CN110690144A - Hot-pressing sintering machine for packaging high-power semiconductor device - Google Patents
Hot-pressing sintering machine for packaging high-power semiconductor device Download PDFInfo
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- CN110690144A CN110690144A CN201910888004.0A CN201910888004A CN110690144A CN 110690144 A CN110690144 A CN 110690144A CN 201910888004 A CN201910888004 A CN 201910888004A CN 110690144 A CN110690144 A CN 110690144A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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Abstract
The invention discloses a hot-pressing sintering machine for packaging a high-power semiconductor device, which structurally comprises the hot-pressing sintering machine, an access door, a machine door, a human-computer interface and a radiator, wherein the hot-pressing sintering machine consists of a machine body, a power supply device, a PLC (programmable logic controller), a display and a hot-pressing furnace, the PLC can bind a lead through a wire bundling mechanism to avoid the lead from swinging randomly to cause wiring dislocation, the lead is pressed on a conductive terminal by a wire pressing wheel to avoid the lead from being influenced by external vibration in work and the work is stopped due to poor contact, when the lead is burnt off, the outer cover of the hot-pressing sintering machine does not need to be detached to be inserted into the lead again, the motor shaft is driven to rotate by a servo motor, the lead intercepted below the bottom end is pushed into the bottom end of the wire pressing wheel again by a wire feeding wheel on the motor shaft, and avoids damage to the processing of the material.
Description
Technical Field
The invention relates to the field of Programmable Logic Controllers (PLC), in particular to a hot-pressing sintering machine for packaging a high-power semiconductor device.
Background
With the rapid development of electric power, high-speed rail, electric vehicles, and the like, the demand for high-power semiconductor devices has increased rapidly in recent years. The high-power semiconductor device has high power density and large heat productivity, and has very high heat dissipation requirements. The hot-pressing sintering machine is mainly controlled by a temperature control, a voltage regulator and a large-current transformer in a closed loop mode, the temperature is automatically tracked, all actions are completed by a PLC (programmable logic controller), a touch screen is combined with the PLC to complete all operation actions, various operation conditions of the furnace are monitored in real time, temperature, vacuum and displacement data can be displayed and recorded in real time and downloaded, and data curves can be checked in real time.
Therefore, the PLC has a great effect on the hot-pressing sintering machine, and in high-power equipment, the PLC can often cause that the lead is blown or the lead is badly contacted by external influence in work so as to stop work, so that the material is damaged in the processing process, and the material and the time are wasted.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a hot-pressing sintering machine for packaging a high-power semiconductor device structurally comprises a hot-pressing sintering machine, an access door, a machine door, a human-computer interface and a radiator, wherein the access door is arranged at the front end of the hot-pressing sintering machine, the hot-pressing sintering machine is movably connected with the access door, the machine door is arranged on the surface of the hot-pressing sintering machine, the hot-pressing sintering machine is connected with the machine door through a hinge, the radiator is arranged on the side surface of the hot-pressing sintering machine, and the human-computer interface is arranged on the surface of the front end of the hot-pressing;
the hot-pressing sintering machine is characterized by comprising a machine body, a power supply device, a PLC (programmable logic controller), a display and a hot-pressing furnace, wherein the hot-pressing furnace is arranged on the left side inside the machine body, the power supply device is arranged inside the machine body, the machine body is connected with the power supply device, the display is arranged at the front end inside the machine body, the machine body is matched with the display, the PLC is arranged inside the machine body, and the power supply device and the display are electrically connected through the PLC.
As a further optimization of the technical scheme, the PLC programmable controller is composed of a shell, a power terminal, a servo motor, a motor shaft, conductive terminals, a wire pressing wheel and a wire bundling mechanism, wherein the power terminal is installed on the surface of the shell, the wire bundling mechanism is arranged at each of the left end and the right end of the shell, the shell is connected with the wire bundling mechanism in an adhesive manner, the conductive terminals are arranged in the left end and the right end of the shell, the shell is fixedly connected with the conductive terminals, the servo motor is arranged on the conductive terminals, the conductive terminals are connected with the servo motor through the motor shaft, the wire pressing wheel is arranged on the inner side of each conductive terminal, and the shell and the wire pressing wheel are in clearance fit.
As a further optimization of the technical scheme, the motor shaft comprises a shaft body, an external gear and wire feeding wheels, wherein more than two wire feeding wheels are equidistantly distributed on the surface of the shaft body, the shaft body is fixedly connected with the wire feeding wheels, and the external gear is arranged on the surface of each wire feeding wheel.
As a further optimization of the technical scheme, an inner gear ring is arranged on the inner side of the outer gear, the outer gear and the inner gear ring are of an integrated structure, an outer gear ring is arranged on the surface of the wire feeding wheel, the wire feeding wheel is fixedly connected with the outer gear ring, three linkage gears are arranged between the inner gear ring and the outer gear ring, and the inner gear ring is in transmission connection with the outer gear ring through the linkage gears.
As the further optimization of the technical scheme, the line pressing wheel consists of a wheel body, line pressing arc plates, a first spring and a fixed shaft, the fixed shaft is arranged at the middle position of the wheel body, the wheel body and the fixed shaft are welded through electric welding, the four line pressing arc plates are distributed on the inner side of the wheel body at equal intervals, and the wheel body and the line pressing arc plates are connected through the first spring.
As a further optimization of the technical scheme, the wire bunching mechanism comprises a wire inserting frame, a second spring, a wire bunching column and a push-pull rod, wherein the wire bunching column is arranged in the wire inserting frame, the wire inserting frame and the wire bunching column are in sliding fit through the second spring, the push-pull rod is arranged on the surface of the wire bunching column, and the wire bunching column is connected with the push-pull rod through glue.
As a further optimization of the technical scheme, the wire harness column is made of stainless steel and is provided with a thread groove on the surface.
As a further optimization of the technical scheme, the beam column is meshed with the external gear.
As a further optimization of the technical scheme, a corrugated rubber ring is arranged in the middle of the wire feeding wheel and used for pushing the wires.
Advantageous effects
The invention relates to a hot-pressing sintering machine for packaging a high-power semiconductor device, which is characterized in that a lead is inserted into a wire inserting frame, a bunching column is pushed upwards by a push-pull rod so that the lead can enter, the lead penetrates through the bottom ends of a wire feeding wheel and a wire pressing wheel to be contacted with a conducting strip after entering, when the lead is in poor contact or is burnt out, a servo motor is driven, the servo motor converts electric energy into kinetic energy through a shaft body, the shaft body drives the wire feeding wheel to rotate, the lead below the bottom end is pushed into a conductive terminal by the wire feeding wheel, an outer gear on the wire feeding wheel drives an inner gear to rotate through a linkage gear, the inner gear drives the outer gear to rotate, the outer gear drives threads on the bunching column through teeth, the bunching column of a wheel body moves upwards, the bunching column can loosen the pressing of the lead, the lead is, the influence of external vibration on the lead in the working process is avoided, and the working termination caused by poor contact is avoided.
Compared with the prior art, the invention has the beneficial effects that: PLC programmable controller can tie the wire through the binding mechanism, avoid the wire to swing at will, lead to the wiring dislocation, utilize the fabric wheel with the wire suppression on conductive terminal, avoid the wire to receive external vibration's influence at work, and contact failure leads to the work to terminate, when the wire is burnt out, need not dismantle hot pressing sintering machine's enclosing cover and reinsert the wire, it is rotatory to drive the motor shaft through servo motor, utilize the epaxial wire feeding wheel of motor to push the fabric wheel bottom with the wire of holding back under the bottom again, the maintenance duration has been saved, the work efficiency is improved, also avoid causing the processing of material to appear damaging.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a hot-pressing sintering machine for packaging a high-power semiconductor device according to the present invention.
Fig. 2 is a schematic top view of a hot pressing sintering machine for packaging a high power semiconductor device according to the present invention.
Fig. 3 is a schematic front view of a PLC programmable controller according to the present invention.
Fig. 4 is a schematic structural view of the creasing wheel of the present invention.
Fig. 5 is a schematic structural view of a motor shaft of the present invention.
Fig. 6 is a schematic top view of a PLC programmable controller according to the present invention.
In the figure: hot-pressing sintering machine-1, access door-2, machine door-3, human-machine interface-4, radiator-5, machine body-1 a, power supply device-1 b, PLC (programmable logic controller) -1c, display-1 d, hot-pressing furnace-1 e, shell-1 c1, power supply terminal-1 c2, servo motor-1 c3, motor shaft-1 c4, conductive terminal-1 c5, wire pressing wheel-1 c6, wire binding mechanism-1 c7, shaft body-1 c41, external gear-1 c42, wire feeding wheel-1 c43, external gear ring-g 1, internal gear ring-g 2, linkage gear-g 3, wheel body-1 c61, wire pressing arc plate-1 c62, first spring-1 c63, fixed shaft-1 c64, wire inserting frame-1 c71, second spring-1 c72, A wire-bundling column-1 c73 and a push-pull rod-1 c 74.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Examples
Referring to fig. 1-6, the invention provides a hot-pressing sintering machine for packaging a high-power semiconductor device, which comprises a hot-pressing sintering machine 1, an access door 2, a machine door 3, a human-computer interface 4 and a radiator 5, wherein the access door 2 is arranged at the front end of the hot-pressing sintering machine 1, the hot-pressing sintering machine 1 is movably connected with the access door 2, the machine door 3 is arranged on the surface of the hot-pressing sintering machine 1, the hot-pressing sintering machine 1 is connected with the machine door 3 through a hinge, the radiator 5 is arranged on the side surface of the hot-pressing sintering machine 1, the human-computer interface 4 is arranged on the surface of the front end of the hot-pressing sintering machine 1, the hot-pressing sintering machine 1 consists of a machine body 1a, a power supply device 1b, a Programmable Logic Controller (PLC) 1c, a display 1d and a hot-pressing furnace 1e, the hot-pressing furnace 1e is arranged on the left, the machine body 1a is connected with the power supply device 1b, a display 1d is arranged at the front end inside the machine body 1a, the machine body 1a is matched with the display 1d, a PLC (programmable logic controller) 1c is installed inside the machine body 1a, and the power supply device 1b is electrically connected with the display 1d through the PLC 1 c.
The PLC 1c is composed of a shell 1c1, a power supply terminal 1c2, a servo motor 1c3, a motor shaft 1c4, a conductive terminal 1c5, a wire pressing wheel 1c6 and a wire bundling mechanism 1c7, the power supply terminal 1c2 is installed on the surface of the shell 1c1, wire bundling mechanisms 1c7 are arranged at the left end and the right end of the shell 1c1, the shell 1c1 is connected with the wire bundling mechanisms 1c7 through glue, conductive terminals 1c5 are arranged at the left end and the right end of the shell 1c1, the shell 1c1 is fixedly connected with the conductive terminal 1c5, the servo motor 1c3 is arranged on the conductive terminal 1c5, the conductive terminal 1c5 is connected with the servo motor shaft 1c3 through the motor shaft 1c4, the wire pressing wheel 1c6 is arranged on the inner side of the conductive terminal 1c5, and the shell 1c1 and the wire pressing wheel 1c6 are in clearance fit.
The motor shaft 1c4 comprises a shaft body 1c41, an external gear 1c42 and a wire feeding wheel 1c43, wherein the surface of the shaft body 1c41 is equidistantly provided with more than two wire feeding wheels 1c43, the shaft body 1c41 is fixedly connected with the wire feeding wheel 1c43, and the surface of the wire feeding wheel 1c43 is provided with an external gear 1c 42.
The external gear 1c42 is used to drive the wire harness post 1c73 to release the pressing of the wire.
An inner gear ring g2 is arranged on the inner side of the external gear 1c42, the external gear 1c42 and the inner gear ring g2 are of an integrated structure, an outer gear ring g1 is arranged on the surface of the wire feeding wheel 1c43, the wire feeding wheel 1c43 is fixedly connected with the outer gear ring g1, three linkage gears g3 are arranged between the inner gear ring g2 and the outer gear ring g1, and the inner gear ring g2 is in transmission connection with the outer gear ring g1 through the linkage gears g 3.
The linkage gear g3 is used for providing a rotary fulcrum for the transmission of the inner gear ring g2 and the outer gear ring g 1.
The wire pressing wheel 1c6 is composed of a wheel body 1c61, wire pressing arc plates 1c62, a first spring 1c63 and a fixed shaft 1c64, the fixed shaft 1c64 is arranged in the middle of the wheel body 1c61, the wheel body 1c61 and the fixed shaft 1c64 are welded through electric welding, four wire pressing arc plates 1c62 are distributed on the inner side of the wheel body 1c61 at equal intervals, and the wheel body 1c61 and the wire pressing arc plates 1c62 are connected through the first spring 1c 63.
The first spring 1c63 is used to press the wire through the pressing line arc plate 1c 62.
The wire bundling mechanism 1c7 comprises a wire inserting frame 1c71, a second spring 1c72, a wire bundling column 1c73 and a push-pull rod 1c74, wherein the wire bundling column 1c73 is arranged inside the wire inserting frame 1c71, the wire inserting frame 1c71 and the wire bundling column 1c73 are in sliding fit through the second spring 1c72, the push-pull rod 1c74 is arranged on the surface of the wire bundling column 1c73, and the wire bundling column 1c73 is connected with the push-pull rod 1c74 through glue.
The push-pull rod 1c74 is used to push the wire-tying post 1c73 to move, and the insertion of the wire is not hindered by the wire-tying post 1c 73.
The wire bundling post 1c73 is made of stainless steel, a thread groove is formed in the surface of the wire bundling post, the wire bundling post 1c73 is meshed with the external gear 1c42, and a corrugated rubber ring is arranged in the middle of the wire feeding wheel 1c43 and used for pushing a wire.
The principle of the invention is as follows: the wire is inserted into a wire inserting frame 1c71, a wire binding column 1c73 is pushed upwards through a push-pull rod 1c74, so that the wire can enter, the wire penetrates through the bottom ends of a wire feeding wheel 1c43 and a wire pressing wheel 1c6 to be in contact with a conducting strip after entering, when the wire is in poor contact or is burnt, a servo motor 1c3 is driven, the servo motor 1c3 converts electric energy into kinetic energy through a shaft body 1c41, the shaft body 1c41 drives a wire feeding wheel 1c43 to rotate, the wire under the bottom end is pushed into an electric conduction terminal 1c5 by the wire feeding wheel 1c43, an external gear 1c42 on the wire feeding wheel 1c43 drives an internal gear g2 to rotate through a linkage gear g3, the internal gear g2 drives an external gear 1c42 to rotate, the external gear 1c42 drives threads on the wire binding column 1c 469 through a tooth pattern, so that the wire binding column 1c73 moves upwards, the wire binding column 821 c 56 can be released to press the wire, and the wire is fed into a wheel body, the wheel body 1c61 uses the wire pressing arc plate 1c62 to press the wire firmly on the conductive terminal 1c5, so as to avoid the wire being affected by external vibration during operation and the operation being terminated due to poor contact.
The method for solving the problems comprises the following steps: the PLC 1c can bind the wire through the wire bundling mechanism 1c7, the wire is prevented from swinging randomly to cause wiring dislocation, the wire is pressed on the conductive terminal 1c5 by the wire pressing wheel 1c6, the influence of external vibration on the wire in work is avoided, the work termination caused by poor contact is avoided, when the wire is burnt, the outer cover of the hot-pressing sintering machine 1 is not required to be detached and inserted into the wire again, the servo motor 1c3 drives the motor shaft 1c4 to rotate, the wire intercepted below the bottom end is pushed into the bottom end of the wire pressing wheel 1c6 again by the wire feeding wheel 1c43 on the motor shaft 1c4, the maintenance time is saved, the work efficiency is improved, and the damage to the processing of the material is avoided.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a hot pressing sintering machine for high-power semiconductor device encapsulation, its structure includes hot pressing sintering machine (1), access door (2), door (3), man-machine interface (4), radiator (5), hot pressing sintering machine (1) front end on be equipped with access door (2), hot pressing sintering machine (1) and access door (2) swing joint, hot pressing sintering machine (1) on the surface be equipped with door (3), hot pressing sintering machine (1) and door (3) pass through hinged joint, hot pressing sintering machine (1) side on install radiator (5), hot pressing sintering machine (1) front end on be equipped with man-machine interface (4) on the surface, its characterized in that:
the hot-pressing sintering machine (1) consists of a machine body (1a), a power supply device (1b), a PLC (programmable logic controller) (1c), a display (1d) and a hot-pressing furnace (1e), wherein the hot-pressing furnace (1e) is installed on the left side of the inside of the machine body (1a), the power supply device (1b) is arranged inside the machine body (1a), the machine body (1a) is connected with the power supply device (1b), the display (1d) is arranged at the front end inside the machine body (1a), the machine body (1a) is matched with the display (1d), the PLC (1c) is installed inside the machine body (1a), and the power supply device (1b) is electrically connected with the display (1d) through the PLC (1 c).
2. The hot-pressing sintering machine for packaging the high-power semiconductor device according to claim 1, characterized in that: the PLC programmable controller (1c) consists of a shell (1c1), a power supply terminal (1c2), a servo motor (1c3), a motor shaft (1c4), conductive terminals (1c5), a wire pressing wheel (1c6) and a wire bundling mechanism (1c7), wherein the surface of the shell (1c1) is provided with the power supply terminal (1c2), the left end and the right end of the shell (1c1) are respectively provided with the wire bundling mechanism (1c7), the shell (1c1) is in glue connection with the wire bundling mechanism (1c7), the left end and the right end of the shell (1c1) are respectively provided with the conductive terminals (1c5), the shell (1c1) is fixedly connected with the conductive terminals (1c5), the conductive terminals (1c5) are provided with the servo motor (1c3), the conductive terminals (6861 c 9) and the servo motor (1c2) are connected through a motor shaft (1c4), and the inner side of the wire pressing wheel (5) is arranged on the conductive terminals (1c 8653), the shell (1c1) and the wire pressing wheel (1c6) are in clearance fit.
3. The hot-pressing sintering machine for packaging the high-power semiconductor device according to claim 2, characterized in that: the motor shaft (1c4) comprises a shaft body (1c41), an external gear (1c42) and a wire feeding wheel (1c43), wherein the surface of the shaft body (1c41) is equidistantly provided with more than two wire feeding wheels (1c43), the shaft body (1c41) is fixedly connected with the wire feeding wheel (1c43), and the surface of the wire feeding wheel (1c43) is provided with the external gear (1c 42).
4. The hot-pressing sintering machine for packaging the high-power semiconductor device according to claim 3, characterized in that: the inner side of the external gear (1c42) is provided with an internal gear ring (g2), the external gear (1c42) and the internal gear ring (g2) are of an integrated structure, the surface of the wire feeding wheel (1c43) is provided with an external gear ring (g1), the wire feeding wheel (1c43) is fixedly connected with the external gear ring (g1), three linkage gears (g3) are arranged between the internal gear ring (g2) and the external gear ring (g1), and the internal gear ring (g2) is in transmission connection with the external gear ring (g1) through the linkage gears (g 3).
5. The hot-pressing sintering machine for packaging the high-power semiconductor device according to claim 2, characterized in that: the wire pressing wheel (1c6) consists of a wheel body (1c61), wire pressing arc plates (1c62), a first spring (1c63) and a fixing shaft (1c64), wherein the fixing shaft (1c64) is arranged in the middle of the wheel body (1c61), the wheel body (1c61) and the fixing shaft (1c64) are welded through electric welding, the inner side of the wheel body (1c61) is provided with the four wire pressing arc plates (1c62) at equal intervals, and the wheel body (1c61) is connected with the wire pressing arc plates (1c62) through the first spring (1c 63).
6. The hot-pressing sintering machine for packaging the high-power semiconductor device according to claim 2, characterized in that: the wire bundling mechanism (1c7) comprises a wire inserting frame (1c71), a second spring (1c72), a wire bundling column (1c73) and a push-pull rod (1c74), wherein the wire bundling column (1c73) is arranged inside the wire inserting frame (1c71), the wire inserting frame (1c71) and the wire bundling column (1c73) are in sliding fit through the second spring (1c72), the push-pull rod (1c74) is arranged on the surface of the wire bundling column (1c73), and the wire bundling column (1c73) and the push-pull rod (1c74) are connected through glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910888004.0A CN110690144A (en) | 2019-09-19 | 2019-09-19 | Hot-pressing sintering machine for packaging high-power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910888004.0A CN110690144A (en) | 2019-09-19 | 2019-09-19 | Hot-pressing sintering machine for packaging high-power semiconductor device |
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| Publication Number | Publication Date |
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| CN110690144A true CN110690144A (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910888004.0A Withdrawn CN110690144A (en) | 2019-09-19 | 2019-09-19 | Hot-pressing sintering machine for packaging high-power semiconductor device |
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| CN (1) | CN110690144A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238243A (en) * | 2020-03-11 | 2020-06-05 | 秦皇岛知聚科技有限公司 | Photodiode retrieves smelting pot |
| CN113380667A (en) * | 2021-04-29 | 2021-09-10 | 林超峰 | Hot-pressing sintering machine for packaging high-power semiconductor device |
-
2019
- 2019-09-19 CN CN201910888004.0A patent/CN110690144A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111238243A (en) * | 2020-03-11 | 2020-06-05 | 秦皇岛知聚科技有限公司 | Photodiode retrieves smelting pot |
| CN111238243B (en) * | 2020-03-11 | 2021-11-26 | 江苏烨明光电有限公司 | Photodiode retrieves smelting pot |
| CN113380667A (en) * | 2021-04-29 | 2021-09-10 | 林超峰 | Hot-pressing sintering machine for packaging high-power semiconductor device |
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Application publication date: 20200114 |
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