CN110682629A - Light bullet-resistant dot matrix sandwich plate and preparation method thereof - Google Patents

Light bullet-resistant dot matrix sandwich plate and preparation method thereof Download PDF

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Publication number
CN110682629A
CN110682629A CN201911093336.6A CN201911093336A CN110682629A CN 110682629 A CN110682629 A CN 110682629A CN 201911093336 A CN201911093336 A CN 201911093336A CN 110682629 A CN110682629 A CN 110682629A
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dot matrix
metal
pyramid
panel
metal panel
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刘长猛
徐田秋
黄俊锦
张浩锐
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Beijing University of Technology
Beijing Institute of Technology BIT
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Beijing University of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41—WEAPONS
    • F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
    • F41H5/00—Armour; Armour plates
    • F41H5/02—Plate construction
    • F41H5/04—Plate construction composed of more than one layer
    • F41H5/0414—Layered armour containing ceramic material
    • F41H5/0421—Ceramic layers in combination with metal layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2571/00—Protective equipment
    • B32B2571/02—Protective equipment defensive, e.g. armour plates, anti-ballistic clothing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a light bullet-resistant dot matrix sandwich plate and a preparation method thereof, and belongs to the technical field of material preparation. In the invention, the relative density needs to be improved when the elasticity resistance of the pure metal lattice sandwich plate is improved, but the metal (particularly steel) density is high, so that the cost for improving the relative density is higher, and the constraint action between the metal lattice and the ceramic filler can be utilized when the ceramic filler is filled in the metal lattice sandwich plate, so that the cost for improving the relative density is reduced while the elasticity resistance is improved, and the light elasticity resistance is realized.

Description

Light bullet-resistant dot matrix sandwich plate and preparation method thereof
Technical Field
The invention relates to the technical field of material preparation, in particular to a light anti-elastic dot matrix sandwich plate and a preparation method thereof.
Background
At present, in the field of elastic resistance and energy absorption, the elastic resistance and energy absorption capability of unit mass are improved mainly by using materials or porous structures. Lattice structures are one type of porous material. However, if a single metal lattice structure is required to improve the elastic resistance and energy absorption performance, the relative density is improved to a certain extent, and the elastic resistance and energy absorption capacity per unit mass is not obviously improved, i.e., a light-weight and elastic resistance plate is not taken into consideration in the prior art.
Disclosure of Invention
In view of the above, the present invention is directed to a light-weight and anti-elastic dot matrix sandwich panel and a method for manufacturing the same. The light anti-elastic dot matrix sandwich plate provided by the invention has both light and anti-elastic properties.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a light-weight bulletproof dot matrix sandwich plate which comprises an upper metal panel and a lower metal panel, wherein pyramid-shaped metal dot matrix cells are uniformly distributed between the upper metal panel and the lower metal panel, the lower surface of the upper metal panel is adhered to the upper surfaces of the pyramid-shaped metal dot matrix cells, the upper surface of the lower metal panel is adhered to the lower surfaces of the pyramid-shaped metal dot matrix cells, and gaps among the pyramid-shaped metal dot matrix cells, gaps among the upper metal panel and the lower metal panel are filled with ceramic fillers.
Preferably, the number of layers of the light bullet-resistant dot matrix sandwich plate is 2-4.
Preferably, the upper metal panel and the lower metal panel are made of titanium alloy.
Preferably, the distance between the centers of the pyramid-shaped metal lattice cells is 50-100 mm.
Preferably, the relative density of the pyramid-shaped metal lattice cells is 0.05-0.3.
The invention also provides a preparation method of the light bullet-resistant dot matrix sandwich plate in the technical scheme, which comprises the following steps:
performing arc 3D printing on the lower metal panel to obtain a pyramid-shaped metal dot matrix cell;
connecting the pyramid-shaped metal dot matrix cell with an upper metal panel by using electric arc 3D printing to obtain a semi-finished product;
and filling ceramic fillers in the gaps of the semi-finished product to obtain the light and elastic-resistant dot matrix sandwich plate.
Preferably, the specific process of performing arc 3D printing on the lower metal panel is as follows:
and performing arc 3D printing to obtain four inclined rods on the lower metal panel so as to form a pyramid-shaped metal dot matrix cell.
Preferably, the specific process of connecting the pyramid-shaped metal dot matrix cell and the upper metal panel by using arc 3D printing is as follows:
and preheating the upper end parts of the four inclined rods by using electric arcs to enable the upper end parts of the four inclined rods to be in a molten state to form nodes, then forming tapered holes in the upper metal panel, and matching the nodes with the tapered holes to realize the connection of the pyramid-shaped metal dot matrix cell elements and the upper metal panel.
Preferably, after the tapered hole is formed, the electric arc force is increased, and meanwhile, the machine tool moves along the circular track to enable the wire to be mechanically stirred, so that a molten pool can be fully spread out to form a deposition layer.
Preferably, the parameters when performing arc 3D printing on the lower metal panel include: the peak current in the initial stage is 250-300A, the duty ratio is 10-16%, the base current is 4-6A, the layer height is 0.3-0.6 mm, and the moving speed of the machine tool is 500-1000 cm/min.
The invention provides a light-weight bulletproof dot matrix sandwich plate which comprises an upper metal panel and a lower metal panel, wherein pyramid-shaped metal dot matrix cells are uniformly distributed between the upper metal panel and the lower metal panel, the lower surface of the upper metal panel is adhered to the upper surfaces of the pyramid-shaped metal dot matrix cells, the upper surface of the lower metal panel is adhered to the lower surfaces of the pyramid-shaped metal dot matrix cells, and gaps among the pyramid-shaped metal dot matrix cells, gaps among the upper metal panel and the lower metal panel are filled with ceramic fillers. In the invention, the relative density needs to be improved when the elasticity resistance of the pure metal lattice sandwich plate is improved, but the metal (particularly steel) density is high, so that the cost for improving the relative density is high, and the constraint action between the metal lattice and the ceramic filler can be utilized when the ceramic filler is filled in the metal lattice sandwich plate, so that the cost for improving the relative density is reduced while the elasticity resistance is improved, and the light elasticity resistance is realized. The data of the embodiment shows that the light bullet-resistant dot matrix sandwich plate provided by the application, wherein the thickness of the upper metal panel is 4mm, the thickness of the lower metal panel is 2mm, the thickness of the pyramid-shaped metal dot matrix cell is 23mm, and the length and width of the light bullet-resistant dot matrix sandwich plate are both 1m, compared with a solid titanium alloy plate which has the same mass and length and width but different thicknesses, the light bullet-resistant dot matrix sandwich plate has the advantages that the sandwich plate and a steel plate are equidistantly penetrated at the penetrating positions of 600m/s, the outgoing speed of the bullet is 237m/s for the sandwich plate, the ballistic limit is 440.26m/s, the outgoing speed of the bullet is 338m/s for the titanium alloy plate, the ballistic limit is 368.45m/s, and for the same incoming speed, the outgoing speed of the sandwich plate is obviously smaller, more kinetic energy of the bullet is converted into the internal energy of the sandwich plate, which shows that the bullet-resistant elastic energy per unit mass is obviously improved, the aim of light weight and elasticity resistance is achieved.
Furthermore, the invention also provides a preparation method of the light anti-elastic dot matrix sandwich plate, which is characterized in that the pyramid-shaped metal dot matrix cell is manufactured by using an electric arc 3D printing method, the material utilization rate is high, the manufacturing of the pyramid-shaped metal dot matrix cell can be efficiently completed at low cost, and the problems of low material utilization rate and high processing cost of the existing method for manufacturing the metal dot matrix sandwich plate are solved; the connection between the pyramid-shaped metal dot matrix cell and the upper metal panel is completed by using an electric arc 3D printing method, the connection quality is high, and the problems that in the prior art, a three-dimensional dot matrix interlocking process is combined with a brazing technology for manufacturing, a multi-layer sandwich structure cannot be prepared, and only single-layer sandwich can be prepared are solved.
Drawings
FIG. 1 is a schematic structural view of a light bullet-resistant lattice sandwich plate of the present invention, wherein 1 is a metal panel; 2 is pyramid type metal lattice cell, 3 is ceramic filler.
Detailed Description
The invention provides a light anti-elastic dot matrix sandwich plate which comprises an upper metal panel and a lower metal panel, wherein pyramid-shaped metal dot matrix cells are uniformly distributed between the upper metal panel and the lower metal panel, the lower surface of the upper metal panel is adhered to the upper surfaces of the pyramid-shaped metal dot matrix cells, the upper surface of the lower metal panel is adhered to the lower surfaces of the pyramid-shaped metal dot matrix cells, and gaps among the pyramid-shaped metal dot matrix cells, gaps among the upper metal panel and the lower metal panel are filled with ceramic fillers.
FIG. 1 is a schematic structural view of a light bullet-resistant lattice sandwich plate of the present invention, wherein 1 is a metal panel; 2 is pyramid type metal lattice cell, 3 is ceramic filler, the metal faceplate includes upper metal faceplate and lower metal faceplate.
In the invention, the number of layers of the light bullet-resistant lattice sandwich plate is preferably 2-4.
In the present invention, the upper metal panel and the lower metal panel are preferably made of titanium alloy.
In the present invention, the preferred pitch of the centers of the pyramid-shaped metal lattice cells is 50 to 100mm, and more preferably 75 to 98 mm.
In the present invention, the relative density of the pyramid-shaped metal lattice cells is preferably 0.05 to 0.3, and more preferably 0.14.
In the present invention, the material of the pyramid-shaped metal lattice cell is preferably titanium alloy.
In an embodiment of the present invention, the thickness of the upper metal panel is preferably 4mm, the thickness of the lower metal panel is preferably 2mm, the thickness of the pyramid-type metal lattice cell is preferably 23mm, or the thickness of the upper metal panel is 3mm, the thickness of the lower metal panel is 4mm, the thickness of the pyramid-type metal lattice cell is 30mm, and the length and the width are both 42 m.
The invention also provides a preparation method of the light bullet-resistant dot matrix sandwich plate in the technical scheme, which comprises the following steps:
performing arc 3D printing on the lower metal panel to obtain a pyramid-shaped metal dot matrix cell;
connecting the pyramid-shaped metal dot matrix cell with an upper metal panel by using electric arc 3D printing to obtain a semi-finished product;
and filling ceramic fillers in the gaps of the semi-finished product to obtain the light and elastic-resistant dot matrix sandwich plate.
According to the invention, arc 3D printing is carried out on the lower metal panel to obtain the pyramid type metal dot matrix cell. In the present invention, the specific process of performing arc 3D printing on the lower metal panel is preferably:
and performing arc 3D printing to obtain four inclined rods on the lower metal panel so as to form a pyramid-shaped metal dot matrix cell.
In the present invention, the parameters for performing arc 3D printing on the lower metal panel preferably include: the peak current in the initial stage is 250-300A, the duty ratio is 10-16%, the base current is 4-6A, the layer height is 0.3-0.6 mm, and the moving speed of the machine tool is 500-1000 cm/min. In the invention, after the arc 3D printing is carried out on the lower metal panel for 6-10 pulse periods, the peak current is preferably adjusted to be 90-110A, the duty ratio is 5%, the base current is 4-6A, the layer height is 0.3-0.6 mm, and the moving speed of a machine tool is 500-1000 cm/min.
In the invention, the wire feeding speed when the arc 3D printing is carried out on the lower metal panel is preferably 40 cm/min-100 cm/min, and is determined according to the required forming size.
According to the invention, arc 3D printing is utilized to connect the pyramid-shaped metal dot matrix cell and the upper metal panel to obtain a semi-finished product. In the present invention, the specific process of connecting the pyramid-shaped metal dot matrix cells and the upper metal panel by arc 3D printing is preferably as follows:
and preheating the upper end parts of the four inclined rods by using electric arcs to enable the upper end parts of the four inclined rods to be in a molten state to form nodes, then forming tapered holes in the upper metal panel, and matching the nodes with the tapered holes to realize the connection of the pyramid-shaped metal dot matrix cell elements and the upper metal panel.
In the invention, after the conical hole is opened, the electric arc force is preferably increased, and meanwhile, the machine tool moves along the circular track to mechanically stir wires, so that a molten pool can be fully spread out to form a deposition layer. In the present invention, the parameters after the node is matched with the tapered hole are preferably as follows: the peak current is 250-300A, the duty ratio is 18-22%, the base current is 10-15A, and the moving speed of the machine tool is 60 cm/min.
After a semi-finished product is obtained, the invention fills the ceramic filler in the gap of the semi-finished product to obtain the light bullet-resistant dot matrix sandwich board. The filling method of the present invention is not particularly limited, and may be a method known to those skilled in the art.
To further illustrate the present invention, the light-weight, spring-resistant dot matrix sandwich panel and the method for making the same are described in detail below with reference to examples, which should not be construed as limiting the scope of the invention.
Example 1
The light bullet-resistant dot matrix sandwich plate shown in fig. 1 comprises an upper metal panel and a lower metal panel, pyramid-shaped metal dot matrix cells are uniformly distributed between the upper metal panel and the lower metal panel, the upper metal panel, the lower metal panel and the pyramid-shaped metal dot matrix cells are made of titanium alloy, the lower surface of the upper metal panel is adhered to the upper surface of the pyramid-shaped metal dot matrix cells, the upper surface of the lower metal panel is adhered to the lower surface of the pyramid-shaped metal dot matrix cells, and gaps among the pyramid-shaped metal dot matrix cells, the upper metal panel and the lower metal panel are filled with ceramic fillers. Wherein the thickness of the upper metal panel is 4mm, the thickness of the lower metal panel is 2mm, the thickness of the pyramid-shaped metal lattice cell is 23mm, and the length and the width are 1 m; the distance between the centers of the pyramid-shaped metal lattice cells is 98mm, and the relative density of the pyramid-shaped metal lattice cells is 0.14.
The preparation process comprises the following steps:
the manufacturing method comprises the steps that firstly, a wire is sent out by a wire feeding nozzle at a constant wire feeding speed (60cm/min) in a base value time period, after the end part of the wire is stabbed into a molten pool, a hot wire loop is formed, the temperature of the wire can rise under the action of resistance heat, meanwhile, as the end part of the wire is stabbed into the molten pool, a part of heat can be transferred to the wire from the molten pool through heat conduction, at the moment, the end part of the wire can form local high temperature, after the end part of the wire is in a molten state, a necking phenomenon can occur at the liquid-solid phase interface under the action of self electromagnetic shrinkage force in the local melting section at the moment, when an electric arc of a peak current section comes, the effect of the electric arc on the molten pool can be generated, the wire is fused, the appearance of the molten pool is. After the additive materials are stacked in a plurality of periods, the inclined rod grows the pyramid-shaped preset growth path, and the process parameters comprise: the peak current is 280A in the initial stage, the duty ratio is 15%, the base current is 14A, the layer height is 0.55mm, the moving speed of the machine tool is 1000cm/min, the peak current is adjusted to be 100A after 9 pulse periods, the duty ratio is 5%, and other parameters are unchanged, shape control and controllability are achieved to obtain the optimal parameters. The order of the diagonal rods is based on the principle of no interference.
And then connecting the joints of the pyramid-shaped metal dot matrix cell units, preheating the end parts of the inclined rods by using electric arcs, so that the end parts of the four inclined rods are in a molten state, drilling holes on the upper metal panel, wherein the wire feeding points of the common round straight holes cannot be distributed in the whole hole, and in order to enable the wire feeding points under the tungsten electrode to reach any area of the hole, the connection can be realized by a mode of drilling the conical hole. Because the surface tension of liquid metal easily causes the polycondensation phenomenon, in case first layer molten bath does not fully spread out, the later molten bath also can grow on this basis, and the connection quality can be very poor, on the one hand through improving heat input, increase electric arc power, on the other hand lets the lathe follow circular path motion, and the process parameter includes: the peak current is 280A, the duty ratio is 20%, the base current is 14A, the moving speed of a machine tool is 60cm/min, and wires are mechanically stirred, so that a molten pool can be fully spread to form a deposition layer. The fabrication of the first layer of the matrix board is completed and then the fabrication of the second layer is performed on the upper panel.
When mass production is carried out, all pyramid type metal dot matrix cells are printed well, including connector connection, and finally, the connection between the nodes and the upper metal panel is carried out, so that the efficiency can be greatly improved.
And finally, filling gaps in the lattice sandwich plate with ceramic fillers.
In general, for a plate with ballistic resistance, it is desirable that the projectile has the same initial velocity v when ballistic resistance is desirediIncident light, its exit velocity vrThe smaller the better, i.e. the ballistic impact limit of the projectileThe larger the size, the better the penetration resistance of the plate. The ballistic resistance can be assessed using the following criteria: ballistic impact limit of the projectile. The greater the ballistic impact limit of the projectile, the better the ballistic performance.
Compared with the solid titanium alloy plate with the same mass, length and width but different thickness, the lightweight bullet-resistant dot matrix sandwich plate provided by the embodiment is subjected to equidistant penetration on the sandwich plate and the titanium alloy plate at the spherical projectile incidence speed of 600m/s, wherein the penetration positions are the central points of all plates. For the sandwich plate, the outgoing speed of the projectile is 237m/s, the ballistic limit is 440.26m/s, while for the titanium alloy plate, the outgoing speed of the projectile is 338m/s, and the ballistic limit is 368.45m/s, for the same incoming speed, the outgoing speed of the sandwich plate is obviously smaller, and the kinetic energy of the projectile is more converted into the internal energy of the sandwich plate, which shows that the ballistic resistance energy of unit mass is obviously improved, and the aim of light ballistic resistance is achieved.
Example 2
The light bullet-resistant dot matrix sandwich plate shown in fig. 1 comprises an upper metal panel and a lower metal panel, pyramid-shaped metal dot matrix cells are uniformly distributed between the upper metal panel and the lower metal panel, the upper metal panel, the lower metal panel and the pyramid-shaped metal dot matrix cells are made of titanium alloy, the lower surface of the upper metal panel is adhered to the upper surface of the pyramid-shaped metal dot matrix cells, the upper surface of the lower metal panel is adhered to the lower surface of the pyramid-shaped metal dot matrix cells, and gaps among the pyramid-shaped metal dot matrix cells, the upper metal panel and the lower metal panel are filled with ceramic fillers. Wherein the thickness of the upper metal panel is 3mm, the thickness of the lower metal panel is 4mm, the thickness of the pyramid-shaped metal lattice cell is 30mm, and the length and the width are 42 m; the distance between the centers of the pyramid-shaped metal lattice cells is 75mm, and the relative density of the pyramid-shaped metal lattice cells is 0.14.
The preparation process comprises the following steps:
the manufacturing method comprises the steps that firstly, a wire is sent out by a wire feeding nozzle at a constant wire feeding speed (60cm/min) in a base value time period, after the end part of the wire is stabbed into a molten pool, a hot wire loop is formed, the temperature of the wire can rise under the action of resistance heat, meanwhile, as the end part of the wire is stabbed into the molten pool, a part of heat can be transferred to the wire from the molten pool through heat conduction, at the moment, the end part of the wire can form local high temperature, after the end part of the wire is in a molten state, a necking phenomenon can occur at the liquid-solid phase interface under the action of self electromagnetic shrinkage force in the local melting section at the moment, when an electric arc of a peak current section comes, the effect of the electric arc on the molten pool can be generated, the wire is fused, the appearance of the molten pool is. After the additive is stacked in multiple cycles, the pyramid-shaped preset growth path is grown by the inclined rod, the process parameters comprise that the peak current is 280A in the initial stage, the duty ratio is 15%, the base current is 14A, the layer height is 0.55mm, the moving speed of a machine tool is 1000cm/min, the peak current is adjusted to be 100A after 9 pulse cycles, the duty ratio is 5%, and other parameters are unchanged, the shape and the controllability are controlled, so that the optimal parameters are obtained. The order of the diagonal rods is based on the principle of no interference.
And then connecting the joints of the pyramid-shaped metal dot matrix cell units, preheating the end parts of the inclined rods by using electric arcs, so that the end parts of the four inclined rods are in a molten state, drilling holes on the upper metal panel, wherein the wire feeding points of the common round straight holes cannot be distributed in the whole hole, and in order to enable the wire feeding points under the tungsten electrode to reach any area of the hole, the connection can be realized by a mode of drilling the conical hole. As the surface tension of liquid metal is easy to cause polycondensation, once the first layer of molten pool is not fully spread, the later molten pool can grow on the basis, the connection quality is poor, on one hand, the electric arc force is increased by improving the heat input, on the other hand, the machine tool is enabled to move along the circular track, the technological parameters comprise that the peak current is 280A, the duty ratio is 20%, the base current is 14A, the moving speed of the machine tool is 60cm/min, the wire is enabled to be mechanically stirred, so that the molten pool can be fully spread, and a deposition layer is formed. The fabrication of the first layer of the matrix board is completed and then the fabrication of the second layer is performed on the upper panel.
When mass production is carried out, all pyramid type metal dot matrix cells are printed well, including connector connection, and finally, the connection between the nodes and the upper metal panel is carried out, so that the efficiency can be greatly improved.
And finally, filling gaps in the lattice sandwich plate with ceramic fillers.
Compared with the solid titanium alloy plate with the same mass, length and width and different thickness, the light bullet-resistant dot matrix sandwich plate provided by the embodiment is penetrated equidistantly by spherical bullet incidence speed of 600m/s, and the penetration positions are the central points of all plates. For the sandwich plate, the outgoing speed of the projectile is 215m/s, the ballistic limit is 560.16m/s, while for the titanium alloy plate, the outgoing speed of the projectile is 304m/s, and the ballistic limit is 517.29m/s, for the same incoming speed, the outgoing speed of the sandwich plate is obviously smaller, and the kinetic energy of the projectile is more converted into the internal energy of the sandwich plate, which shows that the anti-elastic energy of unit mass is obviously improved, and the aim of light anti-elastic is achieved.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be construed as the protection scope of the present invention.

Claims (10)

1. The utility model provides a light bullet-resistant dot matrix sandwich board, its characterized in that, includes metal decking and lower metal decking, evenly distributed has pyramid type metal dot matrix cell element between metal decking and the lower metal decking, the lower surface of going up metal decking and the upper surface adhesion of pyramid type metal dot matrix cell element, the upper surface of metal decking and the lower surface adhesion of pyramid type metal dot matrix cell element down, between pyramid type metal dot matrix cell element, the space of pyramid type metal dot matrix cell element and last metal decking and lower metal decking is filled by ceramic packing.
2. The lightweight bulletproof dot matrix sandwich panel according to claim 1, wherein the number of layers of the lightweight bulletproof dot matrix sandwich panel is 2-4.
3. The lightweight spring-proof sandwich panel according to claim 1, wherein the upper and lower metal panels are made of titanium alloy.
4. The lightweight elastic lattice sandwich panel according to claim 1, wherein the distance between the centers of the pyramid-shaped metal lattice cells is 50-100 mm.
5. The lightweight elastic-resistant lattice sandwich panel according to claim 1 or 4, wherein the relative density of the pyramid-shaped metal lattice cells is 0.05-0.3.
6. The method for preparing a lightweight bulletproof dot matrix sandwich panel according to any one of claims 1 to 5, comprising the following steps:
performing arc 3D printing on the lower metal panel to obtain a pyramid-shaped metal dot matrix cell;
connecting the pyramid-shaped metal dot matrix cell with an upper metal panel by using electric arc 3D printing to obtain a semi-finished product;
and filling ceramic fillers in the gaps of the semi-finished product to obtain the light and elastic-resistant dot matrix sandwich plate.
7. The preparation method according to claim 6, wherein the arc 3D printing on the lower metal panel is carried out by the following specific process:
and performing arc 3D printing to obtain four inclined rods on the lower metal panel so as to form a pyramid-shaped metal dot matrix cell.
8. The method of claim 7, wherein the step of connecting the pyramid-shaped metal dot matrix cells to the upper metal panel by arc 3D printing comprises:
and preheating the upper end parts of the four inclined rods by using electric arcs to enable the upper end parts of the four inclined rods to be in a molten state to form nodes, then forming tapered holes in the upper metal panel, and matching the nodes with the tapered holes to realize the connection of the pyramid-shaped metal dot matrix cell elements and the upper metal panel.
9. The method according to claim 8, wherein after the tapering, the arc force is increased while the machine tool is moved along the circular path to mechanically stir the wire so that the molten pool is spread out sufficiently to form a deposit layer.
10. The method of claim 6, wherein the parameters for arc 3D printing on the lower metal panel include: the peak current in the initial stage is 250-300A, the duty ratio is 10-16%, the base current is 4-6A, the layer height is 0.3-0.6 mm, and the moving speed of the machine tool is 500-1000 cm/min.
CN201911093336.6A 2019-11-11 2019-11-11 Light bullet-resistant dot matrix sandwich plate and preparation method thereof Withdrawn CN110682629A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111922480A (en) * 2020-07-24 2020-11-13 中国航空工业集团公司沈阳飞机设计研究所 Method for connecting components
CN112590327A (en) * 2020-12-23 2021-04-02 南京工程学院 Ti/B4Preparation method of C ceramic and aluminum pyramid structure layer combined layered armor and pyramid structure layer
CN112848553A (en) * 2021-01-21 2021-05-28 北京理工大学 Reinforced single cell structure, preparation method and application thereof, and sandwich board
CN115157822A (en) * 2022-07-14 2022-10-11 北京理工大学 Gradient pyramid type dot matrix sandwich board and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111922480A (en) * 2020-07-24 2020-11-13 中国航空工业集团公司沈阳飞机设计研究所 Method for connecting components
CN112590327A (en) * 2020-12-23 2021-04-02 南京工程学院 Ti/B4Preparation method of C ceramic and aluminum pyramid structure layer combined layered armor and pyramid structure layer
CN112848553A (en) * 2021-01-21 2021-05-28 北京理工大学 Reinforced single cell structure, preparation method and application thereof, and sandwich board
CN115157822A (en) * 2022-07-14 2022-10-11 北京理工大学 Gradient pyramid type dot matrix sandwich board and preparation method thereof
CN115157822B (en) * 2022-07-14 2024-02-13 北京理工大学 Gradient pyramid type lattice sandwich board and preparation method thereof

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Application publication date: 20200114