CN110658682A - Gas bath cavity structure, gas bath device and photoetching equipment - Google Patents

Gas bath cavity structure, gas bath device and photoetching equipment Download PDF

Info

Publication number
CN110658682A
CN110658682A CN201810690346.7A CN201810690346A CN110658682A CN 110658682 A CN110658682 A CN 110658682A CN 201810690346 A CN201810690346 A CN 201810690346A CN 110658682 A CN110658682 A CN 110658682A
Authority
CN
China
Prior art keywords
gas bath
gas
bath cavity
air
orifice plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810690346.7A
Other languages
Chinese (zh)
Other versions
CN110658682B (en
Inventor
戴思雨
赵建军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN201810690346.7A priority Critical patent/CN110658682B/en
Publication of CN110658682A publication Critical patent/CN110658682A/en
Application granted granted Critical
Publication of CN110658682B publication Critical patent/CN110658682B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention provides a gas bath cavity structure and applies the gas bath cavity structure to a gas bath device. The gas bath cavity structure comprises a pore plate and a wedge-shaped gas bath cavity, wherein the pore plate is arranged in the gas bath cavity and divides the gas bath cavity into a plurality of static pressure cavities. The gas bath device comprises an air inlet pipeline and a gas bath cavity device, wherein the air inlet pipeline is connected with an air inlet of the gas bath cavity. On the premise of limited internal space of the photoetching equipment, the gas bath cavity provided by the invention can directly replace the original gas bath cavity, does not provide the requirement of common modification for the photoetching equipment, and has good substitution.

Description

Gas bath cavity structure, gas bath device and photoetching equipment
Technical Field
The invention relates to the technical field of integrated circuit manufacturing equipment, in particular to a gas bath cavity structure, a gas bath device and photoetching equipment.
Background
The lithography machine is a high-precision device, and the temperature of the internal environment and components greatly affects the lithography precision when the lithography machine works. Because of the large number of heat sources inside the lithography machine, the heat generated by these heat sources affects the temperature stability of the components and spaces in the system and must be monitored and controlled. The gas bath is one of the main means for controlling the temperature of the photoetching machine, and achieves the purpose of controlling the temperature of the space and the components by delivering constant-temperature and constant-pressure air flow to key areas and components of a workpiece table, a mask table, a silicon wafer transmission device and the like. The gas bath device is a special device for achieving the purpose.
The gas bath device is a device for accurately controlling the temperature of a space light path or a core device of the photoetching equipment. The uniformity and stability of the output air flow of the gas bath device are main performance indexes for evaluating the gas bath device, and the compactness of the structure of the gas bath device is an important structural index for determining whether the gas bath device can be integrated on the whole machine. However, in engineering practice, these two criteria affect each other, requiring a technician to seek a balance point between them.
Fig. 1 shows a typical prior art air bath apparatus, in which an air inlet duct 101 is connected to one end of a rectangular parallelepiped air bath chamber 102, and air is buffered in the air bath chamber 102 and then flows out of the air bath apparatus through a filter 103 on one side of the air bath chamber 102. Through the buffering of the gas bath chamber 102 and the filtering of the filter 103, the stability and uniformity of the flowing gas flowing out of the gas bath device are improved. However, this improvement is not ideal enough to meet the space requirements and temperature control requirements of the growing lithographic apparatus.
Disclosure of Invention
In order to improve the problems and effectively improve the uniformity and stability of gas flowing through the gas bath device in a limited space, and meanwhile, the structure is not complex.
Optionally, in the above-mentioned gas bath cavity structure, the gas bath cavity includes an inclined plane and an air outlet surface, the inclined plane is opposite to the air outlet surface, and an included angle between a plane where the air outlet surface is located and the inclined plane is greater than arctg 0.05.
Optionally, in the above structure of the gas bath cavity, the orifice plate is disposed in the gas bath cavity at a predetermined inclination angle; the inclination angle is an included angle between the pore plate and the direction perpendicular to the air outlet surface.
Optionally, in the above structure of the gas bath cavity, the inclination angle is in the range of 12 ° to 30 °.
Optionally, in the above structure of the gas bath chamber, the number of the orifice plates is at least 3.
Optionally, in the above gas bath cavity structure, the number of the pore plates is 3, and the pore plates are a first pore plate, a second pore plate and a third pore plate in sequence; the first pore plate is arranged at an air inlet of the air bath cavity; the inclination angle range of the first pore plate is 12-18 degrees, the inclination angle range of the second pore plate is 20-25 degrees, and the inclination angle range of the third pore plate is 25-30 degrees.
Optionally, in the above structure of the gas bath chamber, the aperture ratio of the aperture plate ranges from 20% to 40%.
Optionally, in the above gas bath cavity structure, the aperture ratio of the first aperture plate ranges from 20% to 30%, the aperture ratio of the second aperture plate ranges from 35% to 40%, and the aperture ratio of the third aperture plate ranges from 35% to 40%.
Optionally, in the above structure of the gas bath chamber, a product range of a tangent value of an angle between a plane where the air outlet surface is located and the inclined surface and an aperture ratio of the orifice plate is 0.01 to 0.03.
The invention also provides a gas bath device, which comprises an air inlet pipeline and the gas bath cavity structure; the air inlet pipeline is connected with an air inlet of the gas bath cavity, so that gas flowing in through the air inlet pipeline moves along the long edge of the gas bath cavity.
Optionally, the gas bath device further includes a filter, and the filter is disposed on an air outlet surface of the gas bath cavity to isolate particles that may exist.
The invention also provides a lithographic apparatus comprising a gas bath cavity structure as described above.
The invention also provides a lithographic apparatus comprising a gas bath device as described above.
The invention achieves the effect of improving the uniformity and stability of the gas flowing out of the air outlet surface by changing the shape of the gas bath cavity. The gas bath device based on the gas bath cavity structure has simple structure and is easy to realize.
Meanwhile, compared with the prior art, the change of the shape of the gas bath cavity does not increase the requirement on the space, and on the premise of limited internal space of the photoetching equipment, the gas bath cavity or the gas bath device can be directly replaced by the gas bath cavity or the gas bath device, the requirement on the common transformation of the photoetching equipment is not provided, and the gas bath cavity or the gas bath device has good substitution.
Furthermore, the position of the pore plate used in the gas bath device can be changed or the pore plate with different opening rates can be replaced according to the requirements, so that different requirements on the wind speed can be met.
In addition, the wind speed can be controlled by improving the shape and adjusting the pore plate, so that the requirement on the pressure resistance of the filter can be reduced, and the space occupied by the filter can be further reduced.
Drawings
FIG. 1 is a typical gas bath apparatus of the prior art;
FIG. 2 is a schematic view of the wind velocity distribution of the air outlet surface of the rectangular gas bath cavity;
FIG. 3 is a schematic view of the distribution of wind speeds at the air outlet surface of the air bath cavity according to an embodiment of the present invention;
FIG. 4 is a simulation diagram of the wind velocity distribution at the outlet face of the air bath cavity shown in FIG. 2;
FIG. 5 is a simulation diagram of wind speed distribution of the wind outlet surface of the embodiment shown in FIG. 3;
FIG. 6 is a schematic view of the structure of a gas bath apparatus according to an embodiment of the present invention;
fig. 7 is a simulation diagram of wind speed distribution of the wind outlet surface of the embodiment shown in fig. 6.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings, which are included to illustrate embodiments of the present invention. Also, the embodiments and features of the embodiments in the present application are allowed to be combined with or substituted for each other without conflict. The advantages and features of the present invention will become more apparent in conjunction with the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The lithographic apparatus has high requirements for its internal gas pressure and temperature, which need to be monitored and controlled. The air bath device can change the speed (pressure) of input air flow, so that the air flow can uniformly and stably flow out from the air outlet surface. The matching with the filter can also filter the tiny dust in the air flow, and the purity of the air flow is improved.
In order to ensure that the air flow at the air outlet surface of the air bath cavity is uniform and stable, a static pressure cavity is required to be formed in the air bath cavity. The gas bath cavity is equivalent to a buffer pool, and in a theoretical state, after flowing gas enters the gas bath cavity, the flowing gas is buffered to be quasi-static gas, and at the moment, a static pressure cavity is formed in the gas bath cavity. That is, the dynamic pressure of the gas is converted to static pressure in this cavity, so that the gas flow out of the gas bath cavity is improved to a relatively uniform, stable gas flow.
For the gas bath cavity with larger coverage area, the pressure resistance can be further controlled by adopting measures such as filter cloth, a pore plate, a filter and the like, so that the uniformity and the stability of gas flowing out of the air outlet surface are improved.
Through practice, there are 2 types of methods for effectively improving the uniformity and stability of the air flowing out of the air outlet surface. One type of method is to increase the volume of the gas bath chamber. The greater the space in which the different velocity air streams interact, the easier it is to form an ideal hydrostatic chamber. However, this method is not easy to implement on the premise that the internal space of the lithographic apparatus is limited. Another method is to increase the pressure resistance of the filter. However, this method is implemented by increasing the thickness of the filter, and accordingly, the air supply pressure needs to be increased, and the requirement for the air supply pipeline is additionally provided, and the energy consumption is increased. Furthermore, the thickness to which the filter can be added is still limited by the space inside the lithographic apparatus.
The invention improves the structure of the gas bath cavity, which comprises a pore plate and a wedge-shaped gas bath cavity. The invention firstly improves the air bath cavity from the traditional cuboid shape to the wedge shape, and improves the speed of the tail end of the air flow. The invention also arranges a plurality of pore plates in the wedge-shaped gas bath cavity in an inclined way, thereby buffering the airflow in a plurality of stages to form static pressure cavities, and uniformly dispersing the airflow in each static pressure cavity to achieve the aim of uniform and stable airflow at the air outlet surface. The specific improvements and effects can be compared with the structures shown in fig. 2 and 3 and the simulation effect diagrams shown in fig. 4 and 5.
Fig. 3 is a schematic view illustrating wind speed distribution on the wind outlet surface according to an embodiment of the present invention. The present invention modifies the conventional rectangular parallelepiped gas bath cavity 102 shown in fig. 2 into a wedge-shaped gas bath cavity 202. This change in shape increases the velocity of the air at the end of the air stream, i.e., the velocity of the exiting air at the end farther from the air inflow. The gas flows into and out of the gas bath chamber 202 in the direction indicated by the arrows. The inflowing air is slightly buffered in the cavity, converts dynamic pressure into static pressure, and then flows out of the air outlet surface 204. In the figure, the length of the straight line segment at the tail of the arrow indicates the velocity of the airflow, and accordingly, the velocity distribution of the gas flowing out of the air outlet surface 204 tends to gradually increase. That is, the velocity of the outgoing gas decreases closer to the gas inflow point, and the velocity of the outgoing gas increases further away from the gas inflow point. The reasons for this phenomenon are: the height of the gas bath chamber 202 gradually decreases in the direction of the gas flow, forcing the gas to gather in a smaller space, where the velocity of the gas flow increases, depending on the characteristics of the fluid.
Fig. 2 shows a currently common gas bath chamber. The gas bath cavity 102 is rectangular. Similar to fig. 3, the air velocity flowing out of the outlet surface 104 tends to decrease gradually according to the length of the straight line segment at the tail of the arrow in the figure. That is, the velocity of the outgoing gas is higher as the distance from the gas inlet is shorter, and the velocity of the outgoing gas is lower as the distance from the gas inlet is longer.
FIGS. 4 and 5 are simulated analysis plots of the gas velocity exiting the gas bath chamber shown in FIGS. 2 and 3, respectively. Referring to the color scale in FIG. 4, the velocity of the gas flowing out is gradually decreased in a step-like manner, and the simulation result is identical to the analysis result of FIG. 2; in FIG. 5, the velocity of the effluent gas is staggered, but the general trend is still rising, and the simulation result is consistent with the analysis result of FIG. 3. When the air bath cavity has no inclination (as shown in figure 2), kinetic energy of the air flow is continuously lost in the forward movement process, so that the wind speed is continuously reduced along the moving direction of the air flow; when the air bath chamber has a certain slope (as shown in fig. 3), the wind speed rises instead as the height decreases, so that the wind speed rises continuously along the moving direction of the air flow. Therefore, the gas bath cavity with a certain inclination is adopted, and the tail end speed of the gas flow can be improved.
The pore plate is arranged in the gas bath cavity and divides the gas bath cavity into a plurality of static pressure cavities. The purpose of providing a plurality of said orifice plates is to vary the air flow velocity in stages and to make the air flow distribution more uniform in stages. Preferably, at least 3 of said orifice plates are disposed within said gas bath chamber at a predetermined inclination. The inclination angle refers to an included angle between the pore plate and a direction perpendicular to the air outlet surface. The recommended range of this angle is 12-30. Meanwhile, the recommended range of the aperture ratio of the orifice plate is 20% -40%.
Further, since the inclination of the gas bath cavity (i.e. the tangent value of the included angle between the inclined plane of the gas bath cavity and the plane of the air outlet surface) and the aperture ratio of the orifice plate both play a role in the uniformity and stability of the gas flowing out of the gas bath cavity, i.e. under the combined influence of the inclination of the gas bath cavity and the aperture ratio of the orifice plate, the uniformity and stability of the gas flowing out can be well controlled, and the inventor finds through practice that the best effect is obtained when the product of the inclination of the gas bath cavity and the aperture ratio of the orifice plate is in the range of 0.01-0.03.
Further, according to the inventors' practice, the slope of the gas bath cavity is preferably greater than 1: 20. That is, the inclined plane of the wedge-shaped air bath cavity and the plane of the air outlet surface form an included angle which is preferably larger than 0.05 of arctg. The larger the pitch, the better the lifting effect on the end air flow velocity.
According to the improved structure of the gas bath cavity, the invention also provides a gas bath device. The gas bath device comprises an air inlet pipeline and the gas bath cavity structure. Preferably, a filter is also included.
The air inlet pipeline is arranged on the end wall of the gas bath cavity, an air inlet is formed in the end wall, and gas is introduced into the gas bath cavity from the air inlet pipeline through the air inlet. Generally, it is most reasonable that the air inlet duct is disposed on the end wall opposite to the aforementioned included angle, so that the air flowing in through the air inlet duct moves along the long side of the gas bath chamber, and the air flow has the longest straight flow distance, which helps to form a static pressure chamber.
The filter is arranged on the air outlet surface of the air bath cavity. The filter is arranged, on one hand, the uniformity of the outflow gas can be further improved, on the other hand, the micro dust in the air can be filtered, and a cleaner environment is provided for the interior of the photoetching machine. Preferably, the air outlet surface is arranged on the bottom surface opposite to the inclined surface, and the air flow changes the flow direction when meeting the inclined surface, and the changed direction is towards the bottom surface, so that the air outlet surface is arranged on the bottom surface, and the air flow can smoothly flow out.
The invention also provides an embodiment of the photoetching equipment, which comprises the gas bath cavity structure, a laser interferometer, an illumination light path, a projection objective lens and the like.
The invention also provides another embodiment of a lithographic apparatus comprising the above-described gas bath device, as well as a laser interferometer, an illumination path, a projection objective, and the like.
FIG. 6 is a schematic diagram of a specific gas bath apparatus employing 3 plates to form 3 hydrostatic chambers. The gas bath apparatus includes an air inlet duct 201, a gas bath chamber 202, a filter 203, a first orifice plate 205, a second orifice plate 206, and a third orifice plate 207. The air inlet pipe 201 is disposed on an end wall of the air bath cavity 202, an included angle is formed between an inclined plane of the air bath cavity 202 and a plane of the bottom surface, and the end wall is opposite to the included angle. The air outlet surface 204 of the air bath cavity 202 is the bottom surface, the filter 203 is disposed on the air outlet surface 204, and the first orifice plate 205, the second orifice plate 206, and the third orifice plate 207 are sequentially disposed in the air bath cavity 202. The first orifice plate 205, the second orifice plate 206 and the gas bath cavity 202 enclose a first hydrostatic cavity 208, the second orifice plate 206, the third orifice plate 207 and the gas bath cavity 202 enclose a second hydrostatic cavity 209, and the third orifice plate 207 and the gas bath cavity 202 enclose a third hydrostatic cavity 210.
The air flows into the air bath cavity 202 through the air inlet pipe 201, and then enters the first hydrostatic cavity 208 after being guided and dispersed evenly by the first orifice plate 205. After the initial buffering in the first hydrostatic pocket 208, a portion of the gas flows out of the gas bath pocket 202 from the filter 203, and the remainder of the gas continues to travel, be directed and dispersed by the pocket extrusion and the second orifice 206, and enter the second hydrostatic pocket 209. After being buffered again by the second hydrostatic pocket 209, a part of the gas flows out of the gas bath pocket 202 from the filter 203, and the rest of the gas continues to advance, and enters the third hydrostatic pocket 210 through the pocket extrusion and the guidance and dispersion of the third orifice plate 207. After being buffered by the third hydrostatic pocket 210, all of the gas flows out of the gas bath 202 through the filter 203. As can be seen from the straight line segment at the head and tail of the arrow in the figure, all the gas flowing out of the filter 203 has a relatively uniform velocity.
Preferably, the inclination angles of the plurality of orifice plates arranged in order are sequentially increased so as to obtain better guiding effect. For example, the first orifice plate 205 may be inclined at an angle in the range of 12 ° to 18 °, the second orifice plate 206 may be inclined at an angle in the range of 20 ° to 25 °, and the third orifice plate 207 may be inclined at an angle in the range of 25 ° to 30 °. As shown in fig. 6, the inclination angles of the first, second, and third orifice plates 205, 206, and 207 are gradually increased to 15 °, 20 °, and 30 ° in this order.
Preferably, the aperture ratio of the plurality of the aperture plates arranged in an orderly manner is increased in sequence, so as to obtain better dispersion effect. For example, the first orifice plate 205 has an orifice ratio in the range of 20% to 30%, the second orifice plate 206 has an orifice ratio in the range of 35% to 40%, and the third orifice plate 207 has an orifice ratio in the range of 35% to 40%. As shown in fig. 6, the aperture ratio of the first aperture plate 205, the second aperture plate 206 and the third aperture plate 207 is gradually increased to 25%, 40% and 40% in this order. More preferably, the openings are uniform openings.
Preferably, in fig. 6, the first orifice plate 205 is disposed at one end of the air bath chamber 202, and is close to the air inlet pipe 201 (i.e., the air inlet), so that the air flow is guided in the first time when the air flow enters the air bath chamber 202, and is dispersed through the plurality of orifices on the first orifice plate 205, thereby achieving the purpose of uniform and stable air flow distribution. The second orifice plate 206 and the third orifice plate 207 are disposed at equal distances, and divide the length of the bottom surface of the gas bath chamber 202 into three equal parts to form three stages of static pressure chambers, and the gas flow is gradually and uniformly distributed in stages.
Fig. 7 is a simulation diagram of the wind speed at the outlet of a gas bath apparatus, and the structure adopted by the simulation diagram is shown in fig. 6. The specific parameters of the gas bath device are as follows: the slope of the gas bath cavity 202 is 1: 15 (included angle: arctg1/15), the first orifice plate 205 has an inclination angle of 15 ° and an aperture ratio of 25%, the second orifice plate 206 has an inclination angle of 20 ° and an aperture ratio of 40%, the third orifice plate 207 has an inclination angle of 30 ° and an aperture ratio of 40%. According to the distribution of the color blocks in the figure, the wind speed of the air outlet surface of the air bath device is very uniform, and the wind speeds at the positions corresponding to the middle parts of the 3 static pressure cavities are slightly different.
In addition, according to the aforementioned requirement for the product of the slope of the gas bath cavity and the aperture ratio of the aperture plate, in this embodiment, the product of the slope of the first aperture plate 205 and the slope of the gas bath cavity 202 is 0.017(1/15 × 0.25), the product of the slope of the second aperture plate 206 and the slope of the gas bath cavity 202 is 0.027(1/15 × 0.40), and the product of the slope of the third aperture plate 207 and the slope of the gas bath cavity 202 is 0.027(1/15 × 0.40), all of which do not exceed the range of 0.01-0.03. It is demonstrated that controlling the product of the gas bath cavity slope and the aperture plate opening ratio within this range does achieve a better control of the gas flow uniformity.
In conclusion, the invention optimizes the structure of the gas bath cavity, can improve the uniformity and stability of the gas flowing out of the air outlet surface only by changing the shape of the gas bath cavity, simultaneously reduces the requirements on the piezoresistance of the filter and can reduce the manufacturing cost. The gas bath device adopting the gas bath cavity structure has the advantages of simple structure, easy realization, no increase of the requirement on space and better replacement of the old gas bath device. The requirements for different wind speeds can also be met by adjusting the orifice plate, which cannot be achieved by the prior art.
It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (13)

1. The utility model provides a gas bath cavity structure, its characterized in that, gas bath cavity structure includes orifice plate and wedge-shaped gas bath cavity, the orifice plate set up in the gas bath cavity, will the gas bath cavity separates for a plurality of static pressure chambeies.
2. The gas bath cavity structure as claimed in claim 1, wherein said gas bath cavity comprises an inclined surface and an air outlet surface, said inclined surface is opposite to said air outlet surface, and the included angle between the plane of said air outlet surface and said inclined surface is greater than arctg 0.05.
3. The gas bath cavity structure according to claim 2, wherein the orifice plate is disposed in the gas bath cavity at a predetermined inclination angle, the inclination angle being an angle between the orifice plate and a direction perpendicular to the outlet air plane.
4. The gas bath cavity structure as defined in claim 3 wherein said angle of inclination is in the range of 12 ° to 30 °.
5. The gas bath cavity structure according to claim 3, wherein the number of said orifice plates is at least 3.
6. The gas bath chamber structure according to claim 5, wherein the number of the orifice plates is 3, and the first orifice plate, the second orifice plate and the third orifice plate are sequentially arranged; the first pore plate is arranged at an air inlet of the air bath cavity; the inclination angle range of the first pore plate is 12-18 degrees, the inclination angle range of the second pore plate is 20-25 degrees, and the inclination angle range of the third pore plate is 25-30 degrees.
7. The gas bath cavity structure according to any one of claims 2-6, wherein said orifice plate has an open porosity in the range of 20% -40%.
8. The gas bath cavity structure according to claim 6, wherein said first orifice plate has an open porosity in the range of 20% to 30%, said second orifice plate has an open porosity in the range of 35% to 40%, and said third orifice plate has an open porosity in the range of 35% to 40%.
9. The gas bath chamber structure according to claim 7, wherein the product of the tangent of the angle between the plane of the outlet face and the inclined face and the aperture ratio of the orifice plate is in the range of 0.01 to 0.03.
10. A gas bath apparatus, characterized in that it comprises an air inlet duct and a gas bath cavity structure as claimed in any one of claims 1 to 9; the air inlet pipeline is connected with an air inlet of the air bath cavity.
11. The gas bath apparatus according to claim 10, further comprising a filter disposed at an outlet face of the gas bath chamber.
12. A lithographic apparatus comprising a gas bath chamber structure according to any one of claims 1 to 9.
13. A lithographic apparatus comprising a gas bath device according to any one of claims 10 to 11.
CN201810690346.7A 2018-06-28 2018-06-28 Gas bath cavity structure, gas bath device and photoetching equipment Active CN110658682B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810690346.7A CN110658682B (en) 2018-06-28 2018-06-28 Gas bath cavity structure, gas bath device and photoetching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810690346.7A CN110658682B (en) 2018-06-28 2018-06-28 Gas bath cavity structure, gas bath device and photoetching equipment

Publications (2)

Publication Number Publication Date
CN110658682A true CN110658682A (en) 2020-01-07
CN110658682B CN110658682B (en) 2021-04-02

Family

ID=69026431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810690346.7A Active CN110658682B (en) 2018-06-28 2018-06-28 Gas bath cavity structure, gas bath device and photoetching equipment

Country Status (1)

Country Link
CN (1) CN110658682B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116841137A (en) * 2023-08-31 2023-10-03 光科芯图(北京)科技有限公司 Gas bath device, temperature control system and exposure equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286724A (en) * 1985-10-11 1987-04-21 Mitsubishi Electric Corp Semiconductor manufacturing device
CN1952786A (en) * 2005-10-21 2007-04-25 Asml荷兰有限公司 Gas shower, lithographic apparatus and use of a gas shower
CN101988732A (en) * 2010-11-18 2011-03-23 西安建筑科技大学 Air port adjustable static pressure box with uniform outlet air
CN103176368A (en) * 2013-03-06 2013-06-26 浙江大学 Gas-seal and gas-liquid vibration damping recovery device used in immersion lithographic machine
CN203443461U (en) * 2013-08-12 2014-02-19 甘肃蓝科石化高新装备股份有限公司 Air distributor of air cooler

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286724A (en) * 1985-10-11 1987-04-21 Mitsubishi Electric Corp Semiconductor manufacturing device
CN1952786A (en) * 2005-10-21 2007-04-25 Asml荷兰有限公司 Gas shower, lithographic apparatus and use of a gas shower
CN101988732A (en) * 2010-11-18 2011-03-23 西安建筑科技大学 Air port adjustable static pressure box with uniform outlet air
CN103176368A (en) * 2013-03-06 2013-06-26 浙江大学 Gas-seal and gas-liquid vibration damping recovery device used in immersion lithographic machine
CN203443461U (en) * 2013-08-12 2014-02-19 甘肃蓝科石化高新装备股份有限公司 Air distributor of air cooler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116841137A (en) * 2023-08-31 2023-10-03 光科芯图(北京)科技有限公司 Gas bath device, temperature control system and exposure equipment
CN116841137B (en) * 2023-08-31 2023-11-21 光科芯图(北京)科技有限公司 Gas bath device, temperature control system and exposure equipment

Also Published As

Publication number Publication date
CN110658682B (en) 2021-04-02

Similar Documents

Publication Publication Date Title
CN110658682B (en) Gas bath cavity structure, gas bath device and photoetching equipment
WO2018103348A1 (en) Worm drive-based constant-flow slit type inlet and outlet port
CN110848258A (en) Gas static pressure air floating pad and air floating guide rail
CN110594221B (en) Valve core and valve sleeve matching pair and hydraulic/pneumatic force compensation method thereof
CN107269698A (en) Air bearing
CN109856918B (en) Interferometer gas bath device and photoetching machine
CN117073966B (en) Temporary flushing type three-sound-velocity wind tunnel layout structure
CN110500330A (en) A kind of anti-bias load adjustable speed synchronous valve, synchronous control system and working method
TW201136745A (en) Mold plate module and injection mold using same
CN109213213A (en) A kind of gas flow adjusting method
CN102797882A (en) Needle valve capable of accurately adjusting flow rate
WO2018103347A1 (en) Lever transmission-based equal flow slit-type inlet and outlet
CN111828478A (en) Pressure equalizing groove composite throttling gas static pressure guide rail and gas mold rigidity analysis method
CN110487346B (en) Rectification pore plate for high-flow low-temperature propellant supply pipeline and design method thereof
CN110966916B (en) Gas bath device and photoetching machine
CN107796299B (en) Gas bath control device
CN115220306A (en) Gas bath device and photoetching machine
JP5959792B1 (en) Gas branching device and method for producing glass particulate deposit using the same
CN109899161B (en) Liquid fuel metering device
CN210637527U (en) Energy-saving electromagnetic valve
CN104777531A (en) Dynamic adjusting method for focal length based on graded-refractive-index fluid micro lens
CN207357168U (en) A kind of gas distribution structure, gas distributor
CN105371463A (en) Pore plate for bushing air-conditioning wind and method for improving air output uniformity of bushing air-conditioning wind
CN201729762U (en) Ventilation device of glass forming plug
CN104865622B (en) A kind of based on graded index fluid lenticular focal spot dynamic regulating method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant