CN110681835A - Continuous casting mold flux temperature control device - Google Patents
Continuous casting mold flux temperature control device Download PDFInfo
- Publication number
- CN110681835A CN110681835A CN201911125306.9A CN201911125306A CN110681835A CN 110681835 A CN110681835 A CN 110681835A CN 201911125306 A CN201911125306 A CN 201911125306A CN 110681835 A CN110681835 A CN 110681835A
- Authority
- CN
- China
- Prior art keywords
- thermocouple
- circuit
- signal
- heating
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/10—Supplying or treating molten metal
- B22D11/11—Treating the molten metal
- B22D11/111—Treating the molten metal by using protecting powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/16—Controlling or regulating processes or operations
- B22D11/18—Controlling or regulating processes or operations for pouring
- B22D11/181—Controlling or regulating processes or operations for pouring responsive to molten metal level or slag level
- B22D11/182—Controlling or regulating processes or operations for pouring responsive to molten metal level or slag level by measuring temperature
Abstract
The invention relates to a continuous casting mold flux temperature control device, which comprises a switching power supply, a thermocouple, a main control chip and a serial port communication circuit, wherein the switching power supply is connected with the thermocouple; the method is characterized in that: the thermocouple signal acquisition and heating conversion circuit, the signal amplification circuit, the AD acquisition circuit and the three voltage stabilizing circuits are arranged; the output end of the switching power supply is connected with the thermocouple heating circuit and the three voltage stabilizing circuits, the signal output of the thermocouple is connected with the signal amplification circuit, the output end of the signal amplification circuit is connected with the AD acquisition circuit, and the output end of the AD acquisition circuit is connected with the main control chip; the positive electrode and the negative electrode of the thermocouple heating circuit are respectively connected with the thermocouple 1 end and the thermocouple 2 end, and the PWM output end of the main control chip is connected with the switching power supply; the main control chip outputs high and low levels by controlling the PWM signal, switches the thermocouple heating and signal acquisition circuit, and performs thermocouple heating and signal acquisition. The invention has the advantages of low cost, simple operation, accurate lifting constant temperature and strong real-time property, and can meet the experimental requirements.
Description
Technical Field
The invention relates to a temperature control device for continuous casting mold flux, which is used for controlling the temperature rise and the temperature reduction of the mold flux and observing the crystallization process of the mold flux.
Background
The continuous casting covering slag is powder added on the surface of molten steel to help normal casting, and has the main functions of preventing secondary oxidation of the molten steel, insulating heat, absorbing non-metallic inclusions, improving heat transfer of a crystallizer and lubricating a casting blank. The selection of the mold flux has a great influence on the smooth running of the actual production, the surface quality of the casting blank and the subcutaneous quality, and the function of the mold flux in the continuous casting process is very important. The melting temperature and the melting speed of the continuous casting mold flux must be controllable, and the thickness of a molten slag layer and the formation of a slag film are closely related to the melting temperature and the melting speed. The method is very important for researching the crystallization process of the mold flux, the crystallization process of the mold flux at different rates has very high requirements on experimental instruments, and the traditional methods such as a microscope hemisphere method and a quenching method have very high prices of experimental equipment used by the methods. In addition, some traditional devices have various problems of inaccurate temperature control, unavailable set temperature, serious delay of temperature rising and reducing processes, time consumption and the like.
Disclosure of Invention
Aiming at the problems of higher cost and inaccurate control precision of the traditional equipment, the invention provides the continuous casting mold flux temperature control device which is low in cost, simple to operate, accurate in lifting constant temperature and strong in real-time performance and can meet the experimental requirements.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a continuous casting mold flux temperature control device comprises a switch power supply, a thermocouple, a main control chip and a serial port communication circuit; the thermocouple signal acquisition and heating conversion circuit, the signal amplification circuit, the AD acquisition circuit and the three voltage stabilizing circuits are arranged; the output end of the switching power supply is connected with the thermocouple heating circuit and the three voltage stabilizing circuits, the signal output of the thermocouple is connected with the signal amplification circuit, the output end of the signal amplification circuit is connected with the AD acquisition circuit, and the output end of the AD acquisition circuit is connected with the main control chip; the positive electrode and the negative electrode of the thermocouple heating circuit are respectively connected with the thermocouple 1 end and the thermocouple 2 end, and the PWM output end of the main control chip is connected with the switching power supply; the main control chip outputs high and low levels by controlling the PWM signal, switches the thermocouple heating and signal acquisition circuit, and performs thermocouple heating and signal acquisition.
Compared with the prior art, the invention adopting the technical scheme has the beneficial effects that:
by arranging the thermocouple signal acquisition and heating conversion circuit, the high-frequency switching between the thermocouple signal acquisition and the heating can be realized; the main control chip outputs PWM signals in a PID (proportion integration differentiation) regulation mode by comparing the set temperature value, and controls a thermocouple heating circuit so as to control the heating temperature of the thermocouple; the operation is simple, the lifting constant temperature is accurate, the real-time performance is strong, and the experimental requirements can be met.
Preferably, the present invention further comprises:
one switching cycle of thermocouple heating and signal acquisition is 5ms, wherein 4ms is a heating stage, and 1ms is a signal acquisition stage.
The output end of the switching power supply outputs +5V voltage to the thermocouple heating circuit and the three voltage stabilizing circuits respectively, the three voltage stabilizing circuits convert the +5V voltage into +12V, +3.3V and-5V respectively, wherein the +12V supplies power to a positive power supply of an instrumentation amplifier in the signal amplification circuit, the-5V supplies power to a negative power supply of the instrumentation amplifier, and the +3.3V supplies power to the main control chip and the serial port.
The thermocouple signal acquisition and heating conversion circuit is composed of resistors R5, R6 and R7, an MOS tube Q1, a triode Q2, a thermocouple, 1 switching power supply outputting +5V and 40A, one PWM output of the main control chip and +3.3V and +12V output by the voltage stabilizing circuit. When the device is in any state, the switching circuit is in the state of one of the signal acquisition or heating circuit. After the device is powered on and before the main control chip does not send the PWM signal, the device is in a signal acquisition stage, and the main control chip can switch the thermocouple signal acquisition and heating states by controlling the PWM signal.
The signal amplification circuit is composed of resistors R1, R3 and R4, capacitors C1 and C3, a thermocouple, an instrumentation amplifier chip AD8221 and +12V and-5V output by the voltage stabilizing circuit. When the thermocouple collects signals, the positive end and the negative end of the instrument amplifier are provided with +5V common mode voltage provided by a switching power supply, the amplifying circuit adopts a differential input mode, and the amplified signals are obtained by subtracting negative input voltage from positive input voltage; when the thermocouple is heated, the anode of the instrument amplifier is +5V, the cathode of the instrument amplifier is 0V, and the amplified signal is larger than 5V. The amplified signal passes through a following AD acquisition circuit, and the signal is clamped at about 3.5V.
The AD acquisition circuit consists of a resistor R2, a capacitor C2, 2 Schottky diodes VD1 and VD2 and +3.3V for stabilizing voltage output. When the voltage output by the signal amplifying circuit is larger than 3.5V or smaller than-0.2V, the circuit can clamp the voltage between-0.2V and 3.5V, so that the final AD output voltage is in a safety determined range. When the voltage output by the signal amplifying circuit is between-0.2V and 3.5V, the AD output voltage is the same as the voltage amplified by the signal amplifying circuit.
Drawings
FIG. 1 is a block diagram of a system architecture of an embodiment of the present invention;
FIG. 2 is a diagram of thermocouple signal acquisition and heating conversion circuitry, signal amplification circuitry, and AD acquisition circuitry;
FIG. 3 is a circuit diagram of +5V to + 12V;
FIG. 4 is a circuit diagram of +5V to-5V and + 3.3V;
fig. 5 is a serial communication circuit.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings and examples.
The continuous casting mold flux temperature control device comprises a 220VAC input, a switching power supply, an instrument amplifier, an MOS tube, a triode, a voltage stabilizing chip, an AD acquisition circuit, a master control chip, a thermocouple, a serial port and the like, wherein a signal amplification circuit is arranged between the thermocouple and the AD acquisition circuit, and the output end of the AD acquisition circuit is connected with the master control chip; the output end of the switching power supply is connected with a thermocouple heating circuit in the thermocouple signal acquisition and heating conversion circuit, and the anode and the cathode of the thermocouple heating circuit are respectively connected with the end 1 of the thermocouple and the end 2 of the thermocouple; the main control chip adopts STM32F103RBT6, and the PWM output end of main control chip connects switching power supply, and the main control chip realizes the switching of thermocouple heating and signal acquisition through control PWM signal output high-low level.
Specifically, the method comprises the following steps:
referring to fig. 1, the whole system is externally connected with a 220VAC power line to the switching power supply, and then the switching power supply outputs +5V to the voltage stabilizing circuit, as shown in fig. 3 and 4, +5V converts the voltage into +12V, +3.3V and-5V through three voltage stabilizing circuits, respectively, wherein +12V supplies power to the positive power supply of the instrumentation amplifier, -5V supplies power to the negative power supply of the amplifier, +3.3V supplies power for the main control chip and the serial port, and the pull-up of the transistor Q2 of fig. 2. In addition, when the thermocouple is in a heating stage, +5V is also used for heating the thermocouple, the maximum output current of the selected switching power supply can reach 40A, and sufficient output current is ensured to heat the thermocouple to more than 1500 ℃. The method is a conversion mode of a heating circuit and a signal acquisition circuit in periodic cycle, 5ms is 1 period, 4ms is a heating stage, 1ms is a signal acquisition stage, after a thermocouple is heated, a PWM signal is controlled by a main control chip to output high level, an MOS tube is conducted, the circuit is converted into the signal acquisition circuit, a thermoelectric voltage signal of the thermocouple at the moment is acquired, the acquired signal is amplified by a signal amplification circuit, and finally the thermoelectric voltage signal is converted into a digital signal by an ADC of the main control chip for processing. The main control chip converts the thermoelectric voltage signal into an actual temperature value through corresponding algorithm processing, compares the actual temperature value with a set temperature value, and finally outputs a PWM signal through a PID (proportion integration differentiation) regulation mode so as to control the heating of the thermocouple.
Referring to fig. 2, when no PWM control signal is input by controlling the transistor S8050 and the MOS transistor IRF3205, a current is generated at the base of the transistor Q2 due to the pull-up resistor R5, so that the transistor Q2 is in a conducting state, and due to the voltage division of the resistor R6, the collector equivalent to the Q2 is shorted with the GND terminal, and the collector voltage of the transistor Q2 is 0V. At the moment, the G end of the MOS tube Q1 is also 0V, the MOS tube is in a cut-off state, the positive electrode and the negative electrode of the thermocouple are all +5V voltage, and the circuit belongs to a thermocouple signal acquisition stage. When the PWM control signal is at a low level, the base electrode of the triode Q2 is 0V, the triode is in a cut-off state, the collector electrode of the Q2 is 12V, the G end of the MOS tube Q1 is also 12V, the MOS tube is conducted, the anode of the thermocouple is +5V, the cathode of the thermocouple is equivalently in short circuit with GND and is 0V, and the circuit belongs to the thermocouple heating stage. The conversion of the thermocouple signal acquisition and heating circuit can be controlled by controlling the PWM signal, and the resistor R7 has the function of limiting the current of the base.
As shown in fig. 2, the positive electrode of the thermocouple is connected to the thermocouple 1 end of fig. 1, the negative electrode is connected to the thermocouple 2 end of fig. 1, and R1 and R4 in the figure are input current limiting resistors, so that the damage to the instrumentation amplifier chip due to excessive input current is prevented. The resistors R1, R4 and C3 form an RC low-pass filter circuit which can effectively filter high-frequency noise, so that the input signal is more stable. When the circuit belongs to a signal acquisition stage, the 1 and 2 ends of the thermocouple are both +5V, so that the setting of the input bias voltage of the amplifier is met. In the signal amplifying circuit, a differential amplifying circuit is adopted, the differential amplifying circuit has good electrical symmetry and has strong inhibiting effect on common-mode signals and noise, and signals amplified by the signal amplifier are obtained by subtracting negative voltage from positive voltage of an input end. R3 is a gain resistor, and the amplification factor of the amplifier is set to 259 times. The positive pole of the amplifier uses a +12V power supply, the negative pole uses a-5V power supply, the two power supplies are obtained through a voltage stabilizing chip, the capacitor C1 is used for removing high-frequency noise of the power supplies, the voltage of the positive pole of the amplifier is more stable, and the reference voltage pin REF is directly connected to GND. The amplified signal is finally output from 7 pins.
As shown in fig. 2, the amplified thermoelectric voltage signal is finally acquired by the ADC of the main control chip, and then processed by a corresponding algorithm, and finally converted into the temperature of the thermocouple. The resistor R2 has three functions, namely, the resistor R2 is used as a current-limiting resistor to prevent the master control chip from being burnt out due to overlarge output current; a clamping circuit is formed by the main control circuit, the diodes VD1 and VD2, and the condition that the output voltage of the amplifier is overlarge and exceeds the upper limit of the ADC acquisition voltage is avoided, so that the main control chip is damaged; and thirdly, the capacitor C2 and the capacitor C2 form an RC low-pass filter circuit to filter high-frequency interference, so that the AD output voltage is more stable. The diodes VD1 and VD2 use 1N5819, which has a turn-on voltage of about 0.2V. When the thermocouple circuit belongs to a heating stage, the MOS tube Q1 is conducted, the anode input of the amplifier is +5V, the cathode input of the amplifier is 0V, the differential input voltage at the moment is not a thermoelectric potential signal of the thermocouple and belongs to abnormal voltage, and the Vout output voltage is larger than 5V. At the moment, VD1 is cut off, VD2 is conducted, the final AD output voltage is clamped to be about 3.5V through voltage division of R2 resistor and the characteristic of diode VD2, and ADC damage of the main control chip is effectively avoided. When the differential input voltage of the amplifying circuit is negative voltage, if the amplified Vout output voltage is less than-0.2V, VD1 is conducted, VD2 is cut off, and the final AD output voltage is clamped to be about-0.2V after the voltage is divided by the R2 resistor. The final AD output voltage can be clamped between-0.2V and 3.5V through the clamping circuit, and the damage to a main control chip caused by overhigh output voltage is effectively avoided.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the structure of the present invention in any way. Any simple modification, equivalent change and modification of the above embodiments according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (6)
1. A continuous casting mold flux temperature control device comprises a switch power supply, a thermocouple, a main control chip and a serial port communication circuit; the method is characterized in that: the thermocouple signal acquisition and heating conversion circuit, the signal amplification circuit, the AD acquisition circuit and the three voltage stabilizing circuits are arranged; the output end of the switching power supply is connected with the thermocouple heating circuit and the three voltage stabilizing circuits, the signal output of the thermocouple is connected with the signal amplification circuit, the output end of the signal amplification circuit is connected with the AD acquisition circuit, and the output end of the AD acquisition circuit is connected with the main control chip; the positive electrode and the negative electrode of the thermocouple heating circuit are respectively connected with the thermocouple 1 end and the thermocouple 2 end, and the PWM output end of the main control chip is connected with the switching power supply; the main control chip outputs high and low levels by controlling the PWM signal, switches the thermocouple heating and signal acquisition circuit, and performs thermocouple heating and signal acquisition.
2. The continuous casting mold flux temperature control device according to claim 1, characterized in that: one switching cycle of thermocouple heating and signal acquisition is 5ms, wherein 4ms is a heating stage, and 1ms is a signal acquisition stage.
3. The continuous casting mold flux temperature control device according to claim 1, characterized in that: the output end of the switching power supply outputs +5V voltage to the thermocouple heating circuit and the three voltage stabilizing circuits respectively, the three voltage stabilizing circuits convert the +5V voltage into +12V, +3.3V and-5V respectively, wherein the +12V supplies power to a positive power supply of an instrumentation amplifier in the signal amplification circuit, the-5V supplies power to a negative power supply of the instrumentation amplifier, and the +3.3V supplies power to the main control chip and the serial port.
4. The continuous casting mold flux temperature control device according to claim 1, characterized in that: the thermocouple signal acquisition and heating conversion circuit is composed of resistors R5, R6 and R7, an MOS tube Q1, a triode Q2, a thermocouple, 1 switching power supply outputting +5V and 40A, one PWM output of the main control chip and +3.3V and +12V output by the voltage stabilizing circuit.
5. The continuous casting mold flux temperature control device according to claim 1, characterized in that: the signal amplification circuit is composed of resistors R1, R3 and R4, capacitors C1 and C3, a thermocouple, an instrumentation amplifier chip AD8221 and +12V and-5V output by the voltage stabilizing circuit.
6. The continuous casting mold flux temperature control device according to claim 1, characterized in that: the AD acquisition circuit consists of a resistor R2, a capacitor C2, 2 Schottky diodes VD1 and VD2 and +3.3V for stabilizing voltage output.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911125306.9A CN110681835B (en) | 2019-11-18 | 2019-11-18 | Continuous casting mold flux temperature control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911125306.9A CN110681835B (en) | 2019-11-18 | 2019-11-18 | Continuous casting mold flux temperature control device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110681835A true CN110681835A (en) | 2020-01-14 |
CN110681835B CN110681835B (en) | 2023-09-08 |
Family
ID=69116948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911125306.9A Active CN110681835B (en) | 2019-11-18 | 2019-11-18 | Continuous casting mold flux temperature control device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110681835B (en) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05318092A (en) * | 1992-05-20 | 1993-12-03 | Kobe Steel Ltd | Detection of slag outflow |
JPH1151780A (en) * | 1997-08-05 | 1999-02-26 | Nippon Avionics Co Ltd | Heater temperature detector for pulse heat type bonding apparatus |
CN200996870Y (en) * | 2006-12-14 | 2007-12-26 | 冶金自动化研究设计院 | Intelligent steel water thermometric appliance |
CN201132375Y (en) * | 2007-11-14 | 2008-10-15 | 杭州科强智能控制系统有限公司 | Multiplex thermocouple signal switching device for controller of plastic jetting-moulding machine |
JP2008254017A (en) * | 2007-04-04 | 2008-10-23 | Jfe Steel Kk | Method and apparatus for diagnosing mold thermocouple in continuous casting facility |
JP2009079965A (en) * | 2007-09-26 | 2009-04-16 | Mitsuteru Kimura | Thermocouple heater and temperature measuring device using it |
CN102000801A (en) * | 2009-09-02 | 2011-04-06 | 江苏圆通汽车零部件有限责任公司 | Temperature control device for magnesium alloy wheel low-pressure casting mold |
CN203733011U (en) * | 2014-03-11 | 2014-07-23 | 陕西理工学院 | Thermocouple automatic temperature controller |
CN204052889U (en) * | 2014-07-14 | 2014-12-31 | 天津那诺机械制造有限公司 | A kind of control casts the immersion heater forging liquid taking port temperature |
KR101523495B1 (en) * | 2015-02-17 | 2015-05-28 | 김용규 | apparatus for controlling temperature, tester including the same and control method of the same |
CN105522145A (en) * | 2016-03-08 | 2016-04-27 | 洛阳理工学院 | Temperature-controlled heating system for molten-aluminum delivery packs |
CN106060975A (en) * | 2016-05-31 | 2016-10-26 | 郑州治世长云科技有限公司 | Electric heating/drying oven heating control system and control method |
CN106513615A (en) * | 2016-12-07 | 2017-03-22 | 重庆市合川区银窝铸造厂 | Temperature detecting circuit applied to low-temperature casting system |
CN206028682U (en) * | 2016-09-09 | 2017-03-22 | 武汉钢铁股份有限公司 | A constant temperature detection device that is used for continuous casting crystallizer covering slag heat -insulating property |
CN207557710U (en) * | 2017-11-02 | 2018-06-29 | 北京华亘安邦科技有限公司 | The temperature-adjusting circuit of heating chip based on itself thermometric |
CN109036073A (en) * | 2018-08-30 | 2018-12-18 | 中南大学 | A kind of devices and methods therefor that simulation thin belt continuous casting crystal roller surface oxidation film generates |
CN210848242U (en) * | 2019-11-18 | 2020-06-26 | 华北理工大学 | Continuous casting mold flux temperature control device |
-
2019
- 2019-11-18 CN CN201911125306.9A patent/CN110681835B/en active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05318092A (en) * | 1992-05-20 | 1993-12-03 | Kobe Steel Ltd | Detection of slag outflow |
JPH1151780A (en) * | 1997-08-05 | 1999-02-26 | Nippon Avionics Co Ltd | Heater temperature detector for pulse heat type bonding apparatus |
CN200996870Y (en) * | 2006-12-14 | 2007-12-26 | 冶金自动化研究设计院 | Intelligent steel water thermometric appliance |
JP2008254017A (en) * | 2007-04-04 | 2008-10-23 | Jfe Steel Kk | Method and apparatus for diagnosing mold thermocouple in continuous casting facility |
JP2009079965A (en) * | 2007-09-26 | 2009-04-16 | Mitsuteru Kimura | Thermocouple heater and temperature measuring device using it |
CN201132375Y (en) * | 2007-11-14 | 2008-10-15 | 杭州科强智能控制系统有限公司 | Multiplex thermocouple signal switching device for controller of plastic jetting-moulding machine |
CN102000801A (en) * | 2009-09-02 | 2011-04-06 | 江苏圆通汽车零部件有限责任公司 | Temperature control device for magnesium alloy wheel low-pressure casting mold |
CN203733011U (en) * | 2014-03-11 | 2014-07-23 | 陕西理工学院 | Thermocouple automatic temperature controller |
CN204052889U (en) * | 2014-07-14 | 2014-12-31 | 天津那诺机械制造有限公司 | A kind of control casts the immersion heater forging liquid taking port temperature |
KR101523495B1 (en) * | 2015-02-17 | 2015-05-28 | 김용규 | apparatus for controlling temperature, tester including the same and control method of the same |
CN105522145A (en) * | 2016-03-08 | 2016-04-27 | 洛阳理工学院 | Temperature-controlled heating system for molten-aluminum delivery packs |
CN106060975A (en) * | 2016-05-31 | 2016-10-26 | 郑州治世长云科技有限公司 | Electric heating/drying oven heating control system and control method |
CN206028682U (en) * | 2016-09-09 | 2017-03-22 | 武汉钢铁股份有限公司 | A constant temperature detection device that is used for continuous casting crystallizer covering slag heat -insulating property |
CN106513615A (en) * | 2016-12-07 | 2017-03-22 | 重庆市合川区银窝铸造厂 | Temperature detecting circuit applied to low-temperature casting system |
CN207557710U (en) * | 2017-11-02 | 2018-06-29 | 北京华亘安邦科技有限公司 | The temperature-adjusting circuit of heating chip based on itself thermometric |
CN109036073A (en) * | 2018-08-30 | 2018-12-18 | 中南大学 | A kind of devices and methods therefor that simulation thin belt continuous casting crystal roller surface oxidation film generates |
CN210848242U (en) * | 2019-11-18 | 2020-06-26 | 华北理工大学 | Continuous casting mold flux temperature control device |
Also Published As
Publication number | Publication date |
---|---|
CN110681835B (en) | 2023-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN210848242U (en) | Continuous casting mold flux temperature control device | |
CN108258650A (en) | A kind of current foldback circuit of low side driving | |
CN109343644A (en) | A kind of automatic adjustment current-limiting protection circuit | |
CN102412498A (en) | Temperature control system applicable to pump laser | |
CN205540381U (en) | Accurate excess temperature protection circuit of current feedback formula | |
CN106505961B (en) | The automatic gain control circuit of quick response | |
CN110681835B (en) | Continuous casting mold flux temperature control device | |
CN202710200U (en) | Space remote sensing CCD camera high-precision CCD temperature measurement circuit | |
CN102368164B (en) | Mode control circuit, semiconductor integrated circuit and audio processing circuit | |
CN102045044A (en) | Comparator and A/D converter | |
CN113050742B (en) | Precise constant current source circuit | |
CN103743934A (en) | High-precision high-side current detection circuit | |
CN106026940B (en) | A kind of DC bias circuit of trans-impedance amplifier | |
CN206302386U (en) | The automatic gain control circuit of quick response | |
CN107834837B (en) | A kind of start-up circuit with unstable state current limit | |
KR20110068613A (en) | Analog circuit with improved response speed feature | |
CN211015186U (en) | Voltage follower circuit | |
CN113364248B (en) | Output clamping circuit of DC-DC error amplifier | |
US9768630B2 (en) | Real time compensating power output charging circuit | |
CN105652070B (en) | A kind of differential signal amplitude detection circuit | |
WO2022056923A1 (en) | Constant current source sampling circuit and method | |
CN211905486U (en) | Low-cost electronic circuit for core-through closed-loop Hall current sensor | |
CN110224699B (en) | Analog-to-digital converter | |
CN105676939A (en) | Adjustable precise over-temperature protection circuit applied to wireless charging control chip | |
CN203590236U (en) | Automatic optical power control device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210120 Address after: 300384 No. 391 Binshui West Road, Xiqing District, Tianjin Applicant after: TIANJIN University OF TECHNOLOGY Address before: 063210 Tangshan City Caofeidian District, Hebei Province, Tangshan Bay eco Town, Bohai Road, 21 Applicant before: NORTH CHINA University OF SCIENCE AND TECHNOLOGY |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |