CN106675501A - Dual-cured electrically-conductive silver adhesive - Google Patents
Dual-cured electrically-conductive silver adhesive Download PDFInfo
- Publication number
- CN106675501A CN106675501A CN201710013948.4A CN201710013948A CN106675501A CN 106675501 A CN106675501 A CN 106675501A CN 201710013948 A CN201710013948 A CN 201710013948A CN 106675501 A CN106675501 A CN 106675501A
- Authority
- CN
- China
- Prior art keywords
- parts
- agent
- conductive silver
- dual cure
- dual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a dual-cured electrically-conductive silver adhesive. The dual-cured electrically-conductive silver adhesive is prepared from, by weight, 70-85 parts of matrix resin, 40-55 parts of diluent, 30-35 parts of electrically-conductive filler, 5-8 parts of photoinitiator, 5-8 parts of thermal initiator, 18-23 parts of anti-settling agent, 12-18 parts of defoaming agent, 15-20 parts of coupling agent, 16-26 parts of ultraviolet light absorber, 11-20 parts of thixotropic agent and 22-29 parts of wear-resistant agent. Compared with a commercially available product, the dual-cured electrically-conductive silver adhesive has the advantages that the dual-cured electrically-conductive silver adhesive is short in curing time, low in volume resistivity, high in adhesive strength and excellent in wear resistance; after high-temperature and high-humidity aging, the volume resistivity and the adhesive strength of a sample have no change basically, indicating that the dual-cured electrically-conductive silver adhesive is high in weather resistance; the sample has no change when positioned under the acid or alkaline condition for 72 hours, showing that the dual-cured electrically-conductive silver adhesive is high in resistance to chemical erosion.
Description
Technical field
The present invention relates to a kind of dual cure conductive silver glue, particularly belongs to conducting resinl technical field.
Background technology
As developing rapidly for microelectric technique is increasingly wide with application prospect, ask must be played to integrated circuit integrated level
Right meeting more and more higher, most of function of electronic system all starts to Single-Chip Integration, and caloric value also gradually increases, especially
Power chip in TGBT modules, with the increase and the diminution of size of power, the circuit temperature of chip constantly rises, thus needs
Chip is assembled on heat sink material to carry still radiating efficiency.Power chip typically adopts slicker solder with heat sink assembling
(6.3Sn/37Pb) or golden stannum (20Sn/80Au) welding, due to the needs of environmental conservation, worldwide prohibitted the use of
Plumber's solder；Golden tin solder high cost, welding temperature is up to 300 DEG C, then the materials such as chip are played and ask strict so as to range of application
It is very limited.As the succedaneum of stannum-kupper solder --- high heat-conductivity conducting adhesive bonding technique has been capable of achieving power chip with heat
Heavy assembling, low with bonding temperature in low cost, work progress, equipment needed thereby is simple, it is easy to accomplish automation mechanized operation etc.
Number of advantages.Furthermore it is possible to save a large amount of noble metal raw materials, energy resource consumption is reduced, the production of precision components can also be improved
Efficiency, solution Metal Substrate welding difficulty is reprocessed, yielding technical barrier.Commonly use in conducting resinl for conductive silver glue, prior art
In, conductive silver glue toleration in complex environment is also relatively poor, therefore studies a kind of good conductive silver glue of environmental resistance,
Seem particularly necessary.
The content of the invention
To solve the deficiencies in the prior art, it is an object of the invention to provide a kind of dual cure conductive silver glue, with good
Electric conductivity well and decay resistance.
In order to realize above-mentioned target, the present invention is adopted the following technical scheme that：
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：70~85 parts of matrix resin,
40~55 parts of diluent, 30~35 parts of conductive filler, 5~8 parts of light trigger, 5~8 parts of thermal initiator, 18~23 parts of anti-settling agent,
12~18 parts of defoamer, 15~20 parts of coupling agent, 16~26 parts of UV absorbent, 11~20 parts of thixotropic agent and anti-wear agent 22~
29 parts.
Further, aforementioned dual cure conductive silver glue, in parts by weight, is obtained by following components：Matrix resin
70~80 parts, 45~55 parts of diluent, 30~33 parts of conductive filler, 5~8 parts of light trigger, 5~8 parts of thermal initiator, anti-settling agent
20~23 parts, 12~15 parts of defoamer, 15~20 parts of coupling agent, 20~26 parts of UV absorbent, 11~16 parts of thixotropic agent and
22~25 parts of anti-wear agent.
Preferably, aforementioned dual cure conductive silver glue, in parts by weight, is obtained by following components：Matrix resin 75
Part, 47 parts of diluent, 31 parts of conductive filler, 6 parts of light trigger, 6 parts of thermal initiator, 22 parts of anti-settling agent, 14 parts of defoamer, coupling
24 parts of 18 parts of agent, 23 parts of UV absorbent, 15 parts of thixotropic agent and anti-wear agent.
In aforementioned dual cure conductive silver glue, matrix resin is that phenolic resin that mass ratio is 2~3 ︰ 3~5 and polyamides are sub-
Polyimide resin.
In aforementioned dual cure conductive silver glue, diluent is 2-Butoxyethyl acetate, diethyl phthalate, adjacent benzene
One or two in dicarboxylic acid dimethyl ester or n-butyl glycidyl ether.
In aforementioned dual cure conductive silver glue, conductive filler is according to the flake silver powder and ball shape silver powder that mass ratio is 3 ︰ 1；
The particle diameter of the flake silver powder is 0.3 μm~0.5 μm；The particle diameter of the ball shape silver powder is 30nm~60nm.
In aforementioned dual cure conductive silver glue, light trigger is 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) benzene
Base] -1- acetone, the thermal initiator is azodiisobutyronitrile.
In aforementioned dual cure conductive silver glue, UV absorbent be ESCALOL 567 or 2- hydroxyls-
4- oxy-octyl benzophenones；The anti-wear agent is alumina in Nano level or nano silicon；The anti-settling agent is mass ratio
For the aerosil and organobentonite of 2 ︰ 1.
In aforementioned dual cure conductive silver glue, defoamer is that polyoxyethylene polyoxypropylene tetramethylolmethane ether or Polyethylene oxide are poly-
Oxygen propanol amidogen ether；The coupling agent is silicon dioxide, aluminium sesquioxide, carborundum, aluminium hydroxide or titanium dioxide；The thixotroping
Agent is castor oil hydrogenated or hydroxyethyl cellulose.
The invention has benefit that：A kind of dual cure conductive silver glue that the present invention is provided, compared with commercially available prod,
The dual cure conductive silver glue of the present invention is hardening time short, and specific insulation is low, and adhesion strength is high, and anti-wear performance is good.At -40 DEG C
At~200 DEG C, after thermal shock 300 times, sample volume resistivity and adhesion strength are substantially unchanged.It is old in Jing high temperature, high humidity
After change, sample volume resistivity and adhesion strength are also not changed in substantially, show that product of the present invention has good weatherability, can
Used in different working environments.Under conditions of acid or alkali, there is not change to 72h in sample, shows excellent resistance to
Chemical corrosion resistance.
Specific embodiment
The present invention is further introduced below in conjunction with specific embodiment.
Embodiment 1
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：70 parts of matrix resin, dilution
40 parts of agent, 30 parts of conductive filler, 5 parts of light trigger, 8 parts of thermal initiator, 18 parts of anti-settling agent, 12 parts of defoamer, 15 parts of coupling agent,
22 parts of 16 parts of UV absorbent, 11 parts of thixotropic agent and anti-wear agent.Matrix resin is phenolic resin and polyamides that mass ratio is 2 ︰ 3
Imide resin.Diluent is 2-Butoxyethyl acetate.Conductive filler is according to the flake silver powder and spherical silver that mass ratio is 3 ︰ 1
Powder；The particle diameter of the flake silver powder is 0.3；The particle diameter of the ball shape silver powder is 30nm.Light trigger is 2- methyl -2- (4-
Quinoline base) -1- [4- (methyl mercapto) phenyl] -1- acetone, the thermal initiator is azodiisobutyronitrile.UV absorbent is 2- hydroxyls
Base -4- methoxy benzophenones；The anti-wear agent is alumina in Nano level；The anti-settling agent is gas phase two that mass ratio is 2 ︰ 1
Silicon oxide and organobentonite.Defoamer is polyoxyethylene polyoxypropylene tetramethylolmethane ether；The coupling agent is silicon dioxide；Institute
Thixotropic agent is stated for hydroxyethyl cellulose.
Embodiment 2
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：85 parts of matrix resin, dilution
55 parts of agent, 35 parts of conductive filler, 8 parts of light trigger, 5 parts of thermal initiator, 23 parts of anti-settling agent, 18 parts of defoamer, 20 parts of coupling agent,
29 parts of 26 parts of UV absorbent, 20 parts of thixotropic agent and anti-wear agent.Matrix resin is phenolic resin and polyamides that mass ratio is 3 ︰ 5
Imide resin.Diluent is diethyl phthalate.Conductive filler is according to the flake silver powder and spherical silver that mass ratio is 3 ︰ 1
Powder；The particle diameter of the flake silver powder is 0.5 μm；The particle diameter of the ball shape silver powder is 60nm.Light trigger is 2- methyl -2- (4-
Morpholinyl) -1- [4- (methyl mercapto) phenyl] -1- acetone, the thermal initiator is azodiisobutyronitrile.UV absorbent is 2-
Hydroxyl -4- oxy-octyl benzophenones；The anti-wear agent is nano silicon；The anti-settling agent is gas that mass ratio is 2 ︰ 1
Aerosil and organobentonite.Defoamer is polyoxyethylene polyoxypropylene tetramethylolmethane ether；The coupling agent is three oxidations
Two aluminum；The thixotropic agent is hydroxyethyl cellulose.
Embodiment 3
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：75 parts of matrix resin, dilution
47 parts of agent, 31 parts of conductive filler, 6 parts of light trigger, 6 parts of thermal initiator, 22 parts of anti-settling agent, 14 parts of defoamer, 18 parts of coupling agent,
24 parts of 23 parts of UV absorbent, 15 parts of thixotropic agent and anti-wear agent.Matrix resin is phenolic resin that mass ratio is 2.5 ︰ 4 and poly-
Imide resin.Diluent is dimethyl phthalate.Conductive filler is according to the flake silver powder that mass ratio is 3 ︰ 1 and spherical
Argentum powder；The particle diameter of the flake silver powder is 0.4 μm；The particle diameter of the ball shape silver powder is 45nm.Light trigger is 2- methyl -2-
(4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, the thermal initiator is azodiisobutyronitrile.UV absorbent
For ESCALOL 567；The anti-wear agent is alumina in Nano level；The anti-settling agent is 2 ︰ 1 for mass ratio
Aerosil and organobentonite.Defoamer is Polyethylene oxide polyoxy propanol amidogen ether；The coupling agent is carborundum；It is described
Thixotropic agent is castor oil hydrogenated.
Embodiment 4
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：72 parts of matrix resin, dilution
45 parts of agent, 33 parts of conductive filler, 7 parts of light trigger, 6 parts of thermal initiator, 20 parts of anti-settling agent, 15 parts of defoamer, 18 parts of coupling agent,
25 parts of 20 parts of UV absorbent, 16 parts of thixotropic agent and anti-wear agent.Matrix resin for phenolic resin that mass ratio is 2.6 ︰ 3.5 and
Polyimide resin.Diluent is n-butyl glycidyl ether.Conductive filler is according to the flake silver powder and ball that mass ratio is 3 ︰ 1
Shape argentum powder；The particle diameter of the flake silver powder is 0.35 μm；The particle diameter of the ball shape silver powder is 50nm.Light trigger be 2- methyl-
2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, the thermal initiator is azodiisobutyronitrile.Ultra-violet absorption
Agent is Octabenzone；The anti-wear agent is nano silicon；It is 2 ︰ that the anti-settling agent is mass ratio
1 aerosil and organobentonite.Defoamer is Polyethylene oxide polyoxy propanol amidogen ether；The coupling agent is hydroxide
Aluminum；The thixotropic agent is castor oil hydrogenated.
Embodiment 5
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：78 parts of matrix resin, dilution
50 parts of agent, 31 parts of conductive filler, 6 parts of light trigger, 8 parts of thermal initiator, 21 parts of anti-settling agent, 13 parts of defoamer, 19 parts of coupling agent,
24 parts of 24 parts of UV absorbent, 12 parts of thixotropic agent and anti-wear agent.Matrix resin for phenolic resin that mass ratio is 2.1 ︰ 4.5 and
Polyimide resin.Diluent is 2-Butoxyethyl acetate and diethyl phthalate.Conductive filler is according to mass ratio
For the flake silver powder and ball shape silver powder of 3 ︰ 1；The particle diameter of the flake silver powder is 0.45 μm；The particle diameter of the ball shape silver powder is
40nm.Light trigger is 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, and the thermal initiator is even
Nitrogen bis-isobutyronitrile.UV absorbent is Octabenzone；The anti-wear agent is alumina in Nano level；
The anti-settling agent is aerosil and organobentonite that mass ratio is 2 ︰ 1.Defoamer is polyoxyethylene polyoxypropylene season
Penta 4 alcohol ethers；The coupling agent is titanium dioxide；The thixotropic agent is hydroxyethyl cellulose.
Embodiment 6
A kind of dual cure conductive silver glue, in parts by weight, is obtained by following components：74 parts of matrix resin, dilution
48 parts of agent, 32 parts of conductive filler, 5 parts of light trigger, 7 parts of thermal initiator, 22 parts of anti-settling agent, 14 parts of defoamer, 17 parts of coupling agent,
23 parts of 21 parts of UV absorbent, 14 parts of thixotropic agent and anti-wear agent.Matrix resin for phenolic resin that mass ratio is 2.7 ︰ 3.8 and
Polyimide resin.It is 2 that diluent is mass ratio:1 2-Butoxyethyl acetate and n-butyl glycidyl ether.Conductive filler
It is according to the flake silver powder and ball shape silver powder that mass ratio is 3 ︰ 1；The particle diameter of the flake silver powder is 0.47 μm；The ball shape silver powder
Particle diameter be 58nm.Light trigger is 2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, and the heat is drawn
It is azodiisobutyronitrile to send out agent.UV absorbent is ESCALOL 567；The anti-wear agent is nano-silica
SiClx；The anti-settling agent is aerosil and organobentonite that mass ratio is 2 ︰ 1.Defoamer is Polyethylene oxide polyoxy third
Alcohol amidogen ether；The coupling agent is titanium dioxide；The thixotropic agent is castor oil hydrogenated.
In embodiment 1~6, diluent is 2-Butoxyethyl acetate, diethyl phthalate, phthalic acid diformazan
One or two in ester or n-butyl glycidyl ether.
Dual cure conductive silver glue is to be prepared by the following method in embodiment 1~6：By measuring matrix resin, dilute
Releasing agent, light trigger, thermal initiator, anti-settling agent, defoamer, coupling agent, UV absorbent, thixotropic agent and anti-wear agent carries out height
Speed dispersion, after stirring, adds conductive filler, is obtained final product by three-high mill mix homogeneously.
In order to ensure the science, rationally, effectively of technical solution of the present invention, inventor has carried out a series of experimentation.
The conductive silver glue of Example 1~6, commercially available prod and comparative example 1~2, carry out as follows performance test.Its
In,
Comparative example 1：It is with the difference of embodiment 3：Conductive filler is according to the flake silver powder that mass ratio is 2 ︰ 1 and spherical
Argentum powder；The particle diameter of the flake silver powder is 0.2 μm；The particle diameter of the ball shape silver powder is 20nm.
Comparative example 2：It is with the difference of embodiment 3：Conductive filler is according to the flake silver powder that mass ratio is 4 ︰ 1 and spherical
Argentum powder；The particle diameter of the flake silver powder is 0.6 μm；The particle diameter of the ball shape silver powder is 80nm.
1st, method of testing
1.1st, specific insulation：The sample for preparing is spread evenly across on the poly (methyl methacrylate) plate wiped across with dehydrated alcohol
Two blocks of sheet glass between, photo-thermal dual curable.Tested using four electrode resistance methods of testing.
1.2nd, adhesion strength test：With conductive silver glue as binding agent, with aluminium flake as substrate, sample is adopted adhesion strength sample
Single lap joint test piece.The test of adhesion strength is carried out on microcomputer controlled electronic universal testing machine.
1.3rd, hardening time：Testing conductive elargol specific insulation and adhesion strength reach the stable time.
1.4th, resistance to 5%NaOH：In the solution of the 5%NaOH of test board immersion room temperature, 72h observes outward appearance.
1.5th, resistance to 5%H2SO4：Test board immerses the 5%H of room temperature2SO4Solution in, 72h, observe outward appearance.
1.6th, thermal shock experiment：Experimental temperature is -40 DEG C -200 DEG C, and thermal shock number of times is 300 times, test sample body
Product resistivity and adhesion strength.
1.7th, high temperature, high humidity senile experiment：Experimental temperature is 90 DEG C, and humidity is 90%RH, and ageing time is 200h, test
Test sample specific insulation and adhesion strength.
1.8th, abrasiveness：According to GB/T15036.2-2001 tests, film does not grind.
2nd, test result
2.1st, the performance test results of embodiment 1~6 are as shown in Table 1 and Table 2.
Table 1
Table 2
From Tables 1 and 2, compared with commercially available prod, the dual cure conductive silver glue of the present invention is hardening time short, volume
Resistivity is low, and adhesion strength is high.Thermal shock does not affect substantially on the specific insulation and adhesion strength of system.It is high in Jing
After warm, high deterioration with moisture, sample volume resistivity and adhesion strength are also not changed in substantially.72h is under conditions of acid or alkali, sample
There is not change in product, show excellent resistance to chemical corrosion.
2.2nd, comparative example test result, as shown in table 3.
Table 3
As shown in Table 3, using the conducting particles in the present invention, gained conducting resinl excellent product performance.
Claims (9)
1. a kind of dual cure conductive silver glue, it is characterised in that：In parts by weight, it is obtained by following components：Matrix resin
70~85 parts, 40~55 parts of diluent, 30~35 parts of conductive filler, 5~8 parts of light trigger, 5~8 parts of thermal initiator, anti-settling agent
18~23 parts, 12~18 parts of defoamer, 15~20 parts of coupling agent, 16~26 parts of UV absorbent, 11~20 parts of thixotropic agent and
22~29 parts of anti-wear agent.
2. dual cure conductive silver glue according to claim 1, it is characterised in that：In parts by weight, by with the following group
Divide and be obtained：70~80 parts of matrix resin, 45~55 parts of diluent, 30~33 parts of conductive filler, 5~8 parts of light trigger, thermal initiation
5~8 parts of agent, 20~23 parts of anti-settling agent, 12~15 parts of defoamer, 15~20 parts of coupling agent, 20~26 parts of UV absorbent, touch
Become 22~25 parts of 11~16 parts of agent and anti-wear agent.
3. dual cure conductive silver glue according to claim 2, it is characterised in that：In parts by weight, by with the following group
Divide and be obtained：75 parts of matrix resin, 47 parts of diluent, 31 parts of conductive filler, 6 parts of light trigger, 6 parts of thermal initiator, anti-settling agent 22
Part, 14 parts of defoamer, 18 parts of coupling agent, 23 parts of UV absorbent, 15 parts of thixotropic agent and 24 parts of anti-wear agent.
4. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The matrix resin is
Mass ratio is the phenolic resin and polyimide resin of 2~3 ︰ 3~5.
5. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The diluent is second
One kind in glycol monobutyl ether acetate, diethyl phthalate, dimethyl phthalate or n-butyl glycidyl ether or
Two kinds.
6. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The conductive filler is
According to flake silver powder and ball shape silver powder that mass ratio is 3 ︰ 1；The particle diameter of the flake silver powder is 0.3 μm~0.5 μm；It is described spherical
The particle diameter of argentum powder is 30nm~60nm.
7. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The light trigger is
2- methyl -2- (4- morpholinyls) -1- [4- (methyl mercapto) phenyl] -1- acetone, the thermal initiator is azodiisobutyronitrile.
8. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The ultra-violet absorption
Agent is ESCALOL 567 or Octabenzone；The anti-wear agent is nanoscale
Aluminum or nano silicon；The anti-settling agent is aerosil and organobentonite that mass ratio is 2 ︰ 1.
9. the dual cure conductive silver glue according to any one of claims 1 to 3, it is characterised in that：The defoamer is poly-
Oxygen ethylene polyoxypropylene tetramethylolmethane ether or Polyethylene oxide polyoxy propanol amidogen ether；The coupling agent is silicon dioxide, three oxidations two
Aluminum, carborundum, aluminium hydroxide or titanium dioxide；The thixotropic agent is castor oil hydrogenated or hydroxyethyl cellulose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710013948.4A CN106675501A (en) | 2017-01-09 | 2017-01-09 | Dual-cured electrically-conductive silver adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710013948.4A CN106675501A (en) | 2017-01-09 | 2017-01-09 | Dual-cured electrically-conductive silver adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106675501A true CN106675501A (en) | 2017-05-17 |
Family
ID=58849464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710013948.4A Pending CN106675501A (en) | 2017-01-09 | 2017-01-09 | Dual-cured electrically-conductive silver adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106675501A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107502248A (en) * | 2017-09-13 | 2017-12-22 | 太仓天润新材料科技有限公司 | A kind of electronic material suitable for high integration Electronic Assemblies |
| CN107760232A (en) * | 2017-09-27 | 2018-03-06 | 苏州星烁纳米科技有限公司 | Resin combination, light conversion element and light source assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101245227A (en) * | 2007-02-13 | 2008-08-20 | 核工业第八研究所 | Epoxy conductive silver glue for LED and method for manufacturing same |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN104046315A (en) * | 2014-06-11 | 2014-09-17 | 深圳职业技术学院 | Ultraviolet dual-curing conductive adhesive and preparation method thereof |
| CN105062398A (en) * | 2015-08-25 | 2015-11-18 | 佛山市顺德区百锐新电子材料有限公司 | Double-curing frontal polymerization conductive silver adhesive and preparing method thereof |
| CN105131861A (en) * | 2015-10-09 | 2015-12-09 | 重庆文理学院 | Low-cost conductive silver adhesive |
-
2017
- 2017-01-09 CN CN201710013948.4A patent/CN106675501A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101245227A (en) * | 2007-02-13 | 2008-08-20 | 核工业第八研究所 | Epoxy conductive silver glue for LED and method for manufacturing same |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN104046315A (en) * | 2014-06-11 | 2014-09-17 | 深圳职业技术学院 | Ultraviolet dual-curing conductive adhesive and preparation method thereof |
| CN105062398A (en) * | 2015-08-25 | 2015-11-18 | 佛山市顺德区百锐新电子材料有限公司 | Double-curing frontal polymerization conductive silver adhesive and preparing method thereof |
| CN105131861A (en) * | 2015-10-09 | 2015-12-09 | 重庆文理学院 | Low-cost conductive silver adhesive |
Non-Patent Citations (3)
| Title |
|---|
| 李广宇等: "《胶粘与密封新技术》", 31 January 2006, 国防工业出版社 * |
| 段予忠等: "《塑料母料生产及应用技术》", 31 August 1999, 中国轻工业出版社 * |
| 薛茹君、吴玉程著: "《无机纳米材料的表面修饰改性与物性研究》", 31 October 2009, 合肥工业大学出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107502248A (en) * | 2017-09-13 | 2017-12-22 | 太仓天润新材料科技有限公司 | A kind of electronic material suitable for high integration Electronic Assemblies |
| CN107760232A (en) * | 2017-09-27 | 2018-03-06 | 苏州星烁纳米科技有限公司 | Resin combination, light conversion element and light source assembly |
| CN107760232B (en) * | 2017-09-27 | 2019-12-17 | 苏州星烁纳米科技有限公司 | resin composition, light conversion element, and light source module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105873248B (en) | A kind of heating film low-temperature sintering slurry and preparation method thereof | |
| CN106675434B (en) | One kind can rapid curing conductive silver glue | |
| CN105949903B (en) | A kind of high efficiency and heat radiation coating and its application process | |
| CN101872653A (en) | Nano silver conductive paste and preparation method thereof | |
| CN110760233A (en) | Heat-conducting composite coating and heat-conducting coating prepared from same | |
| CN105733469B (en) | A kind of conducting resinl of photocuring and preparation method thereof | |
| CN102222536B (en) | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste | |
| CN106675501A (en) | Dual-cured electrically-conductive silver adhesive | |
| CN102277109A (en) | Preparation method of environmentally-friendly photocuring silver conductive adhesive | |
| CN109698040A (en) | A kind of water-base electron slurry and preparation method thereof | |
| CN105778361A (en) | High-dielectric tunability ceramic/high polymer functional composite and preparation method | |
| CN108735343A (en) | A kind of conductive silver paste and preparation method thereof for low-temperature co-fired ceramic substrate | |
| CN103226989B (en) | Corrosivity carrier and preparation method, crystal silicon solar energy battery just/back silver electrocondution slurry and preparation method | |
| CN106128548B (en) | A kind of resistance slurry of high electric heating conversion ratio | |
| CN102964948A (en) | Heat-curing heat-conduction heat-dissipation paint and preparation method thereof | |
| CN109003699A (en) | A kind of plate resistor resistance slurry and preparation method thereof | |
| CN106653145A (en) | Medium-and-high temperature thick film circuit conductor paste and preparation method thereof | |
| CN108511107B (en) | A kind of back passivation aluminium paste and preparation method thereof containing porous structure powder | |
| CN106601332A (en) | High electric-heating conversion low temperature resistance slurry with electromagnetic purifying function and preparation method thereof | |
| CN102262915B (en) | Environment-friendly silver conductive paste based on surface mount of high-power light-emitting diode (LED) chip and preparation method for paste | |
| CN102992631B (en) | Lead-free glass powder for solar cell electronic paste, preparation method and application thereof | |
| CN103497717B (en) | A kind of LED heat-conductive solid crystal glue binder and preparation method thereof | |
| CN109360673B (en) | Silver-coated copper conductive copper paste and preparation method thereof | |
| CN106634775B (en) | High-temperature-resistant conductive silver adhesive | |
| Li et al. | A highly conductive bimodal isotropic conductive adhesive and its reliability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170517 |
|
| WD01 | Invention patent application deemed withdrawn after publication |