CN110669458B

CN110669458B - Resin composition

Info

Publication number: CN110669458B
Application number: CN201911109857.6A
Authority: CN
Inventors: 马卜; 徐晓波; 王允军
Original assignee: Suzhou Xingshuo Nanotech Co Ltd
Current assignee: Suzhou Xingshuo Nanotech Co Ltd
Priority date: 2017-09-27
Filing date: 2017-09-27
Publication date: 2021-06-29
Anticipated expiration: 2037-09-27
Also published as: CN110669458A; CN107760232B; CN107760232A

Abstract

The invention provides a resin composition, which is characterized by comprising the following components in percentage by weight: 60.00-95.00 percent of organic resin, 0.01-5.00 percent of initiator, 0.10-10.00 percent of hydrophobic gas-phase silicon dioxide and 1.00-30.00 percent of barrier particles which are uniformly dispersed in the organic resin. The light conversion element based on the resin composition has high stability and long service life, and effectively solves the problems of poor stability and short service life of the existing quantum dot material in the using process.

Description

Resin composition

Divisional application

The present application is a divisional application of chinese patent application "201710888050.1" entitled "resin composition, light-converting element, and light source assembly" filed on 27/9/2017.

Technical Field

The invention relates to the technical field of quantum dot material packaging, in particular to a resin composition.

Background

The quantum dot is an inorganic semiconductor luminescent nanocrystal with three-dimensional size within 1-20nm, and has the advantages of wide excitation wavelength range, controllable particle size, narrow half-peak width, large Stokes shift and the like because the size of the quantum dot is smaller than or close to the exciton Bohr radius. Compared with white light emitted by a traditional backlight source, the quantum dot-based backlight source can obtain purer red light and green light, so that the display is brighter, the color gamut of the liquid crystal display can be improved from 70% NTSC to 110% NTSC, and therefore, the quantum dots are widely applied to the display field.

The existing quantum dot backlight display technology can be mainly divided into an On-edge structure based On a quantum dot tube, an On-surface structure based On a quantum dot film and an On-chip structure based On packaging On an LED chip. The quantum dots are generally dispersed in a polymer matrix and exist in the form of quantum dot colloids, and then the quantum dot colloids are further sealed, for example, the quantum dot colloids are sealed between glass tubes or barrier films. However, the quantum dots have large specific surface area and many surface defects, and the luminescent properties of the quantum dot materials are extremely easily damaged by water vapor or oxygen, so that the luminescent properties of the quantum dot materials are deteriorated. The stability and lifetime of quantum dots are related to at least two aspects, the water oxygen barrier capability of the polymer matrix on the one hand and the further sealing capability of the quantum dot colloid on the other hand. However, the water and oxygen barrier properties of the existing polymer matrix can not meet the packaging requirements of the quantum dots, the sealing problem of quantum dot colloids is not well solved, and the quantum dots still have the problems of poor stability and short service life.

Disclosure of Invention

In view of the above-mentioned deficiencies of the prior art, the present invention provides a resin composition, a quantum dot colloid, a light conversion element and a light source assembly, so as to solve the problems of poor stability and short lifetime of quantum dots.

One aspect of the present invention provides a resin composition, comprising, by weight: 60.00-95.00 percent of organic resin, 0.01-5.00 percent of initiator, 0.10-10.00 percent of hydrophobic gas-phase silicon dioxide and 1.00-30.00 percent of barrier particles which are uniformly dispersed in the organic resin.

Preferably, the barrier particles comprise surface ligands comprising crosslinkable groups capable of undergoing a crosslinking reaction with the organic resin.

Preferably, the crosslinkable group includes at least one of alkenyl group, alkynyl group, carboxyl group, hydroxyl group, isocyanate group.

Preferably, the barrier particles have a particle size of 0.02 to 2 microns.

Preferably, the barrier particles comprise at least one of aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, hafnium oxide, yttrium oxide, graphene.

According to another aspect of the present invention, there is provided a light conversion member comprising a polymer matrix obtained by curing the above resin composition and quantum dots dispersed in the polymer matrix.

According to another aspect of the present invention, there is provided a light conversion element including: a substrate, a light emitting section provided on the substrate, and a sealing section; the light conversion material of the light emitting section includes quantum dots, the sealing section is obtained by curing the resin composition, and the sealing section and the substrate seal the light emitting section.

Preferably, the light conversion element is a quantum dot optical tube; the substrate is a glass tube, the light-emitting part is a polymer dispersed with quantum dots, and the sealing part is arranged at least one port of the glass tube.

Preferably, the light conversion element is a quantum dot film; the substrate is a barrier film, the light-emitting part is a polymer dispersed with quantum dots, and the sealing part is arranged at the peripheral edge along the thickness direction of the barrier film.

According to another aspect of the present invention, a light source assembly is provided, which includes a fixing support, an LED chip disposed on the fixing support, and the light conversion element, which is disposed on a light emitting line of the LED chip.

The invention has the following beneficial effects: the invention provides a resin composition, which improves the water and oxygen resistance of the resin composition after curing by mixing barrier particles, hydrophobic fumed silica and organic resin, and obviously improves the stability and the service life of quantum dots in a light conversion element of a paper cup by the resin composition.

Drawings

FIG. 1 is a schematic structural diagram of a quantum dot film in an embodiment of the invention;

fig. 2 is a schematic view of a light source module according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described in detail below with reference to the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, belong to the scope of the present invention.

The invention provides a resin composition, which comprises the following components in percentage by weight: 60.00-95.00 percent of organic resin, 0.01-5.00 percent of initiator, 0.10-10.00 percent of hydrophobic gas-phase silicon dioxide and 1.00-30.00 percent of barrier particles which are evenly dispersed in the organic resin. According to the invention, the barrier particles are dispersed in the organic resin, so that the characteristic of strong water and oxygen barrier capability of the barrier particles can be fully utilized, a plurality of water and oxygen barrier barriers are formed in the organic resin, and meanwhile, the advantage of easy encapsulation of the organic resin is utilized, and the encapsulation adhesive with good water and oxygen barrier capability is prepared after curing.

When the content of barrier particles is too low, the barrier particles cannot form an effective water oxygen barrier; when the content of the barrier particles is too high, dispersion of the barrier particles is not facilitated. In order to ensure sealability and dispersibility of the resin composition after curing, in a preferred embodiment, the barrier particles are present in an amount of 10.00% to 20.00% by weight of the resin composition.

After the resin composition is cured into the encapsulation adhesive, in order to increase the dispersion uniformity and stability of the barrier particles in the encapsulation adhesive and increase the arrangement compactness of the barrier particles, in a preferred embodiment, the barrier particles contain surface ligands, and the surface ligands contain crosslinkable groups, and the crosslinkable groups can perform a crosslinking reaction with the organic resin. In a preferred embodiment, the crosslinkable group comprises at least one of alkenyl, alkynyl, carboxyl, hydroxyl, isocyanate groups. In a preferred embodiment, the surface ligands of the barrier particles comprise at least one of an alkenylphosphonic acid, an alkynylphosphonic acid, an alkenylcarboxylic acid, an alkynylcarboxylic acid, in particular, the surface ligands of the barrier particles comprise at least one of vinylphosphonic acid, 2-propenylphosphonic acid, 3-butenylphosphonic acid, 4-pentenylphosphonic acid, 5-hexenylphosphonic acid, 6-heptenylphosphonic acid, 7-octenylphosphonic acid, 8-nonenylphosphonic acid, 9-decenylphosphonic acid, ethynylphosphonic acid, 2-propynylphosphonic acid, 3-butynylphosphonic acid, 4-pentynylphosphonic acid, 5-hexynylphosphonic acid, 6-heptynylphosphonic acid, 7-octynylphosphonic acid, 8-nonynylphosphonic acid, 9-decynylphosphonic acid, a vinylcarboxylic acid, 3-propenylcarboxylic acid, 4-buten, 5-pentenyl carboxylic acid, 6-hexenyl carboxylic acid, 7-heptenyl carboxylic acid, 8-octenyl carboxylic acid, 9-nonenyl carboxylic acid, 10-decenyl carboxylic acid, ethynyl carboxylic acid, 3-propynyl carboxylic acid, 4-butynyl carboxylic acid, 5-pentynyl carboxylic acid, 6-hexynyl carboxylic acid, 7-heptynyl carboxylic acid, 8-octynyl carboxylic acid, 9-nonenyl carboxylic acid, 10-decynyl carboxylic acid.

In order to increase the dispersibility of the barrier particles in the organic resin and reduce agglomeration, in a preferred embodiment, the barrier particles have a particle size of 0.02 to 2 microns, and more preferably, the barrier particles have a particle size of 0.1 to 1 micron. The particle size of the barrier particles of the present invention refers to the largest dimension of the barrier particles in any three-dimensional direction, and the shape of the barrier particles is not limited in the present invention, and for example, the shape of the barrier particles may be spherical, plate-like, rod-like, or the like.

The barrier particles in the present invention are selected from materials having a high water oxygen barrier capability, and in a preferred embodiment, the barrier particles comprise at least one of aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, hafnium oxide, yttrium oxide, and graphene. In one specific embodiment, the barrier particles are alumina particles of about 0.05 microns; in another specific embodiment, the barrier particles are silicon nitride particles of about 0.1 microns; in another specific embodiment, the barrier particles are graphene sheets of about 1 micron, the graphene sheets preferably being less than 4 monolayers thick, more preferably single-layer graphene sheets.

In a preferred embodiment, the organic resin comprises at least one of silicone, polyurethane, epoxy, acrylic. The silicone resin preferably comprises at least one of methyl phenyl silicone resin, methyl silicone resin, epoxy modified silicone resin, silicone polyester modified resin, amino silicone resin, fluorosilicone resin, silicone polyester resin and vinyl silicone resin. The polyurethane preferably comprises a polyisocyanate. The epoxy resin preferably includes at least one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, and silicone epoxy resin. The acrylic resin preferably includes an epoxy-modified acrylic resin. In a specific embodiment, the organic resin is a silicone epoxy resin.

The resin composition of the present invention is preferably cured under irradiation of an ultraviolet lamp or heating. In a preferred embodiment, the resin composition is cured by ultraviolet light irradiation, the initiator comprises at least one of 2-hydroxy-2-methyl-1-phenyl-1 acetone, 2-dimethoxy-2-phenylacetophenone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, 1-hydroxycyclohexyl phenyl ketone, 2-dimethoxy-phenyl ketone, phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzylphenyl) butanone, 2, 4-dimethylthioxanthone or 2, 4-diethylthioxanthone. In another preferred embodiment, the resin composition is cured by heating and the initiator comprises at least one of azo, peroxide, persulfate, redox initiator.

In a preferred embodiment, the resin composition further comprises a functional adjuvant, and the functional adjuvant refers to an additive capable of additionally increasing the properties of the resin composition, such as stability in use, control of molding speed, and the like. In a preferred embodiment, the functional auxiliary comprises at least one of a plasticizer, a heat stabilizer, an antioxidant, a light stabilizer, a dispersant, and a crosslinking agent.

In an exemplary embodiment of the present invention, there is provided a light conversion member including a polymer matrix and quantum dots dispersed in the polymer matrix, the polymer matrix being obtained by curing the above-described resin composition of the present invention. Because the resin composition has excellent sealing performance after being cured, the stability and the service life of the quantum dots can be effectively improved after the quantum dots are directly sealed in the resin composition.

The quantum dots of the present invention are semiconductor nanocrystals having a size in the range of about 1-20nm, and the size of the quantum dots should be adjusted within the above size range according to the chemical composition and structure used to obtain the desired wavelength of light emission. The semiconductor nanocrystal includes at least one semiconductor material, wherein the semiconductor material is selected from group IV, II-VI, II-V, III-VI, IV-VI, I-III-VI, II-IV-V binary or multicomponent semiconductor compounds of the periodic table of elements or mixtures thereof. Examples of specific stated semiconductor materials include, but are not limited to: the group IV semiconductor compound consists of simple substance Si, Ge and C and binary compounds SiC and SiGe; group II-VI semiconductor compounds consisting of binary compounds including CdSe, CdTe, CdO, CdS, CdSe, ZnS, ZnSe, ZnTe, ZnO, HgO, HgS, HgSe, HgTe, ternary compounds including CdSeS, CdSeTe, CdSTe, CdZnSe, CdZnTe, CgHgS, CdHgSe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, HgZnS, HgSeSe, and quaternary compounds including CgHgSeS, CdHgSeTe, CgHgHgSTe, CdZnSeS, CdZnSeTe, HgZnSeTe, HgZnSTe, CdZnSTe, HgZnSeS; group III-V semiconductor compounds consisting of binary compounds including AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ternary compounds including AlNP, AlNAs, AlNSb, AlPAs, AlPSb, GaNP, GaNAs, GaNSb, GaGaAs, GaGaSb, InNP, InNAs, InNSb, InPAs, InPSb, and quaternary compounds including GaAlNAs, GaAlNSb, GaAlPAs, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlN, InAsInAs, InNSb, InAlGaAs, InAlGaPSb; group IV-VI semiconductor compounds consisting of binary compounds including SnS, SnSe, SnTe, PbSe, PbS, PbTe, ternary compounds including SnSeS, SnSeTe, SnSTe, SnPbS, SnPbSe, SnPbTe, PbSTe, PbSeS, PbSeTe and quaternary compounds including SnPbSSe, SnPbSeTe, SnPbSTe. A II-VI semiconductor material, preferably selected from CdSe, CdS, CdTe, ZnO, ZnSe, ZnS, ZnTe, HgS, HgSe, HgTe, CdZnSe, CdZnSeS and any combination thereof; the group I-III-VI II-VI semiconductor material preferably comprises CuInS or CuInSe; the II-IV-VI semiconductor material preferably comprises CaTiO3 or BaTiO 3. In a preferred embodiment, the quantum dots are of a core-shell structure, the core and the shell respectively comprising one or more semiconductor materials, either identically or differently. The core of the quantum dot may be selected from the group consisting of the group IV, II-VI, II-V, III-VI, IV-VI, I-III-VI, II-IV-V binary or multicomponent semiconductor compounds of the periodic Table of the elements mentioned above. Specific examples for quantum dot cores include, but are not limited to, alloys or mixtures of ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InP, InAs, InN, InSb, AlAs, AlN, AlP, AlSb, PbO, PbS, PbSe, PbTe, Ge, Si, and any combination thereof. The shell of the quantum dot is selected from the same or different semiconductor materials of the core. In the quantum dot with the core-shell structure, the shell can comprise a single-layer structure or a multi-layer structure. In a preferred embodiment, the shell has a thickness of about 1 to 20 layers. In a more preferred embodiment, the shell has a thickness of about 5 to 10 layers. In certain embodiments, two or more shells are grown on the surface of the quantum dot core. In a preferred embodiment, the semiconductor material used for the shell has a larger bandgap than the core. In a particularly preferred embodiment, the semiconductor material used for the shell has an atomic crystal structure that is the same as or close to the core, and such a choice is advantageous in reducing the stress between the core and the shell, making the quantum dot more stable. In order to increase the compatibility of the quantum dot with the polymer matrix and the stability of the quantum dot, the surface of the quantum dot also contains a ligand. In a preferred embodiment, the ligand of the quantum dot is one or more of an acid ligand, a thiol ligand, an amine ligand, an (oxy) phosphine ligand, a phospholipid, a lecithin, and polyvinylpyridine. In a preferred embodiment, the acid ligand is one or more of decanoic acid, undecanoic acid, tetradecanoic acid, oleic acid, and stearic acid; the mercaptan ligand is one or more of octaalkylmercaptan, dodecyl mercaptan and octadecyl mercaptan; the amine ligand is one or more of oleylamine, octadecylamine and octamine; the (oxy) phosphine ligand is one or two of trioctylphosphine and trioctylphosphine.

In another exemplary embodiment of the present invention, there is provided a light conversion element including: a substrate, a light emitting section provided on the substrate, and a sealing section; the light conversion material of the light emitting part includes quantum dots, the sealing part is obtained by curing the resin composition, and the sealing part and the substrate seal the light emitting part, thereby ensuring long service life of the quantum dot material.

In a preferred embodiment, the light-emitting part includes a quantum dot dispersion, which means that quantum dots are dispersed in a polymer material, and the polymer material can protect the quantum dots from damage by external moisture, oxygen, and the like, and can also prevent the quantum dots from being aggregated. The polymer material includes any polymer capable of dispersing the quantum dots therein, and preferably includes at least one of polyurethane, polyacrylate, silicone, and polyepoxy.

The substrate in the present invention may comprise a substance of any shape or material, and may be rigid or flexible. In a preferred embodiment, the substrate is composed of a material including plastic, metal, a semiconductor wafer, or glass. The substrate is preferably flexible, and the material of the flexible substrate includes at least one of a polyethylene film, a polypropylene film, a polystyrene film, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyimide film, a polycarbonate film, a polyvinyl chloride film, a polyvinyl alcohol film, and a polyethylene glycol film.

In a preferred embodiment, the light conversion element is a quantum dot optical tube; the substrate is a glass tube, the light emitting part is a polymer dispersed with quantum dots, and the sealing part is arranged at least one port of the glass tube. The length and inner and outer diameters of the glass tube are not limited in the present invention, and in a preferred embodiment, the outer diameter of the glass tube is less than 5 mm. In the present invention, the sealing portion is provided at least one port of the glass tube to seal the glass tube, and the other port of the glass tube is preferably sealed by sintering.

In a preferred embodiment, the light conversion element is a quantum dot film; the substrate is a barrier film, the light emitting part is a polymer dispersed with quantum dots, and the sealing part is arranged at the peripheral edge along the thickness direction of the barrier film. As shown in fig. 1, a typical embodiment of the quantum dot film of the present invention includes a quantum dot layer 12, and a first barrier film 11 and a second barrier film 13 disposed on opposite surfaces of the quantum dot layer 12, wherein a sealing portion 14 is further disposed on an edge of the quantum dot film, the sealing portion 14 seals the quantum dot layer 12 between the first barrier film 11 and the second barrier film 13, and the sealing portion 14 is obtained by curing the resin composition.

The barrier film can be formed from any useful film material that can protect the quantum dots from ambient conditions, such as moisture or oxygen. Suitable barrier films include, for example, polymeric, glass, or dielectric materials. Suitable barrier layer materials include, but are not limited to, polymers such as polyethylene terephthalate (PET); oxides such as silicon oxide, titanium oxide, or aluminum oxide; and suitable combinations thereof. In many embodiments, each barrier layer of the quantum dot film comprises at least two layers of different materials or compositions such that the shielding of the multiple layers eliminates or reduces alignment of pinhole defects in the barrier layers, thereby providing effective shielding against oxygen and moisture permeation into the quantum dot phosphor material. The quantum dot film may comprise any suitable material or combination of materials, and any suitable number of barrier layers on one or both sides of the quantum dot phosphor material. The materials, thicknesses, and number of barrier layers will depend on the particular application and will be appropriately selected to maximize shielding protection and brightness of the quantum dot phosphor while minimizing the thickness of the quantum dot film. In many embodiments, each barrier layer is a laminate film, such as a bi-laminate film, wherein the thickness of each barrier layer is sufficiently thick to eliminate wrinkles in the roll-to-roll laminate manufacturing process. In a preferred embodiment, the first barrier film 11 and the second barrier film 13 are both polyester films (PET barrier films) having an oxide layer. The quantum dot layer 12 includes a polymer matrix, quantum dots uniformly dispersed in the polymer matrix, and light scattering particles. The polymer matrix preferably comprises at least one of modified silicone resin, modified polyurethane, modified polyepoxy resin and modified polyacrylic resin, and more preferably, the polymer matrix is selected from polyepoxy modified acrylic resin which has good solubility to oil-soluble quantum dots and strong water oxygen barrier capability. The light scattering particles preferably include at least one of zirconia, titania, zinc oxide, and tin oxide, and the size of the light scattering particles is preferably 0.2 to 2 μm.

In an exemplary embodiment of the present invention, a light source assembly is provided, which includes a fixing support, an LED chip disposed on the fixing support, and the light conversion element, where the light conversion element is disposed on a light emitting path of the LED chip.

In a specific embodiment, as shown in fig. 2, the light source assembly 200 includes a fixing support 21, an LED chip 22 disposed on the fixing support 21, and a light conversion element 23 directly encapsulated on the LED chip 22, wherein the light conversion element 23 includes a polymer matrix and quantum dots dispersed in the polymer matrix, and the polymer matrix is obtained by curing the above resin composition of the present invention.

The quantum dot optical element, such as a quantum dot glass tube and a quantum dot film, and the quantum dot light source component can be applied to a plurality of fields, such as products of illumination, mobile phones, flat panel displays, televisions and the like.

The present invention will be further described with reference to specific examples.

Example 1

This example provides a resin composition, in which the organic resin is an acrylic resin, the initiator is 1-hydroxycyclohexyl phenyl ketone and phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, and the barrier particles are 0.05 μm alumina nanoparticles with 2-propenyl phosphonic acid modified on the surface;

specifically, the coating comprises the following components in percentage by weight: 75.00 percent of acrylic resin, 0.30 percent of 1-hydroxycyclohexyl phenyl ketone, 2.20 percent of phenyl bis (2,4, 6-trimethyl benzoyl) phosphine oxide, 5.00 percent of hydrophobic fumed silica and 17.50 percent of alumina nano particles.

Example 2

This example provides a resin composition, in which an organic resin is an acrylic resin, an initiator is 1-hydroxycyclohexyl phenyl ketone and phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, and barrier particles are single-layer graphene sheets with a particle size of about 1 μm;

specifically, the coating comprises the following components in percentage by weight: 85.00% of acrylic resin, 0.30% of 1-hydroxycyclohexyl phenyl ketone, 2.20% of phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, 5.00% of hydrophobic fumed silica and 7.50% of graphene sheets.

Example 3

The embodiment provides a resin composition, in which an organic resin is an acrylic resin, an initiator is 1-hydroxycyclohexyl phenyl ketone and phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, barrier particles are 0.1 micron silicon carbide nanoparticles with 2-propenyl phosphonic acid modified on the surface, and a single-layer graphene sheet with a particle size of about 1 micron;

specifically, the coating comprises the following components in percentage by weight: 75.00% of acrylic resin, 0.30% of 1-hydroxycyclohexyl phenyl ketone, 2.20% of phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide, 5.00% of hydrophobic fumed silica, 7.50% of silicon nitride nanoparticles and 10.00% of graphene sheets.

Example 4

The embodiment provides a quantum dot film, which comprises a quantum dot layer, a first barrier film and a second barrier film, wherein the first barrier film and the second barrier film are arranged on two opposite surfaces of the quantum dot layer, and the edge of the quantum dot film is also provided with packaging glue. The packaging adhesive is obtained by curing the resin composition in the embodiment 1 after ultraviolet irradiation;

in this embodiment, the quantum dot layer is an epoxy acrylic polymer colloid dispersed with cadmium selenide quantum dots, and the first barrier film and the second barrier film are both PET barrier films.

Example 5

This example provides a quantum dot film, which is the same as example 4 except that the encapsulant is obtained by curing the resin composition of example 2 after ultraviolet irradiation.

Example 6

This example provides a quantum dot film, which is the same as example 4 except that the encapsulant is obtained by curing the resin composition of example 3 after ultraviolet irradiation.

Comparative example 1

This comparative example provides a resin composition, the same as example 1, except that the resin composition does not contain barrier particles;

specifically, the coating comprises the following components in percentage by weight: 90.00 percent of acrylic resin, 0.50 percent of 1-hydroxycyclohexyl phenyl ketone, 2.50 percent of phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide and 7.00 percent of hydrophobic fumed silica.

Comparative example 2

The present comparative example provides a quantum dot film, which is the same as example 4 except that the sealing adhesive at the edge of the quantum dot film in the present comparative example is obtained by curing the resin composition in comparative example 1 after ultraviolet irradiation.

Comparative example 3

This comparative example provides a quantum dot film, which is the same as example 4 except that no encapsulant is disposed at the edges of the quantum dot film.

The stability of the quantum dot films of example 4, example 5, example 6, comparative example 2 and comparative example 3 was measured under the test conditions of 0.5W/cm in a test chamber having a humidity of 85% and a temperature of 85 deg.c²Is irradiated for 1000 h.

The stability test results are given in the following table:

quantum dot film	Stability test results
		Example 4	Edge failure of less than 0.1mm
Example 5	Edge failure of less than 0.1mm
		Example 6	Edge failure of less than 0.1mm
Comparative example 2	Edge failure < 0.8mm
		Comparative example 3	Edge failure > 1.5mm

From the experimental results, the encapsulation adhesive based on the resin composition can obviously improve the stability of the quantum dot film, compared with the quantum dot film without edge sealing adhesive, the stability of the quantum dot film is obviously improved, and the quantum dot film can meet the requirements of the existing backlight display product on the stability and service life of the quantum dot film.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are intended to be within the scope of the invention.

Claims

1. A resin composition, comprising, in weight percent: 60.00-95.00% of organic resin, 0.01-5.00% of initiator, 0.10-10.00% of hydrophobic fumed silica and 1.00-30.00% of barrier particles uniformly dispersed in the organic resin, wherein the barrier particles comprise at least one of aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, hafnium oxide, yttrium oxide and graphene.

2. The resin composition of claim 1, wherein the barrier particles comprise surface ligands comprising crosslinkable groups capable of crosslinking with the organic resin.

3. The resin composition of claim 2, wherein the crosslinkable group comprises at least one of an alkenyl group, an alkynyl group, a carboxyl group, a hydroxyl group, and an isocyanate group.

4. The resin composition of claim 1, wherein the barrier particles have a particle size of 0.02 to 2 microns.