CN110677996A - Spacer disc design method and system based on Allegro software - Google Patents
Spacer disc design method and system based on Allegro software Download PDFInfo
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- CN110677996A CN110677996A CN201910866937.XA CN201910866937A CN110677996A CN 110677996 A CN110677996 A CN 110677996A CN 201910866937 A CN201910866937 A CN 201910866937A CN 110677996 A CN110677996 A CN 110677996A
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- speed differential
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Abstract
The invention discloses a method and a system for designing an isolation disc based on Allegro software. The invention relates to an isolating disc design method based on Allegro software, which is characterized by comprising the following steps of: s11, capturing coordinates of the high-speed differential signal via holes through Allegro software; s12, detecting different wiring leading-out layers of the high-speed differential signal; and S13, automatically drawing corresponding isolation disc graphs according to the coordinates of the captured high-speed differential signal via holes and the detected reference layers where the different wiring leading-out layers are located. The invention realizes automatic coordinate capture of the through hole required to be subjected to impedance control in the design of a high-speed and high-density backboard or plug-in board, draws a corresponding shared isolation disc according to requirements, automatically judges the adjacent reference plane of a signal line, and draws the isolation disc with a signal line protection structure meeting the design requirements, thereby solving the problems of low manual drawing efficiency and easy error of the traditional design scheme.
Description
Technical Field
The invention relates to the technical field of PCB design software, in particular to a method and a system for designing an isolation disc based on Allegro software.
Background
The creator of the printed circuit board was the aldrich Paul Eisler, who first used the printed circuit board in the radio in 1936. Printed wiring boards have begun to be widely used since the mid-50 s of the 20 th century. Before the advent of PCBs, interconnections between electronic components were made by direct wire connections. Today, however, electrical wires exist for laboratory testing applications only; printed circuit boards have certainly occupied the absolute control in the electronics industry.
With the development of electronic technology, the number of layers of the PCB is more and more, and a conventional PCB is connected with at least two signal layers through holes; meanwhile, the internal interference is more serious, which is not beneficial to the transmission of key signals. The differential line pair operates on the principle that the received signal is equal to the difference between two complementary signals that are referenced to each other, thereby greatly reducing the electrical noise effect of the signals. With the development of high frequency and high speed of signals, PCB signal routing also affects
In the process of designing a high-speed and high-performance PCB, a large number of high-speed serial link interconnections are applied, and in order to enable the channel characteristics of a transmission link to meet the design requirements of relevant specifications, technical means such as an impedance control through hole and the like become a loop which must be realized in the PCB design.
In the existing high-speed PCB design process, all the separation discs needing impedance control through holes need to be called out one by one and manually drawn one by one according to the actual wiring condition. The design of high-speed and high-density back boards or plug-in boards is time-consuming, labor-consuming and easy to miss.
Disclosure of Invention
The invention aims to provide a method and a system for designing an isolation disc based on Allegro software, aiming at the defects of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
an isolated disk design method based on Allegro software comprises the following steps:
s1, capturing coordinates of high-speed differential signal via holes through Allegro software;
s2, detecting different wiring leading-out layers of the high-speed differential signal;
and S3, automatically drawing corresponding isolation disc graphs according to the coordinates of the captured high-speed differential signal via holes and the detected reference layers where the different wiring leading-out layers are located.
Further, the coordinates of the high-speed differential signal via captured in step S1 are captured by Anti-etc. in the Allegro software.
Further, what is captured in the coordinates of the high-speed differential signal via in the step S1 is the high-speed differential via coordinates that need to be controlled by using impedance.
Further, the drawing of the corresponding antipad pattern in step S3 is specifically an antipad pattern protected by the impedance of the signal transmission line in the reference layer where the high-speed differential signal is located.
Further, the step S3 includes using a differential via antipad pattern on the reference layer where the non-high speed differential signal is located.
Correspondingly, an isolated disk design system based on Allegro software is further provided, and comprises:
the grabbing module is used for grabbing the coordinates of the high-speed differential signal via holes through Allegro software;
the detection module is used for detecting different wiring leading-out layers of the high-speed differential signal;
and the drawing module is used for automatically drawing the corresponding isolation disc graph according to the coordinate of the captured high-speed differential signal via hole and the detected reference layer where the different wiring leading-out layers are located.
Furthermore, the coordinates of the high-speed differential signal via holes in the grabbing module are grabbed through Anti-Etc in Allegro software.
Furthermore, the coordinates of the high-speed differential signal via holes in the grabbing module are grabbed by the coordinates of the high-speed differential via holes which need to be controlled by impedance.
Furthermore, the drawing module draws a corresponding isolation pad pattern, specifically, an isolation pad pattern protected by a signal transmission line impedance is used in a reference layer where the high-speed differential signal is located.
Furthermore, the drawing module further comprises a differential via isolation disc graph used in a reference layer where the non-high-speed differential signal is located.
Compared with the prior art, the invention realizes the automatic coordinate capture of the through hole required to be subjected to impedance control in the design of the high-speed and high-density backboard or the plug-in board, draws the corresponding shared isolation disc according to the requirement, automatically judges the adjacent reference plane of the signal line and draws the isolation disc with the signal line protection structure meeting the design requirement, and solves the problems of low manual drawing efficiency and easy error of the traditional design scheme.
Drawings
Fig. 1 is a flowchart of an isolated disk design method based on Allegro software according to an embodiment;
FIG. 2 is a diagram of a processing graph without interconnect default layer according to an embodiment;
FIG. 3 is a schematic diagram of a process diagram with interconnections between adjacent signal layers according to one embodiment;
FIG. 4 is a schematic view of a processing diagram of a back-drilled through layer according to an embodiment;
fig. 5 is a structural diagram of an isolated disk design system based on Allegro software according to the second embodiment.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
The invention aims to provide an isolating disc design method and system based on Allegro software aiming at the defects of the prior art.
Example one
An isolated disk design method based on Allegro software is shown in FIG. 1, and comprises the following steps:
s11, capturing coordinates of the high-speed differential signal via holes through Allegro software;
s12, detecting different wiring leading-out layers of the high-speed differential signal;
and S13, automatically drawing corresponding isolation disc graphs according to the coordinates of the captured high-speed differential signal via holes and the detected reference layers where the different wiring leading-out layers are located.
In step S11, the coordinates of the high-speed differential signal via are captured.
In the embodiment, the coordinates of the high-speed differential signal via holes are captured through Anti-Etc in Allegro software.
The Allegro software is drawing board software and is mainly used on large-scale boards such as a computer mainboard and optical fiber communication.
Anti-Etc is a line that divides the PCB into different areas for dividing the power plane.
And automatically capturing the coordinates of the high-speed differential signal via holes through an Anti-Etc layer in Allegro software.
In the present embodiment, what is captured in the coordinates of the high-speed differential signal via is the high-speed differential via coordinates that require the use of impedance control.
Impedance control, there are various signal transmission in the conductor in the circuit board, must raise its frequency in order to raise its transmission rate, if the circuit itself will cause the impedance value to change because of different factors such as etching, lamination thickness, wire width, etc., make its signal distortion. Therefore, the impedance value of the conductor on the high-speed circuit board should be controlled within a certain range, which is called "impedance control". The purpose of impedance control is to try to ensure that the instantaneous impedance experienced during signal propagation is constant, thereby reducing reflections. The importance in high speed interconnect design is self evident.
In this embodiment, the coordinates for grabbing the high-speed differential signal via holes are specifically:
firstly, activating an extension program in Allegro software, using a mouse to frame a pair of differential via holes needing to be processed, and then reading the coordinates and related information of the selected differential via holes by the extension program through a function in the Allegro software. And the expansion program classifies and arranges the via hole interconnection information.
In step S12, different wiring lead-out layers of the high-speed differential signal are detected.
In this embodiment, different wiring extraction layers of the high-speed differential signal are detected by Allegro software.
The application of differential signals in the design of high-speed circuits is more and more extensive, the differential lines are mostly the most critical signals in the circuits, and the quality of the differential line wiring directly influences the signal quality of the PCB. The differential lines generally need to be subjected to impedance control, particularly, the impedance of the differential lines of each layer to be carried out in the multilayer board needs to be calculated and controlled during design, otherwise, the adjustment of only a PCB (printed circuit board) manufacturer is very troublesome, and the PCB manufacturer has no way to adjust the required impedance in many cases.
In this embodiment, the different wiring extraction layers for detecting the high-speed differential signal are specifically:
after the expansion program classifies and sorts the via interconnection information, extracting differential via information, and classifying reference layers where all differential signals are located according to the sequence from the TOP layer to the Bottom layer; further judging whether the differential via hole is an interconnection layer, if so, identifying an adjacent power supply or stratum as a special processing layer; if not, the default layer is set.
In step S13, automatically drawing a corresponding antipad pattern according to the captured coordinates of the high-speed differential signal via and the detected reference layer where the different wiring lead-out layers are located.
Drawing a corresponding isolation disc graph, specifically an isolation disc graph protected by using signal transmission line impedance on a reference layer where a high-speed differential signal is located; and a differential via antipad pattern is used on a reference layer where the non-high-speed differential signals are positioned.
Specifically, a designer specifies the depth and direction of the back drilling, the power supply or the stratum removed by the back drilling is set as a non-processing layer according to the depth and direction of the back drilling specified by the designer, and all the power supplies or the strata are processed layer by layer according to the set identification.
FIG. 2 illustrates a non-interconnect default layer processing graph; FIG. 3 illustrates a process diagram with interconnections between adjacent signal layers; fig. 4 shows a processing pattern for back-drilling through a layer.
In this embodiment, a Cadence skip language package can be used to design a third-party plug-in to implement a high-speed differential via layered isolation disk.
The embodiment realizes automatic coordinate capture of the through holes needing impedance control in the design of the high-speed and high-density backboard or plug-in board, draws the corresponding shared isolation disc according to the requirement, automatically judges the adjacent reference planes of the signal lines, draws the isolation disc with the signal line protection structure meeting the design requirement, and solves the problems of low efficiency and easy error in manual drawing of the traditional design scheme.
Example two
An isolated disk design system based on Allegro software, as shown in fig. 5, includes:
the grabbing module 11 is used for grabbing the coordinates of the high-speed differential signal via holes through Allegro software;
the detection module 12 is used for detecting different wiring leading-out layers of the high-speed differential signal;
and the drawing module 13 is used for automatically drawing the corresponding isolation disc graph according to the coordinate of the captured high-speed differential signal via hole and the detected reference layer where the different wiring leading-out layers are located.
In the grasping module 11, coordinates of the high-speed differential signal via are grasped.
In the embodiment, the coordinates of the high-speed differential signal via holes are captured through Anti-Etc in Allegro software.
The Allegro software is drawing board software and is mainly used on large-scale boards such as a computer mainboard and optical fiber communication.
Anti-Etc is a line that divides the PCB into different areas for dividing the power plane.
And automatically capturing the coordinates of the high-speed differential signal via holes through an Anti-Etc layer in Allegro software.
In the present embodiment, what is captured in the coordinates of the high-speed differential signal via is the high-speed differential via coordinates that require the use of impedance control.
Impedance control, there are various signal transmission in the conductor in the circuit board, must raise its frequency in order to raise its transmission rate, if the circuit itself will cause the impedance value to change because of different factors such as etching, lamination thickness, wire width, etc., make its signal distortion. Therefore, the impedance value of the conductor on the high-speed circuit board should be controlled within a certain range, which is called "impedance control". The purpose of impedance control is to try to ensure that the instantaneous impedance experienced during signal propagation is constant, thereby reducing reflections. The importance in high speed interconnect design is self evident.
In this embodiment, the coordinates for grabbing the high-speed differential signal via holes are specifically:
firstly, activating an extension program in Allegro software, using a mouse to frame a pair of differential via holes needing to be processed, and then reading the coordinates and related information of the selected differential via holes by the extension program through a function in the Allegro software. And the expansion program classifies and arranges the via hole interconnection information.
In the detection block 12, different wiring lead-out layers of the high-speed differential signal are detected.
In this embodiment, different wiring extraction layers of the high-speed differential signal are detected by Allegro software.
The application of differential signals in the design of high-speed circuits is more and more extensive, the differential lines are mostly the most critical signals in the circuits, and the quality of the differential line wiring directly influences the signal quality of the PCB. The differential lines generally need to be subjected to impedance control, particularly, the impedance of the differential lines of each layer to be carried out in the multilayer board needs to be calculated and controlled during design, otherwise, the adjustment of only a PCB (printed circuit board) manufacturer is very troublesome, and the PCB manufacturer has no way to adjust the required impedance in many cases.
In this embodiment, the different wiring extraction layers for detecting the high-speed differential signal are specifically:
after the expansion program classifies and sorts the via interconnection information, extracting differential via information, and classifying reference layers where all differential signals are located according to the sequence from the TOP layer to the Bottom layer; further judging whether the differential via hole is an interconnection layer, if so, identifying an adjacent power supply or stratum as a special processing layer; if not, the default layer is set.
And in the drawing module 13, automatically drawing a corresponding isolation disc graph according to the coordinate of the captured high-speed differential signal via hole and the detected reference layer where the different wiring leading-out layers are located.
Drawing a corresponding isolation disc graph, specifically an isolation disc graph protected by using signal transmission line impedance on a reference layer where a high-speed differential signal is located; and a differential via antipad pattern is used on a reference layer where the non-high-speed differential signals are positioned.
Specifically, a designer specifies the depth and direction of the back drilling, the power supply or the stratum removed by the back drilling is set as a non-processing layer according to the depth and direction of the back drilling specified by the designer, and all the power supplies or the strata are processed layer by layer according to the set identification.
The embodiment realizes automatic coordinate capture of the through holes needing impedance control in the design of the high-speed and high-density backboard or plug-in board, draws the corresponding shared isolation disc according to the requirement, automatically judges the adjacent reference planes of the signal lines, draws the isolation disc with the signal line protection structure meeting the design requirement, and solves the problems of low efficiency and easy error in manual drawing of the traditional design scheme.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. An isolated disk design method based on Allegro software is characterized by comprising the following steps:
s1, capturing coordinates of high-speed differential signal via holes through Allegro software;
s2, detecting different wiring leading-out layers of the high-speed differential signal;
and S3, automatically drawing corresponding isolation disc graphs according to the coordinates of the captured high-speed differential signal via holes and the detected reference layers where the different wiring leading-out layers are located.
2. The method for designing the insulated disk based on the Allegro software as claimed in claim 1, wherein the coordinates of the high-speed differential signal via holes captured in the step S1 are captured by Anti-Etc in the Allegro software.
3. The method for designing the separation disc based on the Allegro software as claimed in claim 1 or 2, wherein the coordinates of the high-speed differential signal via captured in the step S1 are the coordinates of the high-speed differential via requiring impedance control.
4. The method according to claim 3, wherein the drawing of the corresponding antipad pattern in step S3 is specifically performed by using an antipad pattern protected by a signal transmission line impedance in a reference layer where the high-speed differential signal is located.
5. The method according to claim 4, wherein the step S3 further comprises using a differential via antipad pattern in a reference layer where the non-high-speed differential signals are located.
6. An isolated disk design system based on Allegro software, comprising:
the grabbing module is used for grabbing the coordinates of the high-speed differential signal via holes through Allegro software;
the detection module is used for detecting different wiring leading-out layers of the high-speed differential signal;
and the drawing module is used for automatically drawing the corresponding isolation disc graph according to the coordinate of the captured high-speed differential signal via hole and the detected reference layer where the different wiring leading-out layers are located.
7. The insulated disk design system based on Allegro software as claimed in claim 6, wherein the coordinates of the high-speed differential signal via holes captured in the capture module are captured by Anti-Etc in Allegro software.
8. The system according to claim 6 or 7, wherein the coordinates of the high-speed differential signal via holes in the grabbing module are grabbed by using the coordinates of the high-speed differential through holes requiring impedance control.
9. The system according to claim 8, wherein the drawing module draws the corresponding antipad pattern, specifically, the antipad pattern protected by the impedance of the signal transmission line in the reference layer where the high-speed differential signal is located.
10. The system according to claim 9, wherein the drawing module further comprises an antipad pattern using differential vias in a reference layer where the non-high speed differential signals are located.
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| CN201910866937.XA CN110677996A (en) | 2019-09-12 | 2019-09-12 | Spacer disc design method and system based on Allegro software |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448880B2 (en) * | 2005-11-22 | 2008-11-11 | Hitachi, Ltd. | Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus |
| CN103793575A (en) * | 2014-02-19 | 2014-05-14 | 浪潮(北京)电子信息产业有限公司 | Method and device for arranging passing holes in single plate |
| CN107220442A (en) * | 2017-05-31 | 2017-09-29 | 郑州云海信息技术有限公司 | A kind of difference through hole for PCB is to detection instrument |
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- 2019-09-12 CN CN201910866937.XA patent/CN110677996A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7448880B2 (en) * | 2005-11-22 | 2008-11-11 | Hitachi, Ltd. | Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus |
| CN103793575A (en) * | 2014-02-19 | 2014-05-14 | 浪潮(北京)电子信息产业有限公司 | Method and device for arranging passing holes in single plate |
| CN107220442A (en) * | 2017-05-31 | 2017-09-29 | 郑州云海信息技术有限公司 | A kind of difference through hole for PCB is to detection instrument |
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Application publication date: 20200110 |