CN110658096A - PCB treating agent performance detection method - Google Patents
PCB treating agent performance detection method Download PDFInfo
- Publication number
- CN110658096A CN110658096A CN201810685530.2A CN201810685530A CN110658096A CN 110658096 A CN110658096 A CN 110658096A CN 201810685530 A CN201810685530 A CN 201810685530A CN 110658096 A CN110658096 A CN 110658096A
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- circuit board
- printed circuit
- tin
- time
- copper
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N5/00—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
- G01N5/04—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by removing a component, e.g. by evaporation, and weighing the remainder
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The invention relates to the field of PCB production, and particularly discloses a method for detecting the performance of a PCB treating agent, which comprises the following steps: a. dipping a first printed circuit board with a substrate only covered with a uniform copper layer into a to-be-detected tin stripping solution; b. before the substrate below the copper layer is exposed, taking out the first printed circuit board from the to-be-detected tin stripping liquid, and recording the time from the immersion of the first printed circuit board in the to-be-detected tin stripping liquid to the taking-out of the first printed circuit board as a first period of time; c. weighing a first mass difference of the first printed circuit board before and after a first period of time, calculating a first product of the first period of time and the area of the copper layer, and dividing the first product by the first mass difference to obtain a copper withdrawal rate; d. and dipping the second printed circuit board with the substrate only covered with the uniform tin layer into the tin stripping liquid to be detected.
Description
Technical Field
The invention relates to the field of PCB production, in particular to a method for detecting the performance of a PCB treating agent.
Background
The tin stripping solution is one of the largest chemical materials used in the production of printed wiring boards, and is used for reacting with tin to strip tin protecting a copper layer from a printed board in the production process of the printed board. The common tin stripping solution comprises a mixture of nitric acid and ferric trichloride, such as CN201010617321.8, and its preparation method and application. However, in the using process of the tin stripping liquid, the tin stripping liquid can also react with copper on the printed circuit board. The tin stripping liquid is used at the initial stage, the speed of stripping tin from the tin stripping liquid is far greater than the speed of reaction of the tin stripping liquid and copper, and along with repeated use of the tin stripping liquid, the speed of reaction of the tin stripping liquid and the copper is accelerated, so that the copper layer of the produced printed circuit board is seriously thinned to cause scrapping of the printed circuit board. If can carry out the performance detection with tin liquid before producing the printed circuit board, measure tin liquid and withdraw copper and withdraw tin speed ratio with withdrawing the copper that the tin liquid withdrawed copper and withdraw tin, just can avoid this tin liquid's use of withdrawing when the speed specific gravity that withdraws copper is too big to avoid producing condemned printed circuit board.
Disclosure of Invention
The invention aims to solve the technical problem of providing a PCB treating agent performance detection method for detecting the performance of a tin stripping solution.
The invention is realized by the following steps:
the method for detecting the performance of the PCB treating agent comprises the following steps:
a. dipping a first printed circuit board with a substrate only covered with a uniform copper layer into a to-be-detected tin stripping solution;
a. dipping the first printed circuit board covered with the uniform copper layer into a to-be-detected tin stripping solution;
b. before the substrate below the copper layer is exposed, taking out the first printed circuit board from the to-be-detected tin stripping liquid, recording the time from the immersion of the first printed circuit board into the to-be-detected tin stripping liquid to the taking-out of the first printed circuit board as a first period of time, and drying the first printed circuit board after ultrasonic washing;
c. weighing a first mass difference of the first printed circuit board before and after a first period of time, calculating a first product of the first period of time and the area of the copper layer, and dividing the first product by the first mass difference to obtain a copper withdrawal rate;
d. dipping the second printed circuit board of which the substrate is only covered with the uniform tin layer into the tin stripping liquid to be detected;
e. before the substrate under the tin layer is exposed, taking out the second printed circuit board from the tin stripping liquid to be detected, recording the time from the immersion of the second printed circuit board into the tin stripping liquid to be detected to the taking out as a second period of time, and drying the second printed circuit board after ultrasonic washing;
f. weighing a second mass difference of the second printed circuit board before and after a second period of time, calculating a second product of the second period of time and the area of the tin layer, and dividing the second mass difference by the second product to obtain a tin stripping rate;
g. and dividing the copper stripping rate by the tin stripping rate to obtain the copper stripping and tin stripping rate ratio.
And furthermore, a step h of determining that the solder stripping liquid to be detected is unqualified when the measured copper stripping and solder stripping rate ratio reaches a preset value.
Further, the preset value is 0.1.
Further, the first period of time and the second period of time are equal.
Further, the area of the copper layer is equal to the area of the tin layer.
Furthermore, the upper surface and the lower surface of the substrate of the first printed circuit board are covered with uniform copper layers.
Furthermore, the upper surface and the lower surface of the substrate of the second printed circuit board are covered with uniform tin layers.
Further, the area of the copper layer is 30-100 square centimeters.
Furthermore, the area of the tin layer is 30-100 square centimeters. .
The invention has the following advantages: the performance of the tin stripping liquid can be conveniently measured, the process is simple, and an accurate result can be quickly measured. A layer of silica gel is formed on the surface of the circuit board, so that water can be prevented from permeating, and a product can be well protected.
Detailed Description
The invention provides a method for detecting the performance of a PCB treating agent, which is used for detecting the performance of a tin stripping solution. The copper layer only covers the substrate, so that the influence of other materials on the board on an experimental result is avoided, the copper layer covers uniformly, and the error of calculation of the area of the copper layer caused by non-uniformity is avoided. The copper layer can be covered on one surface or both the upper surface and the lower surface, and preferably, the upper surface and the lower surface of the substrate are covered with uniform copper layers, so that the area of the copper layer on a unit area of the substrate is larger, the space occupied by the substrate can be reduced in the same area of the copper layer, and the material of the substrate is saved. The excessive area of the copper layer can cause waste of the printed circuit board and the tin stripping liquid, and a larger experimental container is also needed; however, if the area of the copper layer is too small, the change in the quality of the copper layer is small, and the measurement error greatly affects the experimental result. Preferably, the copper layer area is 30-100 square centimeters.
And step S102, before the substrate under the copper layer is exposed, taking out the first printed circuit board from the to-be-tested tin stripping solution, and recording the time from the immersion of the first printed circuit board in the to-be-tested tin stripping solution to the taking-out as a first period of time. If the substrate below the copper layer is exposed along with the removal of the copper layer, the area of the reacted copper layer is changed, so that the subsequent calculation result is inaccurate, and therefore the first printed circuit board is taken out before the substrate below the copper layer is exposed, and is dried after ultrasonic water washing is carried out on the first printed circuit board.
Then, in step S103, a first mass difference of the first pcb before and after the first period of time is weighed, a first product of the first period of time and the area of the copper layer is calculated, and the first product is divided by the first mass difference to obtain the copper stripping rate. The first printed circuit board is stained with the solder stripping solution when taken out of the solder stripping solution, and in order to weigh the first quality difference of the first printed circuit board, the common practice in the art is to clean the first printed circuit board with alcohol and air-dry the first printed circuit board. The measured copper removing rate is the rate of removing the copper layer of the tin removing liquid to be measured on the unit area of the first printed circuit board in unit time.
Since the rate of tin stripping is to be measured, the tin stripping rate test method is similar to the copper stripping rate test method, except that the copper layer is changed to a tin layer. The specific step is that in step S104, the second printed circuit board with the substrate covered with the uniform tin layer is dipped into the tin stripping liquid to be tested. Preferably, the upper and lower surfaces of the substrate of the second printed circuit board are covered with a uniform layer of tin having an area of 30-100 square centimeters.
And then, in step S105, before the substrate under the tin layer is exposed, taking out the second printed circuit board from the to-be-detected tin stripping liquid, recording the time from the immersion of the second printed circuit board into the to-be-detected tin stripping liquid to the taking-out of the second printed circuit board as a second period of time, and drying the second printed circuit board after ultrasonic washing.
Then, in step S106, a second mass difference of the second pcb before and after the second period of time is weighed, a second product of the second period of time and the area of the tin layer is calculated, and then the second mass difference is divided by the second product to obtain the tin stripping rate;
in step S107, the copper stripping rate is divided by the tin stripping rate to obtain the copper stripping and tin stripping rate ratio. The performance of the tin stripping liquid can be obtained after the copper stripping rate ratio is obtained, and a basis is provided for subsequent treatment. And finally, in the step S108, when the measured copper stripping and tin stripping rate ratio reaches a preset value, determining that the tin stripping liquid to be measured is unqualified. When the copper stripping and tin stripping rate reaches a certain value, the copper stripping rate is higher than the tin stripping rate, so that more copper can be stripped in the tin stripping process, and the printed circuit board is likely to be scrapped. Through tests, the preferred preset value is 0.1.
In the above method, preferably, the first period of time is equal to the second period of time. Therefore, when the copper stripping and tin stripping rate ratio is calculated, the first period of time and the second period of time can be directly reduced, and the calculation steps are reduced. During specific operation, the first printed circuit board and the second printed circuit board can be dipped into the tin stripping liquid at the same time, and then the first printed circuit board and the second printed circuit board are taken out at the same time, so that the equal time is ensured without timing.
In the above method, preferably, the area of the copper layer is equal to the area of the tin layer. Therefore, when the copper and tin stripping rate ratio is calculated, the area of the copper layer and the area of the tin layer can be directly reduced, and the calculation steps are reduced. In particular, the first printed circuit board and the second printed circuit board can be cut into the same size at the same time, so that the areas of the copper layer and the tin layer are not required to be measured.
When the first period of time is equal to the second period of time and the area of the copper layer is equal to the area of the tin layer, the copper stripping and tin stripping rate ratio is the ratio of the first mass difference to the second mass difference, and the calculation process is greatly simplified.
In conclusion, the method can conveniently detect the performance of the tin stripping solution.
The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiment, but equivalent modifications or changes made by those skilled in the art according to the present disclosure should be included in the scope of the present invention as set forth in the appended claims.
Claims (9)
1. A method for detecting the performance of a PCB treating agent is characterized by comprising the following steps: the method comprises the following steps:
a. dipping the first printed circuit board covered with the uniform copper layer into a to-be-detected tin stripping solution;
b. before the substrate below the copper layer is exposed, taking out the first printed circuit board from the to-be-detected tin stripping liquid, recording the time from the immersion of the first printed circuit board into the to-be-detected tin stripping liquid to the taking-out of the first printed circuit board as a first period of time, and drying the first printed circuit board after ultrasonic washing;
c. weighing a first mass difference of the first printed circuit board before and after a first period of time, calculating a first product of the first period of time and the area of the copper layer, and dividing the first product by the first mass difference to obtain a copper withdrawal rate;
d. dipping the second printed circuit board of which the substrate is only covered with the uniform tin layer into the tin stripping liquid to be detected;
e. before the substrate under the tin layer is exposed, taking out the second printed circuit board from the tin stripping liquid to be detected, recording the time from the immersion of the second printed circuit board into the tin stripping liquid to be detected to the taking out as a second period of time, and drying the second printed circuit board after ultrasonic washing;
f. weighing a second mass difference of the second printed circuit board before and after a second period of time, calculating a second product of the second period of time and the area of the tin layer, and dividing the second mass difference by the second product to obtain a tin stripping rate;
g. and dividing the copper stripping rate by the tin stripping rate to obtain the copper stripping and tin stripping rate ratio.
2. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: and h, determining that the solder stripping liquid to be detected is unqualified when the measured copper stripping and solder stripping rate ratio reaches a preset value.
3. The PCB treatment performance detection method of claim 2, wherein: the preset value is 0.1.
4. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the first period of time is equal to the second period of time.
5. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the area of the copper layer is equal to the area of the tin layer.
6. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the upper surface and the lower surface of the substrate of the first printed circuit board are covered with uniform copper layers.
7. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the upper surface and the lower surface of the substrate of the second printed circuit board are covered with uniform tin layers.
8. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the area of the copper layer is 30-100 square centimeters.
9. The method for detecting the performance of the PCB processing agent as recited in claim 1, wherein: the area of the tin layer is 30-100 square centimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810685530.2A CN110658096A (en) | 2018-06-28 | 2018-06-28 | PCB treating agent performance detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810685530.2A CN110658096A (en) | 2018-06-28 | 2018-06-28 | PCB treating agent performance detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110658096A true CN110658096A (en) | 2020-01-07 |
Family
ID=69027291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810685530.2A Withdrawn CN110658096A (en) | 2018-06-28 | 2018-06-28 | PCB treating agent performance detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110658096A (en) |
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2018
- 2018-06-28 CN CN201810685530.2A patent/CN110658096A/en not_active Withdrawn
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| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200107 |
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| WW01 | Invention patent application withdrawn after publication |