIG. 18 is a plan view showing another embodiment of the forming die cleaning apparatus of the present invention.

FIG. 19(a-1) and FIG. 19(a-2) are views showing still another embodiment of the mold cleaning device of the present invention, and are a plan view and a side view showing a state in which a first reflecting mirror is used, and FIG. 19(b) is a plan view showing a state in which a second reflecting mirror is used.

Fig. 20 is a schematic configuration diagram showing an example of a resin molding unit including a plurality of molding units and the like.

Fig. 21 is a schematic configuration diagram showing a state in which the molding die cleaning device has been carried into one molding unit in the resin molding unit.

Fig. 22 is a schematic configuration diagram showing another example of a resin molding unit including a plurality of modules.

Fig. 23(a) and 23(b) show the case where the spot of a laser beam having a circular cross section and the spot thereof are moved, and fig. 23(c) and 23(d) show the case where the spot of a laser beam having an annular cross section and the spot thereof are moved, respectively.

[ description of symbols ]

1: resin molding apparatus

10. 10A, 10B: forming die cleaning device

11: laser light source

112: base seat

12: laser beam moving part

121: galvanometer scanning head

122: lens and lens assembly

13. 13W: reflecting mirror

13A, 13X: first reflector

13B, 13Y: second reflecting mirror

131L: first holding tool

131R: second holding tool

132L: first rotating shaft

132R: second rotating shaft body

1321L, 1321R: trough

133L: bearing assembly

133R: tool for holding rotation shaft body movably

134L: bearing holding part

134R: outside holding tool

135L: first fixing tool

135R: second fixing tool

136: motor with a stator having a stator core

137L: bearing fixing tool

138: shaft

139: sliding bearing

14: XY stage

141: connecting rod

142: guide bar

15: XY stage driver

16. 16A: mirror switching part

161: light path switching mirror

162: optical path switching mirror moving unit

17: shielding part

18: x-direction moving mechanism

181: x-direction guide rail

182: x-direction conveyor belt

183: conveyor belt mounting member

184: x-direction motor

185: x-direction pulley

186: motor block

187: pulley block

188: y-direction guide rail

20: resin molding part

211: base seat

212: tie bar

213: crank connecting rod

221: movable bedplate

222: fixed bedplate

25: forming die

251: upper die

2511: eliminating block

2513. 2523: flow passage

252: lower die

2521: charging barrel

2522: plunger piston

253: heating plate

2531: heating device

30. 30A: resin molding unit

31: material receiving assembly

311: lead frame receiving part

312: resin sheet supply unit

32: forming assembly

33: discharge assembly

331: resin molded product holding part

34: forming die cleaning device standby assembly

34A: mold cleaning device storage/transfer unit

35: conveying device

35A: moving part of forming die cleaning device

A: attachment article

AG: gasified deposit

B: pulsed laser beam

BS: spot of a pulsed laser beam

C: die cavity

CT: coating layer

L: lead frame

P: resin material

PL: plasma body

X, Y, Z: direction of rotation

Detailed Description

In the molding die cleaning apparatus of the present invention, when the molding die is subjected to a treatment by irradiation with a laser beam after the resin molding is temporarily stopped (cleaning is performed in the molding die cleaning apparatus), the mirror is moved to a first position in a space between the first die and the second die by the mirror moving mechanism, and then the mirror is irradiated with a laser beam by a laser light source provided outside the space. Thereby, the laser beam is reflected by the mirror and irradiated onto the surface of the first mode or the second mode. Here, the laser beam is moved relative to the mirror by a laser beam moving mechanism provided outside the space, whereby a spot of the laser beam irradiated onto the surface of the first mode or the second mode is moved on the surface. Thereby, the laser beam is irradiated to a fixed range of the surface of the first or second mode. In this way, the first mold or the second mold is subjected to a treatment such as removal (cleaning) of the deposit adhering to the surface of these molds. After the processing of the molding die is completed, the mirror is moved to a second position outside the space, and then the resin molding is started again.

According to the molding die cleaning apparatus of the present invention, even in a state where the temperature of the first die or the second die is raised, since the laser light source and the laser beam moving mechanism are provided outside the space, the influence of heat in the space or heat radiated from the first die or the second die on the laser light source and the laser beam moving mechanism can be suppressed. On the other hand, the reflecting mirror is arranged in the space, but is less susceptible to the influence of heat than the laser light source and the laser beam moving mechanism. For these reasons, the molding die cleaning apparatus of the present invention can be used while suppressing the influence of heat even when the molding die is heated to a temperature at which resin molding can be performed.

In the molding die cleaning apparatus of the present invention, the laser beam moving mechanism is preferably a galvanometer scanning head (galvanoscan head). The galvanometer scanning head is a device that moves a laser beam in one direction or two different directions by using one mirror that rotates by a rotating shaft or by using two mirrors having different inclinations of the rotating shaft in combination. This allows the spot of the laser beam irradiated on the surface of the first or second mode to be moved in one or two dimensions. The galvanometer scanning head can move the light spot of the laser beam at high speed, so that the processing time can be shortened. Further, since it is not necessary to move the galvanometer scanning head itself with respect to the molding die when moving the spot of the laser beam, the installation space can be made small.

The mold cleaning apparatus of the present invention may further comprise a reflection direction changing mechanism for changing the direction of the reflector. Alternatively, the molding die cleaning apparatus of the present invention may be configured as follows: the reflecting mirror includes a first reflecting mirror and a second reflecting mirror which are different in direction from each other, and the laser beam reflecting mechanism further includes a mirror switching mechanism which switches the reflecting mirror to which the laser beam is irradiated. In either case, the angle at which the laser beam is incident into the first or second mode can be varied. For example, when the laser beam is irradiated in a certain direction into the first mold, in the case where the wall surface of the first mold constituting the cavity is parallel to the laser beam, the wall surface can be easily irradiated with the laser beam by changing the incident angle.

The forming die cleaning apparatus of the present invention may have a structure further including: a pair of first and second rotating shaft bodies connected to both side portions of the reflecting mirror; and a rotating shaft body holding tool that holds at least one of the first rotating shaft body and the second rotating shaft body movably in an axial direction. Thus, even if the mirror thermally expands during the processing of the molding die due to heat generated during the resin molding or contracts due to a temperature drop when the mirror is moved to the second position, the rotational shaft body held by the rotational shaft body holding means moves in the axial direction, and the mirror is allowed to expand or contract in the axial direction, so that the deformation of the mirror can be suppressed. In addition, both the first and second rotational shaft bodies may be held by the rotational shaft body holding tool so as to be movable in the axial direction, or the other of the first and second rotational shaft bodies (which is allowed to rotate around the rotational shaft) may be fixed in the axial direction.

In the mold cleaning device according to the present invention, it is preferable that the laser light source and the laser beam moving mechanism irradiate the mold with a laser beam at an irradiation intensity which is a temperature at which plasma is generated on the deposit and at which the plasma is heated to a temperature equal to or higher than a temperature at which the deposit is vaporized, and which is lower than an irradiation intensity at which the coating is damaged.

Thereby, at least a part of the deposit is heated to a temperature higher than the temperature at which the deposit vaporizes, and is removed from the surface of the molding die. On the other hand, a coating layer containing chromium or the like is often applied to the surface of the mold (in the present invention, the material of the coating layer of the mold is not particularly limited), and it is necessary to suppress damage of the coating layer when removing the adhering matter. In order to obtain knowledge about damage to the coating layer of the molding die by the laser beam, the present inventors examined the formation process of the deposit by observing the surface of the molding die, and found that the deposit initially adheres in a spot shape and thereafter gradually approaches a shape of a pellicle film covering substantially the entire surface of the cavity surface of the molding die (in the electron micrographs of fig. 1(a), 1(b), 1(c), 1(d), and 1(e), the deposit is indicated by the symbol a). Therefore, when the laser beam is irradiated at a stage where the deposit is in a spot shape, there is a gap between the deposit (a portion where the deposit is not deposited) in a spot shape or in a spot shape whose area is not sufficiently enlarged, and therefore the laser beam is directly irradiated onto the coating layer, and there is a possibility that the coating layer is damaged. Therefore, by irradiating the laser beam onto the forming die at a lower irradiation intensity than the irradiation intensity at which the coating layer is damaged, damage to the coating layer can be suppressed.

Here, the irradiation intensity of the laser beam irradiated onto the molding die may be adjusted to 2W/cm, for example, per second of scanning laser power density by adjusting the intensity of the laser beam emitted from the laser light source and the moving speed of the laser beam by the laser beam moving mechanism²～15W/cm²The manner of (c). The "scanning laser power density per second" is obtained by irradiating the surface of the substrate with a laser beam in a unit time (unit: sec (sec)) to a unit area (unit: cm)²) Energy of laser light (unit: j (joules) ═ Wsec (watts) and is defined by J/(cm) } in units of²sec)＝Wsec/(cm²sec), i.e. W/cm²To indicate. The scanning laser power density per second can be determined as follows: the average output power of the laser beam to be irradiated is divided by the sum of the area derived from the distance by which the spot of the laser beam is relatively moved with respect to the molding die within one second and the width of the spot and the area of a single spot (a portion irradiated to the initial position before the movement) (in other words, the scanning laser power density per second is the output power per unit area in a portion irradiated with the laser beam while moving within one second).

The scanning laser power density per second was set to 2W/cm²～15W/cm²In the case of (1), it is desirable that the laser light source emits a laser fluence (laser fluence) of 0.04J/cm per pulse²～0.7J/cm²The pulsed laser beam of (1). The scanning laser power density per second was set to 2W/cm²～15W/cm²In the case of (2), it is preferable that the overlap ratio (described later) of the adjacent pulse laser beams is 85% or more. By adopting either or both of the above-described structures, plasma can be generated on the deposit deposited on the surface of the molding die, and the plasma can be heated to a temperature equal to or higher than the temperature at which various kinds of deposits are vaporized.

Here, the "overlap ratio" is defined by a ratio of a volume of a portion overlapping with a pulse laser beam generated adjacently, among volumes occupied by one pulse laser beam in a space where plasma is generated. If two adjacent pulsed laser beams are parallel, the overlap ratio can be determined from the ratio of the area of a portion overlapping with the cross section perpendicular to the cross section of one pulsed laser beam generated adjacent to the cross section perpendicular to the cross section of one pulsed laser beam at an arbitrary position in the space where the plasma is generated. The inverse of the overlap ratio corresponds to the number of times of irradiation of the pulse laser beam onto the same portion. In addition, if the pulse laser beam is not moved, the overlapping ratio becomes 100%, but in the present invention, the pulse laser beam is moved, and therefore the overlapping ratio is less than 100%.

In the molding die cleaning apparatus of the present invention, it is preferable that the laser beam moving mechanism is a mechanism including: moving the laser beam back and forth in a first direction with respect to the forming mold, and moving the laser beam in a second direction perpendicular to the first direction only a single range of a spot of the laser beam irradiated onto the forming mold every time the laser beam is moved in a single pass in the first direction; and a shielding section for shielding a portion of a single range of the light spot at both ends of the reciprocating movement in the first direction between the laser beam moving mechanism and the molding die. In this way, when the laser beam moves in the second direction at the both ends, the shielding portion shields the laser beam that is excessively irradiated than the positions other than the both ends, and therefore the surface of the molding die can be cleaned with higher uniformity.

The molding die cleaning apparatus of the present invention has been described so far, but the same operation and effects are obtained in the molding die cleaning method, the resin molding apparatus, and the method for producing a resin molded product.

Hereinafter, more specific embodiments of the mold cleaning device and method, the resin molding device, and the method for producing a resin molded article according to the present invention will be described with reference to fig. 2 to 23 (d).

(1) The molding die cleaning apparatus and the structure of the resin molding apparatus of the present embodiment

As shown in fig. 2, the molding die cleaning device 10 of the present embodiment is a part of the components of the resin molding device 1 of the present embodiment. The resin molding apparatus 1 includes both the mold cleaning apparatus 10 and the resin molding section 20.

First, the structure of the resin molding portion 20 will be described. In the present embodiment, the resin molding section 20 is a device for performing transfer (transfer) molding, and includes: a base 211; four (only two are shown in fig. 2) tie bars 212 standing on the base 211; a movable platen 221 which is held on the tie bar 212 so as to be movable up and down; a fixed platen 222 fixed to the upper end of the tie bar 212; and a crank link (toggle link)213 provided on the base 211 to move the movable platen 221 up and down. Between the upper surface of the movable platen 221 and the lower surface of the fixed platen 222, a molding die 25 is disposed in which an upper die (first die) 251 and a lower die (second die) 252 are opposed to each other.

Fig. 3 shows the molding die 25 and its vicinity in an enlarged manner. Two cavities C are formed in parallel upward on the lower surface of the upper die 251, and two cavities C are formed in parallel downward also on the upper surface of the lower die 252. A chromium nitride coating CT is applied to the lower surface of the upper die 251, the upper surface of the lower die 252, and the surfaces of the upper die 251 and the lower die 252 surrounding the respective cavities C. In the coating CT, other materials such as hard chrome may be used instead of chrome nitride. In the present embodiment, the cavity is formed in a rectangular parallelepiped shape, but may be formed in a cylindrical shape or the like according to the shape of the resin molded product to be produced.

The lead frames L can be placed on the upper surfaces of the lower dies 252 positioned around the two cavities C of the lower die 252. Instead of the lead frame L, a substrate or the like may be placed on the upper surface of the lower mold 252.

Between two cavities C of lower mold 252, a cylinder 2521 for housing a resin material and a plunger 2522 for extruding the resin material from cylinder 2521 are provided. Further, the two cavities C of the lower die 252 are connected to the cylinder 2521 through runners (runners) 2523 serving as passages through which the resin material softened or melted as described later passes. A reject block 2511 is provided between the two cavities C of the upper die 251 at a position facing the barrel 2521. The two cavities C of the upper die 251 are connected to spaces directly below the reject blocks 2511 through runners 2513, respectively.

The resin molding portion 20 includes a heating plate 253 that heats the upper mold 251 and the lower mold 252 to maintain the lead frame L and the resin material at a predetermined temperature during resin molding. The heater plate 253 incorporates a heater 2531. The heater 2531 may be, for example, a cartridge heater.

The molding die cleaning device 10 includes a laser light source 11, a laser beam moving unit (laser beam moving mechanism) 12, a reflecting mirror 13, an XY stage 14, and an XY stage driver 15.

The laser light source 11 is a light source that emits pulsed laser light. In the present embodiment, the pulse laser light emitted from the laser light source 11 has a laser energy density of 0.04J/cm for each pulse for the reason described later²～0.7J/cm²In the range of (1), the scanning laser power density per second is set to 2W/cm²～15W/cm²The pulse width is set to be in the range of 1nsec to 200nsec, and the pulse repetition frequency is set to be in the range of 300kHz to 10 MHz. In the present embodiment, the following are used as the laser light source 11: the shape of the beam in a cross section perpendicular to the beam (beam spot) is square, and the emission has substantially the same shape from the center to the end of the cross sectionTop hat (top hat) type pulse laser beam of irradiation intensity distribution. The shape of the beam spot may be other than a square, such as a rectangle, a circle, or a circle. Here, the range (size) of the beam spot is set to 1/e²Method (86% method). The spot size can be measured by a camera beam quality analyzer (beam profiler) manufactured by the Oiffel (Ophir) company, or Coherent (Coherent) company. Further, the average output power of the laser beam can be obtained using a power meter manufactured by orfel corporation or coherence corporation, and the scanning laser power density per second can be obtained from the spot size and the average output power of the laser beam. The laser fluence of each pulse is the value obtained by dividing the average output power of the laser beam by the pulse repetition frequency. The pulse width can be measured using an oscilloscope manufactured by Agilent Technologies. In addition, the average output power of the laser beam can be determined by "the average output power of the laser beam [ W]Pulse energy [ J ═]X pulse repetition frequency [ Hz]"is obtained by the following equation.

The laser beam moving unit 12 includes a galvanometer scanning head 121 and a lens 122 (see fig. 4a and 4 b). The galvanometer scanning head 121 emits the pulse laser beam B introduced from the laser light source 11 so as to repeatedly move back and forth in the X direction (the direction perpendicular to the paper surface in fig. 2) (fig. 4 a) and also move in the Z direction (the vertical direction in fig. 2) (fig. 4B). In the present embodiment, the moving speed of the pulse laser beam by the laser beam moving unit 12 is set so that the overlapping ratio becomes 85% or more. At the time of the movement, there is a possibility that the spot size changes between the vicinity of the center position and the vicinity of the end portion depending on the size of the movement range of the pulse laser beam B, and if so, the irradiation intensity changes depending on the position. Therefore, it is desirable to suppress the variation in the spot size caused by the position by using a telecentric lens (telecentric lens) or a lens having a sufficiently long irradiation depth as the lens 122. In the example shown in fig. 4(a) and 4(b), the lens 122 is disposed at the rear stage of the galvanometer scanning head 121, but an electric variable beam diameter lens (not shown) having a plurality of lenses may be disposed at the front stage of the galvanometer scanning head 121, or the lens 122 and the electric variable beam diameter lens may be used in combination. In the case of using an electric variable beam diameter lens, the spot size on the surface of the molding die 25 can be made substantially constant by changing the beam diameter in accordance with the repeated reciprocating movement.

The reflecting mirror 13 is a mirror that reflects the pulse laser beam B, and has a width in the X direction larger than a range in which the laser beam moving section 12 reciprocates the pulse laser beam B. For example, a mirror containing synthetic quartz glass (fused silica) may be used for the mirror 13. In addition, a coating layer including a metal film may be applied to the surface of the mirror 13. The coating layer may be selected from a gold coating layer, a silver coating layer, an aluminum coating layer, a dielectric multilayer film, and the like.

As shown in fig. 5, one end of the reflecting mirror 13 in the X direction is held by a first holding tool 131L, and the other end is held by a second holding tool 131R. The first holding tool 131L and the second holding tool 131R are provided with a first rotating shaft body 132L and a second rotating shaft body 132R, respectively, which extend in the X direction. The first rotation shaft body 132L is inserted through the bearing 133L. The second pivot shaft body 132R is inserted into the pivot shaft body movable holding tool 133R. The pivot shaft body movable holding tool 133R may be a bearing. In fig. 5, in a perspective view, cross sections in the Z direction passing through the first and second

rotation shaft bodies

132L and 132R are shown in combination, and the rear side of the mirror 13 in the Y direction is shown by a solid line and the near side is shown by a broken line (that is, the mirror 13 is also present in a portion of the broken line).

As shown in fig. 6a in an enlarged manner, a groove 1321L is provided on the surface of the first rotation shaft body 132L on the outer side in the rotation shaft direction (the opposite side to the mirror 13 in the X direction) of the bearing 133L so as to rotate once around the rotation shaft. The first fixing tool 135L is inserted into the slot 1321L. The first fixing tool 135L may extend from the groove 1321L, and has an outer diameter smaller than the bearing 133L. The bearing 133L allows the first rotation shaft body 132L to rotate around the rotation shaft in the X direction in such a manner that the first rotation shaft body 132L is sandwiched in the axial direction by a step difference formed in such a manner that the diameters thereof are different from each other, and restricts the first rotation shaft body 132L via the bearing 133L so as to hardly move in a direction parallel to the rotation shaft. The bearing 133L is sandwiched and fixed by a bearing holding portion 134L and a bearing fixing tool 137L provided outside the bearing holding portion 134L as viewed from the mirror 13.

As shown in fig. 6(b) in an enlarged manner, a groove 1321R is provided on the surface of the second rotating shaft body 132R on the outer side in the rotating shaft direction than the rotating shaft body movable holding tool 133R. The second fixing tool 135R is inserted into the slot 1321R. The second fixing tool 135R need not be provided over the entire groove 1321R. The rotary-shaft-body movable holding tool 133R fixes the positional relationship with the second rotary shaft body 132R in the axial direction by the second rotary shaft body 132R being sandwiched in the axial direction by a step difference formed so as to have a different diameter from the second fixing tool 135R, and holds the second rotary shaft body 132R so as to allow the second rotary shaft body 132R to rotate around the rotary shaft in the X direction. The rotating-shaft-body movable holding tool 133R is held by the outer holding tool 134R, and is movable in the axial direction together with the second rotating shaft body 132R with respect to the outer holding tool 134R. Fig. 6(c) shows an example of a state in which the mirror 13 is expanded as compared with the case of fig. 6(b), and the second pivot shaft body 132R and the pivot shaft body movable holding jig 133R are moved toward the opposite side of the mirror 13 in association with this expansion. By moving the second pivot shaft body 132R and the pivot shaft body movable holding jig 133R as described above, the load applied to the mirror 13 can be suppressed, and the deformation of the mirror 13 can be suppressed. When the mirror 13 contracts, the second pivot shaft body 132R and the pivot shaft body movable holding jig 133R move in opposite directions, and thereby deformation of the mirror 13 can be suppressed. Further, a combination of the pivot-body movable holding tool 133R, the outer holding tool 134R, and the second fixing tool 135R may be regarded as the pivot-body movable holding tool.

Here, one of the pair of rotating shaft bodies (the first rotating shaft body 132L) is restricted so as to be hardly moved in the direction parallel to the rotating shaft by the first fixing tool 135L and the bearing 133L fixed by the bearing holding portion 134L and the bearing fixing tool 137L, but both of the rotating shaft bodies may be moved within a fixed range in the direction parallel to the rotating shaft by the rotating shaft body movable holding tool and the jig.

As shown in fig. 7 a, the first holding jig 131L and the second holding jig 131R are coupled to each other by two shafts 138 (not shown in fig. 5) on the back surface side of the mirror 13 (the back side of the mirror 13 shown in fig. 5). The shaft 138 is fixed to the first holding tool 131L, and is attached to the second holding tool 131R via a slide bearing (bushing) 139. The shaft 138 has a function of reducing a load such as torsion generated in the mirror 13 when the mirror 13 is rotated, and a function of aligning the rotation axis centers of the first rotation shaft body 132L and the second rotation shaft body 132R at the time of assembly. Fig. 7(b) shows an example of a state in which the mirror 13 is expanded as compared with the case of fig. 7(a), and the second holding jig 131R has moved to the opposite side of the mirror 13 in association with this expansion. By moving the second holding jig 131R as described above, the load applied to the mirror 13 can be suppressed, and the deformation of the mirror 13 can be suppressed. When the mirror 13 is contracted, the second holding jig 131R is moved in the opposite direction, whereby the deformation of the mirror 13 can be suppressed.

The mirror 13 is further connected to a motor (reflection direction changing mechanism) 136 (see fig. 2) for rotating the mirror 13 around a rotation axis via a power transmission mechanism (not shown) such as a gear, a pulley, a belt, or the like. The power transmission mechanism normally functions on at least one of the bearing holding portion 134L and the outer holding tool 134R. The power transmitted from the power transmission mechanism to one of the bearing holding portion 134L and the outer holding tool 134R is transmitted to the other via the mirror 13. At this time, the shaft 138 operates to reduce a load such as torsion applied to the mirror 13, and therefore, even when the thickness of the mirror 13 is not sufficiently thick, deformation can be suppressed. When the reflection surface of the mirror 13 is made to face downward and inclined by 45 ° with respect to the Y axis by the motor 136, the pulse laser beam B is perpendicularly irradiated onto the surface of the lower mold 252. In addition, when the reflection surface of the mirror 13 faces upward and is inclined by 45 ° with respect to the Y axis, the pulse laser beam B is irradiated perpendicularly onto the surface of the upper die 251. On the other hand, when the reflection surface of the mirror 13 is inclined downward or upward with respect to the Y axis at an angle other than 45 °, the pulse laser beam B is irradiated at an inclined angle with respect to the surface of the lower mold 252 or the upper mold 251.

The laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13 are mounted on an XY stage 14. The XY stage 14 moves the laser light source 11, the laser beam moving unit 12, and the mirror 13 in the X direction and the Y direction while maintaining the relative positional relationship of the three components by the control of the XY stage driver 15. During cleaning, the mirror 13 and the like are moved in the X direction and the Y direction by the XY stage 14 within a range slightly larger than the widths of the upper die 251 and the lower die 252 in the X direction and the Y direction, respectively. At the same time, the XY stage 14 also has a function of moving the position of the forming die cleaning device 10 in the Y direction as follows: the reflecting mirror 13 is disposed at a use position (fig. 8(a)) located in a space between the upper die 251 and the lower die 252 at the time of cleaning, and the entire mold cleaning device 10 including the reflecting mirror 13 is disposed at a standby position (fig. 8(b)) which is a position outside the space at the time of resin molding.

The XY stage 14 may be configured to move the laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13 in the X direction while maintaining the relative positional relationship between the laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13, and may be configured to couple the laser light source 11 and the laser beam moving unit 12 to the reflecting mirror 13 by a coupling rod 141 extending in the Y direction, as shown in fig. 9. Here, the laser light source 11 and the laser beam moving section 12 are placed on the base 112, and the connecting rod 141 is fixed to the base 112. On the mirror 13 side, a connection rod 141 is fixed to the bearing holding portion 134L and the outer holding jig 134R. The bearing holding portion 134L and the outer holding jig 134R are provided with holes (not shown) extending in the same direction as the first rotating shaft body 132L and the second rotating shaft body 132R, and the reflecting mirror 13 and the bearing holding portion 134L or the outer holding jig 134R as accessories thereof move in the Y direction along the guide rod 142 inserted through the holes. With this configuration, the laser light source 11 and the laser beam moving unit 12, which are separately arranged in the Y direction, and the mirror 13 can be moved in the X direction by only one power source (not shown). By reducing the number of power sources as described above, the influence of heat on the power source from the molding die is suppressed, and therefore the number of cooling mechanisms (not shown) for cooling the power source can be reduced.

When the widths of the upper die 251 and the lower die 252 in the X direction are smaller than the range of the reciprocating movement of the pulse laser beam B by the laser beam moving unit 12, a mechanism that moves only the three components in the Y direction may be used instead of the XY stage 14 and the XY stage driver 15. Alternatively, the mirror 13 may be moved only in the Y direction without maintaining the relative positional relationship between the laser light source 11 and the laser beam moving unit 12 and the mirror 13 in the Y direction. In addition, as shown in fig. 10, when the reflecting mirror 13W having a width in the X direction larger than the irradiation range of the laser beam in the X direction of the molding die 25 is used, it is only necessary to move the laser light source 11 and the laser beam moving section 12 in the Y direction, and it is not necessary to move the reflecting mirror 13W in the X direction.

The mold cleaning device 10 may have a vaporized deposit removing portion (not shown) for sucking gas into a space between the upper mold 251 and the lower mold 252 and discharging the gas to the outside of the resin molding apparatus 1, in addition to the above-described components. In this case, a vaporized deposit trapping filter (not shown) may be further provided in the vaporized deposit removing section.

(2) The mold cleaning device and the operation of the resin molding device of the present embodiment, and the mold cleaning method and the method for manufacturing a resin molded article of the present embodiment

Operations of the mold cleaning device 10 and the resin molding device 1 of the present embodiment, and the mold cleaning method and the resin molded product manufacturing method of the present embodiment will be described. First, the operation of the resin molding section 20 in the resin molding apparatus 1 during resin molding (except for the operation of cleaning the molding die) will be described, and next, the operation of the molding die cleaning apparatus 10 in the resin molding apparatus 1 will be described. The operation of the molding die cleaning device 10 corresponds to an embodiment of the molding die cleaning method of the present invention. The combination of the operation of the resin molding section 20 and the operation of the mold cleaning device 10 corresponds to an embodiment of the method for producing a resin molded article of the present invention.

(2-1) operation in resin Molding by the resin Molding section 20

The operation of the resin molding section 20 in producing a resin molded product will be described with reference to fig. 11(a) and 11 (b). When a resin molded product is manufactured, the entire molding die cleaning apparatus 10 is moved to a standby position (fig. 8(b)) by the XY stage 14. As described above, the standby position is a position outside the space between the upper die 251 and the lower die 252, and the mold cleaning device 10 does not interfere with the operation of the resin molding section 20 when manufacturing a resin molded product.

First, the movable platen 221 is lowered to be in a state of being opened to vertically separate the upper die 251 and the lower die 252 (fig. 11 a). In this state, the lead frame L having the electronic components mounted on the upper and lower surfaces thereof is placed on the upper surface of the lower die 252 so that the electronic components are aligned with the positions of the cavities C in the lateral direction. Further, the resin material P in a plate shape is supplied into the barrel 2521 by a resin material supply mechanism not shown. The resin material P is, for example, a composite material containing a thermosetting resin (epoxy resin or the like). The resin material P may contain a wax (higher fatty acid ester, etc.), a hardening accelerator (phosphorus-based catalyst, amino-based catalyst, etc.), a coupling agent, a coloring agent, a flame retardant aid, and the like. The resin material supply mechanism is widely used in conventional resin molding apparatuses, and a detailed description thereof is omitted. The thermosetting resin in the resin material P is softened or melted in the cylinder 2521 by heat supplied from the heating plate 253. The upper die 251 is also heated to a predetermined temperature by the heating plate 253.

After the thermosetting resin in the cylinder 2521 is softened or melted, the movable platen 221 is raised by the crank link 213 (fig. 11 (b)). Thereby, the lower mold 252 on the movable platen 221 is brought into contact with the upper mold 251 via the lead frame L to press the upper mold 251, and the upper mold 251 is fixed to the fixed platen 222, so that the molding die 25 is clamped. In this state, by raising plunger 2522, resin material P in barrel 2521 is supplied to cavity C of upper die 251 and lower die 252 through runner 2513 and runner 2523. After a predetermined time has elapsed, the thermosetting resin in the resin material P is cured, and a resin molded product obtained by resin molding on the lead frame L is obtained. Thereafter, the movable platen 221 is lowered by the crank link 213, whereby the molding die 25 is opened, and the resin molded product is removed from the molding die 25.

By repeating the operations up to this point, a large number of resin molded articles can be produced. However, while the production of the resin molded product is repeated, a part of the thermosetting resin, the filler, or the like contained in the resin material P gradually adheres to the surface of the molding die 25. Therefore, the surface of the molding die 25 is cleaned by operating the molding die cleaning device 10 as described below every time a predetermined number of resin molded articles are manufactured or every predetermined time.

(2-2) operation of Forming die cleaning apparatus 10

First, in a state where the mold 25 is opened, the mold cleaning device 10 is moved to a use position (fig. 8(a)) by the XY stage 14, that is, the mold cleaning device 10 is moved so that the reflecting mirror 13 is disposed between the upper mold 251 and the lower mold 252 (see fig. 2). In this case, the reflecting surface of the reflector 13 may be in either an upward or downward state, and in the former case, the upper mold 251 is cleaned first, and in the latter case, the lower mold 252 is cleaned first. Hereinafter, a case where the reflecting surface of the mirror 13 at this time point is downward as shown by a solid line in fig. 2 and 4(b) will be described as an example. The deposit adhering to the molding die 25 contains any of the resin material P and the material and component contained in the substrate or the lead frame. In addition, there is a possibility that the deposits also adhere to the parting surface (the lower surface of the upper die 251 and the upper surface of the lower die 252) or the resin passage such as the runner, and the deposits may hinder the continuous molding.

In this state, the laser light source 11 emits the pulse laser beam B having the laser fluence and the pulse width for each pulse at the pulse repetition frequency. Thereby, the pulse laser beam B is reflected by the mirror 13 by 90 ° and irradiated onto the surface of the lower mold 252. At this time, as conceptually shown in the plan view of fig. 4a and the side view of fig. 4B, the laser beam moving unit 12 repeatedly moves the pulse laser beam B back and forth in the X direction within a predetermined range (a range between XL and XR in fig. 4 a), and moves the spot BS of the pulse laser beam B individually in the Z direction within a predetermined range (a range between ZT and ZB in fig. 4B) every time one-pass movement is performed in the X direction. Thereby, on the surface of the lower die 252, first, the spot of the pulse laser beam B is moved only by the predetermined range in the X direction (fig. 4 (a)). Thereafter, if the pulse laser beam B moves only a single range of the spot BS in the Z direction, the spot BS generated on the surface of the lower mold 252 after the pulse laser beam B is reflected by the mirror 13 by 90 ° moves only a single range of the spot in the Y direction (fig. 4 (B)). Thereby, the spot BS on the surface of the lower die 252 repeats the following zigzag movement: a single-pass movement is made in the X direction, followed by only a single range of the spot BS in the Y direction, and then in the X direction, in the opposite direction to that just before (fig. 12).

As described above, the spot BS is moved in a zigzag manner, and the pulse laser beam B is irradiated onto a part or all of the surface of the lower mold 252. Here, in the case where the pulse laser beam B is irradiated only to a part of the surface of the lower mold 252, after the irradiation of the pulse laser beam B by the primary zigzag movement is finished, the XY stage 14 moves the mirror 13 to a region of the surface of the lower mold 252 to which the pulse laser beam B has not been irradiated. In addition, when an electric beam diameter variable lens having a sufficient movable distance is mounted, the spot size can be adjusted by an internal lens, and therefore the laser beam moving unit 12 may be configured to include only the XY stage 14. Then, the pulse laser beam B is irradiated to the region while being moved in a zigzag manner by the same method as described above. By repeating the above operations, the pulse laser beam B is irradiated to the entire surface of the lower mold 252. In fig. 13, the trajectory of the pulse laser beam B on the surface of the lower mold 252 in a zigzag shape is illustrated by a thin solid line, and the boundary of the irradiation region with the pulse laser beam B that makes one zigzag movement is illustrated by a thick broken line.

Thereafter, the mirror 13 is rotated, thereby switching the reflection surface from downward to upward. Further, as in the case of the lower mold 252, the surface of the upper mold 251 is also irradiated with the pulse laser beam B.

In the forming die cleaning apparatus 10 of the present embodiment, the laser energy density per pulse is set to 0.04J/cm²～0.7J/cm²The pulse laser beam B within the range of (a) is irradiated onto the surface of the molding die 25 (the upper die 251 and the lower die 252), thereby generating plasma PL on the surface of the molding die 25 (fig. 14 (a)). The source of generating the plasma PL is not particularly limited, but the plasma PL can be generated by irradiating the pulsed laser beam B onto the deposit AG to bring the vicinity of the surface of the deposit AG into a high-temperature and high-pressure state. Then, the same portion of the plasma PL is irradiated six times or more with the pulse laser beam B having the same laser energy density as that described above by moving the pulse laser beam B so that the overlap ratio becomes 85% or more, thereby heating the plasma PL to a temperature at which the resin contained in the deposit a adhering to the surface of the molding die 25 in the normal resin molding can be vaporized (fig. 14 (B)). Thereby, at least a part of the deposit a on the surface of the molding die 25 is vaporized and removed from the surface. At this time, heat transfer from the coating CT heated by the plasma PL or heat generated by radiation (radiation) may act on the deposit AG from the coating CT side. In addition, in both ends of the X direction in the range in which the pulse laser beam B moves, that is, in a portion that is less than the width of one pulse laser beam B in the X direction (for example, 17/20 of the width in the case where the overlap ratio is 85%), the number of times the pulse laser beam B is irradiated may be less than six times, but the width is generally sufficiently small, and the plasma PL heated around the width flows into the portion, and therefore, this does not become a problem. When the mold cleaning device 10 has a vaporized deposit removing device, the vaporized deposit AG is sucked and removed from the vicinity of the surface of the mold 25.

As described above, in a state where the upper mold 251 and the lower mold 252 are heated by the heating plate 253, a space between the upper mold 251 and the lower mold 252 may become high temperature. However, in the molding die cleaning apparatus 10 of the present embodiment, the laser light source 11 and the laser beam moving section 12, which are likely to be adversely affected by heat, are disposed outside the space, and the reflecting mirror 13 is disposed in the space, but is less likely to be affected by heat than the laser light source 11 and the laser beam moving section 12. Therefore, the molding die cleaning device 10 of the present embodiment can be used even at high temperatures as described above.

The mirror 13 is arranged in the space and thermally expands. However, since the second pivot shaft body 132R is allowed to move in the direction parallel to the pivot shaft until the second grasping tool 131R abuts against the outer holding tool 134R, deformation of the mirror 13 due to thermal expansion can be suppressed. Further, since the shaft 138 moves in the axial direction by sliding in the slide bearing 139 along with thermal expansion of the mirror 13, it is possible to apply a force to the mirror 13 and suppress deformation of the mirror 13. Further, when the mirror 13 is retracted outside the space after the completion of the mold cleaning device 10, the mirror 13 contracts with a decrease in temperature, but at this time, since the second rotation shaft body 132R is allowed to move in a direction parallel to the rotation shaft, the deformation of the mirror 13 can be suppressed.

Further, in the molding die cleaning apparatus 10 of the present embodiment, by removing the deposit a by a process of heating the plasma PL after the plasma PL is generated and vaporizing at least a part of the deposit a by the heat as described above, damage to the coating layer CT of the molding die 25 can be suppressed as compared with a case of removing the deposit a by directly irradiating a laser beam having a larger irradiation intensity (laser energy density, laser power density) onto the deposit a.

In the case of using the laser light source 11 and the laser beam moving section 12 for oscillating the pulse laser beam, in order to more reliably remove the deposit from the surface of the molding die 25 and further suppress damage to the coating layer containing chromium nitride, hard chromium, or the like, it is desirable that the pulse width is 50nsec to 120nsec and the laser energy density per pulse is 0.1J/cm²～0.6J/cm²The overlap rate is more than 90%, and the scanning laser power density per second is 3W/cm²～11W/cm²。

In the case of using the laser light source 11 and the laser beam moving section 12 for oscillating the pulse laser beam, the following configuration may be adopted in order to more reliably remove the deposit from the surface of the molding die and further suppress damage to the coating layer including chromium nitride, hard chromium, or the like: the pulse width is 50 nsec-120 nsec, and the laser energy density of each pulse is 0.04J/cm²～0.1J/cm²The overlap rate is more than 98%, and the scanning laser power density per second is 5W/cm²～11W/cm²。

(3) Another embodiment of the forming die cleaning apparatus

Hereinafter, another embodiment of the mold cleaning device of the present invention will be described.

The configuration shown in fig. 15 a and 15B is a case where the spot BS of the pulse laser beam B moves on the lower surface of the upper die 251 or the upper surface of the lower die 252 along the path shown in fig. 12, and a shielding portion 17 (shown by a thick solid line in fig. 15 a) for shielding the pulse laser beam B only by the width of a single range of the spot BS may be provided between the laser beam moving portion 12 and the upper die 251 or the lower die 252 at both ends of the path in the X direction (i.e., the direction in which the spot BS reciprocates). The shielding portion 17 may be provided between the laser beam moving portion 12 and the upper die 251 and between the laser beam moving portion 12 and the lower die 252.

When the spot BS is moved in the Y direction (corresponding to the second direction) while the emission of the pulse laser beam B from the laser light source 11 is continued without providing the shielding portion 17 as in the above-described embodiment, the portion where the shielding portion 17 is provided is irradiated with the pulse laser beam B at a number of pulses larger than that of the other portion in accordance with the speed of movement of the spot BS. For example, there may be a portion where the number of times of irradiation of the pulse laser beam B is different between a portion that becomes a starting point of irradiation or a portion where the movement in the X direction and the movement in the Y direction are switched, compared to other portions. The portion where the shielding portion 17 is provided may be a position where the number of times the pulse laser beam B is irradiated may be less than six times as described above. On the other hand, in the single range of the spot BS at both ends in the X direction, the pulse laser beam B is shielded by the shielding portion 17, and cleaning is performed by the pulse laser beam B that has passed through the portion where the shielding is not performed, whereby the uniformity of the cleaning process can be further improved.

Instead of using the shielding portion 17, emission of the pulse laser beam B from the laser light source 11 may be stopped while the spot BS is moved in the Y direction. Further, the moving speed of the pulse laser beam may be changed, and the laser energy density and/or repetition frequency of each pulse may be changed in accordance with the changed moving speed. For example, the laser beam is moved faster, and the laser energy density per one pulse and/or the repetition frequency are made large corresponding thereto, whereby the area in which the pulse laser beam can be irradiated in the same time can be enlarged.

The light spot BS may be moved in a zigzag manner as shown in fig. 12 or 13, and may repeat the following operations as shown in fig. 16(a), for example: after the single-pass movement in the X direction (the path of the thin solid line in the figure), the emission of the pulse laser beam B from the laser light source 11 is stopped, and then the single range of the spot BS (the path of the thin broken line in the figure) is moved in the Y direction while returning to the initial position in the X direction, and the single-pass movement in the X direction is further performed. Alternatively, as shown in fig. 16B, the pulsed laser beam B may be irradiated to the entire cleaning target by one zigzag movement (or one-way repetitive movement in fig. 16 a) (without dividing the cleaning target into a plurality of irradiation regions as described above).

In order to move the mirror 13 in the X direction, as shown in fig. 17, an X-direction moving mechanism 18 having an X-direction guide 181, an X-direction conveyor 182, a conveyor belt mounting member 183, an X-direction motor 184, an X-direction pulley 185, a motor block 186, a pulley block 187, and a Y-direction guide 188 may be used. The X-direction guide 181 is a guide extending in the X direction directly below the upper die 251 or directly above the lower die 252 so as to traverse these dies. The X-direction conveyor 182 extends substantially parallel to the X-direction guide 181, and the bearing holding portion 134L or the outer holding jig 134R of the mirror 13 is attached by the conveyor attachment member 183. The bearing holding portion 134L or the outer holding jig 134R attached to the X-direction conveyor 182 is supported by the X-direction guide rail 181. The X-direction motor 184 is housed in a motor block 186, and the motor block 186 is fixed to one end of the X-direction guide rail 181. Further, the X-direction pulley 185 is housed in the pulley block 187, and the pulley block 187 is fixed to the other end of the X-direction guide rail 181. The X-direction conveyor belt 182 is suspended from an X-direction motor 184 and an X-direction pulley 185. The motor block 186 is mounted on the Y-direction guide 188, and each component of the X-direction moving mechanism 18 other than the Y-direction guide 188 is movable in the Y-direction along the Y-direction guide 188.

In the X-direction moving mechanism 18, the X-direction pulley 185 rotates with the rotation of the X-direction motor 184, and the X-direction conveyor belt 182 moves in the X-direction, whereby the mirror 13 attached to the X-direction conveyor belt 182 via the bearing holding portion 134L or the outer holding jig 134R moves in the X-direction. According to the X-direction moving mechanism 18, the X-direction motor 184 is disposed outside the upper die 251 and the lower die 252 in the X direction, and therefore, the influence of heat from the upper die 251 and the lower die 252 on the X-direction motor 184 can be suppressed. In addition, the same as the X-direction moving mechanism 18 may be used to move the laser light source 11 and the laser beam moving unit 12 in the X direction.

FIG. 18 shows another embodiment of the forming die cleaning apparatus of the present invention. The mold cleaning device 10A of this embodiment includes a laser light source 11, a laser beam moving unit 12, an XY stage 14, and an XY stage driver 15, which are similar to the mold cleaning device 10. In fig. 18, the XY stage 14 and the XY stage driver 15 are not illustrated. The mold cleaning device 10A includes a first reflecting mirror 13X and a second reflecting mirror 13Y instead of the reflecting mirror 13 in the mold cleaning device 10. Further, the molding die cleaning device 10A includes a mirror switching section (mirror switching mechanism) 16 including an optical path switching mirror 161 and an optical path switching mirror moving section 162.

The first mirror 13X is rotatable by a rotation shaft extending in the X direction and is disposed on the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. The second reflecting mirror 13Y is configured to rotate the first reflecting mirror 13X by 90 ° around the Z axis, and is rotatable by a rotating shaft extending in the Y direction, and is disposed on the side of the optical path of the pulse laser beam B emitted from the laser beam moving unit 12.

The reflection surface of the optical path switching mirror 161 is parallel to the Z axis and is oriented in a direction inclined by 45 ° with respect to the pulse laser beam B emitted from the laser beam moving unit 12. The optical path switching mirror moving unit 162 is configured to move the optical path switching mirror 161 between the outside (side) of the optical path of the pulse laser beam B emitted from the laser beam moving unit 12 and the inside of the optical path.

The operation of the molding die cleaning device 10A will be described. First, in a state where the optical path switching mirror 161 has been disposed outside the optical path of the pulse laser beam B by the optical path switching mirror moving section 162, the reflection surface of the first reflection mirror 13X is inclined downward and by only 45 ° with respect to the XZ plane. In the same manner as in the case of the molding die cleaning apparatus 10, the pulse laser beam B is emitted from the laser light source 11, and then is reciprocated in the X direction and moved in the Y direction by the laser beam moving section 12. Thereby, the pulse laser beam B is reflected by the first mirror 13X and irradiated onto the surface of the lower mold 252. Here, the reflection surface of the first mirror 13X is inclined by 45 ° with respect to the XZ plane, and thus the pulse laser beam B is perpendicularly incident into the upper surface of the lower mold 252. However, when such injection is performed, it is difficult to irradiate the surface perpendicular to the upper surface of the lower mold 252, such as the side surface facing the cavity C, with the pulse laser beam B. Therefore, after the operations up to this point are completed, the angle of the reflection surface of the first mirror 13X is changed from 45 ° to a different size, and the side surface of the lower mold 252 parallel to the X direction is irradiated with the pulse laser beam B.

Then, after the reflection surface of the first mirror 13X is made to face upward and inclined by only 45 ° with respect to the XZ plane, the pulse laser beam B is reciprocally moved in the X direction and moved in the Y direction by the laser beam moving section 12, thereby being irradiated onto the surface of the upper die 251. At this time, the pulse laser beam B may be irradiated to the side surface of the upper die 251 parallel to the X direction by operating the first reflecting mirror 13X with the angle of the reflecting surface set to 45 ° and then changing the angle to a magnitude other than 45 °.

However, even with the operations described above, the pulse laser beam B cannot be irradiated onto the side surfaces of the lower mold 252 and the upper mold 251 that are parallel to the Y direction. Therefore, the optical path switching mirror moving unit 162 moves the optical path switching mirror 161 into the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. The side surface of the lower mold 252 parallel to the Y direction can be irradiated with the pulse laser beam B by emitting the pulse laser beam B from the laser light source 11 with the reflecting surface of the second reflecting mirror 13Y facing downward and making the angle with the XZ plane larger than 45 °, and by reciprocating the pulse laser beam B in the X direction and moving the pulse laser beam B in the Y direction by the laser beam moving unit 12. Further, when an electric beam diameter variable lens is mounted, the spot size can be adjusted by electrically moving the built-in lens so as to align the angle of the second reflecting mirror 13Y. The upper die 251 may also be subjected to the various operations described herein.

As described above, according to the mold cleaning device 10A, the lower mold 252 and the upper mold 251 can be more reliably cleaned by irradiating the side surfaces of the lower mold 252 and the upper mold 251 that are parallel to the X direction and the Y direction with the pulse laser beam B.

Fig. 19(a-1) to 19(B) show a forming die cleaning device 10B as still another embodiment of the forming die cleaning device of the present invention. The mold cleaning device 10B of this embodiment includes a laser light source 11, a laser beam moving section 12, an XY stage 14, and an XY stage driver 15, which are similar to the mold cleaning device 10. In fig. 19(a-1) to 19(b), the XY stage 14 and the XY stage driver 15 are not illustrated. The mold cleaning device 10B includes a first reflecting mirror 13A and a second reflecting mirror 13B instead of the reflecting mirror 13 in the mold cleaning device 10. Further, the molding die cleaning device 10B includes a mirror switching section (mirror switching mechanism) 16A.

The first reflecting mirror 13A is rotated around the axis in the Z direction by the mirror switching unit 16A as described above, and may be arranged on the optical path of the pulse laser beam B emitted from the laser beam moving unit 12 while being rotated by a rotation axis on the XY plane. The second reflecting mirror 13B is rotatable by a rotating shaft extending in the Y direction, and is disposed on the side of the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. The mirror switching unit 16A is provided below the first mirror 13A and is configured along an annular guide rail so as to rotate the first mirror 13A about an axis in the Z direction.

The operation of the molding die cleaning device 10B will be described. First, the mirror switching unit 16A sets the direction of the first mirror 13A so that the intersection of the XY plane and the reflection surface of the first mirror 13A becomes parallel to the X axis (fig. 19(a-1) and 19 (a-2)). In this state, similarly to the first reflecting mirror 13X in the molding die cleaning device 10A, the first reflecting mirror 13A is rotated by a rotating shaft extending in the X direction, and the pulse laser beam B is irradiated to the first reflecting mirror 13A in four states of a state in which the reflecting surface of the first reflecting mirror 13A is made downward and inclined at only 45 ° with respect to the XZ plane, a state in which the reflecting surface of the first reflecting mirror 13A is made downward and inclined at an angle other than 45 ° with respect to the XZ plane, a state in which the reflecting surface of the first reflecting mirror 13A is made upward and inclined at only 45 ° with respect to the XZ plane, and a state in which the reflecting surface of the first reflecting mirror 13A is made upward and inclined at an angle other than 45 ° with respect to the XZ plane. Thus, the pulse laser beam B is reflected by the first mirror 13A and irradiated onto the surface of the lower mold 252 or the upper mold 251 including the side surface substantially parallel to the XZ plane. When the pulse laser beam B is irradiated onto the lower mold 252 with the reflection surface down, the pulse laser beam B reflected by the first reflection mirror 13A passes through the hollow portion of the mirror switching portion 16A on the inner side than the annular guide rail.

Then, the first mirror 13A is erected so that the reflection surface becomes perpendicular to the XY plane, and the mirror switching portion 16A rotates the first mirror 13A around the Z axis so that the reflection surface faces the direction of 45 ° with respect to the XZ plane (fig. 19 (b)). In this state, the pulse laser beam B irradiated onto the first reflecting mirror 13A is reflected by the first reflecting mirror 13A and incident on the second reflecting mirror 13B. The side surface of the lower mold 252 parallel to the Y direction can be irradiated with the pulse laser beam B by emitting the pulse laser beam B from the laser light source 11 with the reflecting surface of the second reflecting mirror 13B facing downward and making the angle with the XZ plane be not more than 45 °, and by reciprocating the pulse laser beam B in the X direction and moving the pulse laser beam B in the Y direction by the laser beam moving unit 12. Further, when an electric beam diameter variable lens is mounted, the light path when reflected by the second reflecting mirror 13B and the angle of the second reflecting mirror 13B can be aligned to adjust the spot size so that the spot size becomes the same as the spot size when reflected by the first reflecting mirror 13A by electrically moving the built-in lens. The upper die 251 may also be subjected to the various operations described herein.

As described above, the mold cleaning device 10B may irradiate the XZ plane and the side surface substantially parallel to the XZ plane in the lower mold 252 and the upper mold 251 with the pulse laser beam B, as in the mold cleaning device 10A, and thereby the lower mold 252 and the upper mold 251 can be more reliably cleaned.

Fig. 20 shows a configuration of a resin molding unit 30 including a plurality of sets of resin molding sections 20 and a set of mold cleaning device 10. The resin molding unit 30 has a material receiving unit 31, a plurality of molding units 32, a discharge unit 33, and a mold cleaning device standby unit 34. The material receiving unit 31 is a device for receiving the plate-like resin material P and the lead frame L from the outside and feeding them to the molding unit 32, and includes a lead frame receiving portion 311 and a resin sheet supplying portion 312. One molding unit 32 has one resin molding portion 20 in the resin molding apparatus 1 of the embodiment. Although three molding units 32 are shown in fig. 20, any number of molding units 32 may be provided in the resin molding unit 30. Further, even after the resin molding unit 30 is assembled and used, the molding units 32 may be increased or decreased. The discharge unit 33 carries the resin molded product manufactured by the molding unit 32 from the molding unit 32 and holds the resin molded product, and includes a resin molded product holding portion 331. The mold cleaning device standby unit 34 is a unit for housing the mold cleaning device 10 when the mold cleaning device 10 is not used.

The conveying device 35 is a device that conveys a substrate or a resin material from the material receiving unit 31 into the molding unit 32 along a conveying rail provided in the resin molding unit 30, and conveys a molded resin molded article from the molding unit 32 to the discharge unit 33. The conveying device 35 also has the following functions: when cleaning of the molding die is performed in a certain molding unit 32, the molding die cleaning device 10 is carried into the molding unit 32 (fig. 21), and after the cleaning of the molding die is completed, the molding die cleaning device 10 is carried out of the molding unit 32.

The resin molding unit 30 is suitable for mass production of resin molded articles because it can simultaneously produce resin molded articles in a plurality of molding units 32. In this case, since a time is required for the substrate to be mounted on the molding die until the substrate is carried out after the resin molded product is produced, by mounting the object to be molded on another molding element 32 or carrying the resin molded product out of another molding die during the time for producing the resin molded product by a certain molding element 32, the production efficiency of the resin molded product can be improved and the cost required for the transfer device can be suppressed. Further, the mold cleaning device 10 may be shared among a plurality of molding units 32.

In the above-described resin molding unit 30, the mold cleaning device waiting unit 34 arranged in the same row as the other units is used, but instead of the mold cleaning device waiting unit 34, a mold cleaning device housing/moving unit 34A extending along the row arranged with the other units may be used as in the resin molding unit 30A shown in fig. 22. The configurations of the material receiving unit 31, the molding unit 32, and the discharging unit 33 in the resin molding unit 30A are the same as those in the case of the resin molding unit 30. The molding die cleaning device housing/moving unit 34A houses the molding die cleaning device 10, and has a molding die cleaning device moving section 35A therein for moving the molding die cleaning device 10 in the direction of the row in which the other units are arranged. The molding die cleaning device housing/moving unit 34A and the molding die cleaning device moving unit 35A therein are provided on the opposite side of the conveying device 35 as viewed from the resin molding section 20 of each molding unit 32. The operation of the resin molding unit 30A is the same as that of the resin molding unit 30 except that the mold cleaning device moving section 35A is used when the mold cleaning device 10 is carried into the molding unit 32 or when the mold cleaning device is carried out of the molding unit 32.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the gist of the present invention.

For example, in the illustrated embodiment, the laser energy density is at 0.04J/cm using each pulse²～0.7J/cm²In the range of 2W/cm for a scanning laser power density per second²～15W/cm²A pulsed laser beam having a pulse width in the range of 1nsec to 200nsec and a pulse repetition frequency in the range of 300kHz to 10MHz, but these values are not limited to the above ranges. Instead of the pulse laser beam, a beam of laser light that oscillates continuously may be used. Further, in the above-described embodiment, a (pulse) laser beam shaped so that the shape in the cross section perpendicular to the beam becomes a square and having a top-hat type irradiation intensity distribution is used, but a laser beam having another shape such as a circle, a ring (ring, concave) or the like in the cross section, or a laser beam having another irradiation intensity distribution such as a gaussian type or the like may be used. Fig. 23(a) and 23(b) show the case where the spot of the laser beam having a circular cross section and the spot thereof are shifted, and fig. 23(c) and 23(d) show the case where the spot of the laser beam having an annular cross section and the spot thereof are shifted.

In the above embodiment, the pulse laser beam is moved so that the overlap ratio becomes 85% or more, but the moving speed of the pulse laser beam is not limited thereto, and when a beam of laser light that oscillates continuously is used, the moving speed may be set as appropriate. In the above-described embodiment, the (pulse) laser beam is moved so that the spot moves on the surface of the upper mold 251 or the lower mold 252 in a zigzag manner, but the path of movement of the spot is not limited to this. For example, the following operations may be repeated: after the laser beam is stopped after the single-pass movement in the X direction, the laser beam is moved in the Y direction only by a single range of the light spot while returning to the initial position in the X direction, and the laser beam is further moved in the X direction by a single pass.

In the above embodiment, the pulsed laser beam B is reciprocated in the X direction and moved in the Z direction (the spot is moved in the Y direction on the surface of the upper die 251 or the lower die 252) by using the galvanometer scanning head 121, but alternatively, the spot may be moved in the Y direction on the surface of the upper die 251 or the lower die 252 by reciprocating the galvanometer scanning head 121 only in the X direction and moving the mirror 13 in the Y direction.

Claims

1. A molding die cleaning device for removing an attached matter attached to a surface of at least one of a first die and a second die that face the first die, the first die constituting a molding die, the molding die cleaning device comprising:

a laser light source disposed outside a space between the first and second modes and emitting a laser beam;

a laser beam reflecting mechanism having a mirror and a mirror moving mechanism that moves the mirror between a first position in the space and a second position outside the space, the laser beam reflecting mechanism setting a direction of the mirror in such a manner that the laser beam reflected by the mirror is irradiated onto a surface of the first mold or the second mold when the mirror is located at the first position; and

and a laser beam moving mechanism which is arranged outside the space and moves the laser beam relative to the reflecting mirror when the laser beam is positioned at the first position.

2. The forming die cleaning apparatus of claim 1,

the laser beam moving mechanism is a galvanometer scanning head.

3. The forming die cleaning apparatus of claim 1 or 2,

the laser beam reflection mechanism further has a reflection direction changing mechanism that changes a direction of the mirror.

4. The forming die cleaning apparatus of claim 1 or 2,

the reflecting mirror includes a first reflecting mirror and a second reflecting mirror which are different in direction from each other, and the laser beam reflecting mechanism further includes a mirror switching mechanism which switches the reflecting mirror to which the laser beam is irradiated.

5. The forming die cleaning apparatus of claim 1 or 2, further comprising:

a pair of first and second rotating shaft bodies connected to both side portions of the reflecting mirror; and

and a rotating shaft body holding tool that holds at least one of the first rotating shaft body and the second rotating shaft body movably in an axial direction.

6. The forming die cleaning apparatus as claimed in claim 1 or 2, being an apparatus for removing an adherent attached to the forming die having a coating applied to at least a part of a surface thereof,

the laser light source and the laser beam moving mechanism are configured to irradiate the molding die with a laser beam at an irradiation intensity that is equal to or higher than a temperature at which the deposit is vaporized after the plasma is generated on the deposit, and that is lower than an irradiation intensity at which the coating layer is damaged.

7. The forming die cleaning apparatus of claim 1 or 2,

the laser beam moving mechanism is a mechanism that:

reciprocating the laser beam in a first direction with respect to the forming mold, and

moving the laser beam in a second direction perpendicular to the first direction by only a single range of a spot of the laser beam irradiated onto the forming mold every time the laser beam is moved in a single pass in the first direction; and is

The laser beam moving mechanism may further include a shielding portion that shields a portion of a single range of the light spot at both ends of the reciprocating movement in the first direction, between the laser beam moving mechanism and the molding die.

8. A method of cleaning a forming die for removing an adhering substance adhering to a surface of at least one of a first die and a second die opposed to the first die, the first die constituting the forming die,

disposing a mirror in a space between the first mode and the second mode,

emitting a laser beam from a laser light source disposed outside the space, irradiating the laser beam onto the reflecting mirror while moving the laser beam relative to the reflecting mirror by a laser beam moving mechanism disposed outside the space, and

9. The forming die cleaning method of claim 8,

the laser beam moving mechanism is a galvanometer scanning head.

10. The forming die cleaning method as recited in claim 8 or 9,

the direction of the mirror is changed.

11. The forming die cleaning method as recited in claim 8 or 9,

the reflecting mirror includes a first reflecting mirror and a second reflecting mirror which are different in direction from each other, and switches the reflecting mirror to which the laser beam is irradiated.

12. The forming die cleaning method as recited in claim 8 or 9,

a pair of first and second rotating shaft bodies connected to both side portions of the mirror and a rotating shaft body holding tool for holding at least one of the first and second rotating shaft bodies so as to be movable in an axial direction are used.

13. The forming die cleaning method as claimed in claim 8 or 9, which is a method of removing an adherent attached to the forming die having a coating applied to at least a part of a surface thereof,

the laser beam is irradiated onto the molding die at an irradiation intensity that is equal to or higher than a temperature at which the deposit is vaporized after the plasma is generated on the deposit, and that is lower than an irradiation intensity at which the coating layer is damaged.

14. A resin forming apparatus, comprising:

the forming die, and the forming die cleaning device according to any one of claims 1 to 7.

15. A method for producing a resin molded article, characterized in that,

after the forming die cleaning method according to any one of claims 8 to 13 is performed, a resin molded article is produced using the forming die.