CN110678050A - Heat abstractor and fork truck controller - Google Patents
Heat abstractor and fork truck controller Download PDFInfo
- Publication number
- CN110678050A CN110678050A CN201911072233.1A CN201911072233A CN110678050A CN 110678050 A CN110678050 A CN 110678050A CN 201911072233 A CN201911072233 A CN 201911072233A CN 110678050 A CN110678050 A CN 110678050A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- heat
- heat dissipating
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 112
- 239000011229 interlayer Substances 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 101100028477 Drosophila melanogaster Pak gene Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F9/00—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes
- B66F9/06—Devices for lifting or lowering bulky or heavy goods for loading or unloading purposes movable, with their loads, on wheels or the like, e.g. fork-lift trucks
- B66F9/075—Constructional features or details
- B66F9/0759—Details of operating station, e.g. seats, levers, operator platforms, cabin suspension
Abstract
The invention provides a heat dissipation device and a forklift controller, which are used for dissipating heat of a circuit board and comprise a heat dissipation base and a heat dissipation shell which are buckled with each other, wherein an interlayer is arranged between the heat dissipation shell and the heat dissipation base, the circuit board is positioned in the interlayer, and the upper surface and the lower surface of the circuit board are respectively in direct contact with the surfaces of the heat dissipation shell and the heat dissipation base. The upper surface and the lower surface of the circuit board are simultaneously cooled through the cooling base and the cooling shell, so that the cooling efficiency of the circuit board is improved, the temperature of the circuit board can be effectively reduced, and the service life of the circuit board is prolonged. According to the forklift controller provided by the invention, the heat dissipation device is arranged in the forklift controller to dissipate heat of the circuit board, so that the temperature of the circuit board can be effectively reduced, and the working time of the forklift controller is prolonged.
Description
Technical Field
The invention relates to the technical field of controllers, in particular to a heat dissipation device and a forklift controller.
Background
The forklift controller is used for automatically processing signals input by various sensors of the forklift according to a preset program and then outputting the signals to various executive accessories so as to control the operation of the forklift. The forklift controller can be called a forklift control panel, a forklift circuit board, a forklift computer board, a forklift circuit board and the like, is mainly installed in a forklift, is a generally rectangular circuit board, and is provided with a forklift preset program system for controlling the starting, hydraulic pressure, steering, advancing, retreating, speed or stopping of the forklift. The forklift controller is provided with a plurality of power elements, and the power elements can generate larger current output when being switched on and switched off due to larger power required in the running process of the forklift, so that larger heat productivity is generated, and the peak power and the effective working time of the forklift controller are easily influenced. In the prior art, the forklift controller adopts a single-side heat dissipation structure, the heat dissipation efficiency is low, the forklift cannot continuously work for a long time, the carrying efficiency of the forklift is affected, and if the power element cannot be timely and quickly dissipated, the power element is extremely easy to damage, and the service life of the power element is greatly reduced.
Disclosure of Invention
The invention aims to provide a heat dissipation device and a forklift controller, which can improve the heat dissipation efficiency of the forklift controller and prolong the service life of the forklift controller.
In order to achieve the above object, the present invention provides a heat dissipation device for dissipating heat from a circuit board, comprising a heat dissipation base and a heat dissipation housing which are fastened together, wherein an interlayer is provided between the heat dissipation housing and the heat dissipation base, the circuit board is located in the interlayer, and the upper and lower surfaces of the circuit board are in direct contact with the surfaces of the heat dissipation housing and the heat dissipation base, respectively.
Optionally, the circuit board includes a circuit board and a plurality of power components disposed on the circuit board.
Optionally, a plurality of heat-conducting rubber pads are arranged between the circuit board and the heat-radiating shell.
Optionally, the upper surface of each power element is covered with one heat-conducting rubber pad.
Optionally, the heat-conducting rubber pad covers the upper surface of the circuit board as a whole.
Optionally, the circuit board is an aluminum substrate.
Optionally, the power element includes one or more of a bipolar transistor, a field effect transistor, or a thyristor.
Optionally, the cross-sectional shape of the side wall of the heat dissipation housing is corrugated.
Optionally, the base and the housing are made of metal, and the metal includes one or more of aluminum, copper, or iron.
Based on the structure, the invention also provides the forklift controller which comprises the circuit board and the heat dissipation device.
The heat dissipation device comprises a heat dissipation base and a heat dissipation shell which are buckled with each other, wherein an interlayer is arranged between the heat dissipation shell and the heat dissipation base, the circuit board is positioned in the interlayer, and the upper surface and the lower surface of the circuit board are respectively in direct contact with the surfaces of the heat dissipation shell and the heat dissipation base. The upper surface and the lower surface of the circuit board are simultaneously cooled through the cooling base and the cooling shell, so that the cooling efficiency of the circuit board is improved, the temperature of the circuit board can be effectively reduced, and the service life of the circuit board is prolonged. The invention further provides the forklift controller, the circuit board is cooled by arranging the cooling device in the forklift controller, the temperature of the circuit board can be effectively reduced, and the working time of the forklift controller is prolonged.
Drawings
Fig. 1 is a cross-sectional view of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is a perspective assembly view of a heat dissipation device according to an embodiment of the present invention;
wherein the reference numerals are:
10-a heat dissipation base; 20-a heat dissipation housing; 21-external interface; 30-a circuit board; 31-a circuit board; 32-power element.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
As shown in fig. 1 and fig. 2, the present embodiment provides a heat dissipation apparatus, which includes a heat dissipation base 10 and a heat dissipation housing 20, the heat dissipation housing 20 is fastened on the heat dissipation base 10, a gap is formed between an inner wall of the heat dissipation housing 20 and an upper surface of the heat dissipation base 10 to form an interlayer, a circuit board 30 is located in the interlayer, an upper surface of the circuit board 30 contacts with the inner wall of the heat dissipation housing 20, and a lower surface of the circuit board 30 contacts with the upper surface of the heat dissipation base 10, so as to simultaneously dissipate heat from an upper surface and a lower surface of the circuit board 30, thereby improving heat dissipation efficiency, and prolonging a service life of the circuit board 30. It can be understood that, by making the upper and lower surfaces of the circuit board 30 directly contact with the heat dissipation base 10 and the heat dissipation housing 20, the heat is not transferred through the air, but is dissipated through the heat dissipation base 10 and the heat dissipation housing 20 in a contact manner, because the contact heat dissipation is higher in heat dissipation efficiency than the air heat dissipation, the temperature of the circuit board 30 can be effectively reduced, and meanwhile, by simultaneously dissipating the heat to the upper and lower surfaces of the circuit board 30, the temperature of the circuit board 30 can be further reduced, and the service life of the circuit board is prolonged.
Specifically, referring to fig. 2, the shape of the heat dissipation base 10 includes, but is not limited to, a square shape, in this embodiment, a rounded corner is formed at a junction of two adjacent side walls of the square heat dissipation base 10, and a threaded hole is formed on the rounded corner so as to be in threaded connection with the heat dissipation housing 20. Meanwhile, a plurality of threaded holes are also formed in the contact surface between the heat dissipation base 10 and the circuit board 30, so that the circuit board 30 is fixed on the heat dissipation base 10. The heat dissipation base 10 is made of metal, which is because the metal has high thermal conductivity and high heat dissipation performance, so that the temperature of the circuit board 30 can be effectively reduced, the effective working time of the circuit board 30 can be prolonged, and the service life of the circuit board 30 can be further prolonged. The metal includes but is not limited to one of aluminum, copper or iron, and may be an alloy, and generally, the thermal conductivity of copper is due to aluminum, but copper is relatively expensive and has a large mass, and requires a high cost, and aluminum has a better thermal conductivity than iron, and has a lower cost, which is a preferred choice. In this embodiment, the heat dissipation base 10 is made of aluminum or aluminum alloy.
The shape and size of the heat dissipation housing 20 are matched with those of the heat dissipation base 10, the heat dissipation housing comprises four side faces which are sequentially connected in a tail-ending manner and top faces which are arranged at the tops of the four side faces, the four side faces and the top faces are encircled to form a semi-closed structure, and the heat dissipation housing 20 is buckled on the heat dissipation base 10 to be in contact with the circuit board 30. The heat dissipation 20 is provided with a plurality of external interfaces 21 on the housing, one end of the external interface 21 is electrically connected to the circuit board 30, and the other end is used for electrically connecting external devices so that the circuit board can output various signals. Similarly, the heat dissipation housing 20 may also be made of metal, such as aluminum or aluminum alloy, because the metal has a larger thermal conductivity than air and a higher heat dissipation efficiency, and the heat dissipation housing 20 and the heat dissipation base 10 dissipate heat from both sides of the circuit board 30, so that the heat of the circuit board 30 is transferred to the outside faster, and the working time of the circuit board is prolonged.
Referring to fig. 1 and 2, the cross-sectional shape of the sidewall of the heat dissipation housing 20 is corrugated to increase the heat dissipation area of the heat dissipation housing 20, thereby improving the heat dissipation efficiency of the circuit board 30. It can be understood that, the side wall of the heat dissipation housing 20 is provided with a plurality of grooves, and the grooves may be arranged along the horizontal direction, or may be arranged along the height direction, or even may be arranged at an angle with the surface of the circuit board 30, which is not limited in this application. Meanwhile, the plurality of grooves are arranged at equal intervals or unequal intervals, or the depth of the grooves can be the same or different, and the application does not limit the depth of the grooves, so long as the depth of the grooves is smaller than the thickness of the side wall of the heat dissipation shell 20. Of course, the number of grooves is not limited in this application. In this embodiment, the grooves are arranged around the side wall of the heat dissipation housing 20, and the grooves are arranged in the horizontal direction, that is, parallel to the upper surface of the heat dissipation housing 20, the shape and depth of each groove are the same, all grooves are parallel to each other, so that the heat dissipation area of the heat dissipation housing 20 is increased, and the beauty of the heat dissipation housing 20 is improved.
With reference to fig. 2, the circuit board includes a circuit board 31 and a plurality of power devices 32 disposed on the circuit board 31. In this embodiment, the circuit board 30 includes, for example, a plurality of chips, a plurality of semiconductor devices with different functions are disposed on the chips, and each semiconductor device includes a power element 32, in this embodiment, the power element 32 is a high power semiconductor device with a power greater than 360KW, and includes one or more of a bipolar transistor, a field effect transistor, or a thyristor, such as a tol, a D2PAK, a DPAK, and an LFPAK, and when the high power semiconductor device is in operation, a current passing through the high power semiconductor device is large, the high power semiconductor device is heated due to power loss, and an excessively high temperature shortens a lifetime of the high power semiconductor device, or even burns the high power semiconductor device.
The circuit board 31 is an aluminum substrate, and the power element 32 is disposed on the aluminum substrate. The aluminum substrate is a metal-based copper-clad plate with good heat conduction performance, and can accelerate the outward transfer of heat so as to improve the heat dissipation efficiency of the power element 32. In this embodiment, the aluminum substrate is a single-sided board, and includes a circuit layer, an insulating layer, and an aluminum-based layer stacked in sequence from top to bottom along a vertical direction, the power element 32 is disposed on the circuit layer, and the aluminum-based layer is in contact with the heat dissipation base 10. The lower surface of the power element 32 is generally welded on the circuit layer, heat generated when the power element 32 operates is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred out through the metal base layer, so that heat transfer to the power element 32 is realized, the metal base layer is in contact with the upper surface of the heat dissipation base 10 and dissipates heat through the heat dissipation base 10, heat dissipation efficiency is improved, and heat dissipation of the power element 32 is accelerated by arranging the power element 32 on the aluminum substrate. Of course, other metal-based heat dissipation plates may be used to connect the power elements 32, such as copper or iron substrates, and the application is not limited thereto.
A plurality of heat conductive rubber pads are disposed between the circuit board 30 and the heat dissipation housing 20. The heat conductive rubber pad is used for transferring heat generated by the circuit board 30 to the heat dissipation housing 20, so that heat dissipation of the circuit board 30 is accelerated, and the service life of the circuit board is prolonged. It should be noted that, in order to more clearly illustrate the technical solution of the present application, the circuit board 30 in fig. 1 and fig. 2 only shows a portion of the power element 32 on the circuit board 30, and it can be understood that the circuit board 30 is a partial schematic diagram, and the heat dissipation housing 20 corresponds to the portion of the power element 32, that is, the heat dissipation housing 20 is also a partial schematic diagram.
Further, one of the heat conductive adhesive pads is laid on the upper surface of one of the power elements 32, and the heat conductive adhesive pad is located at least between the upper surface of the power element 32 and the inner wall of the housing 20 to transfer the heat of the power element 32 to the housing 20. The thermal conductive rubber pad is a high-performance gap-filling thermal conductive material, has good viscosity and flexibility, and has excellent thermal conductivity, so that the air between the upper surface of the power element 32 and the inner wall of the heat dissipation shell 20 can be completely exhausted in use, the power element 32 and the heat dissipation shell 20 are in full contact, and the heat dissipation effect of the power element 32 is improved. It is understood that the thermal conductive adhesive pads may be cut according to the shape of the power components 32, such that one thermal conductive adhesive pad is laid on the upper surface of one power component 32, so as to dissipate heat of the power component 32. Alternatively, the heat conductive rubber pad may be one, and may be directly laid on and cover the upper surface of the circuit board 30, which is not limited in this application. In addition, the present embodiment is not limited to the heat conductive rubber pad, and may also be a structure capable of realizing heat conduction, such as a heat conductive film, a heat conductive strip, and the like.
Based on this, this embodiment still provides a fork truck controller, include the circuit board reaches heat abstractor, the circuit board set up in heat abstractor is in order to dispel the heat to the circuit board.
Specifically, the forklift controller is, for example, an electric forklift controller, the electric forklift controller controls the motor to work according to set direction, speed, angle and response time through the active work of the integrated circuit, so that the electric forklift has the advantages of wider application range, higher output efficiency, smaller noise and the like, the working temperature and the heat dissipation efficiency of the circuit board 30 directly influence the working efficiency of the electric forklift, and the heat dissipation device is arranged in the forklift controller, so that the temperature of the forklift controller can be greatly reduced, and the working time of the forklift controller is prolonged.
To sum up, the embodiment of the present invention provides a heat dissipation apparatus for dissipating heat from a circuit board, including a heat dissipation base and a heat dissipation housing that are fastened together, wherein an interlayer is disposed between the heat dissipation housing and the heat dissipation base, the circuit board is disposed in the interlayer, and the upper and lower surfaces of the circuit board are in direct contact with the surfaces of the heat dissipation housing and the heat dissipation base, respectively. The upper surface and the lower surface of the circuit board are simultaneously radiated by the radiating base and the radiating shell, the aluminum substrate with high heat conductivity coefficient is arranged between the radiating base and the power element, and the heat-conducting rubber pad for heat conduction is arranged between the radiating shell and the power element, so that the radiating efficiency of the circuit board is improved, the temperature of the circuit board can be effectively reduced, and the service life of the forklift controller is prolonged. The embodiment of the invention also provides the forklift controller, and the heat dissipation device is arranged in the forklift controller, so that the temperature of the circuit board can be reduced, and the working time of the forklift controller can be prolonged.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A heat dissipation device is used for dissipating heat of a circuit board and is characterized by comprising a heat dissipation base and a heat dissipation shell which are mutually buckled, wherein an interlayer is arranged between the heat dissipation shell and the heat dissipation base, the circuit board is positioned in the interlayer, and the upper surface and the lower surface of the circuit board are respectively in direct contact with the surfaces of the heat dissipation shell and the heat dissipation base.
2. The heat dissipating device of claim 1, wherein the circuit board comprises a circuit board and a plurality of power components disposed on the circuit board.
3. The heat dissipating device of claim 2, wherein a plurality of thermally conductive adhesive pads are disposed between said circuit board and said heat dissipating housing.
4. The heat dissipating device of claim 3, wherein an upper surface of each of said power components is covered with one of said thermally conductive adhesive pads.
5. The heat dissipating device of claim 3, wherein the thermally conductive adhesive pad entirely covers the upper surface of the circuit board.
6. The heat dissipating device of claim 2, wherein the circuit board is an aluminum substrate.
7. The heat dissipation device of claim 2, wherein the power element comprises one or more of a bipolar transistor, a field effect transistor, or a thyristor.
8. The heat dissipating device of claim 1, wherein the side walls of the heat dissipating housing are corrugated in cross-sectional shape.
9. The heat dissipating device of claim 1, wherein the heat dissipating base and the heat dissipating housing are made of a metal, and the metal comprises one or more of aluminum, copper, or iron.
10. A forklift controller comprising a circuit board and the heat dissipating device of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911072233.1A CN110678050A (en) | 2019-11-05 | 2019-11-05 | Heat abstractor and fork truck controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911072233.1A CN110678050A (en) | 2019-11-05 | 2019-11-05 | Heat abstractor and fork truck controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110678050A true CN110678050A (en) | 2020-01-10 |
Family
ID=69085960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911072233.1A Pending CN110678050A (en) | 2019-11-05 | 2019-11-05 | Heat abstractor and fork truck controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110678050A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2075993A1 (en) * | 2007-07-02 | 2009-07-01 | Huawei Technologies Co., Ltd. | A mobile terminal preventing temperature rising of user-sensitive surface |
| CN101500398A (en) * | 2008-11-05 | 2009-08-05 | 北京华凯汇信息科技有限公司 | Heat radiation structure for motor driver |
| CN202839585U (en) * | 2012-08-21 | 2013-03-27 | 昆山美博通讯科技有限公司 | Heat radiation structure for power amplification module |
| CN202857197U (en) * | 2012-11-09 | 2013-04-03 | 谢俊福 | Electronic circuit board waterproof and heat radiating device |
| CN106455373A (en) * | 2016-11-04 | 2017-02-22 | 无锡康博瑞特电子科技有限公司 | Electric vehicle controller |
| CN207070484U (en) * | 2017-05-22 | 2018-03-02 | 广州金升阳科技有限公司 | Aluminum alloy base, upper plastic cover and modular power source |
-
2019
- 2019-11-05 CN CN201911072233.1A patent/CN110678050A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2075993A1 (en) * | 2007-07-02 | 2009-07-01 | Huawei Technologies Co., Ltd. | A mobile terminal preventing temperature rising of user-sensitive surface |
| CN101500398A (en) * | 2008-11-05 | 2009-08-05 | 北京华凯汇信息科技有限公司 | Heat radiation structure for motor driver |
| CN202839585U (en) * | 2012-08-21 | 2013-03-27 | 昆山美博通讯科技有限公司 | Heat radiation structure for power amplification module |
| CN202857197U (en) * | 2012-11-09 | 2013-04-03 | 谢俊福 | Electronic circuit board waterproof and heat radiating device |
| CN106455373A (en) * | 2016-11-04 | 2017-02-22 | 无锡康博瑞特电子科技有限公司 | Electric vehicle controller |
| CN207070484U (en) * | 2017-05-22 | 2018-03-02 | 广州金升阳科技有限公司 | Aluminum alloy base, upper plastic cover and modular power source |
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Application publication date: 20200110 |