CN110647013B - GDSII format-based parallel data processing method for direct-write lithography machine - Google Patents
GDSII format-based parallel data processing method for direct-write lithography machine Download PDFInfo
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- CN110647013B CN110647013B CN201910816827.2A CN201910816827A CN110647013B CN 110647013 B CN110647013 B CN 110647013B CN 201910816827 A CN201910816827 A CN 201910816827A CN 110647013 B CN110647013 B CN 110647013B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/46—Multiprogramming arrangements
- G06F9/50—Allocation of resources, e.g. of the central processing unit [CPU]
- G06F9/5005—Allocation of resources, e.g. of the central processing unit [CPU] to service a request
- G06F9/5027—Allocation of resources, e.g. of the central processing unit [CPU] to service a request the resource being a machine, e.g. CPUs, Servers, Terminals
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2209/00—Indexing scheme relating to G06F9/00
- G06F2209/50—Indexing scheme relating to G06F9/50
- G06F2209/5018—Thread allocation
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- General Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A method for processing parallel data of a direct-write photoetching machine based on a GDSII format can solve the technical problem that logic operation is carried out on existing DMD digital micromirrors by adopting an FPGA (field programmable gate array), and if provided direct-write photoetching data adopt polarity characteristics and are processed in a certain sequence mode, the advantages of the FPGA are hardly given play to, and further the capacity of the direct-write photoetching machine is reduced. The invention converts the data of the photoetching pattern into the data in the GDSII format, and makes use of the characteristics that the GDSII pattern format has no polarity and no superposition sequence, and the basic pattern units can be cut and recombined, so that the data processing units corresponding to each DMD digital micromirror can process the data in parallel, thereby achieving the parallel between the DMDs. Meanwhile, because the GDSII data required to be exposed by each DMD can be cut and recombined, the data can be processed in parallel by utilizing the parallel characteristics of the CUDA and the FPGA, the time of the photoetching layout of the direct-writing photoetching machine on data processing is greatly prolonged, and the productivity is improved.
Description
Technical Field
The invention relates to the technical field of graphic image processing of semiconductor lithography machines, in particular to a direct-writing lithography machine parallel data processing method based on a GDSII format.
Background
Direct-write lithography is a technique of printing a pattern having features on the surface of a photosensitive material (mostly, a resist or a film).
CUDA is a programming model and development environment proposed by NVIDIA corporation in 2007 to support GPU for general purpose computing. The idea of CUDA programming is to exploit parallelism in a program with a large number of threads, the large number of threads being organized in a hierarchical manner, individual threads being mapped to scalar cores SP for execution, a group of threads being organized as a thread Block (Block) that is mapped to an SM for execution, and finally a thread Grid (Grid) consisting of thread blocks being mapped to a GPGPU for execution. The GPU has the calculation core number far exceeding that of the CPU and massive parallel calculation resources, so that the GPU is suitable for performing calculation intensive and highly parallelized calculation tasks. Meanwhile, as the price of the GPU is far lower than that of a parallel computing system with the same performance, a heterogeneous system composed of the CPU and the GPGPU has been increasingly applied to various engineering application fields such as biomedicine, hydromechanics, and the like.
The spatial light modulator, also called DMD (Digital Micro-mirror Device) Digital micromirror, is composed of many tiny aluminized mirror plates that can rotate around a yoke with a rotation angle of ± 12 °, and reflects the incident light to different places at different rotation angles by the mirror plates. The direct-writing exposure system adopts a collimated laser or UV mixed light source to inject into a digital micromirror DMD, then the DMD respectively rotates to different positions according to image data, the injected light is reflected onto an objective lens head, and an image is projected onto an exposure surface on a movable platform after being zoomed by the objective lens. The small square lenses on the micro-mirror (DMD) are arranged in a row-column format, each lens can be independently controlled, and one-time refreshing of the DMD lenses can be completed by giving two-dimensional bit data of M rows and N columns of a frame. And the display of images of different frames can be finished by loading the two-dimensional data of different frames.
While most of the material numbers used by the direct-write lithography machine are in vector format, such as ODB + +, Gerber, DPF, and the like, when processing the format, because of the format characteristics, each layer or basic composition unit has polarity, and the final graphic data is obtained by superimposing a plurality of polarities, such as a first layer being a large positive circle of 500um and a second layer being a small negative circle of 200um, and a ring with a diameter of 500um is obtained after superimposing the two, as shown in fig. 1; since a lithographic pattern is superimposed over dozens or even hundreds of polar layers, and according to the requirements of these formats, the layers must be superimposed in a certain order, otherwise the final pattern will be wrong. For the DMD digital micromirror, only 0/1 data patterns, namely contour data, are needed finally, and the number of the intermediate superpositions does not need to be concerned, and the number of the model superpositions does not need to be remembered;
for the control and data processing of the DMD digital micromirror provided by the current TI company, the logic operation is carried out by adopting an FPGA (field programmable gate array), so that a two-dimensional Bit data format required by the DMD is prepared. For FPGA, when various data operations are carried out, parallel calculation is adopted, so that the optimal speed can be reached. If the provided direct-write lithography data adopts the polarity characteristic and is processed according to a certain sequence mode, the advantages of the FPGA are hardly exerted, and the capacity of the direct-write lithography machine is further reduced.
Disclosure of Invention
The invention provides a GDSII format-based parallel data processing method for a direct-write photoetching machine, which can solve the technical problems that the existing DMD digital micromirrors adopt FPGA to carry out logic operation, and if the provided direct-write photoetching data adopt polarity characteristics and are processed in a certain sequence mode, the advantages of the FPGA are hardly exerted, and further the capacity of the direct-write photoetching machine is reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
a direct-write photoetching machine parallel data processing method based on a GDSII format comprises the following steps:
s100, converting the data of the photoetching pattern into GDSII format data;
s200, reading GDSII format data to obtain the width W and the height H of the photoetching pattern;
s300, cutting the photoetching pattern according to the number N of the DMDs used by the direct-writing photoetching machine system and the center distance between the DMDs to obtain the width of the exposure pattern required to be finished by each DMD;
s400, sending exposure graphic data to be completed by each DMD to a data processing unit corresponding to the DMD;
s500, the data processing unit performs parallel processing on the received outline data of the GDSII, and performs triangular decomposition on the data of the basic structure in the outline data, so that each basic graph consists of triangles;
s600, cutting the triangulated basic structure data by using a CUDA (compute unified device architecture), obtaining the graph data of each frame, and converting the original triangle data into convex quadrilateral data; sending the convex quadrilateral data to the FPGA;
s700, the FPGA logic processing unit fills the convex quadrilateral data through multiple threads to obtain G-level gray data after filling, wherein G is a natural number greater than 0;
and S800, sending the G-level gray scale data to the DMD for display.
According to the technical scheme, the parallel data processing method of the direct-write photoetching machine based on the GDSII format has the advantages that the data features of the GDSII format are processed in parallel, so that the production efficiency is improved, and the capacity of the direct-write photoetching machine is increased.
The invention has the following beneficial effects:
the GDSII format based on the outline is adopted, and the method has the advantages that only a broad wheel is provided, the basic graphic elements (Sref, Path, Boundary, Box and the like) have no sequence, and the method is more suitable for parallel calculation in an FPGA or a CUDA; therefore, the data required by the DMD digital micromirror can be quickly prepared, and the exposure of the direct-write photoetching machine is completed.
The invention utilizes the characteristics that the GDSII graphic format has no polarity and no superposition sequence, and the basic graphic units (SREF, Boundary, Path, Box) can carry out cutting, recombination and the like, so that the data processing units corresponding to each DMD digital micromirror can process data in parallel, thereby achieving the parallelism among the DMDs. Meanwhile, because the GDSII data required to be exposed by each DMD can be cut and recombined, the data can be processed in parallel by utilizing the parallel characteristics of the CUDA and the FPGA, the time of the photoetching layout of the direct-writing photoetching machine on data processing is greatly prolonged, and the productivity is improved.
Drawings
FIG. 1 is a schematic view of a polarity pattern overlay;
FIG. 2 is a flow chart of a method of the present invention;
FIG. 3 is a schematic diagram of a basic GDSII format;
FIG. 4 is a schematic exploded view of the triangle of the present invention;
FIG. 5 is a schematic diagram of the present invention for filling in convex quadrilateral data by multiple threads.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
As shown in fig. 2, in the method for processing parallel data of the direct-write lithography machine based on the GDSII format according to this embodiment,
the method comprises the following steps:
s100, converting the data of the photoetching pattern into GDSII format data;
s200, reading GDSII format data to obtain the width W and the height H of the photoetching pattern;
s300, cutting the photoetching pattern according to the number N of the DMDs used by the direct-writing photoetching machine system and the center distance between the DMDs to obtain the width of the exposure pattern required to be finished by each DMD;
s400, sending exposure graphic data to be completed by each DMD to a data processing unit corresponding to the DMD;
s500, the data processing unit performs parallel processing on the received outline data of the GDSII, and performs triangular decomposition on the data of the basic structure in the outline data, so that each basic graph consists of triangles;
s600, cutting the triangulated basic structure data by using a CUDA (compute unified device architecture), obtaining the graph data of each frame, and converting the original triangle data into convex quadrilateral data; sending the convex quadrilateral data to the FPGA;
s700, the FPGA logic processing unit fills the convex quadrilateral data through multiple threads to obtain G-level gray data after filling, wherein G is a natural number greater than 0;
and S800, sending the G-level gray scale data to the DMD for display.
The following is a detailed description:
the method comprises the following steps:
(1) converting the data of the photoetching pattern into GDSII format data (as shown in FIG. 3), and reading the GDSII format data to obtain the width W and the height H of the current photoetching pattern;
(2) cutting the current photoetching pattern according to the number N of DMD digital micromirrors used by the direct-writing photoetching machine system and the center distance between the DMDs, so as to obtain the width of the exposure pattern required to be finished by each DMD, as follows:
W0,W1,W2,…,Wn-1
wherein W0+ W1+ W2+ … + Wn-1 is W;
(3) sending exposure graphic data to be completed by each DMD to a data processing unit corresponding to the DMD;
(4) the data processing unit carries out parallel processing on the received outline data of the GDSII, and carries out triangular decomposition on the data of the basic structures such as SREF, Boundary, Path, Box and the like in the outline data so that each basic graph consists of triangles;
as shown in FIG. 4, the original infrastructure vector graphics silhouette, ABCDEFG, is triangularly decomposed into a plurality of triangles: ABC, ACD, ADE, AEF, AFG.
(5) Cutting basic structure data such as the triangulated SREF, Boundary, Path, Box and the like by using CUDA (compute unified device architecture), obtaining graphic data of each frame (2048 x 1024), and converting the original triangular data into convex quadrilateral data; such as converting triangle ABC to ABCA;
(6) sending the convex quadrilateral data to the FPGA;
(7) the FPGA logic processing unit is used for filling the convex quadrilateral data through multiple threads to obtain G-level gray data after filling, wherein G is a natural number greater than 0; as shown in fig. 5;
(8) sending the first-order or multi-order gray scale data to a DMD for display;
in the step (2), because the read photoetching version in the GDSII format can cut the graph, each DMD digital micromirror can be ensured to process own data;
the data processing unit in the step (3) may be a workstation, a server, a processing board card, or the like, and may be one or more.
Wherein, the frame size in the step (5) is set according to the resolution of the DMD digital micromirror. In addition, the triangle can be regarded as a special quadrangle, and the head and tail vertexes can be the same after conversion; for example, triangle ABC, and adding a point D with the same coordinates as a, a quadrilateral ABCD is obtained.
Wherein, the transmission medium in the step (6) may be USB3.0, gigabit network, optical fiber, PCIE, or the like.
Therefore, in the embodiment, the layout is spliced by using the splicing plate mode and is exposed in a matching manner with the substrate on the platform, so that the purpose of improving the productivity is achieved.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (4)
1. A direct-write photoetching machine parallel data processing method based on GDSII format is characterized in that: the method comprises the following steps:
s100, converting the data of the photoetching pattern into GDSII format data;
s200, reading GDSII format data to obtain the width W and the height H of the photoetching pattern;
s300, cutting the photoetching pattern according to the number N of the DMDs used by the direct-writing photoetching machine system and the center distance between the DMDs to obtain the width of the exposure pattern required to be finished by each DMD;
s400, sending exposure graphic data to be completed by each DMD to a data processing unit corresponding to the DMD;
s500, the data processing unit performs parallel processing on the received outline data of the GDSII, and performs triangular decomposition on the data of the basic structure in the outline data, so that each basic graph consists of triangles;
s600, cutting the triangulated basic structure data by using a CUDA (compute unified device architecture), obtaining the graph data of each frame, and converting the original triangle data into convex quadrilateral data; sending the convex quadrilateral data to the FPGA;
s700, the FPGA logic processing unit fills the convex quadrilateral data through multiple threads to obtain G-level gray data after filling, wherein G is a natural number greater than 0;
and S800, sending the G-level gray scale data to the DMD for display.
2. The GDSII-format-based parallel data processing method for direct-write lithography machines according to claim 1, wherein: the data processing unit in step S500 is a workstation, a server, or a processing board.
3. The GDSII-format-based parallel data processing method for direct-write lithography machines according to claim 1, wherein: the frame value of the graphic data of each frame in the step S600 is set according to the resolution of the DMD digital micromirror.
4. The GDSII-format-based parallel data processing method for direct-write lithography machines according to claim 1, wherein: in the step S600, the convex quadrilateral data are sent to the FPGA; wherein the transmission medium is one of USB3.0, gigabit network, optical fiber and PCIE.
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| US4984282A (en) * | 1988-03-25 | 1991-01-08 | Texas Instruments Incorporated | Parallel processing of reference and guardband data |
| US20060199087A1 (en) * | 2005-03-03 | 2006-09-07 | Lucas Kevin D | Method of making an integrated circuit by modifying a design layout by accounting for a parameter that varies based on a location within an exposure field |
| JP4787673B2 (en) * | 2005-05-19 | 2011-10-05 | 株式会社Ｎｇｒ | Pattern inspection apparatus and method |
| US7477772B2 (en) * | 2005-05-31 | 2009-01-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing 2D run length encoding for image data compression |
| US7586583B2 (en) * | 2005-09-15 | 2009-09-08 | Franklin Mark Schellenberg | Nanolithography system |
| CN101826127B (en) * | 2010-04-07 | 2012-08-29 | 芯硕半导体（中国）有限公司 | Method for converting GDSII file into maskless photoetching machine exposure data |
| CN103034644B (en) * | 2011-09-30 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | The extended method of GDS file |
| US9818168B2 (en) * | 2015-03-24 | 2017-11-14 | Applied Materials, Inc. | Data tuning for fast computation and polygonal manipulation simplification |
| CN106780290A (en) * | 2016-12-14 | 2017-05-31 | 江苏维普光电科技有限公司 | A kind of method that grid figure and filling are extracted in quick calculating from vector graphics |
| CN108710262A (en) * | 2018-05-18 | 2018-10-26 | 无锡中微掩模电子有限公司 | A kind of Multi-layer technology method of gray scale mask figure |
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