CN110648938A - 一种对cpu芯片进行检测的制作设备 - Google Patents
一种对cpu芯片进行检测的制作设备 Download PDFInfo
- Publication number
- CN110648938A CN110648938A CN201911027630.7A CN201911027630A CN110648938A CN 110648938 A CN110648938 A CN 110648938A CN 201911027630 A CN201911027630 A CN 201911027630A CN 110648938 A CN110648938 A CN 110648938A
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- cpu chip
- plate
- chip
- testing
- manufacturing apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911027630.7A CN110648938B (zh) | 2019-10-28 | 2019-10-28 | 一种对cpu芯片进行检测的制作设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911027630.7A CN110648938B (zh) | 2019-10-28 | 2019-10-28 | 一种对cpu芯片进行检测的制作设备 |
Publications (2)
Publication Number | Publication Date |
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CN110648938A true CN110648938A (zh) | 2020-01-03 |
CN110648938B CN110648938B (zh) | 2020-11-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911027630.7A Active CN110648938B (zh) | 2019-10-28 | 2019-10-28 | 一种对cpu芯片进行检测的制作设备 |
Country Status (1)
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CN (1) | CN110648938B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112484414A (zh) * | 2020-11-29 | 2021-03-12 | 寇玉华 | 一种温控的生物检测仪器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790776B1 (ko) * | 2006-12-27 | 2008-01-03 | 주식회사 성우하이텍 | 레이저 용접용 지그장치 |
CN109967946A (zh) * | 2019-03-22 | 2019-07-05 | 广州川也汽车装备有限公司 | 一种汽车焊接生产用夹具 |
CN110014205A (zh) * | 2019-05-06 | 2019-07-16 | 桂林航天工业学院 | 一种电路板焊接用智能夹持固定设备 |
CN209363956U (zh) * | 2018-11-30 | 2019-09-10 | 辰溪县时代巨媒广告有限公司 | 一种焊接用夹持装置 |
-
2019
- 2019-10-28 CN CN201911027630.7A patent/CN110648938B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790776B1 (ko) * | 2006-12-27 | 2008-01-03 | 주식회사 성우하이텍 | 레이저 용접용 지그장치 |
CN209363956U (zh) * | 2018-11-30 | 2019-09-10 | 辰溪县时代巨媒广告有限公司 | 一种焊接用夹持装置 |
CN109967946A (zh) * | 2019-03-22 | 2019-07-05 | 广州川也汽车装备有限公司 | 一种汽车焊接生产用夹具 |
CN110014205A (zh) * | 2019-05-06 | 2019-07-16 | 桂林航天工业学院 | 一种电路板焊接用智能夹持固定设备 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112484414A (zh) * | 2020-11-29 | 2021-03-12 | 寇玉华 | 一种温控的生物检测仪器 |
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CN110648938B (zh) | 2020-11-03 |
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SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Wu Meijuan Inventor after: He Yanbo Inventor after: Liu Zhanwei Inventor after: Yuan Kai Inventor before: Yuan Kai |
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CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201015 Address after: 518101 baoyunda logistics center Meilan business center 801, Fuhua community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen kelani Acoustic Technology Co., Ltd Address before: 325000 Room 613, Xindu Building, Lucheng Railway Station, Wenzhou City, Zhejiang Province (Trusteeship-312) Applicant before: Wenzhou Qizhen Information Technology Co.,Ltd. |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20211229 Address after: 250000 building 79, Xinmao Qilu science and Technology City, No. 1, Zidong Avenue, Tianqiao District, Jinan City, Shandong Province Patentee after: Shandong huanbang Intelligent Technology Co.,Ltd. Address before: 518101 baoyunda logistics center Meilan business center 801, Fuhua community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen kelani Acoustic Technology Co., Ltd |
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TR01 | Transfer of patent right |